JPH0642323Y2 - High frequency coil - Google Patents

Description

TECHNICAL FIELD The present invention relates to a high frequency coil used in various electronic devices.

2. Description of the Related Art Conventionally, in this type of high frequency coil, a capacitor mounting hole 2 is provided in a bottom portion of a terminal plate 1 on which a coil winding drum core 5 is fixed with an adhesive or the like as shown in FIG. A cylindrical capacitor with a lead is housed in the mounting hole 2, and a capacitor lead 4a is drawn out from the upper part of the terminal board 1 along the lead wiring groove 1a provided on the side surface of the terminal board 1 and implanted in the terminal board 1. After the capacitor 4 is fixed and connected by entwining it with the pin terminal 3 formed, the coil 8 is wound, the cap core 6 is covered, and the shield case 7 is covered as shown in FIG. .

As for the method of mounting the capacitor, as shown in Fig. 10, a fusion-bonded part made by melting the resin on the inner wall surface of the capacitor mounting hole 2 with heat.
Capacitor 4 is fused and fixed by 2b and capacitor lead 4a
12 is produced by a method in which the coil core 8 is connected to the pull-out pin terminal 3 downward, the coil 8 is wound around the drum core 5, the cap core 6 is covered, and the shield case 7 is covered thereon. It was

The problem to be solved by the invention However, with such a structure of the terminal board 1, the method of mounting the capacitor 4 as shown in FIG. 9 complicates the routing of the capacitor lead 4a, which requires rationalization and automation. It was difficult.

In addition, in the method of mounting the capacitor 4 as shown in FIG. 10, the resin amount of the fusion-bonded portion 2b is affected by the temperature variation of the chip that melts the inner wall surface of the capacitor mounting hole 2, the size of the terminal board 1, the outer dimension of the capacitor 4, and the like. When the variation is large and small, imperfect fixing such as shaking and detachment of the capacitor 4 occurred. Further, pressure was applied to the capacitor 4, and defects such as cracks and cracks were generated in the capacitor 4.

Further, in the recent trend of the capacitor 4, the multilayer chip capacitor is mainly used, and the cylindrical capacitor with lead 4
It was difficult to reduce the cost of the high frequency coil with a built-in capacitor, including the construction method, while the demand for the product was drastically decreasing.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a concave groove having an arbitrary width and depth on inner wall surfaces of a capacitor mounting hole which face each other, and a pin implanted from the concave groove. Engage a capacitor connection terminal bent into an I-shaped, L-shaped, U-shaped or the like into a capacitor mounting hole of a terminal plate having a groove on the bottom surface of the terminal plate toward the root of the terminal, The tip of the capacitor connecting terminal is formed to project from the bottom surface of the terminal plate. Also, at the root of the planted pin terminal, there is a protrusion from the bottom surface of the terminal board, and along with the groove provided on the bottom surface of the terminal board from this, for capacitor connection engaged with the groove on the inner wall surface of the capacitor mounting hole The terminal plate structure has terminals.

Action As described above, the chip capacitor is housed in the capacitor mounting hole into which the capacitor connecting terminal of I-type, L-shaped, U-shaped, etc. is engaged, is connected to the terminal by soldering, and is connected to the lead wire of the coil. The coil terminal and the capacitor are connected to each other by being entwined with the pin terminal that requires connection with the capacitor and the projecting end of the capacitor connecting terminal.

For capacitor connection terminals that have a protrusion from the bottom of the terminal board at the base of the pin terminal, connect the coil lead wire to the pin terminal and the protrusion of the capacitor connection terminal at the same time, and connect each with solder. To be done. This makes it possible to use inexpensive chip capacitors, and to rationalize and automate them.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of parts constituting a high-frequency coil according to an embodiment of the present invention, FIG. 2 is a sectional front view of the completed high-frequency coil, and FIG. 3 is a sectional front view during assembly. FIG. 4 is a perspective view of the same. In the high frequency coil of the present invention, the capacitor connecting hole 13 provided on the bottom surface of the terminal plate 9 is engaged with the capacitor connecting terminal 13, and both ends of the capacitor connecting hole 10 are connected. A chip capacitor 15 having an electrode 15a therein is accommodated, a drum core 12 around which a coil 18 is wound is fixed to a drum core fixing portion 9b on the upper surface of a terminal board 9, and the drum core 12 is covered with a cap core 16 and an artificial leg 17a.
It has a structure covered with a shield case 17 having.

As shown in FIG. 1, the terminal plate 9 is provided with coil lead wiring grooves 9a on opposite sides, pin terminals 11 and capacitor mounting holes 10 implanted on the bottom surface, and a drum core fixing portion 9b on the top surface.
The capacitor mounting hole 10 is provided with a concave groove 10a on the inner wall surface facing each other, and the concave groove 10a is formed on the bottom surface of the terminal plate 9 toward the root of the adjacent pin terminal 11 from the concave groove 10a.
b is provided.

In addition, FIG. 1 shows a typical example of the capacitor connecting terminal 13, which has a portion 13a protruding from the bottom surface of the terminal plate 9 at the tip of the capacitor connecting terminal 13 which is formed by bending in a U shape.
The lead wire 18a of the coil 18 wound around the drum core 12 is entangled with the pin terminal 11 and then the same coil lead wire 18a is entangled with the protruding portion 13a.

Also, a capacitor connection terminal of another embodiment shown in FIG.
The projecting portion 14a of 14 has a shape projecting to the side and then bent downward, and its tip projects from the root along the pin terminal 11, and the projecting portion 14a and the pin terminal 1
1 has a structure in which the coil lead wires 18a are entangled at the same time when they are entangled. The capacitor connecting terminal 13 or 14 is engaged with the concave groove 10a provided in the capacitor mounting hole 10 of the terminal plate 9 described above, and the chip capacitor 15 is housed therein. 14 is fixed with solder. A sectional front view of the finished product of this embodiment is shown in FIG. 6, a sectional front view during assembly thereof is shown in FIG. 7, and a perspective view thereof is shown in FIG.

As described above, according to the present invention, the groove is formed on the inner wall surfaces of the opposite ends of the capacitor mounting hole of the terminal board, and the terminal of the terminal board is planted from the groove toward the root of the pin terminal. By engaging the capacitor connection terminal provided with the part protruding from the bottom surface of the terminal plate with the groove provided on the bottom surface, the chip capacitor can be stored and the coil and the capacitor can be connected in the coil winding process. The lead wire can be used as it is, an inexpensive chip capacitor can be used, and the construction method can be facilitated for rationalization and automation. In addition, it is possible to remove cracks and cracks in the capacitor that have been generated in the past, and it is possible to provide an inexpensive high-reliability high-frequency coil, which is of great industrial value.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a portion constituting a high frequency coil in an embodiment of the present invention, FIG. 2 is a sectional front view of the same high frequency coil, and FIG. 3 is a capacitor mounting and coil winding of the same embodiment. FIG. 4 is a perspective view showing a state in which a capacitor is also housed, FIG. 5 is a perspective view of a capacitor connecting terminal of another embodiment, and FIG. 6 is a high frequency coil using the same terminal. Sectional front view, FIG. 7 is a sectional front view in the process of assembly, FIG. 8 is a perspective view thereof, and FIGS. 9 and 10 are partially cutaway perspective views of a conventional high-frequency coil with a capacitor housed therein. 11 and 12 are sectional front views of the high frequency coil. 9 ... Terminal plate, 10 ... Capacitor mounting hole, 10a, 10b ...
Groove, 11 …… pin terminal, 12 …… drum core, 13,14 ……
Capacitor connection terminals, 13a, 14a ... Projection, 15 ... Chip capacitor, 16 ... Cap core, 17 ... Shield case, 18 ... Coil, 18a ... Coil lead wire.

Claims (2)

[Scope of utility model registration request] 1. A bobbin or a drum core around which a coil is wound is provided at an upper portion, a capacitor mounting hole is provided at a bottom portion, and a pin terminal is implanted therein, and an arbitrary width is provided on inner wall surfaces of the capacitor mounting hole facing each other. , A terminal plate having a groove having a depth and having a groove toward the root of the pin terminal planted from the groove, and an I-shaped / L-shaped terminal plate at both ends of the capacitor mounting hole of the terminal plate.
Capacitor connection terminals that are bent into a U-shape or U-shape and are installed so as to engage with the concave groove provided on the inner wall surface of the capacitor mounting hole, and the tips of the capacitor connection terminals are from the bottom of the terminal plate. A high-frequency coil that protrudes and incorporates a chip capacitor in this capacitor mounting hole. 2. A root portion of the implanted pin terminal has a projecting portion from the bottom surface of the terminal plate, which engages with a concave groove on the inner wall surface of the capacitor mounting hole along a concave groove provided on the bottom surface of the terminal plate. The high frequency coil according to claim 1, further comprising: a terminal for connecting the capacitor.