CN204843275U - A laser beam perforating cutting system for semi conducting material - Google Patents
A laser beam perforating cutting system for semi conducting material Download PDFInfo
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- CN204843275U CN204843275U CN201520549723.7U CN201520549723U CN204843275U CN 204843275 U CN204843275 U CN 204843275U CN 201520549723 U CN201520549723 U CN 201520549723U CN 204843275 U CN204843275 U CN 204843275U
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Abstract
The utility model discloses a laser beam perforating cutting system for semi conducting material, detect subsystem and industrial computer including laser light path subsystem, motion platform subsystem, vision positioning, laser light path subsystem comprises speculum, the focusing mirror locating the other laser instrument of speculum and locate the speculum below, vision positioning detect the subsystem by the display, same vertical on -line be located the speculum top formation of image lens cone and camera, be located the speculum below focusing mirror and locate the other light of focusing mirror and constitute, the camera passes through the formation of image lens cone with the speculum links to each other, the speculum can reflect the laser light source printing opacity that also can form images. The utility model discloses an in the motion process to semi conducting material carry on that laser locking is punched, multiple functions in an organic wholes such as morpheme error -detecting, laser cutting are beaten again, are punched to machine vision location secondary, can realize that semi conducting material gets through hole and blind hole, laser cutting, visual detection multiple functions in the motion process.
Description
Technical field
The utility model belongs to semi-conducting material technical field of processing equipment, particularly relates to a kind of laser boring cutting equipment of semi-conducting material.
Background technology
Along with the arrival of information age, the industries such as electronic information, communication, semiconductor integrated circuit and high-power electric and electronic obtain fast development, semi-conducting material is used widely, demand is increasing, one of the through hole of semi-conducting material and blind hole key operation creating chip manufacturing, in wafer fabrication techniques and technique to through hole and manufacture efficiency blindly and position accuracy demand more and more higher.
There is the techniques such as efficiency is extremely low, machined material needs good electric conductivity restriction in traditional electric-spark drilling technology, cannot enhance productivity in actual production.Adopt the method for chemical attack also can not solve the manufacture of the large aspect ratio micropore of diameter less than 50 microns degree of depth more than 500 microns.Therefore significantly limit the making of through hole, blind hole in wafer manufacture.Therefore, these electric-spark drillings, chemical attack perforate cannot be solved the problem completely by the optimization of technique self, need the bottleneck taking new processing mode to solve the manufacture of semi-conducting material micropore badly, industry replaces conventional method in the urgent need to a kind of high accuracy, high-quality and efficient capillary processing method.
Utility model content
For this reason, the utility model provides a kind of laser boring diced system for semi-conducting material that can carry out high accuracy, high-quality and efficient capillary processing and cutting on semi-conducting material, to overcome the deficiency that prior art exists.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
For a laser boring diced system for semi-conducting material, comprise laser optical path subsystem, motion platform subsystem, vision detection and localization subsystem and industrial computer;
Described laser optical path subsystem is made up of speculum, the laser instrument being located at speculum side and the focus lamp be located at below speculum;
Described motion platform subsystem by X/Y axle superimposed motion platform, be located at θ axle rotation platform on X/Y axle superimposed motion platform and drive the Z axis lifting regulating mechanism of focus lamp to form, described focus lamp is positioned at above described θ axle rotation platform, towards described θ axle rotation platform;
Described vision detection and localization subsystem by display, on same vertical curve, be positioned at imaging lens barrel above speculum and camera, the illuminating lamp that is positioned at the described focus lamp below described speculum and is located at focus lamp other forms, described camera is connected with described speculum by imaging lens barrel; Described speculum also can carry out imaging source printing opacity by reflects laser;
Described X/Y axle superimposed motion platform, described θ axle rotation platform, described laser instrument, described camera are all electrically connected with described industrial computer, and described industrial computer is also electrically connected described display.
Described X/Y axle superimposed motion platform adopts linear electric motors or servomotor or driving stepper motor, and described θ axle rotation platform adopts turbine and worm mechanism or synchronous wheel belt mechanism or DD motor direct drive mechanism to drive; Described Z axis lifting regulating mechanism adopts motorized adjustment or spiral micrometer head manual adjustments.
In preferred embodiment of the present utility model, described X/Y axle superimposed motion platform adopts linear electric motors to drive; Described θ axle rotation platform adopts DD motor direct drive mechanism to drive; Described Z axis lifting regulating mechanism adopts spiral micrometer head manual adjustments.
In the utility model, described X/Y axle superimposed motion platform and θ axle rotation platform all have grating scale, and described grating scale is electrically connected with described industrial computer.
In utility model, above θ axle rotation platform, be provided with the blowning installation coaxial with described focus lamp, take out dirt device other being provided with of the camera lens of described focus lamp towards described θ axle rotation platform upper surface.In drill process, be aided with air blowing, by the overburden blowout in drill process, dirt device can be taken out and in time the overburden produced during punching is siphoned away.
Described θ axle rotation platform is provided with vacuum absorbing platform, and described industrial computer is also electrically connected with the vacuum switch of described vacuum absorbing platform.
Adopt technique scheme, the utility model is applicable to diode, controllable silicon, the laser boring of large power semiconductor device and cutting.Motion platform is carried out orbiting motion by the program of setting by industrial computer, and controls the switch of laser in motion process simultaneously, can realize the laser boring of through hole, blind hole, during continuous bright dipping, then can realize cutting function; Vision detection and localization subsystem, can measure the silicon chip after punching or cutting and Form and position error detects.
Described X/Y axle superimposed motion platform is fixed on marble countertop.Described marble countertop is fixed on base, and described industrial computer is positioned at described chassis interior.
The utility model achieve in motion process laser synchronization punching is carried out to semi-conducting material, machine vision location secondary is beaten again, the several functions such as Form and position error detections, laser cutting that punch in integrally, semi-conducting material can be realized in motion process, get through hole and blind hole, laser cutting, vision-based detection several functions.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail:
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
As shown in Figure 1, the laser boring diced system for semi-conducting material of the present utility model, comprises base 12, marble countertop 11, laser optical path subsystem, motion platform subsystem, vision detection and localization subsystem and industrial computer.
Wherein, laser optical path subsystem is made up of speculum 4, the laser instrument 1 being located at speculum 4 side and the focus lamp 9 be located at below speculum 4.Laser instrument 1 is an infrared laser, is preferably fiber pulse laser.
Motion platform subsystem is made up of X/Y axle superimposed motion platform 8, θ axle rotation platform 10 and Z axis lifting regulating mechanism 5.
Marble countertop 11 is fixed on base 12, and it is inner that industrial computer 14 is positioned at base 12.8, X/Y axle superimposed motion platform is fixed on marble countertop 11, and θ axle rotation platform 10 is positioned on X/Y axle superimposed motion platform 8.
Marble countertop 11 is also fixed with cantilever shalving 111, and 1, laser instrument is fixed on the top of this cantilever shalving.Focus lamp 9 is positioned at above θ axle rotation platform 10, be fixed on and on the Z axis lifting regulating mechanism 5 of up-down adjustment, can realize focusing function.Rapidoprint is fixed on θ axle rotation platform 10 upper surface.Laser instrument 1 penetrates pulsed laser beam, laser beam enter speculum 4 carry out 45 degree catadioptric after enter focus lamp 9.Different according to the thickness of rapidoprint, laser spot adjusted on the surface of rapidoprint, laser is pooled the light spot focus that diameter is 40 to 100um by focus lamp 9, and focus energy density high concentration, can improve working (machining) efficiency to greatest extent.
X/Y axle superimposed motion platform 8 adopts linear electric motors or servomotor or driving stepper motor.θ axle rotation platform 10 adopts turbine and worm mechanism or synchronous wheel belt mechanism or DD motor direct drive mechanism to drive.Z axis lifting regulating mechanism 5 adopts motorized adjustment or spiral micrometer head manual adjustments.
In the present embodiment, X/Y axle superimposed motion platform 8 adopts linear electric motors to drive; θ axle rotation platform 10 adopts DD motor direct drive mechanism to drive; Z axis lifting regulating mechanism 5 adopts spiral micrometer head manual adjustments.
Vision detection and localization subsystem by display 13, the illuminating lamp 7 that is positioned at camera 2 above speculum 4 on same vertical curve, is positioned at the focus lamp 9 below speculum 4 and is located at focus lamp other forms, camera 2 connects speculum 4 by imaging lens barrel 3.Speculum 4 is coated with different rete, also can carry out imaging source printing opacity by reflects laser.Illuminating lamp 7 adopts LED.
Above θ axle rotation platform 10, be provided with the blowning installation coaxial with focus lamp 9, take out dirt device 6 other being provided with of the camera lens of focus lamp 9 towards θ axle rotation platform 10 upper surface.This is taken out dirt device 6 and is one and takes out ash pipe, and this is taken out ash pipe and is connected with the aspiration of negative pressure equipment.In drill process, be aided with air blowing, by the overburden blowout in drill process, dirt device 6 can be taken out and in time the overburden produced during punching is siphoned away.
X/Y axle superimposed motion platform 8, θ axle rotation platform 10, laser instrument 1, camera 2 are all electrically connected with industrial computer 14, and industrial computer 14 is also electrically connected display 13.
θ axle rotation platform 10 is provided with vacuum absorbing platform 101, and industrial computer is also electrically connected with the vacuum switch of this vacuum absorbing platform, can be controlled the switch of vacuum by software.The semi-conducting material that will process is adsorbed on the upper surface of θ axle rotation platform, guarantees that machined material does not produce displacement during working motion, guarantees the precision of processing.
X/Y axle superimposed motion platform 8 and θ axle rotation platform 10 all have grating scale, and grating scale is electrically connected with described industrial computer 14.Particularly, the grating scale on X/Y axle superimposed motion platform 8 is linear grating chi, and the grating scale on θ axle rotation platform is Circular gratings chi.
It is exactly more than the laser boring diced system for semi-conducting material of the present utility model.
Due to semi-conducting material functional requirement, pitch of holes and the track of perforated material have notable difference, therefore need to be distinguished in software design patterns, to adopt man-hour different laser parameters, kinematic parameter and CCD positional parameter to punch carrying out adding, these downhole parameter mainly comprise: laser frequency, laser power, trepanning velocity, material thickness, the scribing degree of depth and positional punch mode etc.
Before punching, first start hardware power, Laser Power Devices, open gas source switch, restart industrial computer, open punching software, software can carry out Auto-Sensing to current state, if any exception, system is pointed out, and after opening software, selects and editor's punching trace graphics, reset the parameters such as the laser frequency in control software design program, laser power, trepanning velocity, material thickness, the punching degree of depth, pitch of holes, and the parameter such as positional punch.
Then, and by domain import system control software design, add man-hour, motion platform can carry out orbiting motion according to the domain path imported, and controls laser opening and closing simultaneously, semi-conducting material punches.After having punched, machine vision alignment system is utilized to carry out position, hole accuracy detection.
The complement hole of perforated material and secondary override interrupt: before carrying out complement or strike-on, first need to carry out machine vision location to perforated material.When in lighting source illumination to semi-conducting material, produce reflection, reverberation is by becoming directional light after focus lamp, and directional light penetrate through reflective mirror, focuses on after entering imaging cylinder mirror on camera imaging chip, by adjusting position and the angle of camera, focal position of laser can be imaged onto on camera target center, realize laser coaxial with imaging, be adjusted to picture cylinder mirror, change over picture enlargement ratio, until be applicable to the multiplying power of positioning requirements.Directly observed by display screen, coordinate mobile X Y-axis and rotate θ axle rotation platform, by material angle and position correction, position complement and secondary is beaten again.After having punched, detect.
Laser scribing: directly by display screen, CCD cross target center is aimed at reserved cutting channel center, by the comparison to two positions about cutting-up road, calculate the misalignment angle of Cutting Road and screen datum line, by rotating θ axle rotation platform, wafer is rotated to correct angle, the more automatic line of cut by Cutting Road delivers to focal position, press software program again, source, laser apparatus is set to continuous bright dipping, carries out orbiting motion, complete scribing.
Pass through foregoing detailed description, can find out, the utility model achieve in motion process laser synchronization punching is carried out to semi-conducting material, machine vision location secondary is beaten again, the several functions such as Form and position error detections, laser cutting that punch in integrally, semi-conducting material can be realized in motion process, get through hole and blind hole, laser cutting, vision-based detection several functions.
Claims (10)
1., for a laser boring diced system for semi-conducting material, comprise laser optical path subsystem, motion platform subsystem, vision detection and localization subsystem and industrial computer;
Described laser optical path subsystem is made up of speculum, the laser instrument being located at speculum side and the focus lamp be located at below speculum;
Described motion platform subsystem by X/Y axle superimposed motion platform, be located at θ axle rotation platform on X/Y axle superimposed motion platform and drive the Z axis lifting regulating mechanism of focus lamp to form, described focus lamp is positioned at above described θ axle rotation platform, towards described θ axle rotation platform;
Described vision detection and localization subsystem by display, on same vertical curve, be positioned at imaging lens barrel above speculum and camera, the illuminating lamp that is positioned at the described focus lamp below described speculum and is located at focus lamp other forms, described camera is connected with described speculum by described imaging lens barrel; Described speculum also can carry out imaging source printing opacity by reflects laser;
Described X/Y axle superimposed motion platform, described θ axle rotation platform, described laser instrument, described camera are all electrically connected with described industrial computer, and described industrial computer is also electrically connected described display.
2. the laser boring diced system for semi-conducting material according to claim 1, it is characterized in that: described X/Y axle superimposed motion platform adopts linear electric motors or servomotor or driving stepper motor, and described θ axle rotation platform adopts turbine and worm mechanism or synchronous wheel belt mechanism or DD motor direct drive mechanism to drive; Described Z axis lifting regulating mechanism adopts motorized adjustment or spiral micrometer head manual adjustments.
3. the laser boring diced system for semi-conducting material according to claim 2, is characterized in that: described X/Y axle superimposed motion platform adopts linear electric motors to drive; Described θ axle rotation platform adopts DD motor direct drive mechanism to drive; Described Z axis lifting regulating mechanism adopts spiral micrometer head manual adjustments.
4. the laser boring diced system for semi-conducting material according to claim 1, is characterized in that: described X/Y axle superimposed motion platform and θ axle rotation platform all have grating scale, and described grating scale is electrically connected with described industrial computer.
5. the laser boring diced system for semi-conducting material according to claim 1, is characterized in that: be provided with the blowning installation coaxial with described focus lamp above θ axle rotation platform.
6. the laser boring diced system for semi-conducting material according to claim 5, is characterized in that: the camera lens of described focus lamp is other to be provided with and to take out dirt device towards described θ axle rotation platform upper surface.
7. the laser boring diced system for semi-conducting material according to claim 1, is characterized in that: described θ axle rotation platform is provided with vacuum absorbing platform, and described industrial computer is also electrically connected with the vacuum switch of described vacuum absorbing platform.
8. the laser boring diced system for semi-conducting material according to claim 1, is characterized in that: described X/Y axle superimposed motion platform is fixed on marble countertop.
9. the laser boring diced system for semi-conducting material according to claim 8, it is characterized in that: described marble countertop is fixed on base, described industrial computer is positioned at described chassis interior.
10. the laser boring diced system for semi-conducting material according to claim 1, is characterized in that: described laser instrument is fiber pulse laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520549723.7U CN204843275U (en) | 2015-07-27 | 2015-07-27 | A laser beam perforating cutting system for semi conducting material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520549723.7U CN204843275U (en) | 2015-07-27 | 2015-07-27 | A laser beam perforating cutting system for semi conducting material |
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| CN204843275U true CN204843275U (en) | 2015-12-09 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN105665945A (en) * | 2016-04-22 | 2016-06-15 | 大族激光科技产业集团股份有限公司 | Glass pipe laser drilling device and drilling method |
| CN106181046A (en) * | 2016-09-08 | 2016-12-07 | 泉州惠安博派信息技术有限公司 | A kind of laser cutting device |
| CN106425178A (en) * | 2016-09-27 | 2017-02-22 | 华南理工大学 | Automatic welding system and automatic welding method for complicated special-shaped work piece |
| CN108098163A (en) * | 2016-11-24 | 2018-06-01 | 蓝思科技（长沙）有限公司 | The method and its equipment of use that display screen laser spiles before a kind of pressurization |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
| CN111299873A (en) * | 2019-12-25 | 2020-06-19 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Positioner is used in laser-beam drilling machine production |
| CN111421250A (en) * | 2020-05-15 | 2020-07-17 | 深圳市圭华智能科技有限公司 | Semiconductor wafer laser cutting machine |
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2015
- 2015-07-27 CN CN201520549723.7U patent/CN204843275U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN105665945A (en) * | 2016-04-22 | 2016-06-15 | 大族激光科技产业集团股份有限公司 | Glass pipe laser drilling device and drilling method |
| CN105665945B (en) * | 2016-04-22 | 2019-04-12 | 大族激光科技产业集团股份有限公司 | A kind of glass tube laser drilling device and its drilling method |
| CN106181046A (en) * | 2016-09-08 | 2016-12-07 | 泉州惠安博派信息技术有限公司 | A kind of laser cutting device |
| CN106425178A (en) * | 2016-09-27 | 2017-02-22 | 华南理工大学 | Automatic welding system and automatic welding method for complicated special-shaped work piece |
| CN106425178B (en) * | 2016-09-27 | 2018-06-22 | 华南理工大学 | A kind of complicated abnormal shape workpiece robot welding system and method |
| CN108098163A (en) * | 2016-11-24 | 2018-06-01 | 蓝思科技（长沙）有限公司 | The method and its equipment of use that display screen laser spiles before a kind of pressurization |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
| CN111299873A (en) * | 2019-12-25 | 2020-06-19 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Positioner is used in laser-beam drilling machine production |
| CN111421250A (en) * | 2020-05-15 | 2020-07-17 | 深圳市圭华智能科技有限公司 | Semiconductor wafer laser cutting machine |
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