CN205104484U

CN205104484U - Can promote long -range encapsulation white light LED color rendering index's light source module

Info

Publication number: CN205104484U
Application number: CN201520841664.0U
Authority: CN
Inventors: 陈明秦; 叶尚辉
Original assignee: Fujian Zhongke Xinyuan Optoelectronics Technology Co Ltd
Current assignee: Fujian Zhongke Xinyuan Optoelectronics Technology Co Ltd
Priority date: 2015-10-28
Filing date: 2015-10-28
Publication date: 2016-03-23
Anticipated expiration: 2025-10-28

Abstract

The utility model provides a can promote long -range encapsulation white light LED color rendering index's light source module, including solid brilliant base plate and yellow fluorescent layer, gu brilliant base plate comprises the line base plate who is fixed with a plurality of LED chips, still include the red fluorescence coating body, this red fluorescence coating is personally experienced sth. Part of the body and is laid the interval between each LED chip on line base plate, the top of solid brilliant base plate is located to yellow fluorescent layer lid. The utility model discloses the utilization arouses the smooth conversion luminescence of retroreflection blue light in side emergent light and the white light encapsulation of chip, realizes the ruddiness complementary color, has not only promoted the color rendering index of transmission white light, and has guaranteed luminous flux and the light efficiency of launching the white light, has still guaranteed the long -term stability of red light filling.

Description

The light source module of long-range encapsulation white light LEDs color rendering index can be promoted

Technical field

The utility model relates to a kind of light source module of long-range encapsulation white light LEDs, particularly a kind of light source module promoting long-range encapsulation white light LEDs color rendering index.

Background technology

Fluorescence conversion route is still the main flow means that current industrialization manufactures white light LEDs.This wherein, the route that white light LEDs produced by fluorescent material is added compared to ultraviolet light, blue chip adds the white light technology of preparing route of yellow fluorescent material due to the relative advantage in luminous efficiency, making production cost, occupies most of market of illumination white light LEDs.

But, this technology path (blue chip adds yellow fluorescent material) owing to lacking red light portion in emission spectrum, mix white light LEDs processed color rendering index be usually less than 70.Current, optimization or the lifting of color rendering index is mainly carried out by following two aspects:

1st kind of method be by light filling red fluorescence material with yellow fluorescent material by chemistry or physical method is mixed is formed on same matrix or carrier, by fluorescence matrix or carrier be excited to excite altogether realize complementary color;

2nd kind of method arranges yellow fluorescence layer and red fluorescence layer respectively, realize complementary color by the successively stimulated emission of each fluorescence coating exciting the front of blue light to go out on light path.

In these two kinds of methods, the 1st kind of method, because gold-tinted and ruddiness two class luminescence center are at self luminescence feature, there are differences by matrix or carriers affect etc., causes the effect of red light filling and chronicity not very good; 2nd kind of method, owing to being arrange light filling redness in the main surface of emission direction of blue light, although can promote the color rendering index of ejecting white light, is difficult to significantly loss or the decline of avoiding exit luminous flux.

Summary of the invention

The technical problems to be solved in the utility model, is to provide a kind of light source module, can promote long-range encapsulation white light LEDs color rendering index.

The utility model is achieved in that a kind of light source module promoting long-range encapsulation white light LEDs color rendering index, comprise die bond substrate and yellow fluorescence layer, described die bond substrate is made up of the circuit base plate being fixed with a plurality of LED chip, it is characterized in that: also comprise red fluorescence coated body, this red fluorescence coated body is layed in the interval on circuit base plate between each LED chip, and described yellow fluorescence layer is covered on the top of die bond substrate.

Further, described yellow fluorescence layer is slab organization, and edge is fixed on circuit base plate by box dam, and fills a glue-line between red fluorescence coated body and LED chip.The light penetration of described glue-line within the scope of 200-800nm is not less than 60%; And its refractive index is 1.4-1.8.

Further, described yellow fluorescence layer is arcuate structure, and edge is bonded and fixed on circuit base plate, and fills a glue-line between red fluorescence coated body and LED chip.

Further, described yellow fluorescence layer is monolayer constructions will or laminated compound structure.

Further, described LED chip circular array or linear array distribution.

Further, described LED chip is horizontal structure, vertical stratification or inverted structure.

Further, described LED chip is the blue chip of main emission wavelength at 440-480nm, and described circuit base plate is ceramic substrate, metal substrate, class bore carbon base plate or Graphene substrate.

The utility model has the advantage of:

1, during utilization excites the side emergent light of chip and white light to encapsulate, retroreflection blue light is optical conversion luminous, realizes ruddiness complementary color;

2, by the relative concentration of institute's blending rouge and powder in adjustment red fluorescence material coating material, the adjustment to reflection to red light intensity is realized;

3, not only improve the color rendering index of transmitting white, and ensure that luminous flux and the light efficiency of transmitting white;

4, be directly applied to by red fluorescence material on the substrate of high heat conduction, ensure that the long-term stability of red light filling.

Accompanying drawing explanation

The utility model is further described with reference to the accompanying drawings in conjunction with the embodiments.

Fig. 1 is longitudinal sectional structure schematic diagram of the utility model light source module one embodiment.

Fig. 2 is longitudinal sectional structure schematic diagram of another embodiment of the utility model light source module.

Fig. 3 is the Facad structure schematic diagram of the die bond substrate in the utility model light source module.

Fig. 4 is the Facad structure schematic diagram of the die bond substrate after being equipped with red fluorescence coated body in the utility model.

Embodiment

Refer to shown in Fig. 1 and Fig. 2, the light source module promoting long-range encapsulation white light LEDs color rendering index of the present utility model, comprises die bond substrate 1 and yellow fluorescence layer 2, also comprises red fluorescence coated body 3.

Mainly as shown in Figure 3, described die bond substrate 1 is made up of the circuit base plate 12 being fixed with a plurality of LED chip 11, described LED chip 11 is the blue chip of main emission wavelength at 440-480nm, and described circuit base plate ceramic substrate, metal substrate, class can bore carbon base plate or Graphene substrate; Described LED chip 11 circular array or linear array distribution, and described LED chip 11 can be the LED chip of horizontal structure, vertical stratification or inverted structure.

Mainly as shown in Figure 4, described red fluorescence coated body 3 is layed in the interval on circuit base plate between each LED chip 11.Described red fluorescence powder 3 by red fluorescence powder material with mix glue coating and mix; Wherein, the excitation-emission light of red fluorescence powder material absorbable blue chip, and launch the utilizing emitted light of dominant wavelength 620-770nm, be preferably spherical class powder body material, characteristic diameter D50 is at 0.5-20 micron; Described mixing glue coating is epoxies or silicone based, and the relative blending concentration of described red fluorescence powder material is at 1%-75%.

Mainly as depicted in figs. 1 and 2, described yellow fluorescence layer 2 is covered on the top of die bond substrate 1, owing to being that non-immediate is coated on the LED chip 11 of array, is therefore remote light sources module.Described yellow fluorescence layer 2 can be slab organization, and edge is fixed on circuit base plate 12 by box dam 4, and between red fluorescence coated body 3 and LED chip 11, fill glue-line 5(structure as shown in Figure 1); Or be arcuate structure, edge is fixed by box dam or is directly fixed on circuit base plate 12, and between red fluorescence coated body 3 and LED chip 11, fill glue-line 5(structure as shown in Figure 2).Wherein, glue pours into by the glue filling opening 13 that circuit base plate 12 is preset and fills, and the light penetration of glue-line within the scope of 200-800nm is not less than 60%; And its refractive index is 1.4-1.8.Described yellow fluorescence layer 2 can be monolayer constructions will or laminated compound structure.

Making programme of the present utility model is as follows:

1-fixes array blue chip by die bond technique on circuit base plate, forms die bond substrate;

2-takes red fluorescence powder material, miscible in mixing glue coating under stirring, forms red fluorescence glue coating;

Red fluorescence glue coating by gluing process, is layed in the interval of chip chamber on die bond substrate, by solidifying to form red fluorescence coated body by 3-;

Yellow fluorescence layer is located on die bond substrate by box dam Technological cover by 4-, forms final light source module.

Although the foregoing describe embodiment of the present utility model; but be familiar with those skilled in the art to be to be understood that; specific embodiment described by us is illustrative; instead of for the restriction to scope of the present utility model; those of ordinary skill in the art, in the modification of the equivalence done according to spirit of the present utility model and change, should be encompassed in scope that claim of the present utility model protects.

Claims

1. one kind can promote the light source module of long-range encapsulation white light LEDs color rendering index, comprise die bond substrate and yellow fluorescence layer, described die bond substrate is made up of the circuit base plate being fixed with a plurality of LED chip, it is characterized in that: also comprise red fluorescence coated body, this red fluorescence coated body is layed in the interval on circuit base plate between each LED chip, and described yellow fluorescence layer is covered on the top of die bond substrate.

2. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 1, it is characterized in that: described yellow fluorescence layer is slab organization, edge is fixed on circuit base plate by box dam, and fills a glue-line between red fluorescence coated body and LED chip.

3. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 1, it is characterized in that: described yellow fluorescence layer is arcuate structure, edge is bonded and fixed on circuit base plate, and fills a glue-line between red fluorescence coated body and LED chip.

4. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 1, is characterized in that: described yellow fluorescence layer is monolayer constructions will or laminated compound structure.

5. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 1, is characterized in that: described LED chip circular array or linear array distribution.

6. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 5, is characterized in that: described LED chip is the LED chip of horizontal structure, vertical stratification or inverted structure.

7. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 1, it is characterized in that: described LED chip is the blue chip of main emission wavelength at 440-480nm, described circuit base plate is ceramic substrate, metal substrate, class brill carbon base plate or Graphene substrate.

8. a kind of light source module promoting long-range encapsulation white light LEDs color rendering index as claimed in claim 2, is characterized in that: the light penetration of described glue-line within the scope of 200-800nm is not less than 60%; And its refractive index is 1.4-1.8.