WO2023103402A1 - Air conditioner control method and apparatus, air conditioner, and storage medium - Google Patents

Abstract

An air conditioner control method and apparatus, an air conditioner, and a storage medium. The air conditioner comprises: two groups of semiconductor devices. The method comprises: obtaining a current average indoor temperature value within a current set duration of an area where an air conditioner operating in a current working mode is located, and obtaining a current absolute average temperature difference value between the current average indoor temperature value and a target indoor temperature value; determining a current operating frequency of an air conditioner compressor matching the current absolute average temperature difference value, and determining a current operating state of a current semiconductor device matching the current absolute average temperature difference value, the current semiconductor device matching the current working mode; and controlling the air conditioner compressor to operate at the current operating frequency, and controlling the current semiconductor device to operate in the current operating state. Energy consumption of the air conditioner can be reduced while the refrigerating capacity or heating capacity of the air conditioner is increased.

Description

Method, device, air conditioner and storage medium for air conditioner control

This application is based on a Chinese patent application with application number 202111481661.7 and a filing date of December 6, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.

technical field

The present application relates to the technical field of intelligent air conditioners, for example, to methods and devices for air conditioner control, air conditioners and storage media.

Background technique

Air conditioners have been widely used as a common smart device for adjusting the temperature and humidity of indoor environments. In the related art, the air conditioner can use a vapor compression refrigeration cycle to adjust the indoor temperature, which has the advantage of high energy efficiency. However, the air conditioner may have a problem of low cooling or heating capacity when cooling at high temperature or heating at low temperature.

At present, two groups of semiconductor components can be added to the air conditioner, and each group of semiconductor components is connected to the air conditioner internal unit and the air conditioner external unit respectively. In this way, the cooling operation of the air conditioner can control the operation of a group of semiconductor components. The evaporator inlet pipeline of the air conditioner is precooled, and the condenser inlet pipeline of the air conditioner external unit is preheated, which improves the cooling capacity of the air conditioner; while the air conditioner is heating, it can control the operation of another group of semiconductor components. The evaporator inlet pipeline in the air conditioner internal unit is preheated, while the condenser inlet pipeline in the air conditioner external unit is precooled, which improves the heating capacity of the air conditioner and meets the cooling and heating needs under severe working conditions.

It can be seen that after the air conditioner is equipped with two sets of semiconductor components, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which meets the cooling and heating needs under severe working conditions. However, semiconductor components are limited by materials. After long-term connection operation, the cooling or heating efficiency will decrease, and the reliability will decrease, thus affecting the operating efficiency and reliability of the air conditioner. Consumption is relatively large.

Contents of the invention

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.

Embodiments of the present disclosure provide a method, device, air conditioner and storage medium for air conditioner control, so as to solve the technical problem of excessive power consumption of the air conditioner under severe working conditions. The air conditioner includes two sets of semiconductor components.

In some embodiments, the method includes:

Obtain the current average indoor temperature value within the current set time period in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value;

determining the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and determining the current operating state of the current semiconductor components matching the current absolute average temperature difference, wherein the current semiconductor The components match the current working mode;

The air conditioner compressor is controlled to operate at the current operating frequency, and the current semiconductor components are controlled to operate at the current operating state.

In some embodiments, the device includes:

The first acquisition module is configured to acquire the current average indoor temperature value within the current set period of time in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature between the current average indoor temperature value and the target indoor temperature value difference;

a determination module configured to determine the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and determine the current operating state of the current semiconductor components matching the current absolute average temperature difference, Wherein, the current semiconductor component matches the current working mode;

The first control module is configured to control the air conditioner compressor to operate at the current operating frequency, and control the current semiconductor components to operate at the current operating state.

In some embodiments, the device for air conditioner control includes a processor and a memory storing program instructions, and the processor is configured to execute the above method for air conditioner control when executing the program instructions.

In some embodiments, the air conditioner includes the above-mentioned device for air conditioner control.

In some embodiments, the storage medium stores program instructions, and when the program instructions are executed, the above method for air conditioner control is executed.

The method, device and air conditioner for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:

Two sets of semiconductor components are configured in the air conditioner, so that the operating parameters and status of the air conditioner compressor and semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, thereby flexibly controlling The power of the air conditioner, and by controlling the operation of semiconductor components to increase the cooling capacity or heating capacity of the air conditioner, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner.

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings are not limited to scale and in which:

Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure;

Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;

Fig. 3-1 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;

Fig. 3-2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure;

Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure;

Fig. 5 is a schematic structural diagram of an air-conditioning control device provided by an embodiment of the present disclosure;

Fig. 6 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure.

Detailed ways

In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances so as to facilitate the embodiments of the disclosed embodiments described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.

Unless stated otherwise, the term "plurality" means two or more.

In the embodiments of the present disclosure, the character "/" indicates that the preceding and following objects are an "or" relationship. For example, A/B means: A or B.

The term "and/or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and/or B means: A or B, or, A and B, these three relationships.

In the embodiment of the present disclosure, two groups of semiconductor components are added to the air conditioner, and each group of semiconductor components is respectively connected to the air conditioner internal unit and the air conditioner external unit. The heat not only meets the cooling and heating needs under severe working conditions, but also improves the cooling and heating efficiency of the air conditioner.

Fig. 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure. As shown in FIG. 1 , the air conditioner includes: an air conditioner inner unit 100 , an air conditioner outer unit 200 and two groups of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320 .

The first cooling terminal 311 of the first semiconductor component 310 is connected to the air conditioner indoor unit 100 , and the first heating terminal 312 of the first semiconductor component 310 is connected to the air conditioner external unit 200 .

The second cooling terminal 321 of the second semiconductor component 320 is connected to the air conditioner external unit 200 , and the second heating terminal 322 of the second semiconductor component 320 is connected to the air conditioner internal unit 100 .

In the embodiment of the present disclosure, the semiconductor component can use the thermoelectric effect of the semiconductor to connect two metals with different physical properties with a conductor and connect a direct current, so that the temperature at one end can be lowered and the temperature at the other end can be increased. It is often used in electronic components and micro heat exchange Cooling of the device. There are multiple sets of hotspot elements inside the semiconductor components, which can realize the cooling and heating effect of 40-50°C at the hot end, -10--20°C at the cold end, and a temperature difference of 60°C.

Wherein, after the first semiconductor component 310 is turned on and operated, there are multiple sets of hotspot elements in the first cooling end 311 to lower the temperature, and there are also multiple sets of hotspot elements in the first heating end 312 to increase the temperature. After the second semiconductor component 320 is turned on and running, the two ends can also achieve temperature reduction and temperature rise respectively. Among them, there are multiple groups of hotspot elements in the second cooling end 321, which can realize temperature reduction, while the second heating end 322 There are also multiple sets of hot spot elements to achieve temperature rise.

In some embodiments, the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and preheat the inlet pipeline of the evaporator and the inlet pipeline of the condenser respectively. . As shown in FIG. 1 , one end of the first cooling end 311 is connected to the evaporator of the air conditioner 100 through the indoor connector 110 , and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313 . The other end of the first heating end 312 is connected to the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .

One end of the second heating end 322 is connected to the evaporator of the air conditioner 100 through the indoor connector 110, and the other end is connected to one end of the second cooling end 321 through the second semiconductor assembly connecting pipe 323, and the other end of the second cooling end 321 One end is connected with the condenser of the air conditioner external unit 200 through the outdoor connecting piece 210 .

It can be seen that the two ends of the first semiconductor component and the second semiconductor component are arranged oppositely, and the opposite temperature change can be realized after the start-up operation. That is, when cooling, the first semiconductor component is turned on to pre-cool the evaporator inlet pipeline in the air conditioner's inner unit, and preheat the condenser inlet pipeline in the air conditioner's outer unit, so as to realize indoor precooling and outdoor side cooling. Preheating; when heating, turn on the second semiconductor component to preheat the evaporator inlet pipeline in the air conditioner’s inner unit, and precool the condenser inlet pipeline in the air conditioner’s outer unit to achieve indoor preheating. The heat and the outdoor side are pre-cooled, so that the indoor cooling capacity can be increased when the external temperature is high, and the indoor heating capacity can be increased when the external temperature is low, which meets the cooling and heating needs under severe working conditions.

In some embodiments, both ends of the two groups of semiconductor components can be equipped with exhaust fans to enhance air circulation, which can strengthen the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the cooling capacity/heating capacity of the system. compensate. As shown in Figure 1, the air conditioner can also include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first cooling end 311, the second exhaust fan 420 is located on the first heating end 312, and the third exhaust fan 420 is located on the first heating end 312. The exhaust fan 430 is located on the second heating end 322 , and the fourth exhaust fan position 440 is located on the second cooling end 321 .

Of course, in some embodiments, there may be an air conditioner or only one, two or three exhaust fans, which may be located at any end of any semiconductor component.

After the air conditioner is equipped with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans, the cooling capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, which not only meets The demand for cooling and heating under certain conditions also improves the efficiency of air conditioning cooling and heating.

In the embodiments of the present disclosure, the operating parameters and states of the air conditioner compressor and semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, thereby flexibly controlling the power of the air conditioner, and, By controlling the operation of semiconductor components to increase the cooling capacity or heating capacity of the air conditioner, while improving the cooling and heating efficiency, the power consumption of the air conditioner is reduced.

Fig. 2 is a schematic flowchart of an air conditioner control method provided by an embodiment of the present disclosure. As mentioned above, the air conditioner can be configured with two sets of semiconductor components, or equipped with two sets of semiconductor components and their corresponding exhaust fans. As shown in Figure 2, the processes used for air conditioning control include:

Step 2001: Obtain the current average indoor temperature value within the current set time period in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value.

After the air conditioner is turned on, it operates in the current working mode. The current working mode may include: cooling mode, heating mode, dehumidification mode or defrosting mode and so on.

In the embodiment of the present disclosure, the area where the air conditioner is located can be equipped with an indoor temperature acquisition device, so that the indoor temperature value collected by the indoor temperature acquisition device within a set period of time can be recorded, and then, according to the recorded indoor temperature value and the setting time, the average indoor temperature value can be obtained.

Of course, the air conditioner control in the embodiments of the present disclosure can be controlled once after the current mode is running or automatically and continuously. Therefore, the current set duration corresponds to the current average indoor temperature value. The set duration can be 1 minute, 5 minutes, 10 minutes, or 20 minutes, etc. In some embodiments, the current set duration can be zero. At this time, the current average indoor temperature value is obtained through the indoor temperature acquisition device. The collected real-time current indoor temperature value.

After obtaining the current average indoor temperature value, the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value can be obtained.

Step 2002: Determine the current operating frequency of the air conditioner compressor that matches the current absolute average temperature difference, and determine the current operating status of the current semiconductor components that match the current absolute average temperature difference, wherein the current semiconductor components are consistent with the current operating pattern matching.

Generally, when the air conditioner is running in cooling, heating, dehumidification and other modes, the greater the current absolute average temperature difference, the higher the operating frequency of the air conditioner compressor. In some embodiments, the determination of the current absolute average temperature difference The current operating frequency of the matched air conditioner compressor includes: when the current absolute average temperature difference is greater than or equal to the first set temperature value, determining the highest frequency of the air conditioner compressor as the current operating frequency; When the value is less than the first set temperature value, the frequency reduction process is performed on the air conditioner compressor, and the reduced operating frequency is determined as the current operating frequency.

Among them, the first set temperature value can be 1.5°C, 2°C, 3°C, etc., and the current absolute average temperature difference is greater than or equal to the first set temperature value, such as: current absolute average temperature difference│Trp-Tset│ ≥2.5°C, it indicates that the current absolute average temperature difference │Trp-Tset│ is relatively large. Therefore, the highest frequency that can be configured for the air conditioner is determined as the current operating frequency of the air conditioner compressor. If the current absolute average temperature difference │Trp-Tset│ is less than the first set temperature value, such as: │Trp-Tset│<2.5℃, at this time, the temperature difference is relatively small, and the air conditioner compressor does not need a high frequency. Frequency reduction processing can be performed, and the reduced operating frequency is determined as the current operating frequency. In this way, not only the accuracy of temperature control can be guaranteed, but also the power consumption of the air conditioner can be saved. Of course, there are many ways to reduce the frequency, and the frequency can be reduced according to the set value or the set ratio, or the frequency can be reduced according to the set gear, and the details will not be listed one by one.

In the embodiment of the present disclosure, when the current absolute average temperature difference is relatively large, the current semiconductor component matching the current working mode can also be started to run, and the current running state of the current semiconductor component can be determined as the starting running state; and If the current absolute average temperature difference is relatively small, the current operating state of the current semiconductor component can be determined to be the shutdown state without starting the current semiconductor component. In this way, when the current absolute average temperature difference is relatively large, the cooling or heating capacity can be increased through the operation of the semiconductor components, and the cooling or heating efficiency of the air conditioner can be improved.

In some embodiments, determining the current operating state of the current semiconductor component that matches the current absolute average temperature difference includes: determining the shut down shutdown state as The current operating state of the current semiconductor components; when the current absolute average temperature difference is greater than or equal to the second set temperature value, the start-up operating state is determined as the current operating state of the current semiconductor components; wherein, the second setting The temperature value is greater than or equal to the first set temperature value.

The second set temperature value may be 2° C., 2.5° C., 3° C., 3.2° C. and so on. The second set temperature value is greater than or equal to the first set temperature value, and both the first set temperature value and the second set temperature value can be determined according to the location of the air conditioner, the performance of the air conditioner, and the like.

Since the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first heating terminal of the first semiconductor component is connected to the external unit of the air conditioner, in this way, after the first semiconductor component starts running, the indoor forecasting can be realized. Cold and outdoor preheating; while the second cooling terminal of the second semiconductor component is connected to the external unit of the air conditioner, and the second heating terminal of the second semiconductor component is connected to the internal unit of the air conditioner, therefore, after the second semiconductor component starts running , It can realize indoor preheating and outdoor precooling.

It can be seen that, according to the connection relationship between the first semiconductor component and the second semiconductor component, the current semiconductor component matching the current working mode can be determined. Wherein, when the current working mode is cooling mode, the current semiconductor component is the first semiconductor component; when the current working mode is heating mode, the current semiconductor component is the second semiconductor component.

Wherein, in the case of air-conditioning cooling mode operation, if the current absolute average temperature difference is greater than or equal to the second set temperature value, such as: │Trp-Tset│≥3.5°C, the current value of the first semiconductor component can be set to The running state is determined to be the start-up running state. In this way, after the first semiconductor component is started to run, the evaporator inlet pipeline in the air conditioner internal unit can be precooled, and the condenser inlet pipeline in the air conditioner external unit can be precooled. Heat, thereby increasing the cooling capacity of the air conditioner, thereby improving the cooling efficiency of the air conditioner. In the case of air-conditioning and heating mode operation, if the current absolute average temperature difference is greater than or equal to the second set temperature value, such as: │Trp-Tset│≥3°C, the current value of the second semiconductor component can be set to The running state is determined to be the starting running state. In this way, after the second semiconductor component is started to run, the evaporator inlet pipeline in the air conditioner internal unit can be preheated, and the condenser inlet pipeline in the air conditioner external unit can be preheated. Pre-cooling, thereby increasing the heating capacity of the air conditioner, thereby improving the heating efficiency of the air conditioner.

Step 2003: Control the air conditioner compressor to run at the current operating frequency, and control the current semiconductor components to run at the current operating state.

In the current working mode, the air conditioner compressor can be controlled to run at the current running frequency, and the current semiconductor components can be controlled to be in the shutdown state or the start-up state.

Wherein, when the current absolute average temperature difference is greater than or equal to the second set temperature value, the current operating state of the current semiconductor component is the starting running state, and at this time, the current semiconductor component can be controlled to always be in the starting running state; Or, within a set period of time, the semiconductor components are controlled to be in the start-up operation state.

At present, semiconductor components are limited by materials, and long-term continuous operation will reduce the reliability of components. Moreover, long-term operation of semiconductors will also increase the power consumption of air conditioners. Therefore, in some embodiments, the semiconductor components do not operate continuously for a long time, and the operation period can be set as a unit to operate, and within the set operation period, the semiconductor components operate for a period of time, and the semiconductor components operate for the rest of the time. Stopping, that is, setting the running cycle includes: running time and stopping time. For example: set the operating cycle to be 20 minutes. In this way, during the periodic operation of semiconductor components, it can be operated in the manner of running for 10 minutes and then stopping for 10 minutes. At this time, the operating time and stopping time are both 10 minutes. Alternatively, the set operation period can be 30 minutes, so that during the periodic operation of semiconductor components, it can be operated in the manner of running for 20 minutes and then stopping for 10 minutes, etc. At this time, the operation time is 20 minutes, and the stop time is 10 minutes.

Therefore, controlling the current semiconductor components to operate in the current operating state includes: when the current absolute average temperature difference is greater than or equal to the second set temperature value, only within the operating time of the set operating cycle of the semiconductor components, control The current semiconductor components are in the start-up state. However, during the stop time of the set operation cycle of the semiconductor components, the current semiconductor components are controlled to be in a shutdown state. For example: │Trp-Tset│≥3℃, only need to control the current semiconductor components to be in the start-up state within 10 minutes within 20 minutes of the set operating cycle of the semiconductor components, and then control the current semiconductor components to be in the shutdown state state. That is to say, the current semiconductor components only need to be started and run for 10 minutes before they can be turned off. In this way, the cooling or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.

It can be seen that in the embodiment of the present disclosure, two groups of semiconductor components are configured in the air conditioner, so that the operation of the air conditioner compressor and the semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value. Therefore, the power of the air conditioner can be flexibly controlled, and the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of semiconductor components, and the cooling and heating efficiency can be improved while reducing the power consumption of the air conditioner.

The power of semiconductor components is adjustable, and the corresponding output cooling or heat is also different. Therefore, under the same control input voltage, according to different control input currents, semiconductor components can output different cooling or heat. In some embodiments, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component is, the higher the corresponding operating gear is, and the greater the output energy is. For example: the control input voltage is 220V, and the control input current is 0.5A, 1A, and 1.5A respectively. In this way, semiconductor components correspond to three gears of low, medium, and high. Of course, semiconductor components can also only correspond to low and high gears and so on.

It can be seen that, in some embodiments, when the current semiconductor components are in the start-up operation state, they can correspond to different operating gears. Therefore, controlling the current semiconductor components to operate in the current operation state includes: when the current absolute average temperature difference is greater than or equal to In the case of the second set temperature value, determine the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference; within the operating time of the set operating cycle of the semiconductor component, control the current semiconductor component to The current operating gear is running. Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are. Of course, within the stop time of the set operating cycle of the semiconductor components, the current semiconductor components can be controlled to be in a shutdown state;

Wherein, determining the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference includes: when the current absolute average temperature difference is within the first temperature range, determining that the first gear is the current semiconductor component The current operating gear; in the case that the current absolute average temperature difference is within the second temperature range, determine the second gear as the current operating gear of the current semiconductor component; when the current absolute average temperature difference is within the third temperature In the case of within the range, determine the third gear as the current operating gear of the current semiconductor component.

Wherein, the lower limit value of the first temperature range is equal to the second set temperature value, the upper limit value of the first temperature range is equal to the lower limit value of the second temperature range, and the upper limit value of the second temperature range is equal to the third temperature The lower limit values of the ranges are equal, the control input current of the semiconductor components corresponding to the third gear is greater than the control input current of the semiconductor components corresponding to the second gear, and the control input current of the semiconductor components corresponding to the second gear is greater than the control input current of the semiconductor components corresponding to the second gear. The control input current of semiconductor components corresponding to a gear.

For example: the second set temperature value is 2.5° C., the first temperature range may be [2.5, 4.8), the second temperature range may be [4.8, 6.5), and the third temperature range may be [6.5, ∞). In this way, when 2.5℃≤│Trp-Tset│<4.8℃, the first gear can be determined as the current operating gear of the current semiconductor components; when 4.8℃≤│Trp-Tset│<6.5℃, the second gear can be determined The third gear is the current operating gear of the current semiconductor components; and when 6.5°C≤│Trp-Tset│, the third gear can be determined as the current operating gear of the current semiconductor components.

Of course, the semiconductor components correspond to two, four, five, etc. operating gears, and the corresponding current operating gears of the semiconductor components can also be determined according to the current absolute average temperature difference, which will not be described in detail.

The current operating gear of the current semiconductor component is determined, so that the current semiconductor component can be controlled to operate at the current operating gear, or, within a set time period, the current semiconductor component can be controlled to operate at the current operating gear. In some embodiments, the current semiconductor component can be controlled to operate at the current operating gear within the operating time of the set operating period of the semiconductor component.

For example: when 2.5℃≤│Trp-Tset│<4.8℃, the air conditioner compressor can be controlled to run in the current mode at the highest frequency, and within the 10min running time of the 20min set operation cycle of the semiconductor components, the current semiconductor components can be given The device provides a voltage of 220v and a current of 1A, and controls the current semiconductor components to run in the middle range. Or, when │Trp-Tset│≥6.5℃, the air conditioner compressor can be controlled to run in the current mode at the highest frequency, and can provide 220v to the current semiconductor components during the 10min running time of the 20min set operation cycle of the semiconductor components The voltage and the current of 1.5A control the current semiconductor components to run at a high level. Or, when │Trp-Tset│<2°C, reduce the frequency of the air-conditioning compressor, control the air-conditioning compressor to operate in the current mode at the reduced operating frequency, and control the current semiconductor components to be shut down.

It can be seen that in some embodiments, different current absolute average temperature differences correspond to different operating gears of conductor components, that is, correspond to different output energies of semiconductor components, thereby further speeding up the cooling or heating efficiency of the air conditioner. Moreover, during the operation time of the set operation period of the semiconductor components, the semiconductor components are in the start-up operation state, and during the stop time of the set operation cycle of the semiconductor components, the semiconductor components are in the shutdown state, so that the semiconductor components The device will not be turned on continuously for a long time, which not only ensures the stability of the semiconductor components, but also reduces the energy consumption of the air conditioner.

The semiconductor components of the air conditioner may be equipped with a corresponding exhaust fan. The exhaust fan can enhance the air circulation and enhance the heat exchange between the two ends of the semiconductor components and the indoor/outdoor side, so as to realize the compensation of the cooling capacity/heating capacity of the system. Therefore, in some embodiments, controlling the current semiconductor component to operate at the current operating gear further includes: controlling the operation of the corresponding exhaust fan on the current semiconductor component according to the current operating mode.

Wherein, when the first semiconductor component is in the starting operation state, control the operation of the first exhaust fan and the second exhaust fan configured on the first semiconductor component; when the second semiconductor component is in the starting operation state Next, control the operation of the third exhaust fan and the fourth exhaust fan arranged on the second semiconductor component. Wherein, in the air conditioner, the first exhaust fan is located on the first cooling end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second heating end. On the second refrigeration end.

The semiconductor components stop running. In order to further reduce energy consumption, the corresponding exhaust fans can also be turned off. In some embodiments, when the current semiconductor components are in the shutdown state, control the corresponding The exhaust fan is switched off. That is, when the first semiconductor component stops running, control the first exhaust fan and the second exhaust fan configured on the first semiconductor component to stop running; The third exhaust fan and the fourth exhaust fan configured on the second semiconductor component stopped running.

Of course, when the current outdoor temperature is less than the second set temperature value and greater than or equal to the first set temperature value, the operating state of the semiconductor components controlling the air conditioner remains unchanged, and the air conditioner can still use the vapor compression refrigeration cycle , to achieve indoor temperature regulation.

Moreover, when the semiconductor components of the air conditioner are turned off, the air conditioner can still use a vapor compression refrigeration cycle to adjust the indoor temperature.

In the embodiments of the present disclosure, the control process of the air conditioner can be controlled once or automatically and continuously during the operation of the current mode of the air conditioner. Therefore, in some embodiments, the current time period within the current setting period of the area where the air conditioner is running in the current mode is obtained. The average indoor temperature value includes: when the current semiconductor components are turned off and the air conditioner is running in the current mode for a period of time reaching the preset sampling time, record the area where the air conditioner is running in the current working mode within the current set time The indoor temperature value; according to the recorded indoor temperature value, the current average indoor temperature value within the current set time period is obtained.

For example: the preset sampling time can be 5, 10, 15, 25 minutes, etc. In this way, within the preset sampling time, the semiconductor components have not been started and run, and they are in the shutdown state, and the air conditioner has been running in the current working mode , at this time, the temperature sampling and recording within the current set time period can be carried out, so that the current average indoor temperature value within the current set time period can be obtained, and then the current absolute average temperature difference can be obtained, and then the current absolute average temperature difference can be obtained. The temperature difference is used for air conditioning control.

At present, the air conditioner has a communication function, so that the air conditioner can also control the operation of semiconductor components according to the received instructions. In some embodiments, in the case of receiving the semiconductor switch instruction sent by the configuration control application APP terminal, the switching operation of the semiconductor components in the air conditioner is controlled according to the semiconductor switch instruction. In this way, the user can control the switching of semiconductor components through the APP, which improves the intelligence and user experience of the air conditioner.

In the following, the operation process is integrated into a specific embodiment to illustrate the air-conditioning control process provided by the embodiment of the present disclosure.

In this embodiment, the air conditioner may include two sets of semiconductor components and four exhaust fans as shown in FIG. 1 . In addition, the first set temperature value stored in the air conditioner is 2°C, and the second set temperature value is 3°C. Moreover, the semiconductor components correspond to three operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear. Moreover, the first temperature range can be [3, 5), the second temperature range can be [5, 7), and the third temperature range can be [7, ∞); the setting time can be 10 minutes, and the design of semiconductor components The fixed operation cycle can be 20 minutes, and the running time of the set operation cycle is 10 minutes; and the preset sampling time can also be 10 minutes. The current operating mode of the air conditioner is cooling mode, and the corresponding current semiconductor component is the first semiconductor component.

Fig. 3-1 and Fig. 3-2 are schematic flowcharts of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 with Figure 3-1 and Figure 3-2, the process for air conditioning control includes:

Step 3001: Determine if the first semiconductor component is in shutdown state, and whether the duration of the air conditioner in cooling mode is ≥ 10 minutes? If yes, execute step 3002; otherwise, return to step 3001.

Step 3002: Record the indoor temperature value of the air conditioner running in cooling mode within 10 minutes, and obtain the current average indoor temperature value Trp within 10 minutes, and obtain the current absolute average temperature difference based on the current average indoor temperature value Trp and the target indoor temperature value Tset Value │Trp-Tset│.

Step 3003: Determine whether the current absolute average temperature difference│Trp-Tset│≥2 holds true? If yes, go to step 3004; otherwise, go to step 3015.

Step 3004: Determine if 2≤│Trp-Tset│<3 holds true? If yes, go to step 3005; otherwise, go to step 3007.

Step 3005: Determine the highest frequency of the air conditioner compressor as the current operating frequency, and determine the shutdown state as the current operating state of the first semiconductor component.

Step 3006: Control the air conditioner compressor to perform cooling operation at the highest frequency, and control the first semiconductor component to be in a shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, the first system The second exhaust fan on the hot end is off. Go to step 3001.

Step 3007: Determine whether 3≤│Trp-Tset│<5 holds true? If yes, go to step 3008; otherwise, go to step 3009.

Step 3008: Determine the highest frequency of the air conditioner compressor as the current operating frequency, determine the start-up operating state as the current operating state of the first semiconductor component, and determine the first gear as the current operating gear of the first semiconductor component. Go to step 3012.

Step 3009: Determine if 5≤│Trp-Tset│<7 holds true? If yes, go to step 3010; otherwise, go to step 3011.

Step 3010: Determine the highest frequency of the air conditioner compressor as the current operating frequency, determine the starting operating state as the current operating state of the first semiconductor component, and determine the second gear as the current operating gear of the first semiconductor component. Go to step 3012.

Step 3011: Determine the highest frequency of the air conditioner compressor as the current operating frequency, determine the start-up operating state as the current operating state of the first semiconductor component, and determine the third gear as the current operating gear of the first semiconductor component. Go to step 3012.

Step 3012: Control the air conditioner compressor to perform cooling operation at the highest frequency, and control the first semiconductor component to operate at the current operating gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to operate, the first The second exhaust fan on the heating side operates.

Step 3013: Determine whether the running time of the set running cycle of the semiconductor component is 10 minutes? If yes, execute step 3014; otherwise, return to step 3013.

Step 3014: Control the first semiconductor component to be in shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be closed, and the second exhaust fan on the first heating end to be closed, return Step 3001.

Step 3015: Perform frequency reduction processing on the air conditioner compressor, determine the reduced operating frequency as the current operating frequency, and determine the shutdown state as the current operating state of the first semiconductor component.

Step 3016: Control the air conditioner compressor to perform cooling operation at the current operating frequency, and control the first semiconductor component to be in the shut down state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, the first The second exhaust fan on the heating side is switched off. Go to step 3001.

It can be seen that in this embodiment, two groups of semiconductor components are configured in the air conditioner, so that the operating parameters of the air conditioner compressor and semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value. And the status, so that the power of the air conditioner can be flexibly controlled, and the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of semiconductor components, and the cooling and heating efficiency can be improved, while the power consumption of the air conditioner can be reduced.

According to the above process for air-conditioning control, an apparatus for air-conditioning control can be constructed.

Fig. 4 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As mentioned above, the air conditioner includes two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans. As shown in FIG. 4 , the air conditioner control device includes: a first acquisition module 4100 , a determination module 4200 and a first control module 4300 .

The first obtaining module 4100 is configured to obtain the current average indoor temperature value within the current set period of time in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value value.

The determining module 4200 is configured to determine the current operating frequency of the air conditioner compressor that matches the current absolute average temperature difference, and determine the current operating state of the current semiconductor component that matches the current absolute average temperature difference, wherein the current semiconductor element The device matches the current operating mode.

The first control module 4300 is configured to control the air conditioner compressor to operate at the current operating frequency, and control the current semiconductor components to operate at the current operating state.

In some embodiments, determining module 4200 includes:

The frequency determining unit is configured to determine the highest frequency of the air conditioner compressor as the current operating frequency when the current absolute average temperature difference is greater than or equal to the first set temperature value; In the case of setting the temperature value, the frequency reduction processing is performed on the air conditioner compressor, and the reduced operating frequency is determined as the current operating frequency.

In some embodiments, determining module 4200 includes:

The mode determination unit is configured to determine the shutdown state as the current operating state of the current semiconductor component when the current absolute average temperature difference is less than the first set temperature value; when the current absolute average temperature difference is greater than or equal to In the case of the second set temperature value, the start-up operating state is determined as the current operating state of the current semiconductor component; wherein, the second set temperature value is greater than or equal to the first set temperature value.

In some embodiments, the first control module 4300 includes:

The gear determination unit is configured to determine the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference when the current absolute average temperature difference is greater than or equal to the second set temperature value.

The first control unit is configured to control the current semiconductor component to operate at the current operating gear within the operating time of the set operating cycle of the semiconductor component.

The second control unit is configured to control the current semiconductor component to be in a shutdown state within the stop time of the set operation cycle of the semiconductor component.

Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.

In some embodiments, the first control module is further configured to control the operation of the corresponding exhaust fan on the current semiconductor component according to the current working mode.

In some embodiments, the first acquisition module 4100 is specifically configured to record the current set duration when the current semiconductor component is in the shutdown state and the duration of the air conditioner in the current mode of operation reaches the preset sampling duration , the indoor temperature value of the area where the air conditioner is running in the current working mode; according to the recorded indoor temperature value, the current average indoor temperature value within the current set time period is obtained.

The following is an example to illustrate the air-conditioning control process performed by the device for air-conditioning control provided by the embodiments of the present disclosure.

The air conditioner can be shown in Figure 1, including two sets of semiconductor components and four exhaust fans. The first set temperature value stored in the air conditioner is 2°C, and the second set temperature value is 2.5°C. Moreover, the semiconductor components correspond to two operating gears, and the output energy of the second gear is greater than that of the first gear. Moreover, the first temperature range can be [2.5,6.5), the second temperature range can be [6.5,∞); the set time can be 12min, the set operation period of semiconductor components can be 30min, and the set operation period The running time is 15 minutes; and the preset sampling time can also be 15 minutes. The current operating mode of the air conditioner is the heating mode, and the corresponding current semiconductor component is the second semiconductor component.

Fig. 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As shown in Figure 5, the air conditioner control device includes: a first acquisition module 4100, a determination module 4200, and a first control module 4300, wherein the determination module 4200 includes: a frequency determination unit 4210 and a mode determination unit 4220, the first control module 4300 includes: a gear determination unit 4310 , a first control unit 4320 and a second control unit 4330 .

Wherein, after the second semiconductor component is in the stopped state and the air conditioner is in the heating mode for 15 minutes, the first acquisition module 4100 can record the indoor temperature value of the air conditioner in the heating mode within 12 minutes, and obtain the 12 minutes The current average indoor temperature value Trp, and according to the current average indoor temperature value Trp and the target indoor temperature value Tset, the current absolute average temperature difference │Trp-Tset│ is obtained.

In this way, if 2≤│Trp-Tset|<2.5, the frequency determination unit 4210 can determine the highest frequency of the air conditioner compressor as the current operating frequency; Operating status. Therefore, the control module 4300 can control the air-conditioning compressor to perform heating operation at the highest frequency, control the second semiconductor component to be in a shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component Closed, the fourth exhaust fan on the second refrigeration end is closed.

If 2.5≦│Trp-Tset│<6.5, the frequency determination unit 4210 may determine the highest frequency of the air conditioner compressor as the current operating frequency, and the mode determination unit 4220 may determine the startup operating state as the current operating state of the second semiconductor component. And the gear determination unit 4310 in the first control module 4300 can determine the first gear as the current operating gear of the second semiconductor component. If 6.5≦|Trp-Tset|, similarly, the frequency determination unit 4210 may determine the highest frequency of the air conditioner compressor as the current operating frequency, and the mode determination unit 4220 may determine the start-up operating state as the current operating state of the second semiconductor component. The gear determination unit 4310 in the first control module 4300 can determine the second gear as the current operating gear of the second semiconductor component. Therefore, the first control unit 4320 in the first control module 4300 can control the air conditioner compressor to perform heating operation at the highest frequency, control the second semiconductor component to the current operating gear, and control the second semiconductor component of the second semiconductor component. The third exhaust fan on the heating side is running, and the fourth exhaust fan on the second cooling side is running.

When reaching the running time of 15 minutes with the set running cycle of the semiconductor components, the second control unit 4330 can control the second semiconductor components to be in the shut-down state, and control the second heating terminal on the second semiconductor components. The three exhaust fans are closed, and the fourth exhaust fan on the second cooling end is closed.

Of course, when │Trp-Tset│<2, the frequency determining unit 4210 can perform frequency reduction processing on the air conditioner compressor, and determine the reduced operating frequency as the current operating frequency, and the mode determining unit 4220 determines the shutdown state as The current operating state of the second semiconductor component. Therefore, the first control module 4300 controls the air conditioner compressor to perform heating operation at the current operating frequency, and controls the second semiconductor component to be in a shutdown state, and controls the third row on the second heating end of the second semiconductor component. The air fan is closed, and the fourth exhaust fan on the second refrigeration end is closed.

It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner, so that the device for air conditioner control can adjust the air conditioner compressor and the The operating parameters and status of semiconductor components, so as to flexibly control the power of the air conditioner, and increase the cooling or heating capacity of the air conditioner by controlling the operation of semiconductor components, improve the cooling and heating efficiency, and reduce the power consumption of the air conditioner .

An embodiment of the present disclosure provides a device for air conditioning control, the structure of which is shown in Figure 6, including:

A processor (processor) 1000 and a memory (memory) 1001 may also include a communication interface (Communication Interface) 1002 and a bus 1003. Wherein, the processor 1000 , the communication interface 1002 , and the memory 1001 can communicate with each other through the bus 1003 . Communication interface 1002 may be used for information transfer. The processor 1000 can call the logic instructions in the memory 1001 to execute the method for air conditioner control in the above embodiments.

In addition, the above logic instructions in the memory 1001 may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as an independent product.

The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 1000 executes function applications and data processing by running program instructions/modules stored in the memory 1001 , that is, implements the method for air-conditioning control in the above method embodiments.

The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the terminal air conditioner, and the like. In addition, the memory 1001 may include a high-speed random access memory, and may also include a non-volatile memory.

An embodiment of the present disclosure provides an air-conditioning control device, including: a processor and a memory storing program instructions, and the processor is configured to execute an air-conditioning control method when executing the program instructions.

An embodiment of the present disclosure provides an air conditioner, including the above-mentioned control device for an air conditioner.

An embodiment of the present disclosure provides a computer-readable storage medium, which stores computer-executable instructions, and the computer-executable instructions are configured to execute the above method for controlling an air conditioner.

An embodiment of the present disclosure provides a computer program product, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program includes program instructions, and when the program instructions are executed by a computer, the The computer executes the above method for air conditioning control.

The above-mentioned computer-readable storage medium may be a transitory computer-readable storage medium, or a non-transitory computer-readable storage medium.

The technical solutions of the embodiments of the present disclosure can be embodied in the form of software products. The computer software products are stored in a storage medium and include one or more instructions to make a computer air conditioner (which can be a personal computer, a server, or a network air conditioner, etc.) execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium can be a non-transitory storage medium, including: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disc, etc. A medium that can store program code, or a transitory storage medium.

The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, procedural, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present disclosure includes the full scope of the claims, and all available equivalents of the claims. When used in the present application, although the terms 'first', 'second', etc. may be used in the present application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, a first element could be called a second element, and likewise, a second element could be called a first element, as long as all occurrences of "first element" are renamed consistently and all occurrences of "Second component" can be renamed consistently. The first element and the second element are both elements, but may not be the same element. Also, the terms used in the present application are used to describe the embodiments only and are not used to limit the claims. As used in the examples and description of the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well unless the context clearly indicates otherwise . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones. Additionally, when used in this application, the term "comprise" and its variants "comprises" and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitations, an element defined by the statement "comprising a ..." does not exclude the presence of additional identical elements in the process, method or condition comprising said element. Herein, what each embodiment focuses on may be the difference from other embodiments, and the same and similar parts of the various embodiments may refer to each other. For the method, product, etc. disclosed in the embodiment, if it corresponds to the method part disclosed in the embodiment, then the relevant part can refer to the description of the method part.

Those skilled in the art can appreciate that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific application and design constraints of the technical solution. Said artisans may implement the described functions using different methods for each particular application, but such implementation should not be regarded as exceeding the scope of the disclosed embodiments. The skilled person can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, air conditioners, etc.) can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than that disclosed in the description, and sometimes there is no specific agreement between different operations or steps. order. For example, two consecutive operations or steps may, in fact, be performed substantially concurrently, or they may sometimes be performed in the reverse order, depending upon the functionality involved. Each block in the block diagrams and/or flowcharts, and combinations of blocks in the block diagrams and/or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by dedicated hardware implemented in combination with computer instructions.

Claims (11)

1. A method for air conditioner control, characterized in that the air conditioner includes two sets of semiconductor components, wherein the first refrigeration terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first cooling terminal of the first semiconductor component A heating terminal is connected to the air conditioner external unit, a second cooling terminal of the second semiconductor component is connected to the air conditioner external unit, and a second heating terminal of the second semiconductor component is connected to the air conditioner internal unit, so The methods described include:

   Obtain the current average indoor temperature value within the current set time period in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value;

   determining the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and determining the current operating state of the current semiconductor components matching the current absolute average temperature difference, wherein the current semiconductor The components match the current working mode;

   The air conditioner compressor is controlled to operate at the current operating frequency, and the current semiconductor components are controlled to operate at the current operating state.
2. The method according to claim 1, wherein when the current working mode is cooling mode, the current semiconductor component is the first semiconductor component; when the current working mode is heating mode, the The current semiconductor component is the second semiconductor component.
3. The method according to claim 1, wherein the determining the current operating frequency of the air conditioner compressor that matches the current absolute average temperature difference comprises:

   When the current absolute average temperature difference is greater than or equal to a first set temperature value, determine the highest frequency of the air conditioner compressor as the current operating frequency;

   In the case that the current absolute average temperature difference is smaller than the first set temperature value, frequency reduction processing is performed on the air conditioner compressor, and the reduced operating frequency is determined as the current operating frequency.
4. The method according to claim 1, wherein the determining the current operating state of the current semiconductor component matching the current absolute average temperature difference comprises:

   In the case that the current absolute average temperature difference is less than the first set temperature value, the shutdown state is determined as the current operating state of the current semiconductor components;

   In the case that the current absolute average temperature difference is greater than or equal to the second set temperature value, determining the start-up operation state as the current operation state of the current semiconductor component;

   Wherein, the second set temperature value is greater than or equal to the first set temperature value.
5. The method according to claim 4, wherein the controlling the current semiconductor component to operate in the current operating state comprises:

   When the current absolute average temperature difference is greater than or equal to the second set temperature value, determine the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference;

   Control the current semiconductor components to run at the current operating gear within the running time of the set operating cycle of the semiconductor components;

   During the stop time of the set operating cycle of the semiconductor component, control the current semiconductor component to be in a shutdown state;

   Wherein, the semiconductor components correspond to two or more operating gears, and the greater the control input current of the semiconductor components is, the higher the corresponding operating gears are.
6. The method according to claim 5, wherein the controlling the current semiconductor components to operate at the current operating gear further comprises:

   According to the current working mode, the operation of the exhaust fan corresponding to the current semiconductor component is controlled.
7. The method according to any one of claims 1-6, wherein the obtaining the current average indoor temperature value within the current set time period of the area where the air conditioner is running in the current working mode includes:

   In the case that the current semiconductor components are in the shutdown state, and the duration of the air conditioner in the current mode operation state reaches the preset sampling time length, record the area where the air conditioner is running in the current working mode within the current set time length indoor temperature value;

   According to the recorded indoor temperature value, the current average indoor temperature value within the current set time period is obtained.
8. A device for air conditioner control, characterized in that the air conditioner includes two groups of semiconductor components, wherein the first cooling terminal of the first semiconductor component is connected to the air conditioner internal unit, and the first cooling terminal of the first semiconductor component A heating terminal is connected to the air conditioner external unit, a second cooling terminal of the second semiconductor component is connected to the air conditioner external unit, and a second heating terminal of the second semiconductor component is connected to the air conditioner internal unit, so Said devices include:

   The first acquisition module is configured to acquire the current average indoor temperature value within the current set period of time in the area where the air conditioner is running in the current working mode, and obtain the current absolute average temperature between the current average indoor temperature value and the target indoor temperature value difference;

   a determination module configured to determine the current operating frequency of the air conditioner compressor matching the current absolute average temperature difference, and determine the current operating state of the current semiconductor components matching the current absolute average temperature difference, Wherein, the current semiconductor component matches the current working mode;

   The first control module is configured to control the air conditioner compressor to operate at the current operating frequency, and control the current semiconductor components to operate at the current operating state.
9. A device for controlling an air conditioner, the air conditioner includes two groups of semiconductor components, the device includes a processor and a memory storing program instructions, wherein the processor is configured to , executing the method for air conditioning control according to any one of claims 1 to 7.
10. An air conditioner, characterized by comprising: the device for air conditioner control according to claim 8 or 9.
11. A storage medium storing program instructions, wherein the program instructions execute the method for air-conditioning control according to any one of claims 1 to 7 when running.

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