CN1400106A - Ink jet printing method for preparing metal film - Google Patents
Ink jet printing method for preparing metal film Download PDFInfo
- Publication number
- CN1400106A CN1400106A CN 01128004 CN01128004A CN1400106A CN 1400106 A CN1400106 A CN 1400106A CN 01128004 CN01128004 CN 01128004 CN 01128004 A CN01128004 A CN 01128004A CN 1400106 A CN1400106 A CN 1400106A
- Authority
- CN
- China
- Prior art keywords
- ink
- metallic film
- solvent
- prepare
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000007641 inkjet printing Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 title claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000654 additive Substances 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 238000005516 engineering process Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 5
- 239000002280 amphoteric surfactant Substances 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 239000002082 metal nanoparticle Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- NKFNBVMJTSYZDV-UHFFFAOYSA-N 2-[dodecyl(2-hydroxyethyl)amino]ethanol Chemical compound CCCCCCCCCCCCN(CCO)CCO NKFNBVMJTSYZDV-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- RCEAADKTGXTDOA-UHFFFAOYSA-N OS(O)(=O)=O.CCCCCCCCCCCC[Na] Chemical compound OS(O)(=O)=O.CCCCCCCCCCCC[Na] RCEAADKTGXTDOA-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 229940043237 diethanolamine Drugs 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Chemically Coating (AREA)
- Ink Jet (AREA)
Abstract
The method for preparing metal film by using ink-jet printing process includes the following steps: 1. using the compound which can be heated and decomposed into metal as raw material and dissolving it in solvent, the weight ration of the described raw material and solvent in 1-20:100; 2. adding additive to regulate the properties of viscosity, surface tension and drying speed, its added quantity is 0.1-5% of weight of solvent, the controlled solution viscosity is 20-60 mPa.s, surface tension is 20-50 mNm(-1), and preparing ink-jet ink; 3. injecting the above-mentioned ink into ink box, adopting conventional ink-jet printing process to make the ink deposit on the substrate according to the predefined pattern; 4. heating film layer deposited on the substrate at 200-600 deg.C to form metal film.
Description
Technical field
The present invention relates to the metallic film technology of preparing, specifically a kind of inkjet printing prepares the method for metallic film.
Background technology
Metallic film is widely used, and especially the metallic film that has certain figure and a physical and chemical performance at microelectronic has constituted the basis of nearly all microelectronic component.Metallic film not only is used to connect lead, contact, and can be used for finishing multiple functions such as sensing, catalysis, electromagnetic shielding.Conventional now metallic film preparation technology generally needs technologies such as plated film and etching, the preparation process complexity, and cost is higher.
Inkjet technology is one of major technique that generally adopts in the modern handle official bussiness printing, is divided into continous way and random mode two classes according to ink-jetting style.The continous inkjet technology utilizes Piexoelectric actuator that the shower nozzle ink inside is applied fixation pressure, makes its continuous injection, utilizes the heading of deflecting electrode change ink droplet and forms pattern.The only ink-jet when needed of random mode ink-jet technology, it mainly contains two kinds of bubble type and piezoelectric types.Bubble type is provided with heater on the tube wall of shower nozzle, under the electric pulse effect, form very little bubble on the heater, and the bubble expanded by heating produces pressure-driven ink droplet jetting nozzle.Piezoelectric type utilizes the minute-pressure electric device to make transducer, produces pressure wave and drive the ink droplet jetting nozzle under the pulse voltage effect.The a plurality of ink-jet systems of configuration in the general printer, each ink-jet system connects with the print cartridge that the different colours ink is housed, and can print colourful pattern.In recent years, the researcher begins to attempt it is used for the preparation of plane function material, and obtain some preliminary results, as prepare conducting polymer film (D.Pede, G.erra, andDe Rossi, Mater.Sci.Eng.C.5 (1998) 289), preparation color organic light emitting diode (Adv.Mater.11 (1999) 734 for S.-C.Chang, et al), prepare function nano structure graph (H.Y.Fan by the self organizing function ink that has that contains surfactant, et al, Nature, 405 (2000) 56).Inkjet technology is as the functional material preparation means of plane function material particularly because it has and is easy to prepare complex figure, but and the characteristics of pointwise control composition, be expected under a stable condition, to be used to replace plated film, the photoetching process of existing complexity.But utilize inkjet technology to prepare metallic film and yet there are no report.
Summary of the invention
The purpose of this invention is to provide the method that a kind of technology is simple, cost is low inkjet printing prepares metallic film.
To achieve these goals, technical scheme of the present invention is: operation as follows: 1) getting the compound that can add thermal decomposition generation metal is raw material, and it is dissolved in the solvent, and the weight ratio of described raw material and solvent is 1-20: 100; 2) add additive and regulate performances such as viscosity, surface tension and rate of drying, addition is the 0.1-5% of weight of solvent, and the control solution viscosity is that 20-60mPas, surface tension are 20-50mNm
-1, be made into ink-jet ink; 3) described ink is injected in the print cartridge, adopts conventional inkjet technology spray deposited to substrate by predetermined pattern; 4) deposit to on-chip rete through 200-600 ℃ heat treatment with described, form metallic film;
In addition, raw material described in the step 1) is a metal nanoparticle, and it is dispersed in water or the organic solvent;
Also have, after the step 4), the substrate that forms metallic film is put into chemical plating fluid, technology is carried out the plated film of required metal routinely;
Described solvent can be deionized water; Described solvent can be organic solvents such as alcohols, ester class; Described additive is anionic surfactant such as odium stearate, lauryl sodium sulfate, neopelex, cationic surface active agent such as softex kw, nonionic surface active agent such as dodecyl diethanol amine, dodecyl acyl diethanol amine, amphoteric surfactant, high molecular surfactant such as polyvinyl alcohol, Sodium Polyacrylate etc.
The present invention has following advantage:
1. the present invention utilizes the printing high accuracy characteristics of inkjet technology, and the figure and the composition of the control of pointwise simply and easily rete make pattern precision higher, and sharpness of border is evenly distributed, and need not plated film and etching and other complex processes.
2. adopt the present invention to make ink by oneself, adapt to the little requirement of nozzle bore, can prepare multiple metallic film and multiple layer metal film, as monobasic and multi-element metal thin-film materials such as Fe, Au, Cu, Ag, Pb, Pt; Cycle is short, and cost is low, can be widely used in the preparation process of electronic device.
3. the present invention not only can directly prepare metallic film, and can be applied to depositing noble metal film activation substrate and induce next step chemical plating process.
The specific embodiment
Below in conjunction with embodiment the present invention being made further detail describes.
Embodiment 1
Prepare golden lead
Operation as follows: 1) get 1g and can add the compd A uCl that thermal decomposition generates metallic gold Au
3Be raw material, it be dissolved in the 50ml deionized water that the weight ratio of described raw material and deionized water is 2: 100; 2) add lauryl sodium sulfate 0.1g, addition is 0.2% of a deionized water weight, is that 50mPas (room temperature), surface tension are 30mNm with the viscosity of controlling ink
-1Be made into golden ink; 3) described ink is injected in the print cartridge, adopts conventional inkjet technology to deposit on the substrate by predetermined pattern; 4) deposit to on-chip rete through 250 ℃ heat treatment with described, reaction forms has the gold thin film of predetermined pattern.
Embodiment 2
Prepare silver-colored lead
Operation as follows: 1) get 2g and can add the compd A gNO that thermal decomposition generates metal A g
3Be raw material, it be dissolved in the 50ml organic solvent absolute ethyl alcohol that the weight ratio of described raw material and organic solvent is 4: 100; 2) add softex kw 0.1g, addition is 0.2% of an organic solvent weight, is that 40mPas (room temperature), surface tension are 40mNm with the viscosity of controlling ink
-1Be made into silver-colored ink; 3) described ink is injected in the print cartridge, adopts conventional inkjet technology to deposit on the substrate by predetermined pattern; 4) deposit to on-chip rete through 500 ℃ heat treatment with described, reaction forms the silver-colored film with predetermined pattern.
Embodiment 3
Inkjet printing assistant chemical depositing process prepares copper conductor:
Operation as follows: 1) get 1g and can add the compd A uCl that thermal decomposition generates metal
3Be raw material, it be dissolved in the 50ml deionized water that the weight ratio of described raw material and water or organic solvent is 2: 100; 2) add nonionic surface active agent dodecyl diethanol amine 0.2g, addition is 0.4% of water or an organic solvent weight, is that 30mPas (room temperature), surface tension are 30mNm with the viscosity of controlling ink
-1Be made into golden ink; 3) described ink is injected in the print cartridge, adopts conventional inkjet technology to deposit on the substrate by predetermined pattern; 4) deposit to on-chip rete through 250 ℃ heat treatment with described, reaction forms gold thin film.
Described substrate is put into the conventional chemical copper plating solution, under 60 ℃ of temperature,,, on substrate, form the copper film of predetermined pattern at the surface deposition copper of golden film through 10 minutes.
In addition, as another embodiment, difference from Example 1 is: raw material described in the step 1) of the present invention also is bronze, and it is dispersed in water or the absolute ethyl alcohol.
The present invention also can adopt the dodecyl acyl diethanol amine in odium stearate in the anionic surfactant, neopelex, the nonionic surface active agent, polyvinyl alcohol, Sodium Polyacrylate or the amphoteric surfactant etc. in the high molecular surfactant.
Adopt the present invention can prepare as multiple metallic film and multiple layer metal films such as Fe, Au, Cu, Ag, Pb, Pt.
Claims (6)
1. an inkjet printing prepares the method for metallic film, it is characterized in that operating as follows: get 1) that can to add the compound that thermal decomposition generates metal be raw material, it is dissolved in the solvent, the weight ratio of described raw material and solvent is 1-20: 100; 2) add additive, addition is the 0.1-5% of weight of solvent, and the control solution viscosity is that 20-60mPas, surface tension are 20-50mNm
-1, be made into ink-jet ink; 3) described ink is injected in the print cartridge, adopts conventional inkjet technology to deposit on the substrate by predetermined pattern; 4) deposit to on-chip rete through 200-600 ℃ heat treatment with described, form metallic film.
2. prepare the method for metallic film according to the described inkjet printing of claim 1, it is characterized in that: raw material described in the step 1) is a metal nanoparticle, and it is dispersed in water or the organic solvent.
3. prepare the method for metallic film according to claim 1 or 2 described inkjet printings, it is characterized in that: after the step 4), with the substrate that forms metallic film routinely technology carry out the plated film of required metal.
4. prepare the method for metallic film according to claim 1 or 2 described inkjet printings, it is characterized in that: described solvent can be deionized water.
5. prepare the method for metallic film according to claim 1 or 2 described inkjet printings, it is characterized in that: described solvent can be alcohols, ester class organic solvent.
6. prepare the method for metallic film according to claim 1 or 2 described inkjet printings, it is characterized in that: described additive is anionic surfactant, cationic surface active agent, nonionic surface active agent, high molecular surfactant or amphoteric surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128004 CN1199794C (en) | 2001-08-03 | 2001-08-03 | Ink jet printing method for preparing metal film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128004 CN1199794C (en) | 2001-08-03 | 2001-08-03 | Ink jet printing method for preparing metal film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1400106A true CN1400106A (en) | 2003-03-05 |
| CN1199794C CN1199794C (en) | 2005-05-04 |
Family
ID=4667907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01128004 Expired - Fee Related CN1199794C (en) | 2001-08-03 | 2001-08-03 | Ink jet printing method for preparing metal film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1199794C (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100403511C (en) * | 2003-05-12 | 2008-07-16 | 精工爱普生株式会社 | Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus |
| CN101522557B (en) * | 2006-09-29 | 2012-06-20 | Lg化学株式会社 | Ink for ink jet printing and method for preparing metal nanoparticles used therein |
| CN102529479A (en) * | 2011-12-23 | 2012-07-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Post-treatment method for improving printing evenness of electronic material |
| US8492183B2 (en) | 2009-08-14 | 2013-07-23 | Boe Technology Co., Ltd. | Manufacturing method of film pattern of micro-structure and manufacturing method of TFT-LCD array substrate |
| CN103753995A (en) * | 2014-01-09 | 2014-04-30 | 湖南大学 | Method for preparing antireflection film having gradient refractive index based on colour ink-jet printing |
| CN106098545A (en) * | 2016-08-12 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
| CN106274110A (en) * | 2015-05-13 | 2017-01-04 | 广东聚华印刷显示技术有限公司 | A kind of method of low-temp. spraying ink print nano metal pattern |
| CN106335298A (en) * | 2015-07-09 | 2017-01-18 | 广东聚华印刷显示技术有限公司 | Ink jet printing metal patterns, and preparation method thereof |
| CN106972115A (en) * | 2017-05-27 | 2017-07-21 | 深圳市华星光电技术有限公司 | The preparation method and OLED display panel of OLED display panel |
| CN107230747A (en) * | 2017-05-27 | 2017-10-03 | 深圳市华星光电技术有限公司 | The preparation method and OLED display panel of OLED display panel |
| CN107690269A (en) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacture method of electro-magnetic screen layer |
| US10505154B2 (en) | 2017-05-27 | 2019-12-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Manufacturing method of organic light emitting diode display panel and organic light emitting diode display panel |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2155496A4 (en) * | 2007-06-14 | 2010-08-11 | Massachusetts Inst Technology | Method and apparatus for thermal jet printing |
-
2001
- 2001-08-03 CN CN 01128004 patent/CN1199794C/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100403511C (en) * | 2003-05-12 | 2008-07-16 | 精工爱普生株式会社 | Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus |
| CN101522557B (en) * | 2006-09-29 | 2012-06-20 | Lg化学株式会社 | Ink for ink jet printing and method for preparing metal nanoparticles used therein |
| US8492183B2 (en) | 2009-08-14 | 2013-07-23 | Boe Technology Co., Ltd. | Manufacturing method of film pattern of micro-structure and manufacturing method of TFT-LCD array substrate |
| CN102529479B (en) * | 2011-12-23 | 2014-10-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | Post-treatment method for improving printing evenness of electronic material |
| CN102529479A (en) * | 2011-12-23 | 2012-07-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Post-treatment method for improving printing evenness of electronic material |
| CN103753995B (en) * | 2014-01-09 | 2016-01-20 | 湖南大学 | A kind of based on the color ink jet printed method preparing graded index anti-reflection film |
| CN103753995A (en) * | 2014-01-09 | 2014-04-30 | 湖南大学 | Method for preparing antireflection film having gradient refractive index based on colour ink-jet printing |
| CN106274110A (en) * | 2015-05-13 | 2017-01-04 | 广东聚华印刷显示技术有限公司 | A kind of method of low-temp. spraying ink print nano metal pattern |
| CN106274110B (en) * | 2015-05-13 | 2018-11-06 | 广东聚华印刷显示技术有限公司 | A kind of method of low temperature ink jet printing nano metal pattern |
| CN106335298B (en) * | 2015-07-09 | 2018-08-10 | 广东聚华印刷显示技术有限公司 | Ink jet printing metal pattern and preparation method thereof |
| CN106335298A (en) * | 2015-07-09 | 2017-01-18 | 广东聚华印刷显示技术有限公司 | Ink jet printing metal patterns, and preparation method thereof |
| CN106098545A (en) * | 2016-08-12 | 2016-11-09 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
| CN107690269A (en) * | 2016-08-31 | 2018-02-13 | 江苏汉印机电科技股份有限公司 | The inkjet printing manufacture method of electro-magnetic screen layer |
| CN106972115A (en) * | 2017-05-27 | 2017-07-21 | 深圳市华星光电技术有限公司 | The preparation method and OLED display panel of OLED display panel |
| CN107230747A (en) * | 2017-05-27 | 2017-10-03 | 深圳市华星光电技术有限公司 | The preparation method and OLED display panel of OLED display panel |
| WO2018218741A1 (en) * | 2017-05-27 | 2018-12-06 | 深圳市华星光电技术有限公司 | Oled display panel manufacturing method and oled display panel |
| WO2018218740A1 (en) * | 2017-05-27 | 2018-12-06 | 深圳市华星光电技术有限公司 | Oled display panel manufacturing method and oled display panel |
| CN106972115B (en) * | 2017-05-27 | 2019-03-12 | 深圳市华星光电技术有限公司 | The production method and OLED display panel of OLED display panel |
| US10355248B2 (en) | 2017-05-27 | 2019-07-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Manufacturing method of organic light emitting diode display panel and organic light emitting diode display panel |
| US10505154B2 (en) | 2017-05-27 | 2019-12-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Manufacturing method of organic light emitting diode display panel and organic light emitting diode display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1199794C (en) | 2005-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1199794C (en) | Ink jet printing method for preparing metal film | |
| CN1849411A (en) | Electroless deposition methods and systems | |
| CN101541894B (en) | Carbon nanotube ink | |
| KR100678419B1 (en) | Method for surface treatment of board, method for forming wiring and wiring substrate | |
| Jung et al. | Studies on inkjet-printed conducting lines for electronic devices | |
| US20070221887A1 (en) | Low viscosity precursor compositions and methods for the deposition of conductive electronic features | |
| JP2005537386A (en) | Low viscosity precursor composition and method for depositing conductive electronic features | |
| JP5453924B2 (en) | Conductive film pattern and method of forming conductive film pattern | |
| KR100662837B1 (en) | Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus | |
| WO2005115637A1 (en) | Forming method, unit and material for pattern films, and product gained by said method | |
| Cao et al. | Numerical analysis of droplets from multinozzle inkjet printing | |
| JP4059260B2 (en) | Multilayer structure forming method, wiring board manufacturing method, and electronic device manufacturing method | |
| Kwon et al. | A novel method for fine patterning by piezoelectrically induced pressure adjustment of inkjet printing | |
| CN1400107A (en) | Ink jet printing method for preparing metal oxide functional film | |
| US20140231124A1 (en) | Base material for forming electroconductive pattern, circuit board, and method for producing each | |
| JP2010265420A (en) | Inkjet ink and method for forming electroconductive pattern | |
| EP2159270A1 (en) | Method for manufacturing electrically conductive structures | |
| US9217093B1 (en) | Palladium ink compositions | |
| KR101808741B1 (en) | Method for forming conductive layer patterns by inkjet-printing | |
| WO2010029934A1 (en) | Substrate and process for forming electroconductive pattern | |
| WO2017091831A1 (en) | Metallic, geometrically discrete nanoparticle composition and methods of forming the same | |
| JPWO2010134536A1 (en) | Conductive film pattern and method for forming conductive film pattern | |
| JP2010182776A (en) | Conductive film pattern and method of forming the same | |
| CN100404260C (en) | Coating method, liquid supplying head and liquid supplying apparatus | |
| CN100475001C (en) | Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |