CN113532336B - Method for testing flatness of copper strip of high-precision lead frame material for etching - Google Patents
Method for testing flatness of copper strip of high-precision lead frame material for etching Download PDFInfo
- Publication number
- CN113532336B CN113532336B CN202010306208.1A CN202010306208A CN113532336B CN 113532336 B CN113532336 B CN 113532336B CN 202010306208 A CN202010306208 A CN 202010306208A CN 113532336 B CN113532336 B CN 113532336B
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- China
- Prior art keywords
- etching
- copper strip
- flatness
- edge
- lead frame
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 70
- 239000010949 copper Substances 0.000 title claims abstract description 70
- 238000005530 etching Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 title claims abstract description 26
- 238000012360 testing method Methods 0.000 title claims abstract description 24
- 238000005070 sampling Methods 0.000 claims abstract description 12
- 238000011156 evaluation Methods 0.000 claims abstract description 7
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 239000007888 film coating Substances 0.000 claims description 4
- 238000009501 film coating Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 238000006748 scratching Methods 0.000 claims description 2
- 230000002393 scratching effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 2
- 238000010008 shearing Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/28—Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A method for testing the flatness of copper strips of a high-precision lead frame material for etching comprises the following steps: sampling, coating, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation; the method solves the problem of testing the flatness of the copper strip of the high-precision lead frame material for etching, has simple operation method and process, accurate flatness test and evaluation, is suitable for testing requirements on the flatness of the copper strip for etching in small-batch copper strip production, has reproducibility in test data, can effectively guide production, and determines the process, sampling size, sampling method, test scheme design and method for eliminating influences of strip edge shearing on the flatness of the copper strip of the high-precision lead frame material for etching.
Description
Technical Field
The invention belongs to the field of nonferrous metal smelting and processing, and particularly relates to a method for testing the flatness of a copper strip of a high-precision lead frame material for etching.
Background
The high-precision lead frame material copper strip is a key material for frame materials and mobile phone integrated circuit chip carriers, due to the rapid development of electronic information technology, the technology of miniaturization and integration of key electronic components is widely adopted, the subsequent processing is gradually changed from a stamping mode to a finer etching mode, the quality of the high-precision lead frame material copper strip is also required to be higher by the change of the subsequent processing mode, and the flatness of the etched material is one of key evaluation indexes of the quality of the high-precision lead frame material copper strip. If asymmetric dimensional changes such as warpage and distortion occur after etching, the copper strip material is scrapped because the copper strip material cannot be used on electronic components. At present, the flatness of the etched high-precision lead frame material is usually predicted by directly slitting copper and copper alloy strips and then observing or measuring the flatness, but the flatness of the etched strips cannot be predicted by the method. How to test the flatness of the high-precision lead frame material copper strips after etching by a quick and visual method, and to predict whether the material can meet the applicability of downstream users and is applied to industrial production is an industrial technical problem which needs to be solved urgently.
For the above reasons, a method for testing the flatness of copper strips of high-precision lead frame materials for etching has been developed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a method for testing the flatness of the copper strip of the high-precision lead frame material for etching, solves the problem of testing the flatness of the copper strip of the high-precision lead frame material for etching, has simple operation method and flow, accurate flatness test and evaluation, and is suitable for the test requirement on the flatness of the copper strip for etching in the process of producing small batches of copper strips.
In order to achieve the above purpose, the invention adopts the following technical scheme: a method for testing the flatness of copper strips of a high-precision lead frame material for etching comprises the following steps: sampling, coating, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation.
First, sampling: taking a copper strip with the length of 30-300mm and the width of 30-300 mm;
second step, film coating: adopting a corrosion-resistant transparent adhesive tape to manually adhere films on two sides of the copper strip of the sample, wherein the films are uniformly adhered, and have no bubbles and no damage;
third, edge etching: manually scratching the film around the copper strip of the sample by using a blade, etching off the edge by using 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by using clear water;
fourth, plate making: according to the use requirement, designing etched patterns and sizes, carrying out manual single-sided plate making on the copper strip with the etched edges, wherein the longitudinal direction of the patterns is 2-50mm away from the transverse edge of the copper strip, the transverse direction of the patterns is 2-50mm away from the longitudinal edge of the copper strip, manually scribing the edges of the patterns by a blade, and displaying the surface of the copper strip after demoulding;
fifth, full etching or half etching: etching the plate-made copper strip in a container by using 10-60% sulfuric acid or nitric acid, soaking for 1-15 minutes, measuring in the middle, flushing with clear water, measuring etching depth, taking out when the depth reaches 5-100% of the thickness of the copper strip, cleaning with clear water, and wiping;
sixth, flatness measurement: placing the copper strips after full etching or half etching on a standard platform, and measuring and recording the four-angle warping heights by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventh, evaluating flatness: and according to the warping height and technical requirements, evaluating the flatness.
The beneficial effects of the invention are as follows: the method solves the problem of testing the flatness of the copper strip of the high-precision lead frame material for etching, has simple operation method and process, accurate flatness test and evaluation, is suitable for testing requirements on the flatness of the copper strip for etching in small-batch copper strip production, has reproducibility in test data, can effectively guide production, and determines the process, sampling size, sampling method, test scheme design and method for eliminating influences of strip edge shearing on the flatness of the copper strip of the high-precision lead frame material for etching.
Detailed Description
The invention is further described in detail below with reference to examples and embodiments:
example 1
The technical requirements of the copper strip of the high-precision lead frame material for the IC direction are as follows:
brand C19210
Copper strip specification: 0.2×300mm
Status: hard state (H)
The requirements are: leveling after etching, wherein the warping is less than or equal to 0.75mm
The flatness test process is as follows:
first, sampling: taking a copper strip with the length of 300mm and the width of 300 mm;
second step, film coating: adopting a corrosion-resistant transparent adhesive tape to manually adhere films on two sides of the copper strip of the sample, wherein the films are uniformly adhered, and have no bubbles and no damage;
third, edge etching: manually scribing the film with the periphery of the copper strip of the sample being 10mm away from the edge by a blade, rapidly etching the edge by 60% sulfuric acid or nitric acid, and cleaning the corrosive liquid on the surface of the sample by clean water;
fourth, plate making: according to the use requirement, designing etched patterns and sizes, carrying out manual single-sided plate making on the copper strip with the etched edges, wherein the longitudinal direction of the patterns is 50mm away from the transverse edge of the copper strip, the transverse direction of the patterns is 50mm away from the longitudinal edge of the copper strip, manually scribing the edges of the patterns by a blade, and displaying the surface of the copper strip after demoulding;
fifth, half etching: etching the plate-made copper strip in a container by adopting sulfuric acid or nitric acid with the concentration of 20%, soaking for 5 minutes, sampling in the middle, flushing with clear water, measuring etching depth, taking out when the depth reaches about 20% of the thickness of the copper strip, cleaning with clear water, and wiping;
sixth, flatness measurement: placing the half-etched copper strips on a standard platform, and measuring and recording the warpage heights of four corners by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventh, evaluating flatness: and according to the warping height and technical requirements, evaluating the flatness.
Example 2
The technical requirements of the high-precision lead frame material copper strip for the direction of the mobile phone are as follows:
brand C2680
Copper strip specification: 0.15X105 mm
Status: hard state (H)
The requirements are: leveling after etching, wherein the warping is less than or equal to 0.75mm
The flatness test process is as follows:
first, sampling: taking a copper strip with the length of 80mm and the width of 80 mm;
second step, film coating: adopting a corrosion-resistant transparent adhesive tape to manually adhere films on two sides of the copper strip of the sample, wherein the films are uniformly adhered, and have no bubbles and no damage;
third, edge etching: manually scribing the film with the periphery of the copper strip of the sample being 3mm away from the edge by a blade, etching the edge by 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by clean water;
fourth, plate making: according to the use requirement, designing etched patterns and sizes, carrying out manual single-sided plate making on the copper strip with the etched edges, wherein the longitudinal direction of the patterns is 5mm away from the transverse edge of the copper strip, the transverse direction of the patterns is 5mm away from the longitudinal edge of the copper strip, manually scribing the edges of the patterns by a blade, and displaying the surface of the copper strip after demoulding;
fifth, full etching: etching the plate-made copper strip in a container by adopting 60% sulfuric acid or nitric acid, soaking for 2 minutes, taking out when the depth reaches 100% of the thickness of the copper strip, cleaning with clear water, and wiping;
sixth, flatness measurement: placing the fully etched copper strips on a standard platform, and measuring and recording the four-angle warping heights by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventh, evaluating flatness: and according to the warping height and technical requirements, evaluating the flatness.
Claims (1)
1. A method for testing the flatness of a copper strip of a high-precision lead frame material for etching is characterized by comprising the following steps of: the process flow is as follows: sampling, coating, edge etching, plate making, full etching or half etching, flatness measurement and flatness evaluation;
first, sampling: taking a copper strip with the length of 30-300mm and the width of 30-300 mm;
second step, film coating: adopting a corrosion-resistant transparent adhesive tape to manually adhere films on two sides of the copper strip of the sample, wherein the films are uniformly adhered, and have no bubbles and no damage;
third, edge etching: manually scratching the film around the copper strip of the sample by using a blade, etching off the edge by using 20-60% sulfuric acid or nitric acid, and cleaning the surface of the sample by using clear water;
fourth, plate making: according to the use requirement, designing etched patterns and sizes, carrying out manual single-sided plate making on the copper strip with the etched edges, wherein the longitudinal direction of the patterns is 2-50mm away from the transverse edge of the copper strip, the transverse direction of the patterns is 2-50mm away from the longitudinal edge of the copper strip, manually scribing the edges of the patterns by a blade, and displaying the surface of the copper strip after demoulding;
fifth, full etching or half etching: etching the plate-made copper strip in a container by using 10-60% sulfuric acid or nitric acid, soaking for 1-15 minutes, measuring in the middle, flushing with clear water, measuring etching depth, taking out when the depth reaches 5-100% of the thickness of the copper strip, cleaning with clear water, and wiping;
sixth, flatness measurement: placing the copper strips after full etching or half etching on a standard platform, and measuring and recording the four-angle warping heights by adopting a tool microscope, a feeler gauge or a vernier caliper;
seventh, evaluating flatness: and according to the warping height and technical requirements, evaluating the flatness.
Priority Applications (1)
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CN202010306208.1A CN113532336B (en) | 2020-04-17 | 2020-04-17 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
Applications Claiming Priority (1)
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CN202010306208.1A CN113532336B (en) | 2020-04-17 | 2020-04-17 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
Publications (2)
Publication Number | Publication Date |
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CN113532336A CN113532336A (en) | 2021-10-22 |
CN113532336B true CN113532336B (en) | 2024-01-30 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4259436A (en) * | 1978-04-26 | 1981-03-31 | Shinko Electric Industries Co., Ltd. | Method of making a take-carrier for manufacturing IC elements |
JPH10340933A (en) * | 1997-06-09 | 1998-12-22 | Nec Corp | Manufacture of semiconductor device |
CN102781168A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Manufacturing method for golden fingerboard without lead wire |
CN204854698U (en) * | 2015-07-29 | 2015-12-09 | 山西春雷铜材有限责任公司 | Copper strips warpage measuring device for lead frame |
CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
CN109506598A (en) * | 2018-11-19 | 2019-03-22 | 信利光电股份有限公司 | A kind of plate testing flatness method and device |
CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
-
2020
- 2020-04-17 CN CN202010306208.1A patent/CN113532336B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4259436A (en) * | 1978-04-26 | 1981-03-31 | Shinko Electric Industries Co., Ltd. | Method of making a take-carrier for manufacturing IC elements |
JPH10340933A (en) * | 1997-06-09 | 1998-12-22 | Nec Corp | Manufacture of semiconductor device |
CN102781168A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Manufacturing method for golden fingerboard without lead wire |
CN204854698U (en) * | 2015-07-29 | 2015-12-09 | 山西春雷铜材有限责任公司 | Copper strips warpage measuring device for lead frame |
CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
CN109506598A (en) * | 2018-11-19 | 2019-03-22 | 信利光电股份有限公司 | A kind of plate testing flatness method and device |
CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
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