CN105611804B - Heat conductive pad, radiator and electronic product - Google Patents
Heat conductive pad, radiator and electronic product Download PDFInfo
- Publication number
- CN105611804B CN105611804B CN201511025383.9A CN201511025383A CN105611804B CN 105611804 B CN105611804 B CN 105611804B CN 201511025383 A CN201511025383 A CN 201511025383A CN 105611804 B CN105611804 B CN 105611804B
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- Prior art keywords
- heat
- conducting plate
- thermally conductive
- conductive pad
- radiator
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat conductive pads, the heat conductive pad includes the first heat-conducting plate, the second heat-conducting plate and multiple thermally conductive sheets, the multiple thermally conductive sheet, which is located in, to be stacked on one another between first heat-conducting plate and second heat-conducting plate being oppositely arranged, and the multiple thermally conductive sheet arranges independently of one another and forms the thermally conductive pathways of multiple parallel connections, is conducted with realizing thermal energy between first heat-conducting plate and second heat-conducting plate.Invention additionally discloses a kind of radiators and a kind of electronic product including above-mentioned heat conductive pad.The heat conductive pad thermal resistance of the present invention, heating conduction is high, can satisfy the radiating requirements of high-power chip.
Description
Technical field
The present invention relates to the technical field of heat dissipation of electronic product, in particular to thermally conductive mat structure.
Background technique
In electronic radiation field, when different chips use the same radiator, since the height of different chips exists not
Unanimously, will lead to different chips cannot simultaneously with radiator plane contact.In order to solve as chip height it is inconsistent caused by
The tolerance of height is often inhaled between chip and radiator added with certain elastic and thickness heat conductive pad (or thermally conductive gel)
Receive tolerance.
The capacity of heat transmission of common heat conductive pad or thermally conductive gel is limited at present, and common heat conductive pad generally makes on low power devices
With for high power device, the temperature difference caused by common heat conductive pad is too big, is unable to meet demand.It is existing commonly use it is thermally conductive
Thermal coefficient is padded generally at 2w/m DEG C or so, for the common heat conductive pad of 40mm*40mm*3mm, thermal resistance is general are as follows: R=0.67
℃/w.The chip for being 100w for a power P, it is assumed that 100w heat all passes through common heat conductive pad, then caused by heat conductive pad
Temperature rise is general are as follows: T=67 DEG C of Δ.So high temperature rise, it is often unacceptable for electronic radiation field.
Summary of the invention
The present invention provides a kind of heat conductive pad and radiator that the capacity of heat transmission is high, and the heat dissipation that can satisfy high-power chip needs
It asks.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
In a first aspect, the present invention provides a kind of heat conductive pad, the heat conductive pad includes the first heat-conducting plate, the second heat-conducting plate and more
A thermally conductive sheet, the multiple thermally conductive sheet are located in first heat-conducting plate and second heat-conducting plate for being stacked on one another and being oppositely arranged
Between, and the multiple thermally conductive sheet arranges independently of one another and forms the thermally conductive pathways of multiple parallel connections, to realize thermal energy described
It is conducted between one heat-conducting plate and second heat-conducting plate.
In the first possible embodiment of first aspect, first heat-conducting plate, second heat-conducting plate and institute
The material for stating multiple thermally conductive sheets is metal or the non-metallic material with the capacity of heat transmission.
The possible embodiment of with reference to first aspect the first, in second of possible embodiment of first aspect
In, each thermally conductive sheet includes bending part and the first end and second end positioned at the bending part both ends, the first end
It is connected to first heat-conducting plate, the second end is connected to second heat-conducting plate, and the bending part has elastic deformability,
To adjust the vertical range between first heat-conducting plate and second heat-conducting plate.
The possible embodiment of second with reference to first aspect, in the third possible embodiment of first aspect
In, the bending part is in " C " shape or " < " shape or serpentine or " O shape " or " Z-shaped ".
The possible embodiment of second with reference to first aspect, in the 4th kind of possible embodiment of first aspect
In, the heat conductive pad further includes limited post, one end of the limited post be connected to first heat-conducting plate in face of described second
The surface of heat-conducting plate forms interval between the other end of the limited post and second heat-conducting plate.
The 4th kind of possible embodiment with reference to first aspect, in the 5th kind of possible embodiment of first aspect
In, first heat-conducting plate is parallel to second heat-conducting plate, and the limited post is perpendicular to first heat-conducting plate.
The possible embodiment of any one of the above with reference to first aspect, in the 6th kind of possible embodiment party of first aspect
In formula, the thermally conductive sheet is flaky, and the thickness of the thermally conductive sheet is less than or equal to 0.2mm.
Second aspect, the present invention provide a kind of radiator, and the radiator includes heat conductive pad described in first aspect and dissipates
Hot fin, the radiating fin are connected to the side away from first heat-conducting plate of second heat-conducting plate.
In the first possible embodiment of second aspect, the radiating fin is integrated with second heat-conducting plate
Molding structure.
The third aspect, the present invention provide a kind of electronic product, and the electronic product includes circuit board, are set to the circuit board
On euthermic chip and the radiator as described in second aspect, first heat-conducting plate of the radiator and the euthermic chip
Directly heat-conducting medium is filled between contact or first heat-conducting plate and the euthermic chip of the radiator.
Heat conductive pad provided by the invention is located in described first for being stacked on one another and being oppositely arranged by the multiple thermally conductive sheet
Between heat-conducting plate and second heat-conducting plate, the thermally conductive pathways of multiple parallel connections are formed, to realize thermal energy in first heat-conducting plate
It is conducted between second heat-conducting plate.The thermally conductive pathways of multiple parallel connections are independent of one another, that is, are phase each other between multiple thermally conductive sheets
Mutual independent thermal dissipating path, such parallel configurations reduce the thermal resistance of whole heat conductive pad, to realize dynamical thermally conductive
Effect.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is the schematic diagram for the heat conductive pad that one embodiment of the present invention provides.
Fig. 2 is heat conductive pad partial enlargement diagram shown in FIG. 1.
Fig. 3 is the thermal resistance distribution schematic diagram for the heat conductive pad that one embodiment of the present invention provides.
Heat transfer side of the Fig. 4 between one embodiment of the present invention heat conductive pad provided and the euthermic chip of electronic product
Face schematic diagram.
Heat transfer elevational schematic view of the Fig. 5 between heat conductive pad shown in Fig. 4 and the euthermic chip of electronic product.
Fig. 6 is the heat transfer schematic diagram in the electronic product that one embodiment of the present invention provides.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
Fig. 1 and Fig. 2 are please referred to, the present invention provides a kind of heat conductive pad, and the heat conductive pad is led including the first heat-conducting plate 12, second
Hot plate 14 and multiple thermally conductive sheets 16, the multiple thermally conductive sheet 16 are located in first heat-conducting plate 12 for being stacked on one another and being oppositely arranged
Between second heat-conducting plate 14, and the thermally conductive road of multiple parallel connections is arranged and formed independently of one another to the multiple thermally conductive sheet 16
Diameter is conducted with realizing thermal energy between first heat-conducting plate 12 and second heat-conducting plate 14.
The material of first heat-conducting plate 12, second heat-conducting plate 14 and the multiple thermally conductive sheet 16 is metal or has
The non-metallic material (such as graphite) of the capacity of heat transmission.The multiple thermally conductive sheet 16 can by a kind of metal or various metals, or
Other the nonmetallic of high thermal conductivity system are composed.
Specifically, each thermally conductive sheet 16 is including bending part 166 and positioned at the first of 166 both ends of bending part
End 162 and second end 164.The first end 162 is connected to first heat-conducting plate 12, and the second end 164 is connected to described
Second heat-conducting plate 14.It can be fixed by way of welding, being bonded between first end 162 and the first heat-conducting plate 12, it can also be
Jack is set on first heat-conducting plate 12, first end 162 is caught in jack to realize consolidating for first end 162 and the first heat-conducting plate 12
Fixed connection, connection type between second end 164 and the second heat-conducting plate 14 can with reference to first end 162 and the first heat-conducting plate 12 it
Between fixed form.In a kind of embodiment, first end 162 can be fixedly attached to the first heat-conducting plate 12, second end 164 with
Second heat-conducting plate 14 directly contacts installation into electronic product, that is to say, that without solid between second end 164 and the second heat-conducting plate 14
Determine connection structure, further by the euthermic chip and radiator that are mounted on heat conductive pad on the circuit board in electronic product it
Between, by being fixedly connected for radiator and circuit board, realize the positioning between second end 164 and the second heat-conducting plate 14.Alternatively, will
Second end 164 is fixedly attached to the second heat-conducting plate 14, and without fixed connection structure between first end 162 and the first heat-conducting plate 12,
Specific positioning method is same as above.
The bending part 166 has elastic deformability, to adjust first heat-conducting plate 12 and second heat-conducting plate 14
Between vertical range.When heat conductive pad is mounted in electronic product, it is pressurized between the first heat-conducting plate 12 and the second heat-conducting plate 14
Power is close to each other, so that flexible deformation occurs for the bending part 166 of thermally conductive sheet 16.Such design, so that the size of heat conductive pad can
With adjustment, that is to say, that distance is variable between the first heat-conducting plate 12 and the second heat-conducting plate 14, is mounted in electronic product, can
Location tolerance not only can be absorbed by the size adjustable of heat conductive pad, heat conductive pad applicability can also be improved, can be used in more
In the different electronic products of kind, the case where heat conductive pad is suitable for high tolerance can be made by larger-size thermally conductive sheet 16.
Specifically, the bending part 166 is in " C " shape or " < " shape or serpentine or " O shape " or " Z-shaped ", Huo Zheqi
Its irregular shape.
The heat conductive pad further includes limited post 18, and one end of the limited post 18 is connected to the face of first heat-conducting plate 12
To the surface of second heat-conducting plate 14, interval is formed between the other end of the limited post 18 and second heat-conducting plate 14.
In a kind of embodiment, first heat-conducting plate 12 is parallel to second heat-conducting plate 14, and the limited post 18 is perpendicular to described
First heat-conducting plate 12.Limited post 18 is in rigidity, for preventing in the biggish situation of heat conductive pad stress, so that heat conductive pad is born
Pressure be more than thermally conductive sheet 16 elastic deformation limit, cause thermally conductive sheet 16 that can not add bullet or be damaged.In present embodiment,
Thermally conductive sheet 16 is the structure of metal spring leaf, and the thermally conductive sheet 16 is flaky, and the thickness of the thermally conductive sheet 16 is less than or equal to
0.2mm。
Heat conductive pad provided by the invention is located in described for being stacked on one another and being oppositely arranged by the multiple thermally conductive sheet 16
Between one heat-conducting plate 12 and second heat-conducting plate 14, the thermally conductive pathways of multiple parallel connections are formed, to realize thermal energy described first
It is conducted between heat-conducting plate 12 and second heat-conducting plate 14.The thermally conductive pathways of multiple parallel connections are independent of one another, that is, multiple thermally conductive sheets 16
Between for the thermal dissipating path that is mutually independent, such parallel configurations reduce the thermal resistance of whole heat conductive pad, to realize
Dynamical heat-conducting effect.
Referring to Fig. 3, showing the thermal resistance distribution map of heat conductive pad of the present invention, RupFor the thermal resistance of the second heat-conducting plate 14, RbotFor
The thermal resistance of first heat-conducting plate 12, R1、R2、…RnFor the thermal resistance of thermally conductive sheet 16.It can be seen that the first heat-conducting plate 12 and the second heat-conducting plate 14 it
Between with the thermal resistance of thermally conductive sheet 16 be concatenated relationship, the thermal resistance of all thermally conductive sheets 16 is relationship in parallel.First heat-conducting plate 12
It is metal plate with the second heat-conducting plate 14, thermal resistance is small.The entire thermal resistance of heat conductive pad is mainly made of the thermal resistance of thermally conductive sheet 16.
Fig. 4 to fig. 6 is please referred to, the arrow direction in figure represents the direction that thermal energy distributes.The present invention provides a kind of heat dissipation
Device, radiator include the heat conductive pad and radiating fin 19, the radiating fin 19 be connected to second heat-conducting plate 14 it
Away from the side of first heat-conducting plate 12.That is, the first heat-conducting plate 12 with euthermic chip for being in contact.The heat dissipation
Fin 19 is integrally formed structures with second heat-conducting plate 14, and in other words, the second heat-conducting plate 14 can be used as radiating fin
19 bottom plate, integrally formed structure are more easier electronic product during assembling.
Fig. 6 show heat conductive pad in electronic product under use state, heat conduction path.The electronic product includes
Circuit board P, euthermic chip C and radiator on the circuit board P, radiator include heat conductive pad and radiating fin 19.The
One heat-conducting plate 12 is directly contacted with the euthermic chip C or first heat-conducting plate 12 of the radiator and the fever
Heat-conducting medium is filled between chip C.In the case that second heat-conducting plate 14 and radiating fin 19 are the structure of separate type, therebetween
Heat-conducting medium can also be filled.Heat-conducting medium can be the Heat Conduction Materials such as heat-conducting silicone grease, and being filled with for heat-conducting medium is conducive to element
Between contact with each other the thermal resistance to be formed.
As shown in Figure 4 and Figure 5, in the case that the first heat-conducting plate 12 is bigger than euthermic chip C area, the first heat-conducting plate 12 can be with
By the thermal energy horizontal proliferation of euthermic chip C.As shown in fig. 6, the thermal energy that the euthermic chip C on circuit board P is radiated successively transmits
To first heat-conducting plate 12, the thermally conductive sheet 16 of multiple parallel connections, the second heat-conducting plate 14 and radiating fin 19.Final thermal energy is by radiating
Fin 19 radiates.
By taking the typical structure of 40mm*40mm*3mm as an example.First heat-conducting plate 12 and the second heat-conducting plate 14 are 0.5mm thickness copper
Plate, intermediate thermal conductivity piece 16 are 0.1mm thickness copper sheet, thermally conductive sheet 16 several 40PCS.By calculating, the first heat-conducting plate 12 and second is led
The thermal resistance of hot plate 14 is Rup=Rbot=0.0008 DEG C/w.The thermal resistance of intermediate 1 thermally conductive sheet 16 is R1=2.63 DEG C/w, 40 are led
Thermal resistance after 16 parallel connection of backing are as follows: Rt=0.066 DEG C/w.So heat conductive pad entire thermal resistance are as follows: R=0.07 DEG C/W.For a power P
For the euthermic chip of 100w, it is assumed that 100w heat all passes through heat conductive pad, then temperature rise caused by heat conductive pad are as follows: T=7 DEG C of Δ.It can
See, the temperature rise of heat conductive pad of the present invention is significantly lower than the temperature rise of the heat conductive pad of the prior art.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
1. a kind of heat conductive pad, which is characterized in that the heat conductive pad includes the first heat-conducting plate, the second heat-conducting plate and multiple thermally conductive sheets,
The multiple thermally conductive sheet, which is located in, to be stacked on one another between first heat-conducting plate and second heat-conducting plate being oppositely arranged, and institute
State the thermally conductive pathways that multiple thermally conductive sheets arrange independently of one another and form multiple parallel connections, with realize thermal energy in first heat-conducting plate and
It is conducted between second heat-conducting plate, each thermally conductive sheet includes bending part and the first end positioned at the bending part both ends
And second end, the first end are connected to first heat-conducting plate, the second end is connected to second heat-conducting plate, described curved
Folding part has elastic deformability, described to lead to adjust the vertical range between first heat-conducting plate and second heat-conducting plate
Heat pad further includes limited post, and one end of the limited post is connected to the table in face of second heat-conducting plate of first heat-conducting plate
Face forms interval between the other end of the limited post and second heat-conducting plate, the limited post is in rigidity, for preventing
It states in the biggish situation of heat conductive pad stress, so that the elasticity that the pressure that the heat conductive pad is born has been more than the thermally conductive sheet becomes
The shape limit.
2. heat conductive pad as described in claim 1, which is characterized in that first heat-conducting plate, second heat-conducting plate and described
The material of multiple thermally conductive sheets is metal or the non-metallic material with the capacity of heat transmission.
3. heat conductive pad as claimed in claim 2, which is characterized in that the bending part in " C " shape or " < " shape or serpentine,
Or " O shape " or " Z-shaped ".
4. heat conductive pad as described in claim 1, which is characterized in that first heat-conducting plate is parallel to second heat-conducting plate,
The limited post is perpendicular to first heat-conducting plate.
5. the heat conductive pad as described in claim 1-4 any one, which is characterized in that the thermally conductive sheet is flaky, and described
The thickness of thermally conductive sheet is less than or equal to 0.2mm.
6. a kind of radiator, which is characterized in that the radiator include heat conductive pad as described in claim 1-5 any one and
Radiating fin, the radiating fin are connected to the side away from first heat-conducting plate of second heat-conducting plate.
7. radiator as claimed in claim 6, which is characterized in that the radiating fin and second heat-conducting plate are integrated into
The structure of type.
8. a kind of electronic product, which is characterized in that the electronic product includes circuit board, the heat generating core on the circuit board
Piece and the radiator as described in claim 6-7 any one, first heat-conducting plate and the heat generating core of the radiator
Piece directly contact or first heat-conducting plate and the euthermic chip of the radiator between fill heat-conducting medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025383.9A CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025383.9A CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105611804A CN105611804A (en) | 2016-05-25 |
| CN105611804B true CN105611804B (en) | 2019-02-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025383.9A Expired - Fee Related CN105611804B (en) | 2015-12-30 | 2015-12-30 | Heat conductive pad, radiator and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105611804B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191816B (en) * | 2017-05-17 | 2019-02-19 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| CN107263041A (en) * | 2017-08-23 | 2017-10-20 | 柳州市二和汽车零部件有限公司 | The processing method of vehicle radiating fin |
| FR3074011B1 (en) * | 2017-11-21 | 2019-12-20 | Safran Electronics & Defense | ELECTRIC POWER MODULE |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN115226361A (en) * | 2021-04-19 | 2022-10-21 | 中兴通讯股份有限公司 | Thermal bridge and electronic device |
| CN113453418A (en) * | 2021-06-28 | 2021-09-28 | 浙江挚领科技有限公司 | Heat conduction device and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
| JPH0864731A (en) * | 1994-08-19 | 1996-03-08 | Hitachi Ltd | Heat conducting member and cooler and electronic apparatus employing the same |
| JP3280954B2 (en) * | 2000-06-02 | 2002-05-13 | 株式会社東芝 | Circuit module and electronic equipment mounted with circuit module |
| JP2007294554A (en) * | 2006-04-24 | 2007-11-08 | Sumitomo Electric Ind Ltd | Convex structural member |
| US8459334B2 (en) * | 2009-07-31 | 2013-06-11 | International Business Machines Corporation | Containment for a patterned metal thermal interface |
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- 2015-12-30 CN CN201511025383.9A patent/CN105611804B/en not_active Expired - Fee Related
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| CN105611804A (en) | 2016-05-25 |
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Granted publication date: 20190226 Termination date: 20201230 |