CN113745002B

CN113745002B - Electronic component

Info

Publication number: CN113745002B
Application number: CN202110409544.3A
Authority: CN
Inventors: 增田朗丈; 伊藤信弥; 安藤德久; 矢泽广祐; 佐藤佳树; 小林一三; 井口俊宏; 玉木贤也; 斋藤真也
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2020-05-27
Filing date: 2021-04-16
Publication date: 2022-11-04
Anticipated expiration: 2041-04-16
Also published as: US11646163B2; CN113745002A; JP7469956B2; JP2021190503A; US20210375553A1

Abstract

The invention provides an electronic component which is advantageous in high-density mounting and simplification of a mounting process. The electronic component includes: a first capacitor having first and second terminal electrodes; a second capacitor having third and fourth terminal electrodes; a case having an accommodation recess for accommodating the first and second capacitors; a coil which is separated from the first and second capacitors by a part of the case and is disposed outside the accommodation recess; a first conductive terminal connected to the first terminal electrode, a part of which is disposed on a bottom surface of the case on the mounting side; a second conductive terminal which is connected to one end of the coil and the second terminal electrode, and a part of which is disposed on the mounting-side bottom surface; a third conductive terminal which is connected to the other end of the coil and the third terminal electrode, and a part of which is disposed on the mounting-side bottom surface; and a fourth conductive terminal connected to the fourth terminal electrode, a part of which is disposed on the mounting-side bottom surface.

Description

Electronic component

Technical Field

The present invention relates to an electronic component having a capacitor and a coil.

Background

On a mounting substrate or the like, for example, a circuit combining a coil and a capacitor may be formed as a noise filter. Conventionally, a noise filter or the like is formed by mounting a coil element and a capacitor element as shown in patent document 1 on a substrate separately and electrically connecting these elements via the mounting substrate.

However, in the conventional method of mounting the coil and the capacitor on the substrate separately, it is necessary to secure both an area region for mounting the coil and an area region for mounting the capacitor on the mounting substrate. Therefore, the conventional technique has a technical problem in view of high-density mounting and the like. In addition, when the coil and the capacitor are mounted on the substrate separately, the number of times the component is conveyed to the mounting position on the mounting substrate by a mounting machine or the like is large, and therefore, there is a problem in terms of production efficiency.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 11-102837

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component which is advantageous in high-density mounting and simplification of a mounting process.

Means for solving the problems

In order to achieve the above object, the present invention provides an electronic component having:

a first capacitor having a first terminal electrode and a second terminal electrode;

a second capacitor having a third terminal electrode and a fourth terminal electrode;

a case having an accommodation recess for accommodating the first capacitor and the second capacitor;

a coil which is separated from the first capacitor and the second capacitor by a part of the case and is disposed outside the accommodation recess;

a first conductive terminal connected to the first terminal electrode, a part of which is disposed on a bottom surface of the case on the mounting side;

a second conductive terminal which is connected to one end of the coil and the second terminal electrode, and a part of which is disposed on the mounting-side bottom surface;

a third conductive terminal which is connected to the other end of the coil and the third terminal electrode, and a part of which is disposed on the mounting-side bottom surface; and

and a fourth conductive terminal connected to the fourth terminal electrode, a part of which is disposed on the mounting-side bottom surface.

The electronic component of the present invention has at least one coil and two capacitors, and the capacitors and the coil are integrally provided via a housing. The first to fourth terminal electrodes are connected to the terminal electrodes and the coil of the capacitors, and a part of each conductive terminal is disposed on the mounting-side bottom surface of the case. Since such an electronic component is provided with the capacitor and the coil integrally, it is not necessary to mount the coil and the capacitor separately, and therefore, it is advantageous in terms of high-density mounting and simplification of the mounting process. Further, by disposing a part of each conductive terminal on the mounting-side bottom surface of the housing, the electrical connection to the electronic component can be arbitrarily changed on the mounting substrate side, and thus the electronic component can be used as various types of filters and the like. In addition, since the capacitor is accommodated in the accommodation recess of the case, the assembly of such electronic component is easy. Further, by disposing the capacitor in the accommodating recess and disposing the coil outside the accommodating recess, insulation between the coil and the capacitor can be easily ensured.

For example, the housing may have an opening edge surface disposed around an opening of the accommodation recess, and the opening edge surface may be the mounting side bottom surface.

Such an electronic component is advantageous in that the first to fourth conductive terminals can be downsized to reduce the direct current resistance, because the distance between the first to fourth terminal electrodes in the accommodation recess and the mounting-side bottom surface can be shortened.

For example, the coil may be formed of a wire wound around an outer wall of the case.

The coil included in the electronic component is not particularly limited, and may be a laminated chip coil or the like, but a coil formed of a wire wound around the outer wall of the case may be used. Thus, the electronic component using the coil formed of the winding has advantages that the direct current resistance can be suppressed, and the electronic component can easily cope with a high current value.

In addition, for example, the housing may have: a first protrusion formed on the outer side wall closer to the mounting side bottom surface than the coil; a second protrusion formed on the outer side wall farther from the mounting side bottom surface than the coil.

The case has the first projection and the second projection, and the coil is more reliably held by the case. Therefore, such electronic components are advantageous in terms of impact resistance and the like. The first and second protruding portions can also play a role of guiding when the winding is wound on the outer wall of the case.

For example, the coil and at least a part of the first capacitor and the second capacitor may overlap each other when viewed in a direction parallel to the mounting-side bottom surface.

Since a part of the capacitor can be disposed inside the coil, such an electronic component is advantageous in terms of reduction in thickness.

For example, the coil, the first capacitor, and the second capacitor may not overlap with each other when viewed in a direction parallel to the mounting-side bottom surface.

In such an electronic component, the characteristics of the coil can be greatly adjusted by changing the core material disposed inside the coil. For example, a core material having high magnetic permeability is disposed inside the coil, whereby inductance and the like can be increased.

For example, at least one of the first conductive terminal and the second conductive terminal and at least one of the third conductive terminal and the fourth conductive terminal may have a bent portion that elastically contacts the first capacitor or the second capacitor in the accommodation recess.

The conductive terminal and the terminal electrode are connected in a pressure-bonded state by forming the bent portion by the conductive terminal, and there is no need to connect them by a connecting member such as solder or a conductive adhesive. Since the terminal and the electrode can be connected without using solder, copper, a copper alloy, or the like can be used as a material of the terminal, and ESR (equivalent series resistance) can be reduced. Further, since solder is not required, it is possible to avoid the problem of cracks occurring in the chip component due to a difference in thermal expansion or the like occurring at the time of solder connection.

For example, the first to fourth conductive terminals may have an engagement piece that engages with the housing.

The conductive terminal having such an engaging piece can be easily and reliably fixed to the housing only by being inserted into the housing.

In addition, for example, the case may have a partition wall that partitions the first capacitor and the second capacitor in the accommodation recess.

By having the partition wall, such an electronic component can appropriately secure an insulation distance between the terminal electrode of the first capacitor and the terminal electrode of the second capacitor. Further, by providing the partition wall in the case, positioning of the first to fourth conductive terminals and the first and second capacitors when the electronic component is assembled becomes easy.

For example, the housing recess may be filled with resin.

The housing recess of the case can be used as a filling space for resin, and such an electronic component can be improved in insulation properties, heat dissipation properties, and the like by filling the resin.

In addition, for example, the housing may have: an engaging projection formed on an outer side wall perpendicular to the mounting side bottom surface; and the clamping concave part is formed on the side, opposite to the clamping convex part, of the outer side wall and can be clamped with the clamping convex part.

By having such engaging convex portions and engaging concave portions, a plurality of electronic components can be coupled to each other. By connecting a plurality of electronic components, an electronic component which is more advantageous with respect to simplification of a mounting process can be realized.

Drawings

Fig. 1 is a schematic perspective view of an electronic component according to a first embodiment of the present invention from an obliquely upper side.

Fig. 2 is a bottom view of the electronic component shown in fig. 1.

Fig. 3 is a conceptual diagram of the housing of the electronic component shown in fig. 1 and shown in perspective view.

Fig. 4 is a schematic perspective view of the electronic component shown in fig. 1, viewed obliquely from below, and shows a state in which a capacitor included in the electronic component is not displayed.

Fig. 5 is a schematic perspective view of the electronic component shown in fig. 1 from an upper side, and shows a state in which a coil included in the electronic component is not displayed.

Fig. 6 is a side view of the electronic component shown in fig. 1, showing a state in which a coil included in the electronic component is not displayed.

Fig. 7 is a schematic perspective view showing first to fourth conductive terminals included in the electronic component shown in fig. 1.

Fig. 8 is a schematic perspective view from obliquely below of the electronic component shown in fig. 1.

Fig. 9 is a schematic perspective view of an electronic component according to a second embodiment of the present invention from obliquely above.

Fig. 10 is a schematic perspective view of the electronic component shown in fig. 9 from the side, showing a state in which the coil is not displayed.

Fig. 11 is a schematic perspective view showing a state in which the case and the coil are not shown in the electronic component shown in fig. 9.

Fig. 12 is a schematic perspective view of an electronic component according to a third embodiment of the present invention from obliquely below.

Fig. 13 is a schematic perspective view of the electronic component shown in fig. 12, viewed from a different direction.

Fig. 14 is a schematic perspective view showing a state in which two electronic components shown in fig. 12 are connected.

Fig. 15 is a schematic perspective view of an electronic component according to a first modification of the present invention.

Fig. 16 is a schematic perspective view of an electronic component according to a second modification of the present invention.

Fig. 17 is a conceptual diagram illustrating an equivalent circuit diagram formed using one electronic component.

Fig. 18 is a conceptual diagram showing an equivalent circuit diagram formed using two electronic components.

Fig. 19 is a conceptual diagram illustrating a third conductive terminal according to a third modification.

Description of the symbols

10. 110, 210, 310, 410, 510 … … electronic component

20a … … first capacitor

20b … … second capacitor

21 … … first terminal electrode

22 … … second terminal electrode

23 … … third terminal electrode

24 … … fourth terminal electrode

30 … … first conductive terminal

40. 140 … … second conductive terminal

50. 150 … … third conductive terminal

60. 660 … … fourth conductive terminal

32. 42, 52, 62, 662 … … inner electrode portion

34. 44, 54, 64 … … open edge electrode part

36. 46, 56, 66, 146, 156 … … side electrode part

42a, 62a … … curved portion

46a, 56a, 146a, 156a … …

662b … … clamping piece

662c … … through hole

70. 170, 270, 470 … … casing

71. 171, 271, 471 … … outer side wall

71a, 171a … … first projection

71b, 171b … … second projection

71aa … … interruption

171c … … outer sidewall upper portion

271da, 271db … … lower portion of outer sidewall

271e … … clamping concave part

271f … … engagement projection

72 … … receiving recess

73 … … Upper wall

74 … … dividing wall

76. 176, 276 … … opening edge surface

78. 478 … … Upper surface

80. 280, 480 … … coil

481 … … first terminal portion

482 … … second terminal part

Detailed Description

The present invention will be described below based on embodiments shown in the drawings.

First embodiment

Fig. 1 is a schematic perspective view of an electronic component 10 according to a first embodiment of the present invention from an obliquely upper side. As shown in fig. 1, the electronic component 10 includes a case 70, a coil 80 wound around the outer periphery of the case 70, a second conductive terminal 40, and a fourth conductive terminal 60. The electronic component 10 has a substantially rectangular parallelepiped shape, but the external shape of the electronic component 10 is not limited to a rectangular parallelepiped shape, and may be other shapes such as a cylindrical shape and a hexagonal prism shape.

Fig. 2 is a bottom view of the electronic component 10 shown in fig. 1 as viewed from below. As shown in fig. 2, the electronic component 10 further includes: a first capacitor 20a, a second capacitor 20b, a first conductive terminal 30, and a third conductive terminal 50. In the description of the electronic component 10, as shown in fig. 2, the direction in which the first capacitors 20a and the second capacitors 20b are arranged is referred to as the X-axis direction, the direction perpendicular to the X-axis direction, that is, the direction in which the first conductive terminals 30 and the second conductive terminals 40 (or the third conductive terminals 50 and the fourth conductive terminals 60) are arranged is referred to as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction.

Fig. 3 is a conceptual diagram illustrating the housing 70 of the electronic component 10 shown in fig. 1 in a perspective view. As shown in fig. 3, the first capacitor 20a and the second capacitor 20b are chip capacitors having a substantially rectangular parallelepiped shape and have substantially the same shape and size. However, the first capacitor 20a and the second capacitor 20b may have different shapes and sizes.

As shown in fig. 3, the first capacitor 20a has a first terminal electrode 21 and a second terminal electrode 22. The first terminal electrode 21 is provided on an end surface of the first capacitor 20a facing the Y-axis negative direction side, and the second terminal electrode 22 is provided on an end surface of the first capacitor 20a facing the Y-axis positive direction side. That is, the first terminal electrode 21 and the second terminal electrode 22 are formed on a pair of surfaces of the first capacitor 20a facing each other.

Dielectric layers and internal electrode layers are alternately stacked in the first capacitor 20 a. The material of the dielectric layer is not particularly limited, and is composed of a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The thickness of each dielectric layer is not particularly limited, and is usually 1 μm to several hundred μm. In the present embodiment, the thickness of each dielectric layer is preferably 1.0 to 5.0 μm.

The internal electrode layers contain a conductor material. The conductive material included in the internal electrode layers is not particularly limited, and when the constituent material of the dielectric layers has reduction resistance, a relatively inexpensive base metal can be used. The base metal used for the internal electrode layers is preferably Ni or a Ni alloy. The Ni alloy is preferably an alloy of Ni and 1 or more elements selected from Mn, cr, co, and Al, and the Ni content in the alloy is preferably 95 wt% or more. In addition, ni or Ni alloy may contain various trace components such as P in an amount of about 0.1 wt% or less. The internal electrode layers may be formed using a commercially available paste for electrodes. The thickness of the internal electrode layer may be determined as appropriate depending on the application. The internal electrode layers may be made of a conductive material other than metal.

The internal electrode layers stacked in the first capacitor 20a include an electrode layer connected to the first terminal electrode 21 and an electrode layer connected to the second terminal electrode 22. The potential difference applied to the first terminal electrode 21 and the second terminal electrode 22 is applied to the dielectric layer of the first capacitor 20a via the internal electrode layers.

The material of the first terminal electrode 21 and the second terminal electrode 22 is also not particularly limited, and copper, a copper alloy, nickel, a nickel alloy, or the like is generally used, but an alloy of silver, palladium, or the like may also be used. The thicknesses of the first and second

terminal electrodes

21 and 22 are also not particularly limited, but are usually about 10 to 50 μm. Further, at least 1 kind of metal coating selected from Ni, cu, sn, and the like may be formed on the surfaces of the first and second

terminal electrodes

21 and 22.

As shown in fig. 3, the second capacitor 20b has a third terminal electrode 23 and a fourth terminal electrode 24. The third terminal electrode 23 is provided on an end surface of the second capacitor 20b facing the Y-axis negative direction side, and the fourth terminal electrode 24 is provided on an end surface of the second capacitor 20b facing the Y-axis positive direction side. That is, the third terminal electrode 31 and the fourth terminal electrode 24 are formed on a pair of surfaces of the second capacitor 20b facing each other.

The shape and structure of the second capacitor 20b and the material of each part constituting the second capacitor 20b are the same as those of the first capacitor 20a described above.

The shape and size of the first capacitor 20a and the second capacitor 20b may be determined as appropriate according to the purpose and use. The first capacitor 20a and the second capacitor 20b have a length (Y-axis dimension shown in fig. 3) of 1.0 to 6.5mm in vertical direction (Z-axis dimension shown in fig. 3) and a width (Z-axis dimension shown in fig. 3) of 0.5 to 5.5mm in horizontal direction (thickness (X-axis dimension shown in fig. 3)) of 0.3 to 3.5mm, for example. The plurality of

capacitors

20a and 20b may be different in size and shape from each other. The stacking direction of the internal electrode layers and the dielectric layers in the first capacitor 20a and the second capacitor 20b is not particularly limited, and may be the X-axis direction or the Z-axis direction.

Fig. 4 is a schematic perspective view of the electronic component 10 viewed obliquely from below. However, in fig. 4, the first capacitor 20a and the second capacitor 20b are not shown. As shown in fig. 4, the case 70 has an accommodation recess 72 that accommodates the first capacitor 20a and the second capacitor 20b.

The accommodating recess 72 is surrounded by an upper wall surface 73 on the positive Z-axis side and four inner side surfaces on both sides in the X-axis direction and both sides in the Y-axis direction, and forms a substantially rectangular parallelepiped space open to the negative Z-axis direction. A partition 74 that divides the accommodation recess 72 and partitions the first capacitor 20a and the second capacitor 20b in the accommodation recess 72 is provided in the center portion of the accommodation recess 72 in the X axis direction.

The partition 74 approximately bisects the accommodation recess 72, and accommodates the first capacitor 20a in a portion on one side (X-axis negative direction side) of the partition 74 and the second capacitor 20b on the other side (X-axis positive direction side) of the partition 74. The housing 70 has an opening rim surface 76 disposed around the opening of the accommodation recess 72. The opening edge surface 76 is a surface facing the Z-axis negative direction side, and constitutes a mounting-side bottom surface that is an end surface of the housing 70 on the Z-axis negative direction side.

The opening edge surface 76 surrounds the opening of the accommodating recess 72, and a part of the first to fourth

conductive terminals

30, 40, 50, 60 is disposed on the opening edge surface 76.

Fig. 5 is a conceptual diagram illustrating a state in which the coil 80 included in the electronic component 10 shown in fig. 1 is not displayed with respect to the electronic component 10. As shown in fig. 5, the housing 70 has an outer side wall 71 that is substantially rectangular when viewed from the Z-axis direction. As shown in fig. 1, coil 80 is disposed outside accommodation recess 72 in which first capacitor 20a and second capacitor 20b are accommodated, and is disposed around outer wall 71 shown in fig. 5 (see fig. 3).

The coil 80 shown in fig. 1 is separated from the first capacitor 20a and the second capacitor 20b shown in fig. 3 by an outer wall 71 that is a part of the case 70. In the electronic component 10, the coil 80 is formed of a wire wound around the outer wall 71 (see fig. 5) of the case 70. However, the coil 80 included in the electronic component 10 is not limited to a coil formed of a wire wound around the outer wall 71, and may be formed of a chip inductor as described later, another type of coil disposed outside the case 70, or the like.

As shown in fig. 5, the housing 70 has: a first protrusion 71a formed on the outer side wall 71 closer to the opening edge surface 76 (see fig. 4) than the coil 80; and a second protrusion 71b formed on the outer side wall 71 farther from the opening edge surface 76 than the coil 80. The first and second protruding

portions

71a and 71b protrude from the outer wall 71 radially outward of the coil 80 than other portions of the outer wall 71.

The first protruding portion 71a is formed at the Z-axis negative direction end of the housing 70, and the lower end of the first protruding portion 71a continues to the opening edge surface 76. As shown in fig. 5, the first protrusion 71a is formed along the circumferential direction of the outer side wall 71, but is discontinuous in the circumferential direction.

That is, as shown in fig. 5 and 6, the first projecting portion 71a has a stopper portion 71aa that does not project on the side surface in the positive Y-axis direction and the side surface in the negative Y-axis direction. A part of the first to fourth

conductive terminals

30, 40, 50, 60 is disposed in the interrupt portion 71aa.

As shown in fig. 5, the second projecting portion 71b is formed at the Z-axis positive direction end portion of the case 70, and the upper end portion of the second projecting portion 71b continues to the upper surface 78 of the case 70. The second protruding portion 71b is formed so as to be circumferentially continuous along the circumferential direction of the outer side wall 71, unlike the first protruding portion 71 a. However, the second protrusions 71b may be intermittently formed in the circumferential direction, as with the first protrusions 71 a.

As shown in fig. 1, the coil 80 is disposed between the first projection 71a and the second projection 71b of the case 70. The first projection 71a and the second projection 71b regulate the position of the coil 80 in the Z-axis direction, and support the fixation of the coil 80 to the case 70.

The material of the case 70 is not particularly limited, but an insulating material such as ceramics, glass, or synthetic resin is preferable, and a resin material having excellent heat resistance is particularly preferable. The wire constituting the coil 80 is not particularly limited as long as it is a conductive wire, and examples thereof include a covered wire such as a single wire or a twisted wire.

Fig. 7 is a schematic perspective view showing the first to fourth

conductive terminals

30, 40, 50, 60 included in the electronic component 10. As shown in fig. 7, the first conductive terminal 30 has an inner electrode portion 32, an opening edge electrode portion 34, and a side electrode portion 36. The first conductive terminal 30 has a bent L-shape or U-shape. The first conductive terminal 30 is bent at an approximately 90 degree angle at the connection portion between the inner electrode portion 32 and the opening edge electrode portion 34, and at an approximately 90 degree angle at the connection portion between the opening edge electrode portion 34 and the side surface electrode portion 36. The inner electrode portion 32, the opening edge electrode portion 34, and the side electrode portion 36 are each rectangular flat plate-like.

As shown in fig. 3, the first conductive terminal 30 is connected to the first terminal electrode 21 of the first capacitor 20 a. As shown in fig. 4, the inner electrode portion 32 of the first conductive terminal 30 is inserted into the accommodating recess portion 72, and as shown in fig. 2, the first terminal electrode 21 of the first capacitor 20a accommodated in the accommodating recess portion is brought into contact with and electrically conducted to the inner electrode portion 32 of the first conductive terminal 30.

As shown in fig. 4, opening edge electrode portion 34, which is a part of first conductive terminal 30, is disposed on opening edge surface 76 of case 70. Opening edge electrode 34 extends along opening edge surface 76, and opening edge electrode 34 is substantially parallel to opening edge surface 76.

As shown in fig. 6, the side electrode portion 36 of the first conductive terminal 30 is disposed on the outer side surface 71a of the housing 70, particularly on the interruption portion 71aa of the first protrusion portion 71 a. As shown in fig. 7, the side surface electrode portion 36 of the first conductive terminal 30 is shorter than the side surface electrode portion 46 of the second conductive terminal 40 described later. Therefore, the upper end portion of the side electrode portion 36 shown in fig. 6 is not connected to the coil 80, but is separated from the coil 80.

As shown in fig. 7, the second conductive terminal 40 has an inner electrode portion 42, an opening edge electrode portion 44, and a side surface electrode portion 46. The second conductive terminal 40 has a bent L-shape or U-shape. Like the first conductive terminal 30, the second conductive terminal 40 is bent at a portion where the inner electrode portion 42 and the opening edge electrode portion 44 are connected to each other by substantially 90 degrees, and is bent at a portion where the opening edge electrode portion 44 and the side surface electrode portion 46 are connected to each other by substantially 90 degrees. The opening edge electrode portion 44 and the side surface electrode portion 46 of the second conductive terminal 40 are each in the shape of a rectangular flat plate.

As shown in fig. 7, the inner electrode portion 42 of the second conductive terminal 40 has a bent portion 42a bent from the base portion on the Z-axis negative direction side toward the tip on the Z-axis positive direction side. As shown in fig. 3, the second conductive terminal 40 is connected to the second terminal electrode 22 of the first capacitor 20 a. As shown in fig. 2 and 3, the inner electrode portion 42 of the second conductive terminal 40 is inserted into the accommodation recess 72, and the second terminal electrode 22 of the first capacitor 20a accommodated in the accommodation recess 72 is brought into contact with and electrically conducted to the inner electrode portion 42 of the second conductive terminal 40. As shown in fig. 3, the bent portion 42a of the inner electrode portion 42 is elastically deformed while being sandwiched between the inner surface of the accommodation recess 72 and the second terminal electrode 22, and thus elastically contacts the second terminal electrode 22.

As shown in fig. 4, the opening edge electrode portion 44, which is a part of the second conductive terminal 40, is disposed on the opening edge surface 76 of the case 70. The opening edge electrode portion 44 extends along the opening edge surface 76, and the opening edge electrode portion 44 is substantially parallel to the opening edge surface 76.

As shown in fig. 5, the side electrode portion 56 of the second conductive terminal 40 is disposed on the outer wall 71 of the housing 70, and a part thereof is disposed on the interruption portion 71aa of the first protrusion portion 71 a. As shown in fig. 7, the side surface electrode portion 46 of the second conductive terminal 40 is longer than the side surface electrode portion 36 of the first conductive terminal 30. The upper end portion 46a of the side electrode portion 46 of the second conductive terminal 40 shown in fig. 5 is connected to one end portion of the coil 80. The method of connecting the second conductive terminal 40 and the one end portion of the coil 80 is not particularly limited, and examples thereof include welding, pressure welding, soldering, and screwing.

As shown in fig. 7, the third conductive terminal 50 has an inner electrode portion 52, an opening edge electrode portion 54, and a side surface electrode portion 56. The third conductive terminal 50 has a bent L-shape or U-shape. Like the first conductive terminal 30, the third conductive terminal 50 is bent at a portion where the inner electrode portion 52 and the opening edge electrode portion 54 are connected to each other by substantially 90 degrees, and is bent at a portion where the opening edge electrode portion 54 and the side surface electrode portion 56 are connected to each other by substantially 90 degrees. The inner electrode portion 52, the opening edge electrode portion 54, and the side electrode portion 56 are each rectangular flat plate-like.

As shown in fig. 3, the third conductive terminal 50 is connected to the third terminal electrode 23 of the second capacitor 20b. As shown in fig. 4, the inner electrode portion 52 of the third conductive terminal 50 is inserted into the accommodation recess portion 72, and as shown in fig. 2, the third terminal electrode 23 of the second capacitor 20b accommodated in the accommodation recess portion 72 is brought into contact with and electrically conducted to the inner electrode portion 52 of the third conductive terminal 50.

As shown in fig. 4, the opening edge electrode portion 54 as a part of the third conductive terminal 50 is disposed on the opening edge surface 76 of the housing 70, as in the first and second

conductive terminals

30 and 40. Opening edge electrode portion 54 extends along opening edge surface 76, and opening edge electrode portion 54 is substantially parallel to opening edge surface 76.

As shown in fig. 6, the side electrode portion 56 of the third conductive terminal 50 is disposed on the outer wall 71 of the housing 70, and a part thereof is disposed on the interruption portion 71aa of the first protrusion portion 71 a. As shown in fig. 7, the side surface electrode portion 56 of the third conductive terminal 50 is longer than the side surface electrode portion 66 of the fourth conductive terminal 60 described later. The upper end 56a of the side electrode portion 56 in the third conductive terminal 50 shown in fig. 6 is connected to the other end of the coil 80 (the end opposite to the end connected to the second conductive terminal 40). The third conductive terminal 50 and the other end of the coil 80 are connected in the same manner as the second conductive terminal 40 and the one end of the coil 80.

As shown in fig. 7, the fourth conductive terminal 60 includes an inner electrode portion 62, an opening edge electrode portion 64, and a side surface electrode portion 66. The fourth conductive terminal 60 has a bent L-shape or U-shape. Like the second conductive terminal 40, the fourth conductive terminal 60 is bent at an approximately 90-degree joint between the inner electrode portion 62 and the opening edge electrode portion 64, and at an approximately 90-degree joint between the opening edge electrode portion 64 and the side surface electrode portion 66. The opening edge electrode portion 64 and the side surface electrode portion 66 of the fourth conductive terminal 60 are each in the form of a rectangular flat plate.

As shown in fig. 7, the inner electrode portion 62 of the fourth conductive terminal 60 has a bent portion 62a bent from the base portion on the Z-axis negative direction side toward the tip on the Z-axis positive direction side, like the inner electrode portion 42 of the second conductive terminal 40. As shown in fig. 3, the second conductive terminal 40 is connected to the fourth terminal electrode 24 of the second capacitor 20b. As shown in fig. 2 and 3, the inner electrode portion 62 of the fourth conductive terminal 60 is inserted into the accommodating recess portion 72, and the fourth terminal electrode 24 of the second capacitor 20b accommodated in the accommodating recess portion 72 is brought into contact with the inner electrode portion 62 of the fourth conductive terminal 60 and electrically conducted. As shown in fig. 3, the bent portion 62a of the inner electrode portion 62 is elastically deformed while being sandwiched between the inner surface of the accommodation recess 72 and the second terminal electrode 22, and is thereby elastically brought into contact with the fourth terminal electrode 24.

As shown in fig. 4, opening edge electrode portion 64 as a part of fourth conductive terminal 60 is disposed on opening edge surface 76 of case 70. Opening edge electrode portion 64 extends along opening edge surface 76, and opening edge electrode portion 64 is substantially parallel to opening edge surface 76.

As shown in fig. 5, the side electrode portion 66 of the fourth conductive terminal 60 is disposed on the outer wall 71 of the housing 70, particularly on the interruption portion 71aa of the first protrusion portion 71 a. As shown in fig. 7, the side surface electrode portion 66 of the fourth conductive terminal 60 is shorter than the side

surface electrode portions

46 and 56 of the second and third

conductive terminals

40 and 50, as in the side surface electrode portion 36 of the first conductive terminal 30. Therefore, the upper end portion of the side electrode portion 66 shown in fig. 5 is not connected to the coil 80, but is separated from the coil 80.

As can be understood from a comparison between fig. 1 and 3, in the electronic component 10, the coil 80 overlaps at least a part of the first capacitor 20a and the second capacitor 20b when viewed from the Y-axis direction, which is a direction parallel to the opening edge surface 76. By disposing the first capacitor 20a and the second capacitor 20b in the hollow portion of the coil 80 in this manner, the electronic component 10 can be reduced in size and thickness as appropriate.

Fig. 8 is a schematic perspective view of the electronic component 10 shown in fig. 1 from obliquely below. As shown in fig. 8, the opening

edge electrode portions

34, 44, 54, 64 of the first to fourth conductive terminals 30 to 60 of the electronic component 10 are exposed to the opening edge surface 76 side of the case 70. In the electronic component 10, the opening

edge electrode portions

34, 44, 54, and 64 are connected to pads or the like of a mounting board using solder or the like, and are mounted on the mounting board for use.

As shown in fig. 8, in electronic component 10, the lower surfaces of first capacitor 20a and second capacitor 20b are disposed at positions slightly recessed upward from the opening surface of receiving recess 72. Therefore, when the electronic component 10 is mounted, the first capacitor 20a and the second capacitor 20b are prevented from contacting the substrate or the like. However, the positions of the lower surfaces of the first capacitor 20a and the second capacitor 20b are not limited to this, and may be located above the lower surfaces of the opening

edge electrode portions

34, 44, 54, and 64.

In addition, as shown in fig. 8, in the electronic component 10, the opening of the accommodation recess 72 is in an open state, but the electronic component 10 may also have a bottom cover that partially or entirely closes the opening of the accommodation recess 72. In the electronic component 10, the gap of the accommodation recess 72 may be filled with the resin, and a part or all of the opening of the accommodation recess 72 may be closed by the filling resin. Such a resin exhibits an effect of preventing a conductive portion of the accommodation recess 72 from being short-circuited to a mounting board or the like, or preventing the first capacitor 20a and the second capacitor 20b from coming off due to unexpected impact.

Fig. 17 is a conceptual diagram illustrating an equivalent circuit diagram formed using the electronic component 10 shown in fig. 1. As shown in fig. 17 (a) to 17 (c), the electronic component 10 can be used as 3 different filters by changing the connection method to a mounting board or the like. In fig. 17 (a) to 17 (c), circled numbers 1 to 4 correspond to the opening

edge electrode portions

34, 44, 54, and 64 of the first to fourth conductive terminals 30 to 60, respectively.

As shown in fig. 17 (a) to 17 (c), the electronic component 10 can be used as a noise filter by connecting the opening

edge electrode portions

44 and 54 of the second and third

conductive terminals

40 and 50 to the circuit side. Here, as shown in fig. 17 (a), if both the opening

edge electrode portions

34 and 64 of the first and fourth

conductive terminals

30 and 60 are connected to GND, the electronic component 10 can be used as a pi filter (C-L-C).

On the other hand, as shown in fig. 17 b, if only the opening edge electrode portion 64 of the fourth conductive terminal 60 is connected to GND, it can be used as an LC filter (L-C) using the second capacitor 20b. As shown in fig. 17C, if only the opening edge electrode portion 34 of the first conductive terminal 30 is connected to GND, it can be used as an LC filter (C-L) using the first capacitor 20 a.

An example of the method for manufacturing the electronic component 10 will be described below.

The first and

second capacitors

20a and 20b are prepared by a normal method for manufacturing a multilayer ceramic capacitor.

The first to fourth conductive terminals 30 to 60 are prepared as follows. That is, in the manufacture of the first to fourth conductive terminals 30 to 60, first, a flat plate-like metal plate material is prepared. The material of the metal plate is not particularly limited as long as it is a metal material having conductivity, and for example, iron, nickel, copper, silver, or an alloy containing them can be used. Next, the metal plate material is machined to obtain an intermediate member to which the shapes of the

inner electrode portions

32, 42, 52, 62, the opening

edge electrode portions

34, 44, 54, 64, and the

side electrode portions

36, 46, 56, 66 are imparted.

Next, a metal coating is formed by plating on the surface of the intermediate member formed by machining, thereby obtaining the first to fourth conductive terminals 30 to 60. The material used for plating is not particularly limited, and examples thereof include Ni, sn, and Cu.

The housing 70 is prepared, for example, by injection molding manufacturing.

Next, the first to fourth conductive terminals 30 to 60 prepared as described above are mounted on the housing 70. The first to fourth conductive terminals 30 to 60 can be fixed to the case 70 using, for example, an adhesive or the like. However, as shown in fig. 19, when the first to fourth conductive terminals 30 to 60 have engagement pieces 662b (see fig. 19) that engage with the housing 70, the first to fourth conductive terminals 30 to 60 are fixed to the housing 70 by inserting the inner electrode portions 32 to 62 into the housing 70 and engaging the engagement pieces 662b with the housing 70.

Next, a coil 80 is formed by winding a wire around the outer wall 71 of the case 70, one end of the coil 80 is connected to the second conductive terminal 40, and the other end of the coil 80 is connected to the third conductive terminal 50.

Finally, the first and

second capacitors

20a and 20b are inserted into the respective accommodation recesses 72, and the electronic component 10 is obtained. The insertion of the first and

second capacitors

20a and 20b and the formation of the coil 80 may be performed in reverse order to the above.

In the electronic component 10 of the present embodiment, the first and

second capacitors

20a, 20b are assembled only by accommodating the first and

second capacitors

20a, 20b in the accommodating recess 72 from the opening surface of the accommodating recess 72 in the case 70. Therefore, the manufacturing method of the electronic component 10 is easier than the conventional capacitor assembly method requiring solder for welding to the terminal, and is excellent in productivity.

In addition, the electronic component 10 is advantageous in terms of high-density mounting and simplification of the mounting process by integrally providing the

capacitors

20a, 20b and the coil 80. Further, since the coil 80 is separated from the mounting substrate, another member such as a capacitor can be disposed between the coil 80 and the mounting substrate. In particular, the electronic component 10 is advantageous from the viewpoint of high-density mounting because the mounting region of the coil 80 and the mounting regions of the

capacitors

20a and 20b are repeated in the height direction. Further, by disposing a part of each of the conductive terminals 30 to 60 on the opening edge surface 76 which is the mounting side bottom surface of the housing 70, the electrical connection to the electronic component 10 can be arbitrarily changed on the mounting substrate side, and thereby the electronic component 10 can be used as various types of filters and the like. Further, by disposing the first and

second capacitors

20a and 20b in the accommodation recess 72 and disposing the coil 80 outside the accommodation recess 72, insulation between the coil 80 and the

capacitors

20a and 20b can be appropriately ensured.

In the electronic component 10, the opening edge surface 76 is a mounting-side bottom surface, and the first to fourth conductive terminals 30 to 60 are advantageously reduced in size from the viewpoint of reducing the direct current resistance. In the electronic component 10, the insulating distance between the

terminal electrodes

21 and 22 of the first capacitor 20a and the

terminal electrodes

23 and 24 of the second capacitor 20b can be appropriately secured by providing the partition 74 in the accommodation recess 72. Further, by providing the partition wall 74 in the case 70, positioning of the first to fourth conductive terminals 30 to 60 and the first and

second capacitors

20a and 20b when the electronic component 10 is assembled becomes easy.

Second embodiment

Fig. 9 is a schematic perspective view from obliquely below of an electronic component 110 according to a second embodiment of the present invention. The electronic component 110 of the second embodiment is the same as the electronic component 10 of the first embodiment except that the length of the case 170 in the Z-axis direction and the mounting position of the coil 80 are different. The description of the electronic component 110 is mainly focused on differences from the electronic component 10, and the description of common points with the electronic component 10 is omitted.

As shown in fig. 9, in electronic component 110, the length of case 170 in the Z-axis direction is longer than that of electronic component 110. Fig. 10 shows the electronic component 10 shown in fig. 9 in a state where the coil 80 is not displayed. As can be understood from fig. 9 and 10, the coil 180 is provided in the outer side wall 171 of the case 170 in the outer side wall upper portion 171c closer to the upper surface 178 than the opening edge surface 176 which is the mounting side bottom surface.

The outer wall 171 of the housing 170 is formed with a first projection 171a and a second projection 171b, as in the case 70 shown in fig. 5. However, the positions where the first protruding portion 171a and the second protruding portion 171b are formed match the arrangement of the coil 80 shown in fig. 9, and are different from the position of the case 70 shown in fig. 5.

That is, unlike the case 70 shown in fig. 5, the first protruding portion 171a is not continuous to the opening edge surface 176, but is disposed at a position apart from the opening edge surface 176 in the Z-axis direction. The distance from the opening edge surface 176 to the first protruding portion 171a in the Z-axis direction is not particularly limited, and may be, for example, equal to or longer than the length of the first capacitor 20a and the second capacitor 20b in the Z-axis direction (height direction). The first protruding portion 171a has a cut-off portion 171aa, like the first protruding portion 71a shown in fig. 5.

The second protruding portion 171b is formed at the Z-axis positive direction end of the case 170, like the second protruding portion 71b shown in fig. 5, and the upper end portion of the second protruding portion 171b continues to the upper surface 178 of the case 170.

Fig. 11 is a conceptual diagram illustrating a state in which case 170 and coil 80 are not displayed with respect to electronic component 110 shown in fig. 9. As shown in fig. 11, the electronic component 110 has, like the electronic component 10 shown in fig. 3: a first conductive terminal 30 (see fig. 9), a second conductive terminal 140, a third conductive terminal 150, and a fourth conductive terminal 60.

The first conductive terminal 30 and the fourth conductive terminal 60 of the four

conductive terminals

30, 140, 150, 60 of the electronic component 110 are the same as the first conductive terminal 30 and the fourth conductive terminal 60 of the electronic component 10 shown in fig. 7 and the like. However, as shown in fig. 9 and 10, the

side electrode portions

36 and 66 of the first conductive terminal 30 and the fourth conductive terminal 60 are not disposed in the interrupting portion 171aa in a relationship in which the first protruding portion 171a is disposed apart from the opening edge surface 176.

As shown in fig. 11, the second conductive terminal 140 and the third conductive terminal 150 of the electronic component 110 have

side electrode portions

146 and 156 having a longer length in the Z-axis direction than the second conductive terminal 40 and the third conductive terminal 50 shown in fig. 7. Thus, the upper end portion 146a of the side electrode portion 146 in the second conductive terminal 140 is connected to one end portion of the coil 80, and the upper end portion 156a of the side electrode portion 156 in the third conductive terminal 150 is connected to the other end portion of the coil 80.

As shown in fig. 9 to 11, the

side electrode portions

146 and 156 of the second conductive terminal 140 and the third conductive terminal 150 are connected to the coil 80 through the cut-off portion 171aa of the outer wall 171 of the case 70. The second and third

conductive terminals

140 and 150 except for the

side electrode portions

146 and 156 have the same shape as the second and third

conductive terminals

40 and 50 shown in fig. 7.

Housing recess 72 of case 170 shown in fig. 9 has the same shape as housing recess 72 of electronic component 10 shown in fig. 4, and houses first capacitor 20a and second capacitor 20b therein. As can be understood from a comparison between fig. 9 and 11, in electronic component 110, coil 80 and first capacitor 20a and second capacitor 20b do not overlap with each other when viewed from the Y-axis direction, which is a direction parallel to opening edge surface 76. In this way, by disposing the first capacitor 20a and the second capacitor 20b so as to be offset from the hollow portion of the coil 80 and disposing an arbitrary magnetic material or the like in the hollow portion of the coil 80, the characteristics of the coil 80 can be improved.

In addition, the electronic component 110 of the second embodiment has the same effect as the electronic component 10 of the first embodiment in common with the electronic component 10.

Third embodiment

Fig. 12 is a schematic perspective view from obliquely below of an electronic component 210 according to a third embodiment of the present invention. The electronic component 210 of the third embodiment is the same as the electronic component 110 of the second embodiment except that the outer shapes of the coil 280 and the case 270 are different, and the directions of the first capacitor 20a, the first conductive terminal 30, and the second conductive terminal 140 are rotated by 180 degrees. Description of electronic component 210 is mainly focused on differences from electronic component 110, and description of common points with electronic component 110 is omitted.

As shown in fig. 12, the coil 280 of the electronic component 210 has a substantially rectangular winding shape. The winding shape of the coil 280 of the electronic component 210 may be any shape such as a circle, an ellipse, a rectangle, or another polygon. The coil 280 may be formed by winding a wire around the outer wall 271 of the case 270, or an air-core coil may be attached to the outer wall 271 of the case 270.

As can be understood from fig. 12 and 13, in the electronic component 210, the first terminal electrode 21 of the first capacitor 20a faces the positive Y-axis direction, the second terminal electrode 22 faces the negative Y-axis direction, and the first capacitor 20a is disposed so as to be rotated by 180 degrees with respect to the electronic component 110 shown in fig. 9 with respect to the rotation axis parallel to the Z-axis.

As shown in fig. 12, in the electronic component 210, the second conductive terminal 140 and the third conductive terminal 150 connected to the coil 280 are arranged in parallel and oriented in the same direction. As shown in fig. 13, in the electronic component 210, the first conductive terminal 30 and the fourth conductive terminal 60 that are not connected to the coil 280 are arranged side by side in the same direction. The first to fourth

conductive terminals

30, 140, 150, and 60 may be arranged as in the electronic component 210 shown in fig. 12, or may be arranged as in the electronic component 110 shown in fig. 9.

As shown in fig. 12, the housing 270 has an engaging convex portion 271f and an engaging concave portion 271e formed on an outer wall 271 perpendicular to an opening edge surface 276 as a mounting bottom surface. The engaging convex portion 271f and the engaging concave portion 271e are formed in the outer wall 271 so as to be closer to the outer wall lower portions 271da and 271db of the opening edge surface 276 than the coil 280.

As shown in fig. 12, the engaging projection 271f is formed at an outer wall lower portion 271da perpendicular to the side where the

side electrode portions

146, 156 are arranged. The engaging convex portion 271f is formed in the outer wall lower portion 271da so as to protrude outward from the other portions, and has a shape engageable with the engaging concave portion 271e.

The engaging concave portion 271e is formed in the outer wall lower portion 271db on the side opposite to the engaging convex portion 271 f. The engaging recess 271e has a dovetail groove shape continuing to the opening edge surface 276, and the engaging projection 271f can be inserted while sliding from the opening edge surface 276 side.

Fig. 14 is a schematic perspective view showing an electronic component 310 in which two electronic components 210 shown in fig. 12 are coupled. As shown in fig. 14, the electronic component 310 can be manufactured by engaging the engaging convex portion 271f of one electronic component 210 with the engaging concave portion 271e of the other electronic component 210.

As shown in fig. 14, in the electronic component 310, the opening edge surfaces 276 of the two electronic components 210 are arranged on the same plane. Accordingly, the electronic component 310 can easily connect and mount all the opening edge electrode portions of the first to fourth

conductive terminals

30, 140, 150, 60 of the two electronic components 210 to the mounting substrate.

Fig. 18 is a conceptual diagram illustrating an equivalent circuit diagram formed using electronic component 310 shown in fig. 14. As shown in fig. 18, the electronic component 310 can be used as an electronic component 310 to which two electronic components 210 are connected by electrically connecting the third conductive terminal 150 (see the number "3" of the circle) of one electronic component 210 and the second conductive terminal 140 (see the number "6" of the circle) of the other electronic component 210 via a mounting substrate. However, the electronic component 310 may have a connection terminal for connecting the third conductive terminal 150 of one electronic component 210 and the second conductive terminal 140 of another electronic component 210. In the electronic component 310 having such a connection terminal, the one electronic component 210 and the other electronic component 210 are electrically connected to each other even if they are not mounted on the mounting substrate.

As shown in fig. 18 (a) and 18 (b), the electronic component 310 can be used as a filter having a different operation mode by changing a connection method to a mounting board. In fig. 18 (a) and 18 (b), circled numbers 1 to 4 correspond to the opening edge electrode portions of the first to fourth

conductive terminals

30, 140, 150, 60 of one electronic component 210 included in the electronic component 310, respectively. The circled numbers 5 to 8 correspond to the opening edge electrode portions of the first to fourth

conductive terminals

30, 140, 150, 60 of the other electronic component 210 included in the electronic component 310, respectively.

As shown in fig. 18 (a), the electronic component 310 can be connected via a mounting board and used as a pi filter (C-L-C C-L-C). The electronic component 310 can be used as an LC filter (C-L-C) by being connected via a mounting board as shown in fig. 18 (b). In the example shown in fig. 18 (b), the first conductive terminal 30 (the number "5" of the circle in fig. 18 (a)) connected to the connection portion between the one electronic component 210 and the other electronic component 210 is electrically floated.

As shown in fig. 14, a plurality of electronic components 210 are easily connected to form one electronic component 310. The connected electronic component 310 is conveyed at a time to a predetermined mounting position on the mounting board by a mounting machine or the like. Therefore, the electronic component 210 can simplify the mounting process by the mounting machine, compared to the case where capacitors, coils, or the like are individually mounted.

The present invention has been described above by referring to the embodiments, but the technical scope of the present invention is not limited to these embodiments, and the present invention may include a plurality of other embodiments or modifications. Fig. 15 is a schematic perspective view of an electronic component 410 according to a first modification of the present invention.

As shown in fig. 15, the electronic component 410 has a chip-type coil (chip inductor) 480. The coil 480 is disposed on an outer sidewall 471 of the housing 470. One end of the coil 480 is connected to the side electrode portion 46 of the second conductive terminal 40 via the first terminal portion 481 of the coil 480. The other end of the coil 480 is connected to the side electrode portion 56 of the third conductive terminal 50 via the second terminal portion 482 of the coil 480.

Fig. 16 is a schematic perspective view of an electronic component 510 according to a second modification of the present invention. As shown in fig. 16, a chip-type coil 480 may be provided on the upper surface 478 of the case 470. In electronic component 510, the point at which one end of coil 480 is connected to second conductive terminal 40 and the other end of coil 480 is connected to third conductive terminal 50 is the same as that of other electronic component 410.

As shown in fig. 15 and 16, the coils included in the

electronic components

410 and 510 may be chip-type coils, and the chip-type coils may be any of laminated type, film type, and winding type. Although not shown in fig. 15 and 16, case 470 includes a housing recess for housing the first capacitor and the second capacitor, as in

cases

70 and 270 shown in fig. 2 and 12.

In the above-described embodiment, the number of capacitors included in the electronic component 10 is 2, but the number of capacitors included in the electronic component 10 is not limited thereto, and 3 or more capacitors may be included. The electronic component 10 may have a plurality of coils, or may have a chip component different from the capacitor and the coil.

In the electronic component 10, as shown in fig. 7, the second conductive terminal 40 and the fourth conductive terminal 60 have the

bent portions

42a and 62a, but all of the first to fourth conductive terminals 30 to 60 may have the bent portions. However, from the viewpoint of reliably holding the first and

second capacitors

20a and 20b, at least one of the first conductive terminal 30 and the second conductive terminal 40 and at least one of the third conductive terminal 50 and the fourth conductive terminal 60 preferably have a bent portion.

The shapes of the first to fourth conductive terminals 30 to 60 included in the electronic component 10 are not limited to those shown in fig. 7 and the like. Fig. 19 is a schematic perspective view showing a fourth conductive terminal 660 according to a third modification. As shown in fig. 19, the inner electrode portion 662 of the fourth conductive terminal 660 has an engagement piece 662b that engages with the case 70. Further, a through hole 662c for preventing solder or the like from rising during mounting is formed in the inner electrode portion 662 of the fourth conductive terminal 660.

Instead of the fourth conductive terminal 60 shown in fig. 7, a fourth conductive terminal 660 shown in fig. 19 may be used. The first to third conductive terminals 30 to 60 may further include an engaging piece 662b and a through hole 662c similar to the fourth conductive terminal 660.

Claims

1. An electronic component, comprising:

a coil that is separated from the first capacitor and the second capacitor by a part of the case and is disposed outside the accommodation recess;

a first conductive terminal connected to the first terminal electrode, a part of which is disposed on the bottom surface of the case on the mounting side;

2. The electronic component of claim 1,

the housing has an opening edge surface disposed around an opening of the accommodation recess, the opening edge surface being the mounting-side bottom surface.

3. The electronic component according to claim 1 or 2,

the coil is formed of a wire wound around an outer sidewall of the case.

4. The electronic component of claim 3,

the housing has: a first protrusion formed on the outer side wall closer to the mounting side bottom surface than the coil; and a second protrusion formed on the outer side wall lower than the coil and farther from the mounting side.

5. The electronic component of claim 1,

the coil and at least a part of the first capacitor and the second capacitor overlap each other when viewed in a direction parallel to the mounting-side bottom surface.

6. The electronic component of claim 1,

the coil, the first capacitor and the second capacitor do not overlap each other when viewed in a direction parallel to the mounting-side bottom surface.

7. The electronic component of claim 1,

at least one of the first conductive terminal and the second conductive terminal and at least one of the third conductive terminal and the fourth conductive terminal have a bent portion that elastically contacts the first capacitor or the second capacitor in the accommodation recess.

8. The electronic component of claim 1,

at least one of the first to fourth conductive terminals has an engaging piece that engages with the housing.

9. The electronic component of claim 1,

the case has a partition wall that partitions the first capacitor and the second capacitor at the accommodation recess.

10. The electronic component of claim 1,

the accommodation recess is filled with resin.

11. The electronic component of claim 1,

the housing has: an engaging projection formed on an outer side wall perpendicular to the mounting side bottom surface; and an engaging concave portion formed on a side of the outer wall opposite to the engaging convex portion and engageable with the engaging convex portion.