CN1979821A - Radiating module - Google Patents
Radiating module Download PDFInfo
- Publication number
- CN1979821A CN1979821A CNA2005101021078A CN200510102107A CN1979821A CN 1979821 A CN1979821 A CN 1979821A CN A2005101021078 A CNA2005101021078 A CN A2005101021078A CN 200510102107 A CN200510102107 A CN 200510102107A CN 1979821 A CN1979821 A CN 1979821A
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- China
- Prior art keywords
- heat
- heat transfer
- transfer part
- radiation module
- plate body
- Prior art date
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat elimination module includes heat pipe, fastener combined to evaporation end of heat pipe, and heat elimination fins combined to condensation end of heat pipe. The fastener includes a heat transfer part, and fixed part extended from the heat transfer part. One surface of the heat transfer part is jointed to the evaporation end of heat pipe, and the other related surface is in use for contacting a heating element.
Description
[technical field]
The invention relates to a kind of heat radiation module, particularly about a kind of heat radiation module of heat-generating electronic elements.
[background technology]
Existing heat radiation module generally comprises absorber plate, heat pipe and some radiating fins, the heat-generating electronic elements that this absorber plate and is located on the circuit board fits, to absorb the heat that heat-generating electronic elements produces, and with this heat transferred heat pipe, conduct to radiating fin by heat pipe, heat is distributed by radiating fin.
This heat pipe generally is arranged in the groove of offering on the absorber plate, or is fixed on the absorber plate by a fixture.Existingly a kind ofly heat pipe is fixed to fixture on the absorber plate comprises that one is attached at the cover plate on the absorber plate and is fixed to four elastic arms of four jiaos of this cover plates.This cover plate middle part is bent to form one " ㄇ " shape projection, and the accepting groove of this heat pipe is accommodated in formation one on this cover plate.Described elastic arm is to extending absorber plate away from this protruding position.
This heat radiation module is pushed cover plate and absorber plate by fixedly making this elastic arm generation strain between described elastic arm and the circuit board downwards to produce active force, makes between absorber plate and heater element contact well.
But the distortion of this fixture mainly concentrates on the engaging zones between elastic arm and cover plate, the position that promptly close absorber plate is four jiaos, make this active force mainly concentrate on four jiaos of absorber plates, and make the suffered active force in absorber plate middle part less, thereby making absorber plate is that fulcrum deforms with two relative edges of heater element, the middle part and the heater element of absorber plate are separated, influence engaging between heater element and absorber plate, increase the thermal resistance value between heater element and absorber plate, reduce heat and pass effect, under this kind situation, the heat biography effect between them is significantly promoted even between heater element and absorber plate, fill heat-conducting medium.
[summary of the invention]
In view of this, be necessary to provide the heat radiation module of the less thermal resistance of a kind of tool.
A kind of heat radiation module, buckling piece that comprise heat pipe, combines and the radiating fin that combines with the condensation end of heat pipe with the evaporation ends of heat pipe, this buckling piece comprises a heat transfer part and the fixed part that extends from heat transfer part, a surface of this heat transfer part engages with the evaporation ends of this heat pipe, and its another apparent surface is used for contacting with a heater element.
This buckling piece is fixed on the circuit board by fixed part, the surface and the heater element of described heat transfer part are fitted tightly, this heat transfer part can be directly conducted to the heat pipe place with the heat that heater element produces, with the heat transferred radiating fin, make this heat radiation module have less thermal resistance value by heat pipe because of not needing that absorber plate is set in addition.
[description of drawings]
Be further described in conjunction with the embodiments with reference to the accompanying drawings:
Fig. 1 is the stereogram of this heat radiation module first embodiment;
Fig. 2 is the stereogram of this heat radiation module second embodiment;
Fig. 3 is the stereogram of this heat radiation module the 3rd embodiment.
[embodiment]
As shown in Figure 1, this heat radiation module 10 is used for a heater element 21 that is arranged on the circuit board 20 is dispelled the heat, and comprises buckling piece 12, heat pipe 14 and some radiating fins 16.The evaporation ends 141 of this heat pipe 14 is welded in buckling piece 12 tops, and its condensation end 142 contacts with described radiating fin 16.
This buckling piece 12 is fixed on the circuit board 20, comprises the heat transfer part 121 of a lengthwise and is located at two fixed parts 122 at heat transfer part 121 two ends.
This heat transfer part 121 is made by the metal of tool thermal conductive resins such as copper, silver, is used for contacting with the evaporation ends 141 of heater element 21 and heat pipe 14, and the heat transferred that heater element 21 is produced is to heat pipe 14.The middle part of this heat transfer part 121 bends downwards, forms one at heat transfer part 121 middle parts and points to the projection of heater element 21, and make these heat transfer part 121 both sides away from this heater element 21, keeps at a certain distance away along direction and heater element 21 perpendicular to heater element 21.This projection comprises that the base plate 121a that fits with heater element 21 reaches by this base plate 121a two ends to the sidewall 121b that extends away from the direction of heater element 21.
This fixed part 122 is welded in the free end of the sidewall 121b of heat transfer part 121, by thermal conductivity than heat transfer part 121 low the and better flexible material of tool make, in the present embodiment, the material of fixed part 122 is a steel.This fixed part 122 comprises by 2 first plate body 122a of heat transfer part 121 two ends longitudinal extensions and by the vertically extending 2 second plate body 122b of the free end of the described first plate body 122a, makes this buckling piece 12 roughly be one " worker " shape structure.Each second plate body 122b two ends is provided with through hole as shown in Figure 2, is used to wear retaining elements 123 such as screw, rivet, and buckling piece 12 is fixed on the circuit board 20.When fixing this buckling piece 12, described retaining element 123 will apply certain active force to buckling piece 12, the strain of this active force by buckling piece 12 is passed to around the base plate 121a of heat transfer part 121 of buckling piece 12, and then be passed to the central part of heat transfer part 121, buckling piece 12 closely is attached on the heater element 21.
In the foregoing description, because the area of the base plate 121a of heat transfer part 121 is less than the area of absorber plate in the prior art, therefore, can reduce around the base plate 121a of heat transfer part 121 distance with base plate 121a center, more easily make retaining element 123 put on force transmission on the buckling piece 12 to heat transfer part 121 centers, help the concentrated distribution of power, reach and make heat transfer part 121 and the purpose that heater element 21 fully contacts, improve the radiating effect of this heat radiation module 10; The moment that reduces to make retaining element 123 put on the active force at base plate 121a center with base plate 121a centre distance around the base plate 121a of this heat transfer part 121 reduces, therefore, under same function power, the deflection at this base plate 121a center reduces, thereby 21 of heat transfer part 121 and heater elements are contacted well; The structure of this buckling piece 12 is simple in structure than fixture in the prior art, can effectively reduce the shared space of this buckling piece 12, to reduce the volume of this heat radiation module 10, meets the trend that the volume of electronic component reduces day by day; And this buckling piece 12 has heat conduction concurrently and fixes two kinds of effects, can omit the absorber plate in the existing heat radiation module 10, reduces the thermal resistance of this heat radiation module 10, improves its heat dispersion.
As shown in Figure 2, the present invention can not need be provided with the second plate body 122b, only offers a through hole 124 ' on the first plate body 122a ', also heater element 21 can be fixed on the circuit board 20.
As shown in Figure 3, fixed part 122 of the present invention " vertical this 2 second plate body 122b of connection can further be set " the 3rd plate body 122c, and respectively at each second plate body 122b " offer a through hole 124 with the 3rd plate body 122c ", these three through holes 124 " be that the center is symmetrically distributed with the mid point of this heater element 21, make to be arranged in through hole 124 " in retaining element 123 put on the trying hard to keep weighing apparatus that maintains an equal level on the heater element 21.
Claims (10)
- One kind the heat radiation module, buckling piece that comprise heat pipe, combines and the radiating fin that combines with the condensation end of heat pipe with the evaporation ends of heat pipe, it is characterized in that: this buckling piece comprises a heat transfer part and the fixed part that extends from heat transfer part, a surface of this heat transfer part engages with the evaporation ends of this heat pipe, and its another apparent surface is used for contacting with a heater element.
- 2. heat radiation module as claimed in claim 1 is characterized in that: the thermal conductivity of this heat transfer part is higher than the thermal conductivity of fixed part.
- 3. heat radiation module as claimed in claim 2 is characterized in that: the material of this heat transfer part and fixed part is respectively copper and steel.
- 4. heat radiation module as claimed in claim 2 is characterized in that: this fixed part is welded on the heat transfer part.
- 5. heat radiation module as claimed in claim 1 is characterized in that: this fixed part is by the bearing of trend setting along heat transfer part of the two ends of this heat transfer part.
- 6. heat radiation module as claimed in claim 1 is characterized in that: this fixed part is provided with some through holes, and described through hole is used to wear retaining element so that this heater element is fixed to a circuit board.
- 7. heat radiation module as claimed in claim 6 is characterized in that: this fixed part comprises 2 first plate bodys of being located at the heat transfer part both sides, on described first plate body through hole is set respectively.
- 8. heat radiation module as claimed in claim 6 is characterized in that: this fixed part comprises that 2 first plate bodys of being located at the heat transfer part both sides reach by vertically extending second plate body of the free end of each first plate body, and each second plate body two ends is provided with a through hole respectively.
- 9. heat radiation module as claimed in claim 6, it is characterized in that: this fixed part comprises first plate body of being located at the heat transfer part both sides, by vertically extending 2 second plate bodys of the free end of described first plate body and vertical the 3rd plate body that connects described second plate body, on described second and third plate body a through hole is set respectively.
- 10. heat radiation module as claimed in claim 9 is characterized in that: described through hole is that the center is symmetrically distributed with this heater element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101021078A CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101021078A CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979821A true CN1979821A (en) | 2007-06-13 |
| CN100454524C CN100454524C (en) | 2009-01-21 |
Family
ID=38130921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101021078A Expired - Fee Related CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100454524C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025119A (en) * | 2011-09-22 | 2013-04-03 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN107529319A (en) * | 2017-09-01 | 2017-12-29 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6373700B1 (en) * | 2001-06-18 | 2002-04-16 | Inventec Corporation | Heat sink modular structure inside an electronic product |
| JP3637304B2 (en) * | 2001-11-29 | 2005-04-13 | 株式会社東芝 | Small electronic equipment |
| TW564007U (en) * | 2003-03-19 | 2003-11-21 | Quanta Comp Inc | Fixing structure for thermal module |
-
2005
- 2005-12-01 CN CNB2005101021078A patent/CN100454524C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025119A (en) * | 2011-09-22 | 2013-04-03 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN107529319A (en) * | 2017-09-01 | 2017-12-29 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100454524C (en) | 2009-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FU RUI PRECISION COMPONENT (KUNSHAN) CO., LTD. Free format text: FORMER OWNER: QUASI-FU PRECISION INDUSTRY ( SHENZHEN ) CO., LTD. Effective date: 20090612 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090612 Address after: 635, Foxconn Road, hi tech Industrial Development Zone, Kunshan Development Zone, Kunshan, Jiangsu. Zip code: 215316 Co-patentee after: Foxconn Precision Industry Co., Ltd. Patentee after: Furui precision component (Kunshan) Co., Ltd. Address before: 7, 8, 98 industrial town, Wanfeng village, Baoan District, Sha town, Shenzhen, Guangdong Province: zip code: 518104 Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Rich quasi Precision Industry (Shenzhen) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090121 Termination date: 20141201 |
|
| EXPY | Termination of patent right or utility model |