CN113531830B - Method and device for controlling air conditioner and air conditioner - Google Patents
Method and device for controlling air conditioner and air conditioner Download PDFInfo
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- CN113531830B CN113531830B CN202110780026.2A CN202110780026A CN113531830B CN 113531830 B CN113531830 B CN 113531830B CN 202110780026 A CN202110780026 A CN 202110780026A CN 113531830 B CN113531830 B CN 113531830B
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- 238000005057 refrigeration Methods 0.000 claims abstract description 205
- 239000004065 semiconductor Substances 0.000 claims abstract description 196
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 238000001816 cooling Methods 0.000 claims description 34
- 238000004378 air conditioning Methods 0.000 claims description 18
- 238000005485 electric heating Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
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- 238000009529 body temperature measurement Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/61—Control or safety arrangements characterised by user interfaces or communication using timers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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Abstract
The application relates to the technical field of intelligent air conditioners and discloses a method and a device for controlling an air conditioner and the air conditioner. This air conditioner includes: two groups of semiconductor refrigeration components. The method comprises the following steps: acquiring a current outdoor temperature value of an area where an air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located; under the condition that the current outdoor temperature value is greater than a first temperature value, if a first temperature difference value between the first current indoor temperature value and a preset indoor temperature value is greater than a first set value, controlling a first semiconductor refrigeration component in the air conditioner to start operation; and under the condition that the current outdoor temperature value is smaller than a second temperature value, if a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value, controlling a second semiconductor refrigeration component in the air conditioner to start and operate. Therefore, the refrigerating capacity or the heating capacity of the air conditioner is improved, and the refrigerating and heating requirements under severe working conditions are met.
Description
Technical Field
The present application relates to the field of intelligent air conditioner technology, and for example, to a method and an apparatus for air conditioner control, and an air conditioner.
Background
Air conditioners have been widely used as a common intelligent device for adjusting the temperature and humidity of an indoor environment. In the related art, the air conditioner may adopt a vapor compression refrigeration cycle to adjust the indoor temperature, which has an advantage of high energy efficiency, but when cooling at a high temperature or heating at a low temperature, the air conditioner may have a problem of low cooling capacity or heating capacity.
At present, when heating at low temperature, an air conditioner can adopt a mode of adding an electric heating pipe to improve the heating quantity, but when refrigerating at high temperature, the problem of low refrigerating quantity can be hardly solved by a method. Therefore, the air conditioner is difficult to provide more heating capacity and refrigerating capacity, and meets the refrigerating and heating requirements under severe working conditions.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a method and a device for controlling an air conditioner and the air conditioner, which aim to solve the technical problem that the refrigerating capacity or the heating capacity of the air conditioner is insufficient under severe working conditions. The air conditioner comprises two groups of semiconductor refrigeration components.
In some embodiments, the method comprises:
acquiring a current outdoor temperature value of an area where an air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located;
under the condition that the current outdoor temperature value is greater than a first temperature value, if a first temperature difference value between the first current indoor temperature value and a preset indoor temperature value is greater than a first set value, controlling a first semiconductor refrigeration component in the air conditioner to start and operate, wherein a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner internal unit, and a first heating end of the first semiconductor refrigeration component is connected with an air conditioner external unit;
under the condition that the current outdoor temperature value is smaller than a second temperature value, if a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value, controlling a second semiconductor refrigeration component in the air conditioner to start and operate, wherein a second refrigeration end of the second semiconductor refrigeration component is connected with the air conditioner external unit, and a second heating end of the second semiconductor refrigeration component is connected with the air conditioner internal unit;
the first temperature value is greater than the second temperature value.
In some embodiments, the apparatus comprises:
the first acquisition module is configured to acquire a current outdoor temperature value of an area where the air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located;
the first starting control module is configured to control a first semiconductor refrigeration component in the air conditioner to start and operate when a first temperature difference value between a first current indoor temperature value and a preset indoor temperature value is larger than a first set value under the condition that the current outdoor temperature value is larger than a first temperature value, wherein a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner internal unit, and a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner external unit;
the second starting control module is configured to control a second semiconductor refrigeration component in the air conditioner to start and operate when a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value under the condition that the current outdoor temperature value is smaller than a second temperature value, wherein a second refrigeration end of the second semiconductor refrigeration component is connected with the air conditioner external unit, and a second heating end of the second semiconductor refrigeration component is connected with the air conditioner internal unit;
the first temperature value is greater than the second temperature value.
In some embodiments, the apparatus for air conditioning control includes a processor and a memory storing program instructions, the processor being configured to execute the above-described method for air conditioning control when executing the program instructions.
In some embodiments, the air conditioner comprises the device for controlling the air conditioner.
The method and the device for controlling the air conditioner and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:
two groups of semiconductor refrigeration components are configured in the air conditioner, so that when the current outdoor temperature value is greater than a first temperature value and the first temperature difference value between the first current indoor temperature value and the preset indoor temperature value is greater than a first set value, the air conditioner performs refrigeration operation, one group of semiconductor refrigeration components can be controlled to operate, an air conditioner internal unit is precooled, an air conditioner external unit is preheated, and the refrigerating capacity of the air conditioner is improved; when the current outdoor temperature value is smaller than the second temperature value and the second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than the second set value, the air conditioner can be operated in a heating mode, another group of semiconductor refrigerating components can be controlled to operate, the air conditioner internal unit is preheated, the air conditioner external unit is precooled, the heating capacity of the air conditioner is improved, and the refrigerating and heating requirements under severe working conditions are met.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated in the accompanying drawings, which correspond to the accompanying drawings and not in a limiting sense, in which elements having the same reference numeral designations represent like elements, and in which:
fig. 1 is a schematic structural diagram of an air conditioner according to an embodiment of the present disclosure;
fig. 2 is a schematic flowchart of a control method for an air conditioner according to an embodiment of the disclosure;
fig. 3 is a schematic flowchart of a control method for an air conditioner according to an embodiment of the disclosure;
fig. 4 is a schematic structural diagram of an air conditioning control device according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an air conditioner control device according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an air conditioner control device according to an embodiment of the present disclosure.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate for the embodiments of the disclosure described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The term "plurality" means two or more unless otherwise specified.
In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. E.g., a and/or B, represents: a or B, or A and B.
In the embodiment of the disclosure, two groups of semiconductor refrigeration components are added in the air conditioner, and each group of semiconductor refrigeration components is respectively connected with the air conditioner internal unit and the air conditioner external unit, so that when the current outdoor temperature value is greater than a first temperature value and a first temperature difference value between the first current indoor temperature value and a preset indoor temperature value is greater than a first set value, the air conditioner performs refrigeration operation, and can control the operation of one group of semiconductor refrigeration components, pre-cool an evaporator inlet pipeline in the air conditioner internal unit, and pre-heat a condenser inlet pipeline in the air conditioner external unit, thereby improving the refrigeration capacity of the air conditioner; when the current outdoor temperature value is smaller than the second temperature value and the second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than the second set value, the air conditioner can be operated for heating, the other group of semiconductor refrigerating components can be controlled to operate, an evaporator inlet pipeline in the air conditioner internal unit is preheated, a condenser inlet pipeline in the air conditioner external unit is precooled, the heating capacity of the air conditioner is improved, and the refrigerating and heating requirements under the severe working condition are met. In addition, the semiconductor refrigeration component does not use a halogenated hydrocarbon refrigerant, has no influence on atmospheric emission, can reduce the emission pollution of a refrigeration system to the atmosphere, and is more energy-saving and environment-friendly.
Fig. 1 is a schematic structural diagram of an air conditioner provided in an embodiment of the present disclosure. As shown in fig. 1, the air conditioner includes: the air conditioner indoor unit 100, the air conditioner outdoor unit 200 and the two groups of semiconductor refrigeration components are respectively a first semiconductor refrigeration component 310 and a second semiconductor refrigeration component 320.
The first cooling end 311 of the first semiconductor cooling component 310 is connected to the air conditioner indoor unit 100, and the first heating end 312 of the first semiconductor cooling component 310 is connected to the air conditioner outdoor unit 200.
The second cooling end 321 of the second semiconductor cooling component 320 is connected to the air conditioner external unit 200, and the second heating end 322 of the second semiconductor cooling component 320 is connected to the air conditioner internal unit 100.
In the embodiment of the disclosure, the semiconductor refrigeration component can utilize the thermoelectric effect of the semiconductor, connect two different metals with different physical properties by using the conductor and connect direct current, can realize temperature reduction at one end and temperature increase at the other end, and is commonly used for cooling electronic components and micro heat exchangers. The semiconductor refrigeration component is internally provided with a plurality of groups of hot spot elements, and can realize the refrigeration and heating effects of 40-50 ℃ at the hot end, minus 10-minus 20 ℃ at the cold end and 60 ℃ at the temperature difference.
After the first semiconductor refrigeration component 310 is turned on and operated, there are multiple groups of hot spot elements in the first refrigeration end 311, which can achieve temperature reduction, and there are multiple groups of hot spot elements in the first refrigeration end 312, which can achieve temperature increase. After the second semiconductor refrigeration component 320 is started to operate, temperature reduction and temperature rise can be respectively realized at two ends, wherein a plurality of groups of hot spot elements are arranged in the second refrigeration end 321 to realize temperature reduction, and a plurality of groups of hot spot elements are arranged in the second refrigeration end 322 to realize temperature rise.
In some embodiments, the first semiconductor cooling element 310 and the second semiconductor cooling element 320 may be used in conjunction with an indoor evaporator and an outdoor condenser of an air conditioner to pre-cool and pre-heat the evaporator inlet line and the condenser inlet line, respectively. As shown in fig. 1, one end of the first refrigerating end 311 is connected to an evaporator of the air conditioner indoor unit 100 through the indoor connector 110, the other end is connected to one end of the first refrigerating end 312 through the first semiconductor module connecting pipe 313, and the other end of the first refrigerating end 312 is connected to a condenser of the air conditioner outdoor unit 200 through the outdoor connector 210.
One end of the second heating end 322 is connected to the evaporator of the air conditioner indoor unit 100 through the indoor connector 110, the other end is connected to one end of the second cooling end 321 through the second semiconductor device connecting pipe 323, and the other end of the second cooling end 321 is connected to the condenser of the air conditioner outdoor unit 200 through the outdoor connector 210.
Therefore, the arrangement of the two ends of the first semiconductor refrigeration component and the second semiconductor refrigeration component is opposite, and opposite temperature changes can be realized after the refrigeration device is started to operate. When the air conditioner is used for refrigerating, the first semiconductor refrigerating component is started, an inlet pipeline of an evaporator in an air conditioner internal unit can be precooled, and an inlet pipeline of a condenser in an air conditioner external unit can be preheated, so that indoor side precooling and outdoor side preheating are realized; when heating, open second semiconductor refrigeration components and parts, can preheat the evaporimeter inlet pipeline in the air conditioner internal unit, and carry out the precooling to the condenser inlet pipeline in the air conditioner outer unit, realize that the indoor side preheats and the outdoor side precooling to, can improve indoor refrigerating output when external high temperature, improve indoor heating capacity when external low temperature, satisfied the refrigeration heating demand under abominable operating mode.
In some embodiments, two ends of each of the two groups of semiconductor refrigeration components can be provided with exhaust fans for enhancing air circulation, so that heat exchange between the two ends of each of the semiconductor refrigeration components and the indoor/outdoor sides can be enhanced, and compensation of refrigerating capacity/heating capacity of the system can be realized. As shown in fig. 1, the air conditioner may further include: four exhaust fans; the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first cooling end 312, the third exhaust fan 430 is located on the second cooling end 322, and the fourth exhaust fan 440 is located on the second cooling end 321.
Of course, in some embodiments, the air conditioner may have only one, two or three exhaust fans, and may be located at any end of any one semiconductor refrigeration component.
After the air conditioner is provided with two groups of semiconductor refrigeration components or two groups of semiconductor refrigeration components and corresponding exhaust fans, the refrigerating capacity or the heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor refrigeration components, and the refrigerating and heating requirements under severe working conditions are met.
Fig. 2 is a schematic flowchart of a control method for an air conditioner according to an embodiment of the present disclosure. The air conditioner can be provided with two groups of semiconductor refrigeration components or two groups of semiconductor refrigeration components and corresponding exhaust fans. As shown in fig. 2, the process for air conditioning control includes:
step 2001: the method comprises the steps of obtaining a current outdoor temperature value of an area where an air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located.
In this disclosed embodiment, the air conditioner includes air conditioner internal unit and air conditioner outer machine, like this, can acquire corresponding temperature value through the temperature acquisition device that corresponds respectively, for example: and acquiring an outdoor temperature value of an area where an air conditioner outdoor unit is located in real time or at regular time through an outdoor temperature sensor, wherein the acquired temperature value is the current outdoor temperature value each time the outdoor temperature sensor is acquired. And in addition, during each acquisition, a first current indoor temperature value of the area where the indoor unit of the air conditioner is located can be acquired through indoor temperature sensing.
Step 2002: under the condition that the current outdoor temperature value is larger than a first temperature value, if a first temperature difference value between a first current indoor temperature value and a preset indoor temperature value is larger than a first set value, a first semiconductor refrigeration component in the air conditioner is controlled to start and operate, wherein a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner internal unit, and a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner external unit.
In the related art, an air conditioner using a vapor compression refrigeration cycle may have a problem of low cooling capacity or heating capacity when performing high-temperature refrigeration or low-temperature heating. According to the embodiment of the disclosure, the refrigerating capacity or the heating capacity can be increased by controlling the semiconductor refrigerating element. Therefore, a first temperature value can be configured to meet high temperature conditions, such as: the first temperature value may be 42 ℃,43 ℃, or 45 ℃, among others. Like this, when present outdoor temperature value is greater than first temperature value, can confirm that the air conditioner is in the high temperature operating mode in the region, the air conditioner carries out the mode operation of refrigerating to there may be the problem that the refrigerating capacity is not enough, however, semiconductor refrigeration components and parts operating power is higher, it is power consumptive great to open for a long time, in this disclosed embodiment, not only needs outdoor side temperature than higher, simultaneously, indoor temperature measurement and predetermine when indoor temperature difference is great, just steerable first semiconductor refrigeration components and parts in the air conditioner start-up operation. Namely, under the condition that the current outdoor temperature value is greater than the first temperature value, if a first temperature difference value between the first current indoor temperature value and the preset indoor temperature value is greater than a first set value, a first semiconductor refrigeration component in the air conditioner is controlled to start and operate. The first set point may be 3 ℃,4 ℃, or 5 ℃ and so on.
Because the first refrigerating end of the first semiconductor refrigerating element is connected with the air conditioner internal unit and the first heating end of the first semiconductor refrigerating element is connected with the air conditioner external unit, the indoor precooling and the outdoor preheating can be realized after the first semiconductor refrigerating element is started to operate. In some embodiments, the first refrigeration end of the first semiconductor refrigeration component is connected with the evaporator of the air conditioner internal unit through the indoor connecting piece, and the first heating end is connected with the condenser of the air conditioner external unit through the outdoor connecting piece, so that the inlet pipeline of the evaporator in the air conditioner internal unit can be precooled, and the inlet pipeline of the condenser in the air conditioner external unit can be preheated, and therefore the refrigeration capacity of the air conditioner is improved.
Step 2003: and under the condition that the current outdoor temperature value is smaller than a second temperature value, if a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value, controlling a second semiconductor refrigeration component in the air conditioner to start and operate, wherein a second refrigeration end of the second semiconductor refrigeration component is connected with an air conditioner external unit, and a second heating end of the second semiconductor refrigeration component is connected with the air conditioner internal unit.
Of course, a second temperature value may be configured to meet low temperature conditions, such as: the second temperature value may be-5 deg.C, -7 deg.C, or-10 deg.C, etc. Likewise, a second set point can be configured, which can be 3 deg.C, 4 deg.C, or 5 deg.C, etc. Like this, when present outdoor temperature value is less than the second temperature value, can confirm that the area that the air conditioner is located is in low temperature operating mode, and the air conditioner heats the mode operation to there may be the problem that the heating capacity is not enough, and likewise, semiconductor refrigeration components and parts operating power is higher, and it is great to open power consumptive for a long time, in this embodiment of this disclosure, not only need outdoor side temperature ratio lower, simultaneously, predetermine when indoor temperature and indoor side temperature difference are great, just steerable second semiconductor refrigeration components and parts in the air conditioner start-up operation. Namely, under the condition that the current outdoor temperature value is smaller than the second temperature value, if the second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than the second set value, the second semiconductor refrigeration component in the air conditioner is controlled to start to operate.
Because the second refrigerating end of the second semiconductor refrigerating element is connected with the air conditioner external unit and the second refrigerating end of the second semiconductor refrigerating element is connected with the air conditioner internal unit, indoor side preheating and outdoor side precooling can be realized after the second semiconductor refrigerating element is started to operate. In some embodiments, the second heating end of the second semiconductor refrigeration component is connected with the evaporator of the air conditioner internal unit through the indoor connecting piece, and the second refrigeration end is connected with the condenser of the air conditioner external unit through the outdoor connecting piece, so that the inlet pipeline of the evaporator in the air conditioner internal unit can be preheated, and the inlet pipeline of the condenser in the air conditioner external unit can be precooled, and thus the heating capacity of the air conditioner is improved.
Therefore, in the embodiment, the starting operation of the semiconductor refrigeration component can be controlled to improve the refrigeration capacity or heating capacity of the air conditioner, and the refrigeration and heating requirements under severe working conditions are met. Moreover, the semiconductor refrigeration component does not use halohydrocarbon refrigerant, so that the semiconductor refrigeration component has no influence on atmospheric emission, can reduce the emission pollution of a refrigeration system to the atmosphere, and is more energy-saving and environment-friendly.
The semiconductor refrigeration components of the air conditioner are possibly provided with corresponding exhaust fans, the exhaust fans can strengthen air circulation and strengthen heat exchange between two ends of the semiconductor refrigeration components and indoor/outdoor sides, and therefore compensation of system refrigerating capacity/heating capacity is achieved. Therefore, in some embodiments, in the case of operation of the first semiconductor cooling component, the operation of the first exhaust fan and the second exhaust fan provided on the first semiconductor cooling component is controlled; and under the condition that the second semiconductor refrigeration component operates, controlling a third exhaust fan and a fourth exhaust fan which are arranged on the second semiconductor refrigeration component to operate. In the air conditioner, the first exhaust fan is located on the first refrigerating end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second refrigerating end.
In some embodiments, during the cooling or heating operation of the air conditioner, the indoor temperature can be adjusted to the set value at the fastest speed by adjusting the frequency of the compressor or starting the electric heating device. Under the condition that the first semiconductor refrigeration component operates, adjusting the current operating frequency of a compressor of the air conditioner to a refrigeration highest frequency matched with the current outdoor temperature value; and under the condition that the second semiconductor refrigeration component operates, controlling the electric heating device of the air conditioner to start to operate.
When the air conditioner operates in a refrigerating mode, the current operating frequency of the air conditioner compressor is adjusted to the highest refrigerating frequency matched with the current outdoor temperature value, the maximum capacity and the maximum power of the compressor can be achieved, the pre-cooling of the first semiconductor refrigerating component is matched, the indoor side refrigerating effect can be optimal, and the effect of rapid cooling is achieved.
When the air conditioner heats, the electric heating device of the air conditioner is opened, the heating amount measured indoors can be increased, and the indoor side heating effect can be optimal by matching with the preheating of the second semiconductor refrigerating element, so that the effect of quick heating is realized.
The operation of the semiconductor refrigeration component needs energy consumption, so that in some embodiments, when the indoor temperature value of the area where the air conditioner indoor unit is located is closer to the preset indoor temperature value, the semiconductor refrigeration component can be turned off, so that the power consumption of the air conditioner can be reduced, and the overall energy efficiency of the air conditioner can be improved, wherein under the condition that the semiconductor refrigeration component of the air conditioner is in the operation state, the second current indoor temperature value of the area where the air conditioner indoor unit is located is obtained; under the condition that a third temperature difference value between the second current indoor temperature value and the preset indoor temperature value is smaller than a third set value, controlling a first semiconductor refrigeration component in the air conditioner to stop operating; and under the condition that a fourth temperature difference value between the preset indoor temperature value and the second current indoor temperature value is smaller than a fourth set value, controlling a second semiconductor refrigeration component in the air conditioner to stop running.
Since the semiconductor refrigeration component is turned off when the indoor temperature value is closer to the preset indoor temperature value, the third set value may be 1 ℃, 2 ℃ or 3 ℃, and the fourth set value may also be 1 ℃, 2 ℃ or 3 ℃, and so on.
Under the condition that a semiconductor refrigeration component of the air conditioner is in an operating state, the indoor temperature value of the area where the indoor unit of the air conditioner is located can be obtained in real time or at regular time through an indoor temperature secondary acquisition device, such as an indoor temperature sensor, and the indoor temperature value acquired at the current time is the second current indoor temperature value.
Therefore, in some embodiments, the semiconductor refrigeration component of the air conditioner is in an operating state, and when the set acquisition timing moment is reached, the second current indoor temperature value of the area where the indoor unit of the air conditioner is located can be obtained. For example: after the semiconductor refrigeration component is started to operate, the second current indoor temperature value can be acquired every 3 minutes, 5 minutes or 6 minutes.
When the first semiconductor refrigeration component is in an operation state, the general air conditioner is in refrigeration operation, the second current indoor temperature value Tr2 is generally larger than the preset indoor temperature value Tset, and thus, if Tr2-Tset is smaller than a third set value, for example: and 2, the first semiconductor refrigeration component in the air conditioner can be controlled to stop running. When the second semiconductor cooling component is in an operating state, the air conditioner is generally in a heating operation, and the second current indoor temperature value Tr2 is generally smaller than the preset indoor temperature value Tset, so that if Tset-Tr2 is smaller than a fourth set value, for example: and 3, the second semiconductor refrigeration component in the air conditioner can be controlled to stop running.
In some embodiments, under the condition that the first semiconductor refrigeration component stops operating, a first exhaust fan and a second exhaust fan configured on the first semiconductor refrigeration component are controlled to stop operating; and under the condition that the second semiconductor refrigeration component stops operating, controlling a third exhaust fan and a fourth exhaust fan arranged on the second semiconductor refrigeration component to stop operating.
Of course, when the current outdoor temperature value is less than or equal to the first temperature value and greater than or equal to the second temperature value, the operation state of the semiconductor refrigeration component of the air conditioner is controlled to be unchanged, and the air conditioner can still adopt a vapor compression refrigeration cycle to realize the adjustment of the indoor temperature.
Currently, air conditioners have a communication function, so that the air conditioners can also control the operation of semiconductor refrigeration components according to received instructions. In some embodiments, in the case of receiving a semiconductor switch instruction sent by a configuration control application APP terminal, the switching operation of a semiconductor refrigeration component in the air conditioner is controlled according to the semiconductor switch instruction. Like this, user's accessible APP control semiconductor refrigeration components and parts's switch has improved the intelligence and the user experience of air conditioner.
The following sets of operation flows in specific embodiments to illustrate a process for controlling an air conditioner according to an embodiment of the present disclosure.
In this embodiment, the air conditioner may include two sets of semiconductor cooling devices and four exhaust fans, as shown in fig. 1. Also, the first temperature value stored in the air conditioner may be 42 ℃, the second temperature value may be-7 ℃, the first set value may be 3 ℃, the second set value may be 4 ℃, the third set value may be 2 ℃, and the fourth set value may be 3 ℃.
Fig. 3 is a schematic flowchart of a control method for an air conditioner according to an embodiment of the present disclosure. Referring to fig. 1 and 3, a process for air conditioning control includes:
step 3001: the method comprises the steps of obtaining a current outdoor temperature value Tao of an area where an air conditioner external unit is located and a first current indoor temperature value Tr1 of the area where the air conditioner internal unit is located.
Step 3002: determine whether the current outdoor temperature value Tao > 42? If so, go to step 3003, otherwise, go to step 3009.
Step 3003: determine whether a first temperature difference value Tr1-Tset >3 between the first current indoor temperature value Tr1 and the preset indoor temperature value Tset is true? If so, go to step 3004, otherwise, go to step 3016.
Step 3004: and controlling a first semiconductor refrigeration component in the air conditioner, and starting and operating a corresponding first exhaust fan and a corresponding second exhaust fan.
Step 3005: determine whether a preset sampling time is reached? If yes, go to step 3006, otherwise, go back to step 3005.
Step 3006: and acquiring a second current indoor temperature value Tr2 of the area where the air conditioner indoor unit is located.
Step 3007: determine whether Tr2-Tset < 2? If yes, go to step 3008, otherwise, go back to step 3005.
Step 3008: and controlling a first semiconductor refrigeration component in the air conditioner, and stopping the operation of the corresponding first exhaust fan and the second exhaust fan, and ending the control process.
Step 3009: determine whether Tao < -7 ℃ is true? If so, go to step 3010, otherwise, go to step 3016.
Step 3010: determine whether a second temperature difference Tset-Tr1>4 between the preset indoor temperature value Tset and the first current indoor temperature value Tr1 is established? If so, go to step 311, otherwise, go to step 3016.
Step 3011: and controlling a second semiconductor refrigeration component in the air conditioner and the corresponding third exhaust fan and fourth exhaust fan to start and operate.
Step 3012: determine whether a preset sampling time is reached? If yes, go to step 3013, otherwise, go back to step 3012.
Step 3013: and acquiring a second current indoor temperature value Tr2 of the area where the air conditioner indoor unit is located.
Step 3014: determine whether Tset-Tr2 < 3? If yes, go to step 3015, otherwise, go back to step 3012.
Step 3015: and controlling a second semiconductor refrigeration component in the air conditioner and the corresponding third exhaust fan and fourth exhaust fan to stop running, and ending the control flow.
Step 3016: and controlling the air conditioner to operate in a vapor compression refrigeration cycle.
In this embodiment, two groups of semiconductor refrigeration components are configured in the air conditioner, so that when the current outdoor temperature value is greater than the first temperature value and the first temperature difference between the first current indoor temperature value and the preset indoor temperature value is greater than the first set value, the air conditioner performs refrigeration operation, and the group of semiconductor refrigeration components can be controlled to operate, pre-cool an evaporator inlet pipeline in an indoor unit of the air conditioner, and pre-heat a condenser inlet pipeline in an outdoor unit of the air conditioner, so that the refrigerating capacity of the air conditioner is improved; when the current outdoor temperature value is smaller than the second temperature value and the second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than the second set value, the air conditioner can be operated for heating, the other group of semiconductor refrigerating components can be controlled to operate, an evaporator inlet pipeline in the air conditioner internal unit is preheated, a condenser inlet pipeline in the air conditioner external unit is precooled, the heating capacity of the air conditioner is improved, and the refrigerating and heating requirements under the severe working condition are met. And after the semiconductor refrigeration component operates, when the indoor temperature value is close to the preset indoor temperature value, the operation of the semiconductor refrigeration component can be closed, the power consumption of the air conditioner is reduced, and the overall energy efficiency of the air conditioner is improved. Certainly, the semiconductor refrigeration component does not use halohydrocarbon refrigerant, has no influence on atmospheric emission, can reduce the emission pollution of an air conditioner to the atmosphere, and is more energy-saving and environment-friendly.
According to the above-described process for air conditioning control, an apparatus for air conditioning control can be constructed.
Fig. 4 is a schematic structural diagram of an air conditioner control device according to an embodiment of the present disclosure. The air conditioner comprises two groups of semiconductor refrigeration components or two groups of semiconductor refrigeration components and corresponding exhaust fans. As shown in fig. 4, the control device for an air conditioner includes: a first acquisition module 4100, a first start-up control module 4200, and a second start-up control module 4300.
The first obtaining module 4100 is configured to obtain a current outdoor temperature value of an area where an external air conditioner unit is located and a first current indoor temperature value of the area where the internal air conditioner unit is located.
The first start control module 4200 is configured to, when a current outdoor temperature value is greater than a first temperature value and a first temperature difference between a first current indoor temperature value and a preset indoor temperature value is greater than a first set value, control a first semiconductor refrigeration component in the air conditioner to start and operate, where a first refrigeration end of the first semiconductor refrigeration component is connected to an air conditioner internal unit, and a first heating end of the first semiconductor refrigeration component is connected to an air conditioner external unit.
The second start control module 4300 is configured to, under the condition that the current outdoor temperature value is smaller than the second temperature value, control a second semiconductor refrigeration component in the air conditioner to start and operate if a second temperature difference between the preset indoor temperature value and the first current indoor temperature value is greater than a second set value, where a second refrigeration end of the second semiconductor refrigeration component is connected to the air conditioner external unit, and a second heating end of the second semiconductor refrigeration component is connected to the air conditioner internal unit.
Of course, the first temperature value is greater than the second temperature value.
In some embodiments, the first start-up control module 4200 is further configured to control operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor cooling component in the event the first semiconductor cooling component is operating.
The second start-up control module 4300 is further configured to control operation of a third exhaust fan and a fourth exhaust fan configured on the second semiconductor refrigeration component in a case that the second semiconductor refrigeration component is in operation.
In some embodiments, further comprising:
and the frequency adjusting module is configured to adjust the current operation frequency of the compressor of the air conditioner to the highest refrigeration frequency matched with the current outdoor temperature value under the condition that the first semiconductor refrigeration component is operated.
And the heating control module is configured to control the electric heating device of the air conditioner to start operation under the condition that the second semiconductor refrigeration component is operated.
In some embodiments, further comprising:
and the second acquisition module is configured to acquire a second current indoor temperature value of the area where the indoor unit of the air conditioner is located under the condition that the semiconductor refrigeration component of the air conditioner is in the running state.
And the first closing control module is configured to control the first semiconductor refrigeration component in the air conditioner to stop running under the condition that a third temperature difference value between the second current indoor temperature value and the preset indoor temperature value is smaller than a third set value.
And the second closing control module is configured to control the second semiconductor refrigeration component in the air conditioner to stop running under the condition that a fourth temperature difference value between the preset indoor temperature value and the second current indoor temperature value is smaller than a fourth set value.
In some embodiments, the first shutdown control module is further configured to control the first exhaust fan and the second exhaust fan disposed on the first semiconductor cooling component to stop operating in a case where the first semiconductor cooling component stops operating.
And the second closing control module is also configured to control the third exhaust fan and the fourth exhaust fan which are arranged on the second semiconductor refrigeration component to stop running under the condition that the second semiconductor refrigeration component stops running.
In some embodiments, further comprising:
and the maintaining control module is configured to control the operation state of the semiconductor refrigeration component of the air conditioner to be unchanged under the condition that the current outdoor temperature value is less than or equal to the first temperature value and is greater than or equal to the second temperature value.
In some embodiments, further comprising:
and the instruction control module is configured to control the on-off operation of a semiconductor refrigeration component in the air conditioner according to the semiconductor switch instruction under the condition of receiving the semiconductor switch instruction sent by the configuration control application APP terminal.
The following exemplifies an air conditioning control process performed by the apparatus for air conditioning control according to the embodiment of the present disclosure.
The air conditioner may include two sets of semiconductor cooling components and four exhaust fans, as shown in fig. 1. Also, the first temperature value stored in the air conditioner may be 42 ℃, the second temperature value may be-7 ℃, both the first set value and the second set value may be 4 ℃, and both the third set value and the fourth set value may be 3 ℃. Of course, when the air conditioner is running, the preset indoor temperature value Tset is also obtained.
Fig. 5 is a schematic structural diagram of an air conditioning control device according to an embodiment of the present disclosure. As shown in fig. 5, the control device for an air conditioner includes: a first obtaining module 4100, a first start-up control module 4200, a second start-up control module 4300, a frequency adjustment module 4400, a heating control module 4500, a second obtaining module 4600, a first shutdown control module 4700, a second shutdown control module 4800, and a maintenance control module 4900.
The first obtaining module 4100 obtains a current outdoor temperature value Tao of an area where an external air conditioner unit is located and a first current indoor temperature value Tr1 of the area where an internal air conditioner unit is located, so that when Tao is greater than 42 ℃ and Tr1-Tset is greater than 4, the first start control module 4200 can control a first semiconductor refrigeration component in the air conditioner and corresponding first and second exhaust fans to start and operate. In addition, the frequency adjustment module 4400 may also adjust the current operating frequency of the compressor of the air conditioner to the highest refrigeration frequency matched with the current outdoor temperature value, so as to realize the maximum capacity and maximum power operation of the compressor, and by matching with the precooling of the first semiconductor refrigeration component, the indoor side refrigeration effect can be optimized, and the effect of rapid cooling can be realized.
And when Tao < -7 ℃ and Tset-Tr1>4, the second starting control module 4300 can control the second semiconductor refrigeration component in the air conditioner and the corresponding third exhaust fan and fourth exhaust fan to start operation. And, heating control module 4500 controls the electric heater unit of the air conditioner to start and operate, thus, the heating capacity of the indoor side can be increased, and the indoor side heating effect can be optimized by the preheating of the second semiconductor refrigeration component, so as to realize the effect of heating rapidly.
After the semiconductor refrigeration component is started to operate, the second obtaining module 4600 can collect a second current indoor temperature value Tr2 of the area where the air conditioner internal unit is located in real time, and when the first semiconductor refrigeration component operates, namely Tr2-Tset is smaller than 3 ℃ in the refrigeration process, the first closing control module 4700 controls the first semiconductor refrigeration component in the air conditioner and the corresponding first exhaust fan and the second exhaust fan to stop operating. And during the operation of the second semiconductor cooling component, that is, during the heating process, if Tset-Tr2 is less than 3 ℃, the second shutdown control module 4800 may control the second semiconductor cooling component in the air conditioner, and the corresponding third exhaust fan and fourth exhaust fan to stop operating.
Certainly, when the temperature is more than or equal to-7 ℃ and less than or equal to Tao and less than or equal to 42 ℃, the control module 4900 can control the operation state of the semiconductor refrigeration components of the air conditioner to be unchanged, and can control the air conditioner to carry out the operation of a vapor compression refrigeration cycle. In addition, when Tao is higher than 42 ℃ and Tr1-Tset is less than or equal to 4, the maintaining control module 4900 can also control the operating state of the semiconductor refrigeration components of the air conditioner to be unchanged, and when Tao is lower than-7 ℃ and Tset-Tr1 is higher than or equal to 4, the maintaining control module 4900 can also control the operating state of the semiconductor refrigeration components of the air conditioner to be unchanged.
It is thus clear that in this embodiment, two sets of semiconductor refrigeration components and parts have been configured in the air conditioner, and like this, the device for air conditioner control controls the semiconductor refrigeration components and parts and starts the operation according to outdoor temperature value, improves the refrigerating output or the heating capacity of control, has satisfied the refrigeration heating demand under abominable operating mode, and, when indoor temperature value and preset indoor temperature value are relatively close, closes the operation of semiconductor refrigeration components and parts, reduces the consumption of air conditioner, promotes the whole efficiency of air conditioner.
An embodiment of the present disclosure provides an apparatus for controlling an air conditioner, which is configured as shown in fig. 6, and includes:
a processor (processor) 1000 and a memory (memory) 1001, and may further include a Communication Interface (Communication Interface) 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for the transmission of information. The processor 1000 may call logic instructions in the memory 1001 to perform the method for air conditioning control of the above-described embodiment.
In addition, the logic instructions in the memory 1001 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products.
The memory 1001 is a computer readable storage medium and can be used for storing software programs, computer executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 executes functional applications and data processing by executing program instructions/modules stored in the memory 1001, that is, implements the method for air conditioning control in the above-described method embodiment.
The memory 1001 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal air conditioner, and the like. Further, memory 1001 may include high speed random access memory and may also include non-volatile memory.
The embodiment of the present disclosure provides a control device for an air conditioner, including: a processor and a memory storing program instructions, the processor being configured to, upon execution of the program instructions, perform a method for air conditioning control.
The embodiment of the disclosure provides an air conditioner, which comprises the air conditioner control device.
Embodiments of the present disclosure provide a computer-readable storage medium storing computer-executable instructions configured to perform the above-described method for air conditioner control.
The disclosed embodiments provide a computer program product comprising a computer program stored on a computer-readable storage medium, the computer program comprising program instructions that, when executed by a computer, cause the computer to perform the above-described method for air conditioning control.
The computer-readable storage medium described above may be a transitory computer-readable storage medium or a non-transitory computer-readable storage medium.
The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for enabling a computer air conditioner (which may be a personal computer, a server, or a network air conditioner, etc.) to perform all or part of the steps of the method according to the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium comprising: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes, and may also be a transient storage medium.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same elements. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising a" \8230; "does not exclude the presence of additional like elements in the process, method or air conditioner that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosure, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the technical solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It can be clearly understood by the skilled person that, for convenience and simplicity of description, the specific working processes of the above-described systems, apparatuses, and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, air conditioners, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units may be merely a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than disclosed in the description, and sometimes there is no specific order between the different operations or steps. For example, two sequential operations or steps may in fact be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Claims (9)
1. A method for air conditioner control, characterized in that, the air conditioner includes two sets of semiconductor refrigeration components, the method includes:
the method comprises the steps of obtaining a current outdoor temperature value of an area where an air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located;
under the condition that the current outdoor temperature value is greater than a first temperature value, if a first temperature difference value between the first current indoor temperature value and a preset indoor temperature value is greater than a first set value, controlling a first semiconductor refrigeration component in the air conditioner to start and operate, wherein a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner internal unit, and a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner external unit;
under the condition that the current outdoor temperature value is smaller than a second temperature value, if a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value, controlling a second semiconductor refrigeration component in the air conditioner to start and operate, wherein a second refrigeration end of the second semiconductor refrigeration component is connected with an air conditioner external unit, and a second refrigeration end of the second semiconductor refrigeration component is connected with the air conditioner internal unit;
the first temperature value is greater than the second temperature value;
the method further comprises the following steps:
under the condition that a semiconductor refrigeration component of the air conditioner is in an operating state, acquiring a second current indoor temperature value of an area where an indoor unit of the air conditioner is located;
under the condition that a third temperature difference value between the second current indoor temperature value and a preset indoor temperature value is smaller than a third set value, controlling a first semiconductor refrigeration component in the air conditioner to stop operating;
and under the condition that a fourth temperature difference value between the preset indoor temperature value and the second current indoor temperature value is smaller than a fourth set value, controlling a second semiconductor refrigeration component in the air conditioner to stop running.
2. The method of claim 1, further comprising:
under the condition that the first semiconductor refrigeration component operates, controlling a first exhaust fan and a second exhaust fan which are arranged on the first semiconductor refrigeration component to operate;
and under the condition that the second semiconductor refrigeration component operates, controlling a third exhaust fan and a fourth exhaust fan which are arranged on the second semiconductor refrigeration component to operate.
3. The method of claim 1, further comprising:
under the condition that the first semiconductor refrigeration component operates, adjusting the current operating frequency of a compressor of the air conditioner to a refrigeration highest frequency matched with the current outdoor temperature value;
and under the condition that the second semiconductor refrigeration component operates, controlling an electric heating device of the air conditioner to start to operate.
4. The method of any of claims 1 to 3, further comprising:
under the condition that the first semiconductor refrigeration component stops operating, controlling a first exhaust fan and a second exhaust fan which are arranged on the first semiconductor refrigeration component to stop operating;
and under the condition that the second semiconductor refrigeration component stops operating, controlling a third exhaust fan and a fourth exhaust fan which are arranged on the second semiconductor refrigeration component to stop operating.
5. The method of claim 1, further comprising:
and controlling the running state of a semiconductor refrigeration component of the air conditioner to be unchanged under the condition that the current outdoor temperature value is less than or equal to the first temperature value and is greater than or equal to the second temperature value.
6. The method of claim 1, further comprising:
and under the condition of receiving a semiconductor switch instruction sent by a configuration control application APP terminal, controlling the switching operation of a semiconductor refrigeration component in the air conditioner according to the semiconductor switch instruction.
7. An apparatus for air conditioning control, wherein the air conditioner includes two sets of semiconductor cooling components, the apparatus comprising:
the first acquisition module is configured to acquire a current outdoor temperature value of an area where the air conditioner external unit is located and a first current indoor temperature value of the area where the air conditioner internal unit is located;
the first starting control module is configured to control a first semiconductor refrigeration component in the air conditioner to start and operate when a first temperature difference value between a first current indoor temperature value and a preset indoor temperature value is larger than a first set value under the condition that the current outdoor temperature value is larger than a first temperature value, wherein a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner internal unit, and a first refrigeration end of the first semiconductor refrigeration component is connected with an air conditioner external unit;
the second starting control module is configured to control a second semiconductor refrigeration component in the air conditioner to start and operate when a second temperature difference value between the preset indoor temperature value and the first current indoor temperature value is larger than a second set value under the condition that the current outdoor temperature value is smaller than a second temperature value, wherein a second refrigeration end of the second semiconductor refrigeration component is connected with the air conditioner external unit, and a second heating end of the second semiconductor refrigeration component is connected with the air conditioner internal unit;
the first temperature value is greater than the second temperature value;
the second acquisition module is configured to acquire a second current indoor temperature value of an area where an air conditioner internal unit is located under the condition that a semiconductor refrigeration component of the air conditioner is in an operating state;
the first closing control module is configured to control a first semiconductor refrigeration component in the air conditioner to stop running under the condition that a third temperature difference value between a second current indoor temperature value and a preset indoor temperature value is smaller than a third set value;
and the second closing control module is configured to control the second semiconductor refrigeration component in the air conditioner to stop running under the condition that a fourth temperature difference value between the preset indoor temperature value and the second current indoor temperature value is smaller than a fourth set value.
8. An apparatus for air conditioning control, the air conditioner comprising two sets of semiconductor refrigeration components, the apparatus comprising a processor and a memory storing program instructions, wherein the processor is configured to perform the method for air conditioning control of any one of claims 1 to 6 when executing the program instructions.
9. An air conditioner, comprising: the apparatus for air conditioning control as claimed in claim 7 or 8.
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| CN202110780026.2A CN113531830B (en) | 2021-07-09 | 2021-07-09 | Method and device for controlling air conditioner and air conditioner |
| PCT/CN2022/094645 WO2023279872A1 (en) | 2021-07-09 | 2022-05-24 | Air conditioner control method and apparatus, and air conditioner |
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| CN111043801A (en) * | 2019-12-26 | 2020-04-21 | 南京工业大学 | Air conditioner outdoor unit defrosting system and method integrating vortex tube and semiconductor refrigerating sheet |
| CN111397045B (en) * | 2020-04-20 | 2024-04-05 | 珠海格力电器股份有限公司 | Unit based on semiconductor heat exchanger, control method thereof and air conditioner |
| CN113531830B (en) * | 2021-07-09 | 2023-02-17 | 青岛海尔空调器有限总公司 | Method and device for controlling air conditioner and air conditioner |
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2021
- 2021-07-09 CN CN202110780026.2A patent/CN113531830B/en active Active
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2022
- 2022-05-24 WO PCT/CN2022/094645 patent/WO2023279872A1/en active Application Filing
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| Publication number | Publication date |
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| WO2023279872A1 (en) | 2023-01-12 |
| CN113531830A (en) | 2021-10-22 |
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