CN1250669C - 具有宽范围开模时间的热熔湿固化聚氨酯粘合剂 - Google Patents
具有宽范围开模时间的热熔湿固化聚氨酯粘合剂 Download PDFInfo
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- CN1250669C CN1250669C CNB028188993A CN02818899A CN1250669C CN 1250669 C CN1250669 C CN 1250669C CN B028188993 A CNB028188993 A CN B028188993A CN 02818899 A CN02818899 A CN 02818899A CN 1250669 C CN1250669 C CN 1250669C
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- hot melt
- polyurethane adhesive
- adhesive compositions
- melt moisture
- moisture curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2250/00—Compositions for preparing crystalline polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/965,769 US6844073B1 (en) | 2001-09-27 | 2001-09-27 | Hot melt moisture cure polyurethane adhesive with wide range of open time |
US09/965,769 | 2001-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1558938A CN1558938A (zh) | 2004-12-29 |
CN1250669C true CN1250669C (zh) | 2006-04-12 |
Family
ID=25510467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028188993A Expired - Fee Related CN1250669C (zh) | 2001-09-27 | 2002-09-24 | 具有宽范围开模时间的热熔湿固化聚氨酯粘合剂 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6844073B1 (zh) |
EP (1) | EP1430105B1 (zh) |
CN (1) | CN1250669C (zh) |
AT (1) | ATE327297T1 (zh) |
AU (1) | AU2002343411A1 (zh) |
DE (1) | DE60211726T2 (zh) |
ES (1) | ES2262860T3 (zh) |
WO (1) | WO2003060033A1 (zh) |
Cited By (1)
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CN106398625A (zh) * | 2015-02-27 | 2017-02-15 | H.B.富乐公司 | 耐油化学的制品和耐油化学的湿固化型热熔粘合剂组合物 |
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DE60305261T2 (de) * | 2002-09-27 | 2007-03-08 | Dainippon Ink And Chemicals, Inc. | Lösungsmittelfreie, feuchtigkeitshärtende heissschmelzende Urethanharz-Zusammensetzung |
US7138466B2 (en) * | 2004-04-06 | 2006-11-21 | National Starch And Chemical Investment Holding Corporation | Reactive hot melt adhesive with improved properties |
ES2524768T3 (es) * | 2004-04-09 | 2014-12-12 | Dic Corporation | Adhesivo termofusible de poliuretano curable por humedad |
DE102004057292A1 (de) * | 2004-11-26 | 2006-06-01 | Klebchemie, M.G. Becker Gmbh & Co Kg | Verfahren zur Herstellung von reaktiven Polyurethanzusammensetzungen |
EP1873222A1 (de) * | 2006-06-30 | 2008-01-02 | Sika Technology AG | Feuchtigkeitsreaktiver Schmelzklebstoff mit erhöhter Offenzeit |
WO2008093398A1 (ja) * | 2007-01-30 | 2008-08-07 | Asics Corporation | シューズの製造方法、及びシューズ |
US20140262189A1 (en) * | 2008-01-25 | 2014-09-18 | Henkel US IP LLC | Curable compositions and fluid connections made therewith |
CN101787250B (zh) * | 2010-01-22 | 2012-04-25 | 山东久隆高分子材料有限公司 | 含有线性端羟基聚氨酯树脂的eva热熔胶组合物 |
US9676976B2 (en) * | 2010-06-21 | 2017-06-13 | Dic Corporation | Oxygen-barrier film and adhesive |
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EP2535376A1 (de) | 2011-06-14 | 2012-12-19 | Merz+Benteli AG | Mehrkomponentige Zusammensetzung als Klebstoff für schwierig zu verklebende Materialien |
CN102732203A (zh) * | 2012-06-26 | 2012-10-17 | 中国科学院理化技术研究所嘉兴工程中心 | 汽车灯具用反应型聚氨酯热熔胶的制备方法 |
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US9487687B2 (en) | 2013-09-27 | 2016-11-08 | Dic Corporation | Bookbinding adhesive |
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US10011749B2 (en) * | 2014-08-15 | 2018-07-03 | H.B. Fuller Company | Re-workable moisture curable hot melt adhesive composition, methods of using the same, and articles including the same |
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CN106221648A (zh) * | 2016-08-12 | 2016-12-14 | 无锡市万力粘合材料股份有限公司 | 快速装配用的湿固化聚氨酯热熔胶粘剂 |
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CN116103009A (zh) * | 2021-11-11 | 2023-05-12 | H.B.富乐公司 | 反应型热熔胶组合物 |
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CN115820193A (zh) * | 2022-11-30 | 2023-03-21 | 康菲胶粘剂技术(广东)有限公司 | 一种薄基材用聚氨酯热熔胶及其制备方法 |
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JP2986016B2 (ja) | 1996-06-19 | 1999-12-06 | エイチ・ビー・フラー・ライセンシング・アンド・ファイナンシング・インコーポレイテッド | 反応性ホットメルトポリウレタン接着剤を用いた本のためのカバーおよびかかるカバーを含む本 |
US6221978B1 (en) | 1998-04-09 | 2001-04-24 | Henkel Corporation | Moisture curable hot melt adhesive and method for bonding substrates using same |
-
2001
- 2001-09-27 US US09/965,769 patent/US6844073B1/en not_active Expired - Fee Related
-
2002
- 2002-09-24 AT AT02780353T patent/ATE327297T1/de active
- 2002-09-24 CN CNB028188993A patent/CN1250669C/zh not_active Expired - Fee Related
- 2002-09-24 AU AU2002343411A patent/AU2002343411A1/en not_active Abandoned
- 2002-09-24 DE DE2002611726 patent/DE60211726T2/de not_active Expired - Lifetime
- 2002-09-24 EP EP20020780353 patent/EP1430105B1/en not_active Expired - Lifetime
- 2002-09-24 WO PCT/US2002/030428 patent/WO2003060033A1/en active IP Right Grant
- 2002-09-24 ES ES02780353T patent/ES2262860T3/es not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106398625A (zh) * | 2015-02-27 | 2017-02-15 | H.B.富乐公司 | 耐油化学的制品和耐油化学的湿固化型热熔粘合剂组合物 |
CN106398625B (zh) * | 2015-02-27 | 2019-12-27 | H.B.富乐公司 | 耐油化学的制品和耐油化学的湿固化型热熔粘合剂组合物 |
Also Published As
Publication number | Publication date |
---|---|
US6844073B1 (en) | 2005-01-18 |
DE60211726D1 (de) | 2006-06-29 |
ATE327297T1 (de) | 2006-06-15 |
DE60211726T2 (de) | 2007-01-18 |
AU2002343411A1 (en) | 2003-07-30 |
ES2262860T3 (es) | 2006-12-01 |
EP1430105A1 (en) | 2004-06-23 |
WO2003060033A1 (en) | 2003-07-24 |
CN1558938A (zh) | 2004-12-29 |
EP1430105B1 (en) | 2006-05-24 |
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