CN1263168C - 光电元件和用发光层覆盖光电元件的方法 - Google Patents
光电元件和用发光层覆盖光电元件的方法 Download PDFInfo
- Publication number
- CN1263168C CN1263168C CNB018018165A CN01801816A CN1263168C CN 1263168 C CN1263168 C CN 1263168C CN B018018165 A CNB018018165 A CN B018018165A CN 01801816 A CN01801816 A CN 01801816A CN 1263168 C CN1263168 C CN 1263168C
- Authority
- CN
- China
- Prior art keywords
- photoelectric cell
- conductive layer
- semiconductor substrate
- led
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001962 electrophoresis Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 27
- 239000000126 substance Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 230000005670 electromagnetic radiation Effects 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 5
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- WHBHBVVOGNECLV-OBQKJFGGSA-N 11-deoxycortisol Chemical compound O=C1CC[C@]2(C)[C@H]3CC[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 WHBHBVVOGNECLV-OBQKJFGGSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- JOPDZQBPOWAEHC-UHFFFAOYSA-H tristrontium;diphosphate Chemical compound [Sr+2].[Sr+2].[Sr+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JOPDZQBPOWAEHC-UHFFFAOYSA-H 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Luminescent Compositions (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00202263 | 2000-06-29 | ||
EP00202263.0 | 2000-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1383583A CN1383583A (zh) | 2002-12-04 |
CN1263168C true CN1263168C (zh) | 2006-07-05 |
Family
ID=8171713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018018165A Expired - Lifetime CN1263168C (zh) | 2000-06-29 | 2001-06-22 | 光电元件和用发光层覆盖光电元件的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6686581B2 (zh) |
EP (1) | EP1228540B1 (zh) |
JP (1) | JP4928046B2 (zh) |
KR (1) | KR100869866B1 (zh) |
CN (1) | CN1263168C (zh) |
DE (1) | DE60143152D1 (zh) |
TW (1) | TW511302B (zh) |
WO (1) | WO2002001649A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2009676B8 (en) * | 2002-05-08 | 2012-11-21 | Phoseon Technology, Inc. | A semiconductor materials inspection system |
US6828596B2 (en) * | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
US6864110B2 (en) * | 2002-10-22 | 2005-03-08 | Agilent Technologies, Inc. | Electrophoretic processes for the selective deposition of materials on a semiconducting device |
US7524085B2 (en) * | 2003-10-31 | 2009-04-28 | Phoseon Technology, Inc. | Series wiring of highly reliable light sources |
EP1678442B8 (en) * | 2003-10-31 | 2013-06-26 | Phoseon Technology, Inc. | Led light module and manufacturing method |
DE202005002110U1 (de) * | 2004-02-19 | 2005-05-04 | Hong-Yuan Technology Co., Ltd., Yonghe | Lichtemittierende Vorrichtung |
TWI257718B (en) * | 2004-03-18 | 2006-07-01 | Phoseon Technology Inc | Direct cooling of LEDs |
EP1735844B1 (en) | 2004-03-18 | 2019-06-19 | Phoseon Technology, Inc. | Use of a high-density light emitting diode array comprising micro-reflectors for curing applications |
EP1743384B1 (en) * | 2004-03-30 | 2015-08-05 | Phoseon Technology, Inc. | Led array having array-based led detectors |
PT1756876E (pt) * | 2004-04-12 | 2011-06-02 | Phoseon Technology Inc | Rede de led de alta densidade |
WO2005100961A2 (en) * | 2004-04-19 | 2005-10-27 | Phoseon Technology, Inc. | Imaging semiconductor strucutures using solid state illumination |
US9281001B2 (en) * | 2004-11-08 | 2016-03-08 | Phoseon Technology, Inc. | Methods and systems relating to light sources for use in industrial processes |
US8748923B2 (en) * | 2005-03-14 | 2014-06-10 | Philips Lumileds Lighting Company Llc | Wavelength-converted semiconductor light emitting device |
US7341878B2 (en) * | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
US7642527B2 (en) * | 2005-12-30 | 2010-01-05 | Phoseon Technology, Inc. | Multi-attribute light effects for use in curing and other applications involving photoreactions and processing |
US8062925B2 (en) * | 2006-05-16 | 2011-11-22 | Koninklijke Philips Electronics N.V. | Process for preparing a semiconductor light-emitting device for mounting |
EP2122709B1 (en) * | 2007-02-12 | 2010-09-22 | Philips Intellectual Property & Standards GmbH | Large area light emitting diode light source |
KR100967952B1 (ko) * | 2008-01-10 | 2010-07-06 | (주)삼우아이엠씨 | 도로포장의 덧씌우기 공법 |
KR100973238B1 (ko) | 2008-03-26 | 2010-07-30 | 서울반도체 주식회사 | 형광체 코팅방법 및 장치 그리고 형광체 코팅층을 포함하는led |
CN102714263B (zh) | 2010-02-25 | 2015-11-25 | 韩国莱太柘晶电株式会社 | 发光二极管及其制造方法 |
WO2012139644A1 (en) * | 2011-04-13 | 2012-10-18 | Osram Ag | Method for manufacturing a phosphor device and lighting apparatus comprising such phosphor device |
DE102013109031B4 (de) * | 2013-08-21 | 2021-11-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102015106635A1 (de) * | 2015-04-29 | 2016-11-03 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
US10573843B2 (en) | 2015-08-05 | 2020-02-25 | Apple Inc. | Light-emitting device having an electrode with varying sheet resistance |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586252B2 (ja) | 1978-09-29 | 1983-02-03 | 伊勢電子工業株式会社 | 陰極線表示パネルの製造方法 |
JPS6010120B2 (ja) * | 1982-09-14 | 1985-03-15 | ソニー株式会社 | 粉体の非水溶液系電着法 |
DE69214780T2 (de) | 1991-12-11 | 1997-05-15 | Agfa Gevaert Nv | Methode zur Herstellung eines radiographischen Schirmes |
US5226053A (en) * | 1991-12-27 | 1993-07-06 | At&T Bell Laboratories | Light emitting diode |
US5557115A (en) * | 1994-08-11 | 1996-09-17 | Rohm Co. Ltd. | Light emitting semiconductor device with sub-mount |
JP2795194B2 (ja) | 1994-09-22 | 1998-09-10 | 株式会社デンソー | エレクトロルミネッセンス素子とその製造方法 |
US5537738A (en) * | 1995-02-10 | 1996-07-23 | Micron Display Technology Inc. | Methods of mechanical and electrical substrate connection |
JPH11510968A (ja) | 1996-06-11 | 1999-09-21 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 紫外発光ダイオード及び紫外励起可視光放射蛍光体を含む可視発光ディスプレイ及び該デバイスの製造方法 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US5813752A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue LED-phosphor device with short wave pass, long wave pass band pass and peroit filters |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
EP0924966A1 (en) * | 1997-06-30 | 1999-06-23 | Aventis Research & Technologies GmbH & Co. KG | Thin film electrode for planar organic light-emitting devices and method for its production |
JP3617587B2 (ja) * | 1997-07-17 | 2005-02-09 | 日亜化学工業株式会社 | 発光ダイオード及びその形成方法 |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
US6236060B1 (en) * | 1997-11-19 | 2001-05-22 | International Business Machines Corporation | Light emitting structures in back-end of line silicon technology |
US5952681A (en) | 1997-11-24 | 1999-09-14 | Chen; Hsing | Light emitting diode emitting red, green and blue light |
US6153075A (en) * | 1998-02-26 | 2000-11-28 | Micron Technology, Inc. | Methods using electrophoretically deposited patternable material |
DE29804149U1 (de) * | 1998-03-09 | 1998-06-18 | Chen, Hsing, Hsinchu | Leuchtdiode (LED) mit verbesserter Struktur |
US6366018B1 (en) | 1998-10-21 | 2002-04-02 | Sarnoff Corporation | Apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
JP2000150966A (ja) * | 1998-11-16 | 2000-05-30 | Matsushita Electronics Industry Corp | 半導体発光装置及びその製造方法 |
US6373188B1 (en) | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
US6203681B1 (en) | 1999-05-07 | 2001-03-20 | Micron Technology, Inc. | Methods of fabricating display screens using electrophoretic deposition |
JP2001111109A (ja) * | 1999-10-07 | 2001-04-20 | Sharp Corp | 窒化ガリウム系化合物半導体発光素子 |
-
2001
- 2001-06-22 EP EP01943536A patent/EP1228540B1/en not_active Expired - Lifetime
- 2001-06-22 KR KR1020027002544A patent/KR100869866B1/ko active IP Right Grant
- 2001-06-22 JP JP2002505694A patent/JP4928046B2/ja not_active Expired - Lifetime
- 2001-06-22 WO PCT/EP2001/007091 patent/WO2002001649A1/en active Application Filing
- 2001-06-22 DE DE60143152T patent/DE60143152D1/de not_active Expired - Lifetime
- 2001-06-22 CN CNB018018165A patent/CN1263168C/zh not_active Expired - Lifetime
- 2001-06-26 US US09/891,666 patent/US6686581B2/en not_active Expired - Fee Related
- 2001-08-13 TW TW090119776A patent/TW511302B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1383583A (zh) | 2002-12-04 |
KR100869866B1 (ko) | 2008-11-24 |
EP1228540A1 (en) | 2002-08-07 |
KR20020027589A (ko) | 2002-04-13 |
DE60143152D1 (de) | 2010-11-11 |
EP1228540B1 (en) | 2010-09-29 |
US6686581B2 (en) | 2004-02-03 |
TW511302B (en) | 2002-11-21 |
US20020014838A1 (en) | 2002-02-07 |
JP2004502307A (ja) | 2004-01-22 |
WO2002001649A1 (en) | 2002-01-03 |
JP4928046B2 (ja) | 2012-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1263168C (zh) | 光电元件和用发光层覆盖光电元件的方法 | |
JP4451522B2 (ja) | 有機及びポリマー発光デバイスの信頼性を向上させるための構造及びその製造方法 | |
US9893118B2 (en) | Light emitting device and method for fabricating the same | |
CN1184858C (zh) | 带有辅助阴极总线的有机电致发光器件 | |
US6864110B2 (en) | Electrophoretic processes for the selective deposition of materials on a semiconducting device | |
JP2004502307A5 (zh) | ||
US9825208B2 (en) | Method of producing an optoelectronic semiconductor component | |
GB1568111A (en) | Electroluminescent devices | |
CN101809770A (zh) | 光电子半导体芯片,光电子器件和用于制造光电子器件的方法 | |
CN102176498A (zh) | Led芯片的制作方法 | |
CN105742311A (zh) | 一种显示装置及其制备方法 | |
SU1301327A3 (ru) | Электролюминесцентное устройство | |
US5936344A (en) | Organic electroluminescent element | |
US7990057B2 (en) | Surface emitting-type electroluminescent device | |
TW201203644A (en) | Method for creating serial connected OLED-devices | |
KR101216938B1 (ko) | 다수의 셀이 결합된 발광 소자 및 이의 제조 방법 및 이를이용한 발광 장치 | |
KR101486844B1 (ko) | 복사 방출 장치 및 복사 방출 장치의 제조 방법 | |
EP2267818B1 (en) | Organic lighting device | |
CN112968030B (zh) | 显示面板与其制作方法 | |
CN106784176A (zh) | 一种发光效率高的led芯片及其制作方法 | |
CN117080341A (zh) | 一种led芯片及其制备方法 | |
KR101216937B1 (ko) | 다수의 셀이 결합된 발광 소자 및 이의 제조 방법 및 이를 이용한 발광 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven, Netherlands Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven, Netherlands Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200710 Address after: Holland Schiphol Patentee after: KONINKLIJKE PHILIPS NV Address before: Eindhoven, Netherlands Patentee before: KONINKLIJKE PHILIPS N.V. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20060705 |