CN1287432C - Method and equipment for preventing base plate from being polluted by condensation liquid - Google Patents
Method and equipment for preventing base plate from being polluted by condensation liquid Download PDFInfo
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- CN1287432C CN1287432C CN 03141109 CN03141109A CN1287432C CN 1287432 C CN1287432 C CN 1287432C CN 03141109 CN03141109 CN 03141109 CN 03141109 A CN03141109 A CN 03141109A CN 1287432 C CN1287432 C CN 1287432C
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Abstract
The present invention relates to a device for preventing condensation liquid from polluting a basal plate, which is matched with the basal plate and mainly comprises a reaction chamber, a delivery unit, a first air injection element and a second air injection element, wherein the reaction chamber is used for accommodating the basal plate and fluid for a manufacture process so as to implement the steps of the manufacture process; one side edge of the reaction chamber is provided with an inlet and outlet for the basal plate to come in and out the reaction chamber; the delivery unit is used for delivering the basal plate in or out the reaction chamber from the inlet and outlet; the first air injection element is positioned on the traveling path of the delivery unit outside the reaction chamber, and is used for injecting air to the basal plate on the delivery unit; the second air injection element is positioned at one side of the inlet and outlet outside the reaction chamber, and is used for injecting the air to the inlet and outlet. The present invention also provides a method for preventing the condensation liquid from polluting the basal plate.
Description
Technical field
The invention relates to a kind of method that prevents coagulating solution from polluting substrate, refer to a kind of preventing to deluster and carving the method for glue coagulating solution from polluting substrate of photoresist manufacture method that be applicable to especially.
Background technology
Photoetching manufacturing method one of the most crucial steps in semiconductor or the planar display surface board manufacturing process of can saying so, every pattern relevant with component structure or impurity range are all decided by lithography step.The technology of photoetching manufacturing method is very complicated, mainly be to cover one deck photoresist in wafer surface earlier, again by making photoresist carry out the selectivity exposure according to the pattern on the mask by directional light, and then make via development and to present the pattern identical on the photoresist with mask, just can carry out follow-up manufacture method afterwards, for example etching, ion injection etc.After these manufacture methods were finished, the utilization of photoresist just finished, therefore it must be divested (strip) from wafer surface, was commonly referred to as photoresist.
Go at present the photoresist program as shown in Figure 1, substrate 10 is going to photoresist chamber 20 (STRIPPERChamber) to remove photoresist earlier, enters purge chamber 30 (Rising Chamber) afterwards and will deluster and carve glue to clean the universe floating.By finding on the production line that when substrate 10 passed through the dividing plate 40 that goes between photoresist chamber 20 and the purge chamber 30, its surface had washmarking and produces.Examine itself because, when substrate is desired to enter purge chamber 30, dividing plate 40 can be opened automatically, this moment in the purge chamber 30 cold air just can enter temperature higher go to photoresist chamber 20 (about 65～70 ℃), near delustering making carves the glue steam and steam is met cold being condensed on the dividing plate 40, especially when the air knife in the purge chamber 30 50 exported the direction of tuning dividing plates 40, this condensation was more obvious.The deionized water of dividing plate 40 inwalls is carved glue condensation by mixing liquid and is just dropped on the substrate 10 with delustering, and substrate 10 was scraped through the air knives 50 in the purge chamber 30 and stayed the washmarking of a lot of, caused product yield loss and reliability to reduce.
Summary of the invention
Main purpose of the present invention provides a kind of device that prevents coagulating solution from polluting substrate, so that can avoid substrate surface to produce washmarking, improves panel yield and element reliability.
Another object of the present invention is that a kind of method that prevents coagulating solution from polluting substrate is being provided, so that can avoid substrate surface to produce washmarking, improves panel yield and element reliability.
For reaching above-mentioned purpose, a kind of device that prevents coagulating solution from polluting substrate of the present invention, be to cooperate a substrate, mainly comprise: a reative cell, in order to ccontaining this substrate and a manufacture method fluid, to carry out a manufacture method step, a side of this reative cell has at least one gateway, passes in and out this reative cell for this substrate; One delivery unit is in order to this gateway certainly to import this substrate into or spread out of this reative cell; One first air-jet element is positioned on the travel path of outer this delivery unit of this reative cell, in order to jet to this substrate on this delivery unit; And one second air-jet element, be positioned at one of outer this gateway of this reative cell side, in order to jet to this gateway.
For reaching above-mentioned purpose, a kind of method that prevents coagulating solution from polluting substrate of the present invention, be to cooperate a substrate, mainly may further comprise the steps: a reative cell at first is provided, carry out a manufacture method step in order to ccontaining this substrate and a manufacture method fluid, wherein a side of this reative cell has a gateway, passes in and out this reative cell for this substrate; One can import this substrate or spread out of into the delivery unit of this reative cell from this gateway; One is positioned at first air-jet element on outer this delivery unit travel path of this reative cell; Reach one and be positioned at this reative cell second air-jet element of one of this gateway side outward; And make this second air-jet element jet to this gateway.
The present invention prevents that in the apparatus and method of coagulating solution from polluting substrate, the substrate that is used is unrestricted, is preferably glass substrate or silicon wafer.The present invention prevents that the delivery unit in the apparatus and method of coagulating solution from polluting substrate is unrestricted, can be any existing substrate conveying element, is preferably roller or conveyer belt.The present invention prevents that the manufacture method step that the apparatus and method of coagulating solution from polluting substrate are used is preferably photoresist or etching, is more preferred from wet type and removes photoresist or Wet-type etching.The present invention prevents that the manufacture method fluid that the apparatus and method of coagulating solution from polluting substrate use is unrestricted, can be the fluid of the required use of this manufacture method step of any cooperation, is preferably photoresist liquid or acid solution.The present invention prevents that first or second air-jet element in the apparatus and method of coagulating solution from polluting substrate is preferably nozzle, air knife or air knife.The present invention prevents that the gateway in the apparatus and method of coagulating solution from polluting substrate is preferably a gate.The present invention prevents in the method for coagulating solution from polluting substrate that when second air-jet element was jet to this gateway, the state of this gateway was unrestricted, can be to open or close; This first air-jet element can be before this second air-jet element be jet to this gateway, simultaneously or afterwards, jet to this substrate on this delivery unit.
Description of drawings
Fig. 1 is the existing cutaway view that removes the photoresist board;
Fig. 2 be a preferred embodiment of the present invention remove photoresist board cutaway view.
Embodiment
For more understanding technology contents of the present invention, be described as follows especially exemplified by following preferred embodiment.
See also Fig. 2, Fig. 2 removes photoresist board cutaway view for preferred embodiment of the present invention.The photoresist board 100 that goes of this preferred embodiments is the STRIPPER board of SHIBAURA, and its reative cell is for going to photoresist chamber 110.Go to 110 inside, photoresist chamber to deluster to carve glue 111, the TOK liquid of three good fortune chemical industry for example, its temperature is about 65 ℃, to remove the photoresist layer 131 on substrate 130 surfaces.The deionized water 121 that room temperature is arranged in the purge chamber 120 can be after substrate 130 be finished photoresist, and cleaning base plate 130 immediately, cleans so that glue 111 is carved in residual delustering on it.Substrate 130 had before covered photoresist, exposure, and step such as development, perhaps also passed through manufacture method steps such as etching or ion injection, and need carry out the substrate that photomask surface glue divests (strip), was commonly referred to as photoresist.Go to be provided with a pneumatic gate valve 143 between photoresist chamber 110 and the purge chamber 120, and whether export with the gas of gas source 144 and to control opening or closing of pneumatic gate valve 143.When substrate 130 carries out manufacture method in removing photoresist board 100, be to send substrate 130 to photoresist chamber 110 earlier by conveyer belt 140 to remove photoresist, see substrate 130 off photoresist chamber 110 more afterwards and enter purge chamber 120 and clean, again substrate 130 is sent purge chamber 120 after cleaning finishes, and finish the work of this part.By opening or closing of pneumatic gate valve 143, may command substrate 130 enters the time point of purge chamber 120.
Because when substrate 130 enters purge chamber 120, can have delustering of part and carve glue 111, carving glue 111 for avoiding delustering remains on the substrate 130, and reduce to deluster and carve the amount that glue 111 enters purge chamber 120, in purge chamber 120, install one group of air knife 122 near pneumatic gate valve 143 parts, can when enter purge chamber 120, substrate 130 delustering on it be carved glue 111 blow back photoresist chamber 110.The temperature of carving glue 111 because of delustering is higher than the temperature of deionized water 121, make the room temperature of going to photoresist chamber 110 be higher than the room temperature of purge chamber 120, when pneumatic gate valve 143 is opened, steam or deionized water 121 steam of carving glue 111 that deluster are tied in can meet condensation near 120 places, purge chamber, and especially the most normal condensing residues in pneumatic gate valve 143 tops 141.Therefore, set up air knife 123, and make the inflatable mouth of gas 123 aim at pneumatic gate valve 143 tops 141, and air knife 123 desired gas are also provided by gas source 144 in wind 122 sides.As shown in Figure 2, there is a wireway to be connected between air knife 123 and the gas source 144.When gas source 144 provides gas to pneumatic gate valve 143, when closing pneumatic gate valve 143, the gas of gas source 144 can enter air knife 123 via wireway simultaneously.Air knife 123 blows the liquid that is condensed in pneumatic gate valve 143 tops 141 off in the air blowing mode, before pneumatic gate valve 143 is opened once more.In air knife 123 air blowing processes, last substrate 130 left pneumatic gate valve 143, substrate 130 no show pneumatic gate valve 143 still then, and keep a segment distance with pneumatic gate valve 143.Therefore, the liquid that is blown off by air knife 123 can't drop to substrate 130.Therefore, when treating that substrate 130 is passed through pneumatic gate valve 143 belows,, make it produce washmarking so can not fall to substrate 130 again because of the condensation water on the top 141 has been removed or decrement.
In the flexible embodiment of one of the present invention, the air blowing of air knife 123 is not limited to 143 down periods of pneumatic gate valve begin to carry out.Via the distance of 143 of substrate 130 and pneumatic gate valves in the air blowing angle of adjusting air knife 123 and air knife 123 air blowing processes, the air blowing of air knife 123 can also be carried out the action of blowing in pneumatic gate valve 143 open periods.
The present invention uses because jet to having additionally at the position of condensing easily in the locular wall of reative cell gateway or the gate, so can significantly reduce the probability that solution condenses on the locular wall of reative cell gateway or gate, thereby can reduce on the substrate because the washmarking pollution that solution condenses and causes, and can directly adopt the gas source of gas gate because of the gas source of air knife, so the present invention in reative cell or its outer wall install air-jet element additional to remove the required cost of the method for manufacture method fluid or condensation water very low, but can improve the problem of the residual washmarking of substrate surface widely, product yield and element reliability are greatly improved.
The foregoing description only is to give an example for convenience of description, but not only limits to the foregoing description.
Claims (17)
1. a device that prevents coagulating solution from polluting substrate is characterized in that, is to cooperate a substrate, mainly comprises:
One reative cell, in order to ccontaining this substrate and a manufacture method fluid, to carry out a manufacture method step, a side of this reative cell has at least one gateway, passes in and out this reative cell for this substrate;
One delivery unit is in order to this gateway certainly to import this substrate into or spread out of this reative cell;
One first air-jet element is positioned on the travel path of outer this delivery unit of this reative cell, in order to jet to this substrate on this delivery unit; And
One second air-jet element is positioned at one of outer this gateway of this reative cell side, in order to jet to this gateway.
2. device as claimed in claim 1 is characterized in that, wherein this substrate is glass substrate or silicon wafer.
3. device as claimed in claim 1 is characterized in that, wherein this delivery unit is roller or conveyer belt.
4. device as claimed in claim 1 is characterized in that, wherein this manufacture method step is for going photoresist or etching.
5. device as claimed in claim 1 is characterized in that, wherein this gateway is a pneumatic gate valve.
6. device as claimed in claim 1 is characterized in that, wherein this manufacture method fluid is carved glue or acid solution for delustering.
7. device as claimed in claim 1 is characterized in that, wherein this first or second air-jet element is nozzle, air knife or air knife.
8. a method that prevents coagulating solution from polluting substrate is characterized in that, is to cooperate a substrate, may further comprise the steps:
One reative cell is provided, carries out a manufacture method step in order to ccontaining this substrate and a manufacture method fluid, wherein this reative cell one side has a gateway, passes in and out this reative cell for this substrate; One delivery unit is provided, and it imports this substrate into from this gateway or spreads out of this reative cell; One first air-jet element is provided, and it is positioned on outer this delivery unit travel path of this reative cell; And one second air-jet element is provided, it is positioned at outer this gateway one side of this reative cell; And make this second air-jet element jet to this gateway.
9. method as claimed in claim 8 is characterized in that, described this second air-jet element to this gateway jet before, simultaneously or afterwards, more comprise a step: make this first air-jet element jet to this substrate on this delivery unit.
10. method as claimed in claim 8 is characterized in that, described this substrate is glass substrate or silicon wafer.
11. method as claimed in claim 8 is characterized in that, described this gateway is a pneumatic gate valve.
12. method as claimed in claim 8 is characterized in that, described this delivery unit is roller or conveyer belt.
13. method as claimed in claim 8 is characterized in that, described this manufacture method step is for going photoresist or etching.
14. method as claimed in claim 8 is characterized in that, described this manufacture method fluid is carved glue or acid solution for delustering.
15, method as claimed in claim 8 is characterized in that, described this first or second air-jet element is nozzle, air knife or air knife.
16. method as claimed in claim 8 is characterized in that, when jet, this gateway is for opening to this gateway for described this second air-jet element.
17. method as claimed in claim 8 is characterized in that, when jet, this gateway is for closing to this gateway for described this second air-jet element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03141109 CN1287432C (en) | 2003-06-09 | 2003-06-09 | Method and equipment for preventing base plate from being polluted by condensation liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03141109 CN1287432C (en) | 2003-06-09 | 2003-06-09 | Method and equipment for preventing base plate from being polluted by condensation liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567543A CN1567543A (en) | 2005-01-19 |
| CN1287432C true CN1287432C (en) | 2006-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03141109 Expired - Fee Related CN1287432C (en) | 2003-06-09 | 2003-06-09 | Method and equipment for preventing base plate from being polluted by condensation liquid |
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| CN (1) | CN1287432C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4796352B2 (en) * | 2005-08-03 | 2011-10-19 | パナソニック株式会社 | Heat treatment equipment |
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- 2003-06-09 CN CN 03141109 patent/CN1287432C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1567543A (en) | 2005-01-19 |
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Granted publication date: 20061129 Termination date: 20200609 |