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CN113206025B - Electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus Download PDF

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Publication number
CN113206025B
CN113206025B CN202110117011.8A CN202110117011A CN113206025B CN 113206025 B CN113206025 B CN 113206025B CN 202110117011 A CN202110117011 A CN 202110117011A CN 113206025 B CN113206025 B CN 113206025B
Authority
CN
China
Prior art keywords
electronic component
substrate
mark
mounting
mounting head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110117011.8A
Other languages
Chinese (zh)
Other versions
CN113206025A (en
Inventor
桥本正规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020214305A external-priority patent/JP2021121014A/en
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN113206025A publication Critical patent/CN113206025A/en
Application granted granted Critical
Publication of CN113206025B publication Critical patent/CN113206025B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides a mounting device for electronic parts, which can restrain generated dust and can mount with good precision, comprising: a mounting mechanism for mounting the electronic component on the substrate; a substrate supporting mechanism for supporting a substrate on which electronic parts are mounted; a mounting head provided on the mounting mechanism and having a transmission portion that allows the transmission portion to identify the mark of the substrate while the electronic component is held; a first imaging unit configured to, at a mounting position where the mounting head mounts the electronic component on the substrate, be disposed below the substrate supporting mechanism, and to capture a mark of the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position; a second imaging unit which is disposed above the mounting head at the mounting position and images the mark of the substrate by the transmission unit; and a positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the marks and the images of the marks captured by the first and second imaging units.

Description

Electronic component mounting apparatus
Technical Field
The present invention relates to an electronic component mounting apparatus.
Background
A semiconductor chip (chip) as an electronic component has a front-up (face-up) or a front-down (face-down) for a method of mounting a substrate. The surface of the semiconductor chip on which the semiconductor layer is formed is referred to as a front surface (face). The front side is the side opposite to the substrate, and the front face is upward. For example, when a semiconductor chip is mounted on a lead frame (LEAD FRAME) or the like and wiring is performed between an electrode and the frame by a wire, the mounting is performed with the front side facing upward.
The front side is directed toward the substrate for mounting with the front side facing downward. For example, in the case of flip chip (flip chip) connection in which connection with electrical connection is performed by providing bump electrodes on the surface of a semiconductor layer and pressing the bump electrodes against wiring of a substrate, mounting is performed with the front side facing downward.
When mounting electronic components such as semiconductor chips on a substrate, the electronic components must be precisely positioned with respect to the substrate. In order to cope with this problem, for example, a camera capable of simultaneously photographing both the upper and lower directions is interposed between a mounting tool for suction-holding electronic parts and a substrate. Based on the image photographed by the camera, the relative positions of the substrate and the electronic parts in the horizontal direction are identified. Then, the electronic component is mounted on the substrate after correcting the position of the mounting tool based on the recognized relative position.
[ Prior Art literature ]
[ Patent literature ]
Patent document 1 japanese patent laid-open publication No. 2010-129913
Disclosure of Invention
[ Problem to be solved by the invention ]
In recent years, in three-dimensional (three dimensional, 3D) packaging (package) and hybrid bonding (hybrid bonding) in which semiconductor chips are arranged in multiple layers to improve the integration, it is necessary to bond electrodes having very narrow pitches to each other. Therefore, when mounting electronic components on a substrate, higher accuracy, for example, submicron (submicron order) accuracy is required. Further, in the mounting, an error caused by the operation of the mechanism portion for mounting and dust generated by the operation may cause poor joining, and therefore, it is preferable that the distance by which the mechanism portion operates is as short as possible.
However, in the case of using a photographing camera capable of photographing both the up and down directions at the same time, when the relative positions of the substrate and the electronic component in the horizontal direction are recognized, it is necessary to bring the camera between the substrate and the electronic component, and therefore it is necessary to increase the separation distance between the two. Therefore, the distance for moving the electronic component becomes longer after the relative positions of the two are recognized. The longer the moving distance is, the higher the risk of generating a positional shift in the horizontal direction is, and thus it is difficult to obtain high mounting accuracy. In addition, the movement distance of the mechanism part is increased, and the amount of generated dust may be increased.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component mounting device capable of precisely mounting an electronic component while suppressing the amount of dust generated.
[ Means of solving the problems ]
The electronic component mounting apparatus of the present invention includes: a mounting mechanism for mounting the electronic component on the substrate; a substrate supporting mechanism supporting the substrate on which the electronic component is mounted; a mounting head provided in the mounting mechanism and having a transmission portion that allows the transmission portion to recognize the mark of the substrate while the electronic component is held; a first imaging unit configured to capture an image of a mark of the electronic component held by the mounting head in a state in which the mounting head mounts the electronic component on the substrate at a mounting position on the substrate and the substrate is retracted from the mounting position; a second imaging unit which is disposed above the mounting head at the mounting position and which images the mark of the substrate through the transmission unit; and a positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks captured by the first imaging unit and the second imaging unit.
[ Effect of the invention ]
The invention provides a mounting device for electronic parts, which can restrain the generated dust and can be mounted with good precision.
Drawings
Fig. 1 is a front view showing a schematic configuration of an attachment device according to an embodiment.
Fig. 2 is a plan view showing an electronic component and a substrate.
Fig. 3 is a plan view (a) of the mounting device, and an enlarged plan view (B) of the mounting portion of fig. 3.
Fig. 4 (a) to 4 (C) are explanatory views showing the mounting process of the mounting device.
Fig. 5 is a flowchart showing an installation process of the installation apparatus.
Fig. 6 (a) to 6 (C) are explanatory views showing an installation method of the installation device according to another embodiment.
Fig. 7 is a flowchart showing an installation process of the configuration of fig. 6.
Fig. 8 (a) to 8 (C) are explanatory views showing an installation method of an installation device according to another embodiment.
Fig. 9 is a flowchart showing an installation process of the configuration of fig. 8.
[ Description of symbols ]
1: Mounting device
2: Substrate supporting mechanism
3: Mounting mechanism
4: A first shooting part
5: A second shooting part
6: Control device
11: Supporting table
11A: containing hole
21: Carrier table
22: Driving mechanism
22A, 22b, 33a, 34a, 35a: guide rail
23: Movable plate
23A: through hole
31: Mounting head
31A: hollow part
31B: holding part
32: Driving mechanism
33. 34, 35: Moving body
B: mounting area
C: electronic component
D: adsorption zone
M, ma: marking
OA: mounting position
S: substrate board
S101 to S108, S201 to S209, and S301 to S308: step (a)
T: transmission region
X, Y, Z: coordinate axis
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in fig. 1 and2, the present embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of the mounting apparatus 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. The drawings are schematic, and the specifications (size) (hereinafter also referred to as dimensions) and shapes of the respective parts, the ratio of the specifications of the respective parts, and the like may be different from reality.
[ Electronic parts ]
First, the electronic component C to be mounted in the present embodiment includes, for example, a semiconductor device such as an integrated circuit (INTEGRATED CIRCUIT, IC) or a large scale integrated circuit (LSI).
As shown in fig. 2, the present embodiment uses a semiconductor chip having a rectangular parallelepiped shape as the electronic component C. Each semiconductor chip is a bare chip (bare chip) singulated by dicing a semiconductor wafer (wafer) into small pieces. The bare chip is provided with bump (bumpless) or bump-less electrode on the exposed semiconductor, and is mounted by flip-chip connection with pad bonding on the substrate S.
The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, two marks m are provided one at each of a pair of diagonal portions of the rectangular electronic component C, which are diagonal to each other. The mark m is provided on the electrode-formed surface, i.e., the front surface, of the electronic component C. The present embodiment is an example of a device for mounting the front surface side of the substrate S facing down.
[ Substrate ]
In the present embodiment, as shown in fig. 2, the substrate S on which the electronic component C as described above is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, a silicon substrate on which a circuit pattern is formed, or the like. A mounting region B, which is a region where the substrate S is mounted, is provided on the substrate S, and a plurality of marks M for positioning are provided on the outside of the mounting region B. In the present embodiment, two marks M are provided at positions outside the mounting region B and at positions corresponding to the marks M of the electronic component C. That is, one mounting region B is provided outside a pair of diagonal portions which are diagonally opposite to each other in the mounting region B having the same shape and the same specification as those of the rectangular electronic component C.
[ Mounting device ]
The mounting device 1 according to the present embodiment is a mounting device 1 capable of mounting with high accuracy, for example, mounting accuracy of ±0.2 μm or less, and includes, as shown in fig. 1 and fig. 3 (a) and fig. 3 (B): a substrate supporting mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, and a control device 6. Fig. 3 (a) is a plan view of the mounting device 1, and fig. 3 (B) is a plan view showing a mark M penetrating a mounting head 31 described later.
In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is referred to as the Z axis, and two axes orthogonal to each other in a plane orthogonal to the Z axis are referred to as the X axis and the Y axis. In the present embodiment, the Z axis is vertical, the direction following the gravitational force is referred to as downward, the direction resisting the gravitational force is referred to as upward, and the position on the Z axis is referred to as height. The X axis and the Y axis are on the horizontal plane, and the X axis is the left-right direction and the Y axis is the depth direction when viewed from the front side of fig. 1. The present invention is not limited to the setting direction. Regardless of the direction of installation, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side with respect to the substrate S or the substrate support mechanism 2.
The substrate support mechanism 2 is a mechanism for supporting a substrate S on which electronic components C are mounted, and is a so-called substrate stage (stage). The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmission portion that allows the mark M of the substrate S facing the electronic component C to be recognized therethrough while the electronic component C is held.
The first imaging unit 4 is disposed below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S, and images the mark m of the electronic component C held by the mounting head 31 from a position opposite to the electronic component C, that is, below, in a state where the substrate S is retracted from the mounting position OA by the substrate support mechanism 2. The mounting position OA is a position at which the electronic component C is mounted on the substrate S, and is shown by a dash-dot line along the Z-axis that passes through a point (for example, a center point) on XY coordinates in the region of the electronic component C to be mounted. As described later, the mounting position OA matches the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transmission portion of the mounting head 31 (hereinafter, this will be referred to as "imaging across the mounting head 31"). The control device 6 controls the operation of the mounting device 1.
The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks M and M imaged by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 described above is mounted on a support table 11 provided on the installation surface. The top surface of the support table 11 is a horizontal surface. Hereinafter, each portion will be described in detail.
(Substrate supporting mechanism)
As shown in fig. 1 and 3 (a), the substrate support mechanism 2 is disposed on the support table 11 and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-like member on which the substrate S is placed. The driving mechanism 22 is a biaxial movement mechanism that includes, for example, a pair of rails 22a in the X-axis direction and a pair of rails 22b in the Y-axis direction, and moves the stage 21 in a horizontal plane by a belt or a ball screw (ball screw) using a motor, not shown, as a driving source. The pair of guide rails 22a and the pair of guide rails 22b are symmetrically arranged with respect to the mounting position OA. The driving mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the driving mechanism 22 includes a θ driving mechanism for rotationally moving the stage 21 in a horizontal plane.
The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22 b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.
Further, although not shown, a loader/unloader that supplies and stores the substrate S to and on the stage 21 is provided at one of the ends of movement (specifically, the movement end on the right side in the drawing) of the stage 21 of the substrate support mechanism 2 in the X-axis direction. Therefore, the substrate support mechanism 2 receives the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the movement end.
(Mounting means)
The mounting mechanism 3 includes a mounting head 31 and a driving mechanism 32. The mounting head 31 has a substantially rectangular parallelepiped shape, and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through hole formed around the Z axis direction. The holding portion 31b is a plate-like member that transmits light for photographing, and is attached so as to close the opening of the hollow portion 31a toward the substrate S side. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.
As shown in fig. 3 (B), a suction area D for sucking and holding the electronic component C is provided in the center of the holding portion 31B. Although not shown, adsorption holes are formed in the adsorption region D. A flow path for communicating the suction hole with a negative pressure source is formed in the holding portion 31b, and the suction hole generates a negative pressure, so that the electronic component C can be sucked and held. The periphery of the suction area D of the holding portion 31b is a transmission area T through which the mark M of the substrate S can be transmitted and imaged even when the electronic component C is sucked. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be photographed by the second photographing part 5. The holding surface (suction surface) of the holding portion 31b for holding the electronic component C is referred to as a lower end surface.
The driving mechanism 32 includes a movable body 33, a movable body 34, and a movable body 35, and drives the mounting head 31. The movable body 33 is provided so as to be movable along a guide rail 33a in the Y-axis direction provided on the support table 11. The movable body 34 is provided so as to be movable along a guide rail 34a in the X-axis direction provided on the top surface of the movable body 33. The movable body 35 is provided so as to be movable along a guide rail 35a in the Z-axis direction provided on the front surface of the movable body 34. The movable body 35 is formed in a substantially concave shape in a plan view. The moving bodies 33, 34, 35 are driven by a ball screw, a linear motor, a cylinder, or the like using a motor as a driving source.
The mounting head 31 is provided at a lower portion of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b holding the mounting head 31 on the substrate S. The movable body 35 provided with the mounting head 31 is moved in the X-axis direction and the Y-axis direction by the movement of the movable body 33 and the movable body 34. Therefore, the driving mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown, the driving mechanism 32 includes a θ driving mechanism that rotationally moves the mounting head 31 in a horizontal plane.
In the present embodiment, it is preferable to set the movement amounts of the driving mechanism 32 in the X-axis direction, the Y-axis direction, and the Z-axis direction to be extremely short in view of preventing movement errors. For example, the movement amounts of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are set to several mm to ten-odd mm, respectively. The movement amount of the movable body 35 in the Z-axis direction is also set to be about several mm to about ten and several mm. That is, the mounting head 31 receives the electronic component C and photographs the mark m of the received electronic component C at a height position of a facing distance (vertical separation distance) of several mm, for example, 1mm to 2mm, on the upper surface of the substrate S mounted on the stage 21. Therefore, the amount of movement of the movable body 35 in the Z-axis direction may be a movement amount that can be ensured so that at least the electronic component C held by the holding portion 31b can be mounted on the substrate S by being pressurized with a predetermined pressurizing force from the height position.
Further, although not shown, the mounting apparatus 1 is provided with a supply portion for the electronic components C such as a wafer stage and a tray stage, and a transfer mechanism for receiving the electronic components C from the supply portion and transferring the electronic components C to the mounting head 31 of the mounting mechanism 3.
(First photographing part)
The first photographing section 4 has a camera, a lens, a barrel, a light source, and the like, and is provided in a housing hole 11a provided in the support table 11. The first imaging unit 4 is configured to image the optical axis of the camera in a direction in which the mark m of the electronic component C held by the mounting head 31 can be imaged. Specifically, the optical axis is arranged so as to be perpendicular to the optical axis. The first imaging unit 4 is provided so that the mark m of the electronic component C held by the mounting head 31 does not deviate from the imaging field of view within a range in which the mark m can move to the maximum. The holding position of the electronic component C delivered to the mounting head 31 is deviated. That is, the position of the electronic component C is deviated from the mounting position OA. Therefore, the position of the mark m of the electronic component C also varies. The maximum range of the deviation is a range in which the mark m of the electronic component C can move to the maximum. The first imaging unit 4 performs imaging with a sufficient magnification and with a luminance required for illuminance or position recognition of illumination generated by the light source in order to ensure the necessary mounting accuracy. Further, the range in which the mark m can move to the maximum is considered to have a shooting field of view (field of view range) determined by these conditions. The first imaging unit 4 sets the center of the imaging field to a position corresponding to the mounting position OA as an initial position. The position does not change in the case where the first photographing part 4 is provided to be fixed and in the case where it is provided to be movable. The first imaging unit 4 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with the movement operation.
In the present embodiment, the first imaging unit 4 is fixed at the mounting position OA of the electronic component C. That is, in the present embodiment, the first imaging unit 4 is disposed upward in the housing hole 11a of the support table 11, which is the position below the substrate support mechanism 2, so that the optical axis of the camera coincides with the mounting position OA. The first imaging unit 4 is fixed to the support table 11 in such a manner that the two marks m do not deviate from the size and positional relationship of the imaging field of view even if the electronic component C moves to the maximum extent for positioning. The imaging field of view of the first imaging unit 4 is set in consideration of a range in which the two marks m of the electronic component C can be moved to the maximum extent for positioning in a state where the optical axis (center of the imaging field of view) is fixed in agreement with the mounting position OA.
(Second shooting part)
The second imaging unit 5 includes a camera, a lens, a barrel, a light source, and the like, is supported by a frame or the like, not shown, at a position above the support table 11, more specifically, above the mounting head 31, and is provided on the support table 11. The second imaging unit 5 is capable of imaging the optical axis of the camera in the direction of the mark M around the mounting region B of the substrate S through the holding unit 31B of the mounting head 31. Specifically, the optical axis is arranged so as to be perpendicular to the optical axis. The second imaging unit 5 is provided so that the mark M does not deviate from the imaging field of view within a range in which the mark M of the substrate S can move to the maximum extent through the holding unit 31 b. The support position of the substrate S placed on the stage 21 is deviated. That is, the position of the substrate S is deviated from the mounting position OA. Therefore, the position of the mark M of the substrate S also varies. The maximum range of the deviation is a range in which the mark M of the substrate S can move to the maximum. The second imaging unit 5 performs imaging with a sufficient magnification and with a sufficient luminance required for illuminance or position recognition of illumination generated by the light source in order to ensure the necessary mounting accuracy. Further, the marker M has a shooting field of view (field of view range) determined by these conditions, taking into consideration a range in which the marker M can move to the maximum. The second imaging unit 5 sets the center of the imaging field to a position corresponding to the mounting position OA as an initial position. The position does not change in the case where the second photographing section 5 is provided to be fixed and in the case where it is provided to be movable. In addition, the second imaging unit 5 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with the movement operation.
In the present embodiment, the second imaging unit 5 is disposed at a position directly above the mounting head 31 in a state where the optical axis (center of the imaging field of view) of the camera coincides with the mounting position OA as described above. The second imaging unit 5 is fixed at the mounting position OA of the electronic component C, as in the first imaging unit 4. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the range in which the two marks M marked on the mounting region B of the substrate S can move to the maximum for positioning. Therefore, the size of the transmission portion of the mounting head 31 is set against the imaging field of view of the second imaging portion 5.
Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 in the present embodiment will be described. As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of each other so as not to interfere with the movement of the mounting head 31 and the stage 21. That is, the first imaging unit 4 and the second imaging unit 5 are provided independently on the support table 11. Therefore, the first imaging unit 4 and the second imaging unit 5 do not move integrally with the mounting head 31 and the stage 21 when the marks M and M are imaged or when the marks M are positioned.
For example, the first imaging unit 4 and the second imaging unit 5 are independently and fixedly arranged on the support table 11. Alternatively, the first imaging unit 4 and the second imaging unit 5 are provided with an X-axis and Y-axis (horizontal) driving device and a Z-axis (vertical) driving device, and are disposed so as to be movable (movable) in the horizontal direction and the vertical direction. The movement is performed in order to perform adjustment of the horizontal position and adjustment of the vertical position of the imaging unit 4 and the imaging unit 5 (the first imaging unit 4 and the second imaging unit 5) as operation preparation work of the apparatus, or is performed by moving between the marks when the plurality of marks M and M are imaged, as will be described later.
As described above, the first imaging unit 4 and the second imaging unit 5 are provided independently and movably from the mounting head 31 and the stage 21, respectively. Therefore, the above-described fact that the mounting position OA is not moved means that the first imaging unit 4 and the second imaging unit 5 are not integrally moved together with the mounting head 31 and the stage 21 when the marks M and M are imaged or positioned. For example, the imaging unit 4 and the imaging unit 5 are provided so as to be movable independently of the mounting head 31 and the stage 21, and adjustment of the horizontal position and adjustment of the vertical position of the imaging unit 4 and the imaging unit 5 are included in the mounting position OA as operation preparation work of the apparatus. The first imaging unit 4 and the second imaging unit 5 are also fixed to the mounting position OA, and move between the marks in order to capture a plurality of marks M and M.
The mounting device 1 of the present embodiment preferably has a mounting accuracy of 0.2 μm or less. For this reason, the first imaging unit 4 and the second imaging unit 5 are required to have a performance capable of performing high-magnification and high-definition imaging compatible with the precision thereof.
In general, it is known that in order to capture a high-definition image, an imaging unit needs to be disposed at a position close to an electronic component C or a substrate S to be imaged. Therefore, the first imaging unit 4 and the second imaging unit 5 are preferably disposed as close to the electronic component C or the substrate S as possible, that is, the imaging distance is preferably shortened.
However, in the mounting apparatus 1 of the present embodiment, in order to reduce the amount of lowering movement of the electronic component C during mounting as much as possible, the imaging of the mark M of the electronic component C or the imaging of the mark M of the substrate S is performed in a state in which the electronic component C is positioned at a position highly close to the upper surface of the substrate S. Therefore, the moving plate 23 of the stage 21 and the driving mechanism 22 is present between the first imaging unit 4 and the electronic component C, and the mounting head 31 is present between the second imaging unit 5 and the substrate S. Accordingly, it is necessary to avoid interference with the moving plate 23 and the mounting head 31, and therefore there is a limit to shortening the distance between the first imaging unit 4 and the electronic component C and shortening the distance between the second imaging unit 5 and the substrate S.
Therefore, the present inventors studied the maximum value of the photographing distance (so-called working distance) that can photograph an image that can achieve the mounting accuracy. As a result, the thickness was found to be approximately 100 mm. Based on the above results, in the present embodiment, the first imaging unit 4 is disposed stationary at a height position within 100mm of the imaging distance from the electronic component C, and the second imaging unit 5 is disposed stationary at a height position within 100mm of the imaging distance from the substrate S.
In order to ensure rigidity and the like, the mounting head 31 located between the second imaging unit 5 and the substrate S is a member having a relatively large height dimension (Z-axis dimension). Therefore, it is considered that interference occurs in a general structure. Accordingly, as a result of the diligent study by the present inventors, the height dimension was successfully minimized while maintaining the required function and rigidity for the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31 a) is about 70 mm. Thereby, the second imaging unit 5 can be disposed at a height position of 100mm or less with respect to the substrate S.
(Control device)
The control device 6 controls the positioning mechanism based on the marks M and M imaged by the first imaging unit 4 and the second imaging unit 5 so as to position the substrate S and the electronic component C. The coordinates of the imaging units 4 and 5 are adjusted to match the coordinates of the mounting device 1. Specifically, the coordinates of the control device 6 are XY coordinates in the design of the mounting device 1, and the origin thereof can be set as the mounting position OA. The coordinates of the imaging units 4 and 5 are set, for example, to the origin where the imaging center is XY coordinates, and the mounting position OA is matched as information that can be mechanically or computationally. Therefore, in this case, the reference position on the XY coordinates in the mounting device 1 is the mounting position OA, and the imaging centers of the imaging units 4 and 5 are also the same reference position.
The coordinates of the imaging units 4 and 5 and the coordinates of the mounting device 1, which are adjusted to be identical, actually include errors in the assembly of the units of the device. The control device 6 stores information on the shape of the mark M and the mark M, information on the design indicating the positional relationship between the electronic component C and the mark M, and information on the design indicating the positional relationship between the mounting region B of the substrate S and the mark M in advance. Each of the imaging units 4 and 5 has an image recognition unit. The image recognition unit recognizes the mark M and the mark M stored in advance in the control device 6 from the captured image by a known image recognition process, and calculates the position on the coordinates that are the reference of the mounting device 1. That is, the image recognition unit of the first imaging unit 4 calculates the positional information (X, Y, θ) of the electronic component C held by the mounting head 31 based on the recognized mark M at the adjusted coordinates. The image recognition unit of the second imaging unit 5 similarly calculates the position information (X, Y, θ) of the mounting region B of the substrate S mounted on the stage 21 for the mark M. The calculation of the positional information is based on the information indicating the positional relationship between the electronic component C and the mark M and the information indicating the positional relationship between the mounting region B and the mark M stored in advance in the control device 6 as described above.
The control device 6 obtains the positional information of the electronic component C and the positional information of the mounting region B calculated in the above-described manner, and the amounts of offset from the reference position (the origin of coordinates of the imaging units 4 and 5) and the XY axis direction, and controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32) so that the electronic component C or the substrate S moves in the direction and the amount of movement in which the electronic component C matches the mounting region B with the offset corrected.
Action
The operation of the present embodiment described above will be described with reference to the explanatory diagrams of fig. 4 (a) to 4 (C) and the flowchart of fig. 5. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, and is retracted from a position facing the mounting head 31, that is, a mounting position OA.
First, in the mounting mechanism 3, the center of the holding portion 31b of the mounting head 31 is located directly below the second imaging portion 5. That is, the center of the holding portion 31b is positioned at the mounting position OA. In this state, the transfer mechanism receives the electronic component C from the supply unit (neither of which is shown) and transfers it to the mounting head 31 (step S101). As shown in fig. 4a, the holding portion 31b of the mounting head 31 receives the electronic component C from the transfer mechanism and suction-holds the electronic component C by negative pressure (step S102). Further, since the electronic component C is transferred to and from the holding portion 31b by the transfer mechanism at the mounting position OA, the stage 21 is kept in a retracted state to avoid interference with the transfer mechanism at the time of transfer.
The first photographing section 4 photographs the mark m of the electronic component C held by the mounting head 31 (step S103). At this time, the stage 21 is retracted from the mounting position OA, and the through hole 23a provided in the moving plate 23 is positioned directly above the first imaging section 4. The first imaging unit 4 images the mark m through the through hole 23 a. The image recognition unit of the first imaging unit 4 recognizes the mark m from the image captured by the first imaging unit 4, and calculates the positional information of the electronic component C. The control device 6 obtains the offset between the position information of the electronic component C and the reference position and XY axis direction, and operates the driving mechanism 32 to position the electronic component C so as to cancel the offset (step S104).
Next, as shown in fig. 4 (B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (the mounting area B for mounting the electronic component C at this time) reaches a position opposed to the electronic component C held by the mounting head 31, that is, the center of the mounting area B reaches the mounting position OA (step S105). Then, as shown in fig. 3B, the second imaging unit 5 passes over the mounting head 31 to image the mark M of the substrate S visible in the transmission region T around the electronic component C (step S106). The image recognition unit of the second imaging unit 5 recognizes the mark M from the image captured by the second imaging unit 5, and calculates the positional information of the mounting region B.
In step S106, the second imaging unit 5 may take an image of the mark M of the substrate S while the mounting head 31 holding the electronic component C is still at the height position for receiving the electronic component C, or may take an image after moving to a predetermined height position closer to the substrate S. In the case of photographing at a closer height position, the amount of the lowering movement for mounting after photographing can be made smaller, and thus the movement error can be further suppressed.
The control device 6 obtains the offset amount between the position information of the mounting region B and the reference position and XY axis direction, and operates the driving mechanism 22 to position the substrate S so as to cancel the offset (step S107). Further, as shown in fig. 4C, the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S108).
In this way, the electronic component C is sequentially mounted on each mounting region B of the substrate S by repeating the operations of transferring the electronic component C, positioning and mounting the electronic component C and the substrate S. The substrate S on which the predetermined number of electronic components C are mounted is transported by the substrate support mechanism 2 and stored in an unloader.
[ Effect of the invention ]
The mounting device 1 of the present embodiment includes: a mounting mechanism 3 for mounting the electronic component C on the substrate S; a substrate supporting mechanism 2 for supporting a substrate S on which electronic parts C are mounted; and a mounting head 31 provided on the mounting mechanism 3 and having a transmission portion that allows the mark M of the substrate S to be recognized therethrough while the electronic component C is held.
In addition, the mounting device 1 includes: the first imaging unit 4, which is disposed below the substrate support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S, and which images the mark m of the electronic component C held by the mounting head 31 in a state where the substrate S is retracted from the mounting position OA; a second imaging unit 5 which is disposed above the mounting head 31 at the mounting position OA and images the mark M of the substrate S through the transmission unit; and a positioning mechanism for positioning the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks M and M imaged by the first imaging unit 4 and the second imaging unit 5.
According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 disposed below the mounting position OA at the mounting position OA in a state where the substrate S is retracted from the mounting position OA, and the substrate S supported by the substrate support mechanism 2 is imaged by the second imaging unit 5 disposed above the mounting head 31 at the mounting position OA through the transmission unit of the mounting head 31, so that the mark M of the electronic component C and the mark M of the substrate S can be imaged while approaching the electronic component C and the substrate S as close as possible.
Therefore, the movement amounts of the electronic component C (mounting head 31) and the substrate S (substrate supporting mechanism 2) at the time of photographing the mark M and the mark M, and the relative movement amounts of the electronic component C (mounting head 31) and the substrate S (substrate supporting mechanism 2) after photographing the mark M and the mark M can be reduced as much as possible. Therefore, an increase in error caused by moving the mounting head 31 or the substrate support mechanism 2a long distance can be suppressed. Further, although dust is more raised as the movement distance of the mechanism is longer, in the present embodiment, the movement distance can be suppressed, and therefore, the occurrence of poor joining due to dust can be prevented from being reduced in cleanliness. In particular, in a state where the substrate S is positioned at the mounting position OA, the movement amount of the mounting head 31 or the second imaging unit 5 positioned on the substrate S can be reduced as much as possible, and therefore, dust can be prevented from falling onto and adhering to the substrate S. When the mounting head 31 moves to transfer the electronic component C to and from the supply unit, dust falls below the electronic component C. However, in the present embodiment, the mounting head 31 does not move for receiving. When the mounting head 31 transfers the electronic component C to and from the transfer mechanism, the substrate S is retracted. Therefore, dust does not fall onto and adhere to the substrate S.
In addition, for example, in the case where the position of the mounting area B of the substrate S and the electronic component C on the mounting position OA are recognized at the same time by using a photographing camera capable of photographing in the up-down direction at the same time, it is necessary to bring the camera between the electronic component C and the substrate S at the time of photographing. Therefore, the electronic component C has to be separated from the substrate S so as not to interfere with the camera. Therefore, the distance for moving the electronic component C to the substrate S becomes longer at the time of mounting. In addition, at the time of mounting, it is necessary to retract the camera to a position where interference with the mounting head 31 does not occur. According to the mounting device 1 of the present embodiment, the camera is not allowed to enter between the electronic component C and the substrate S, and thus the electronic component C and the substrate S can be imaged as close as possible. Therefore, in the mounting after photographing, the distance of the electronic component C moving to the substrate S can be shortened. In addition, the camera is not moved significantly on the substrate S before and after photographing. This suppresses errors and dust accompanying these movements.
As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of each other so as not to interfere with the movement of the mounting head 31 and the stage 21. Therefore, when positioning the mounting region B of the electronic component C and the substrate S, only the mounting head 31, only the stage 21, or both are moved, but both are independent of the imaging unit 4 and the imaging unit 5, so that the moving part can be reduced in weight and the movement error can be reduced as compared with the case where both are not independent of the imaging unit 4 and the imaging unit 5.
In contrast to this embodiment, for example, when the mark of the substrate S is photographed by the photographing section provided integrally with the mounting head 31, first, the photographing section is positioned at the mounting position OA to perform photographing, the position of the substrate S is recognized based on the photographing result, and the electronic component C held by the mounting head 31 is positioned and mounted at a position positioned so as to be aligned with the position of the electronic component C recognized separately. In this case, when the substrate S is photographed and mounted, there is a possibility that an error or dust may increase by the movement of the photographing part and the mounting head 31 integrally provided with respect to the mounting position OA. In the mounting device 1 of the present embodiment, the mounting head 31, the mounting region B of the substrate S, the first imaging unit 4, and the second imaging unit 5 are independently disposed at the mounting position OA, and therefore only a slight movement for positioning is required, and the electronic component C and the substrate S are not moved together with the camera each time the imaging unit 4 and the imaging unit 5 are used for imaging. This allows the mounting with high accuracy and suppresses dust emission.
In order to achieve high required accuracy, a camera with high magnification is required. Instead of arranging the second imaging unit 5 above the mounting head 31 and imaging the mark M beyond the mounting head 31 as in the present embodiment, that is, imaging the mark M by a camera provided on the mounting head 31 so as to be adjacent to the mounting head 31 is not possible in practice, but high accuracy is required. First, the outer shape of the mounting head 31 has to be larger than the electronic component C to be mounted. The region of the substrate S to which the mark M is provided is only a region that is about several millimeters larger than the region to which the electronic component C is mounted. Therefore, the region to which the mark M is provided is located closer to the center of the mounting head 31 than the outer shape of the mounting head 31. Therefore, even if the lens barrel of the camera is disposed adjacent to the mounting head 31, the mark M does not enter the field of view of the camera in a state where the mounting head 31 is positioned at the mounting position OA, and the mark M cannot be photographed by the camera. Therefore, the mounting head 31 must be deviated from the mounting position OA to take a picture at a position where the mark M is within the field of view of the camera.
In general, the higher the magnification of the objective lens, the darker the image. The brightness of an image is proportional to the square of the numerical aperture (numerical aperture, NA) and inversely proportional to the square of the integrated magnification (M). That is, the larger the numerical aperture, the brighter the image, the higher the magnification, and the darker the image. Therefore, in the case where a high magnification is required, it is necessary to increase the numerical aperture, thereby creating a need to use an objective lens having a large diameter. For example, a lens barrel including an objective lens of a high-magnification camera requiring high-precision positioning is generally required to have a caliber of 10mm or more. If the portion where the optimum image is obtained is set as the center of the lens, a camera provided at a position adjacent to the mounting head 31 can see a portion 5mm or more away from the end of the mounting head 31. Thus, photographing can be performed only at a place far from the mounting head 31. Therefore, the mark M of the substrate S cannot be photographed in a state where the center of the mounting head 31 is positioned at the mounting position OA, regardless of whether a single camera or a plurality of cameras are used. Therefore, for photographing, it is necessary to position the camera on the mark M of the substrate S.
That is, in order to take an image of the mark M of the substrate S in the visual field, the mounting head 31 needs to be moved to position the camera directly above the mark M, and an error occurs in the movement. For example, when the mark M of the electronic component C is recognized to obtain positional information for positioning and then the mark M of the substrate S is recognized, the camera must be moved together with the mounting head 31 to recognize the mark M, and then the electronic component C may be shifted in position due to an error associated with the movement even if the electronic component C is returned to the original position. In addition, there is a possibility that dust may increase.
In addition, when only one of the plurality of (two) marks M of the substrate S is entered in the imaging field of view, it is necessary to move the camera between the marks M to take an image of the plurality of (two) marks M of the substrate S. That is, in the case where the camera is provided to the mounting head 31 so as to be adjacent to the mounting head 31, it is necessary to move the mounting head 31 by a distance between the center of the mounting head 31 and the center of the camera and a distance between the two marks M, and there is a possibility that a larger error occurs or dust increases.
Whether the camera is single or multiple, it does not change. Even if two cameras are arranged adjacent to the mounting head 31 so as to correspond to the two-dot marks M, only a portion farther than the two-dot marks M arranged diagonally is set as a field of view, and therefore, the cameras must be moved together with the mounting head 31, and the same offset occurs.
For example, when the mark M of the board S is recognized before and then the mark M of the electronic component C is recognized, in a camera that photographs the mark M of the electronic component C held by the mounting head 31 provided at the mounting position OA, the electronic component C is blocked and the position thereof cannot be recognized in a state where the board S is located at the position to be mounted (mounting position OA). Therefore, it is necessary to move the substrate S, from which the positional information for positioning is obtained, to photograph the mark m and return to the original position, and the positional shift of the substrate S occurs due to the movement. In addition, dust emission increases.
In addition, it is also conceivable to prepare a template (template) to which a mark corresponding to the mark M of the substrate S is marked at a position different from the position to be mounted, and to perform positioning based on the relative position of the mark of the template and the mark M of the substrate S. In this case, however, each time the electronic component C is mounted, the mounting head 31 and the camera must be moved in order to recognize the mark of the template. Thus, the time required for identifying the mark of the template and the time required for positioning are additionally spent, and thus productivity is lowered. In addition, since the movement distance of the mechanism increases, the amount of dust is also increased, and the error accompanying the movement is also increased.
In the present embodiment, since the moving distance of the electronic component C and the substrate S can be suppressed after the photographing of the marks M and M, any of the positional deviation, the reduction in productivity, and the dust generation amount can be suppressed.
The transmission part has a transparent plate-like member. Therefore, in a narrow region corresponding to the size of the minute electronic component C, it is possible to hold the electronic component C and ensure the transparent shooting of the mark M of the substrate S.
The first imaging unit 4 and the second imaging unit 5 are provided stationary with respect to the mounting position OA. Therefore, the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5 do not deviate from each other, and dust emission due to movement can be prevented.
The positioning device includes a driving mechanism 22 functioning as a positioning mechanism, wherein the driving mechanism 22 includes a biaxial movement mechanism for moving the stage 21 in a horizontal plane, the biaxial movement mechanism includes a pair of guide rails 22a and a pair of guide rails 22b in a direction orthogonal thereto, and the pair of guide rails 22a and the pair of guide rails 22b are symmetrically arranged with respect to the mounting position OA. Therefore, when mounting the electronic component C on the substrate S positioned at the mounting position OA, deformation of the stage 21 can be suppressed, and high-precision mounting can be realized. Of course, the pair of guide rails 22a and 22b are disposed with the mounting position OA therebetween to suppress deformation, and thus are not necessarily limited to being disposed symmetrically with respect to the mounting position OA.
The driving mechanism 22 includes a moving plate 23 that moves along a guide rail 22b, and a through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C. Therefore, the first photographing section 4 can photograph the electronic component C without being hindered by the mechanism for positioning the substrate S. Further, as long as the substrate S can be photographed, a light-transmitting member may be fitted into the through hole 23a, or a part or the whole of the moving plate 23 may be constituted by the light-transmitting member.
Modification example
(1) The mounting head 31 may be configured so that the second imaging unit 5 can capture the mark M of the substrate S. Therefore, even if the transmission portion of the mounting head 31 is not formed of a transparent material, a through hole may be formed at a portion corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M, or the hollow portion 31a may be absent, and the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M of the mounting head 31 and the holding portion 31 b. That is, such a through hole is also a penetration portion of the mounting head 31.
(2) The imaging fields of view of the first imaging unit 4 and the second imaging unit 5 are considered as follows.
(A) The fields of view are shot together
The one-shot view is a view range in which a plurality of marks M or a plurality of marks M can be shot at one time. For example, the position of the electronic component C when delivered to the mounting head 31 varies within a certain range. Therefore, if there is a field of view in which the positions of the two marks m of the electronic component C are deviated and the range can be photographed, it is not necessary to move the first photographing section 4 in order to photograph the two marks m. In addition, the second imaging unit 5 does not need to move to capture the two marks M if it has a single imaging field of view.
(B) Individual shooting view
The individual photographing view is a photographing view in which only a plurality of marks M or a plurality of marks M are photographed individually, i.e., a view range in which one mark M or one mark M can be photographed.
In the above embodiment, the case where the mark M can be shot over the mounting head 31 and the first shooting unit 4 and the second shooting unit 5 can shoot the mounting region B of the electronic component C and the substrate S in one shooting field of view has been described, but there are cases where a higher magnification is achieved depending on the required mounting accuracy. In this case, there is a concern that the mounting region B of the electronic component C and the substrate S cannot be photographed within one photographing field. That is, the first imaging unit 4 and the second imaging unit 5 may have only individual imaging fields of view. In this case, as described above, it is necessary to move the shooting field of view among a plurality of marks to shoot the marks.
For example, the movement between the marks of the imaging field is to move the mounting head 31 between two marks m provided diagonally to the corner of the electronic component C with respect to the first imaging unit 4 that images the electronic component C. The mounting head 31 is capable of XY movement and thus can be directly applied. Even when such movement between marks of the imaging field of view is required, only the mounting head 31 is moved, and the movement distance thereof is limited to the size range of the electronic component C, and only a short movement distance is required, so that errors and dust emission can be suppressed.
Further, the first imaging unit 4 may be moved to perform movement between the marks m of the imaging field of view. That is, the first imaging unit 4 may be provided movably at a position (mounting position OA) where the electronic component C is mounted. When the first imaging unit 4 is made movable, a moving device for moving the first imaging unit 4 is provided, and the first imaging unit 4 is fixed to the moving device. In this case, only the first photographing part 4 moves, and the mounting head 31 is stationary. Further, the movement distance is limited to the size range of the electronic component C, and only a short movement distance is required. Therefore, errors and dust can be suppressed. Further, since the first imaging unit 4 is disposed below the substrate S, dust can be prevented from adhering to the surface of the substrate S even if dust is raised.
Similarly, for example, in order to photograph two marks M provided at the diagonal corners of the rectangular region near the mounting region B of the substrate S, the photographing field of view is moved between the marks M. In this case, the stage 21 is moved between the marks M with respect to the second imaging section 5 for imaging the substrate S. The stage 21 can be XY-moved, and thus can be directly applied. Even in this case, the movement distance of the stage 21 is only limited to the range of the size near the mounting region B of the substrate S, and only a short movement distance is required, so that errors and dust can be suppressed. The drive mechanism 22 of the stage 21 is disposed below the substrate S, and therefore dust does not adhere to the surface of the substrate S even if dust is raised.
The movement between marks M may be performed by moving the second imaging unit 5. That is, the second imaging unit 5 may be provided movably at a position (mounting position OA) where the electronic component C is mounted. When the second imaging unit 5 is moved, a moving device for moving the second imaging unit 5 is provided, and the second imaging unit 5 is fixed to the moving device. In this case, only the second imaging unit 5 moves, and the mounting head 31 and the stage 21 are stationary. Further, the movement distance is limited to a range of the size near the mounting region B of the substrate S, and only a short movement distance is required. Therefore, errors and dust can be suppressed.
(3) In the above embodiment, the calculated position of the electronic component C and the position of the mounting region B of the substrate S are positioned so as to be aligned with each other with respect to the reference position, but the present invention is not limited to this, and the position of the mounting region B may be positioned so as to be aligned with the position of the electronic component C or the position of the electronic component C may be positioned so as to be aligned with the position of the mounting region B. In short, the position of the mounting region B of the substrate S may be aligned with the position of the electronic component C.
(4) In the above embodiment, the control device 6 controls to move the substrate S in order to position the electronic component C and the substrate S, but the substrate S may not be moved for positioning, i.e., for correction of alignment. In this case, the electronic component C is moved by the mounting head 31. As shown in fig. 2, a plurality of electronic components C are often mounted on the substrate S. In such a substrate S, the movement range of the stage 21 for positioning each mounting region B at the mounting position OA becomes large. In this case, in the movable range of the stage 21, the positioning error often varies depending on the location, and there is a concern that the recognition result of the substrate position by the camera (second imaging unit 5) that images the substrate S cannot be accurately reflected. Therefore, by positioning the displacement of the substrate position (mounting position oa=the position of the mark M) with respect to the reference position by the movement of the mounting head 31, the positioning of the electronic component C and the substrate S can be performed more accurately. In addition, by moving the smaller and lighter mounting head 31 instead of moving the large and heavy stage 21, the movement error can be further suppressed. In addition, in this case, the substrate positioning of step S107 in fig. 5 is performed by operating the driving mechanism 32.
(5) The transfer of the substrate S to and from the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA before the mark m of the electronic component C is photographed by the first photographing section 4.
(6) In the embodiment described, front-face down mounting is performed. That is, in the case of front-face down mounting, the face (front face) on which the semiconductor layer is formed of the individual electronic component C before separation from the wafer faces upward, that is, the front face faces upward. The picked-up electronic component C is reversed and then directed downward, i.e., front-facing downward. The transfer mechanism having received it transfers it to the mounting head 31 in a downward state, and thus the mounting head 31 holds the electronic component C downward. The front surface (including the mark m) of the electronic component C is photographed by the first photographing section 4 from below the mounting head 31. The substrate S moves below the mounting head 31. The front surface (including the mark M) of the substrate S is photographed by the second photographing section 5 through the transmission section from above the mounting head 31. The electronic component C held by the mounting head 31 is positioned with respect to the board S and mounted.
On the other hand, the mounting device 1 of the embodiment may also be mounted with the front face facing upward. When the front surface is mounted upward, the first imaging unit 4 cannot image the front surface of the electronic component C, and therefore, the second imaging unit 5 does not use the imaging. That is, the electronic component C picked up from the wafer is not reversed but is directed upward. The transfer mechanism having received it transfers it to the mounting head 31 in an upward state, and thus the mounting head 31 holds the electronic component C upward. The second imaging unit 5 images the front surface (including the mark m) of the electronic component C upward from above the mounting head 31 via the transmission unit. The substrate S moves below the mounting head 31. The front surface (including the mark M) of the substrate S is photographed by the second photographing section 5 through the transmission section from above the mounting head 31. The electronic component C held by the mounting head 31 is positioned with respect to the board S and mounted.
In the case of performing the front-face-up mounting in the above-described manner, the reference position of the mounting head 31 and the positioning of the electronic component C may be performed before the positioning of the electronic component C and the substrate S, based on the result of the imaging of the mark m of the electronic component C. When the electronic component C held by the mounting head 31 is greatly deviated from the reference position, there is a possibility that the mark M of the substrate S is hidden by the electronic component C, but this situation can be avoided by the above positioning. This is the same as the one-time correction when the cameras of the first imaging unit 4 and the second imaging unit 5 are infrared cameras, which will be described later. As described above, the present mounting device 1 can be applied to front-face-up mounting while exerting the same effects as those of the above-described embodiment.
(7) The second imaging unit 5 may be a camera capable of transparently imaging the mark m of the electronic component C. For example, the camera of the second photographing section 5 that photographs the mark M of the substrate S is an infrared camera. Thereby, the mark m of the electronic component C held by the holding unit 31b is shot by the second shooting unit 5 through the holding unit 31b and through the electronic component C. The positioning mechanism performs positioning of the substrate S and the electronic component C based on the mark M of the substrate S and the mark M of the electronic component C imaged by the second imaging unit 5. Further, heretofore, the positioning of the electronic component C was performed based on the position of the electronic component C obtained from the image of the mark m of the electronic component C captured by the first imaging unit 4.
That is, as described above, after the mark m of the electronic component C is photographed by the first photographing section 4, the electronic component C is positioned at the reference position (one correction). Then, the mounting head 31 is moved to bring the electronic component C into close contact with the substrate S, the mark M of the substrate S is photographed by the second photographing section 5, the electronic component C is photographed while being transmitted, and the positioning (secondary correction) of the substrate S is performed to mount the electronic component C on the substrate S. After the photographing by the second photographing section 5, the mounting head 31 for mounting is required to be moved down only by a very short distance, so that the positional deviation is further suppressed.
The above-described positioning operation is specifically described with reference to the explanatory diagrams of fig. 6 (a) to 6 (C) and the flowchart of fig. 7. The upper stage of fig. 6 (a) to 6 (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, and the lower stage is a plan view showing the positions of the electronic component C, the mark M, and the mark M of the substrate S to be imaged.
The movement from the transfer of the electronic component C to the substrate S is the same as S101 to S105 described above (S201 to S205). That is, as shown in fig. 6 (a), the electronic component C is held in the holding portion 31b of the electronic component C in a direction toward the first imaging portion 4 with the front surface indicated by the mark m. In this state, the first imaging unit 4 performs the position recognition of the mark m, and performs the primary correction of aligning the electronic component C to the reference position.
Then, as shown in fig. 6B, the retracted stage 21 is moved to the mounting position OA, that is, below the second imaging unit 5 (step S205), and the mounting head 31 is lowered with respect to the mounted substrate S, and is positioned such that the electronic component C and the substrate S are spaced apart by, for example, about 10 μm (step S206).
In this state, the second imaging unit 5 images the mark M of the substrate S through the transmission unit of the holding unit 31b (step S207). At the same time, the second imaging unit 5 images the mark m of the electronic component C held by the holding unit 31b through the transmission unit of the holding unit 31b and the electronic component C. As shown in fig. 6C, the second imaging unit 5 recognizes the positions of the marks M and M by imaging them, positions the electronic component C and the substrate S (secondary correction) (step S208), lowers the mounting head 31, and mounts the electronic component C on the substrate S (step S209).
As described above, since the electronic component C and the substrate S are simultaneously recognized by the same imaging unit in a state where the substrate S and the electronic component C are brought close to each other, there is no error in the position between the imaging units included in the position recognition result obtained by the plurality of imaging units. Therefore, compared with the above-described embodiment, the accuracy of positioning the electronic component C and the substrate S can be improved. Further, since the lowering distance between the electronic component C and the substrate S after positioning is small, positional displacement due to lowering movement is suppressed, and positioning accuracy is improved.
In the case where the second imaging unit 5 performs the position recognition of the electronic component C and the substrate S at the same time, the second imaging unit 5 may perform the imaging to ensure the necessary recognition accuracy for the mark M of the electronic component C and the mark M of the substrate S, and the operation of bringing the electronic component C into close contact with the substrate S in step S206 is not necessarily required. In this case, the electronic component C is not moved by being lowered, and thus the processing time can be shortened.
When the electronic component C held by the mounting head 31 is largely deviated from the reference position, the mark M of the substrate S may be blocked by the electronic component C, but the second imaging unit 5 recognizes the position thereof by imaging the mark M and the mark M, and before the secondary correction for positioning the electronic component C and the substrate S, the first imaging unit 4 performs the position recognition by imaging the mark M and performs the primary correction for aligning the electronic component C to the reference position, whereby such a situation can be avoided. In addition, when the positional deviation of the electronic component C passing to the mounting head 31 is within an allowable range, the correction may not be performed once.
In addition, such one-time correction can be applied to the front-face-up mounting, if a camera capable of capturing a transparent image is used as the first imaging unit 4. That is, the first imaging unit 4 may have a camera that can image the mark M of the electronic component C in a transparent manner, and the positioning means may position the electronic component C based on the position of the electronic component C obtained from the image of the mark M of the electronic component C imaged by the first imaging unit 4, and then position the substrate S and the electronic component C based on the mark M of the substrate S and the mark M of the electronic component C imaged by the second imaging unit 5. In this case, the second imaging unit 5 may not necessarily be a camera capable of imaging the mark m of the electronic component C in a transparent manner.
(8) In addition, a mark as a reference may be provided on the mounting head 31 as a tool for mounting. The mark provided on the mounting head 31 is provided so as to be shot by either one of the first shooting unit 4 and the second shooting unit 5. The positioning mechanism positions the substrate S and the electronic component C based on the marks M of the electronic component C, the marks M of the substrate S, and the positions of the substrate S and the electronic component C obtained from the images of the marks of the mounting head 31, which are captured by the first imaging unit 4 and the second imaging unit 5. In this case, the marks of the mounting head 31 are captured by the first imaging unit 4 and the second imaging unit 5, respectively, and the positional alignment (reference alignment) of the cameras of the first imaging unit 4 and the second imaging unit 5 is performed based on the marks of the mounting head 31. This suppresses the deviation of the position detection result between cameras, and thus further suppresses the positional deviation of mounting. In addition, it is possible to suppress the displacement caused by the change with time of the position of each camera.
For example, a jig prepared separately from the mounting head 31 may be used for positioning the two cameras, but such a jig is attached to the device when the positioning between the cameras needs to be adjusted, and needs to be detached after the photographing is completed. As such, the jig needs to be installed every time adjustment is made, and thus maintainability and productivity are poor. In addition, dust emission is increased due to the arrangement and disassembly of the clamp. It is also difficult to track changes over time in real time. In this embodiment, the disassembly jig is not attached. The device can perform adjustment with time in real time operation, can realize high installation accuracy, and can inhibit dust.
Further, since the mark provided on the mounting head 31 is used as a reference, for example, compared with a case where a mark of a template (jig) prepared separately from the mounting head 31 is used in the apparatus, an additional movement and time for identifying the mark are not required, and a decrease in productivity, an increase in dust amount, and an error accompanying the movement can be suppressed.
The above-described positioning operation will be specifically described with reference to the explanatory diagrams of fig. 8 (a) to 8 (C) and the flowchart of fig. 9. The upper stage of fig. 8 (a) to 8 (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, and the lower stage is a plan view showing the positions of the electronic component C, the mark M of the substrate S, and the mark ma of the mounting head 31.
First, the mark ma of the mounting head 31 is provided at a position that does not overlap with the holding position of the electronic component C at the lower end surface of the holding portion 31b and can be imaged through the transmission portion. For example, as shown in fig. 8 (a), two positions are diagonally provided so as to be located outside the mark m of the electronic component C. Before the mounting head 31 holds the electronic component C, the marks ma of the mounting head 31 are photographed by the first photographing section 4 and the second photographing section 5, and correction values, which are offset amounts (including inclination in the horizontal plane) of the positions of the marks ma with respect to the respective reference positions, are registered (step S301). The transfer mechanism transfers the electronic component C (step S302), and the mounting head 31 holds the electronic component C (step S303).
The first imaging unit 4 simultaneously images the mark m of the electronic component C and the mark ma of the mounting head 31, and calculates the positional relationship between the two (step S304). As shown in fig. 8B, the substrate S is moved to the mounting position OA (step S305), and the second imaging unit 5 simultaneously images the mark M of the substrate S and the mark ma of the mounting head 31, and calculates the positional relationship between the two (step S306). The positioning mechanism performs positioning of the electronic component C and the substrate S with reference to the mark ma of the mounting head 31 based on the registered correction values of the first imaging section 4 and the second imaging section 5, the positional relationship between the mark M of the electronic component C and the mark ma of the mounting head 31, and the positional relationship between the mark M of the substrate S and the mark ma of the mounting head 31 (step S307). As shown in fig. 8C, after positioning, the mounting head 31 is lowered, and the electronic component C is mounted on the substrate S (step S308).
As described above, the positional relationship between the first imaging unit 4 and the second imaging unit 5 is grasped with reference to the mark ma provided on the mounting head 31, and the positions of the electronic component C and the substrate S can be aligned. Since errors in positions between the plurality of imaging units can be suppressed, the accuracy of positioning the electronic component C and the substrate S can be further improved as compared with the above-described embodiment. In addition, even if the positional relationship between the plurality of imaging units changes with time, the accuracy of positioning of the electronic component C and the substrate S can be ensured, and thus the accuracy of positioning improves. In the above embodiment, the time is required for assembling the mounting device 1 in order to bring the positions of the first imaging unit 4 and the second imaging unit 5 as close as possible to the reference position (design position), but in this embodiment, the positions of the first imaging unit 4 and the second imaging unit 5 with respect to the reference position are not required to be highly accurate at the time of assembling, and therefore, the manufacturing and maintenance of the device are labor-saving.
The mark ma provided on the mounting head 31 may be any characteristic point (mark) that can be imaged by the first imaging unit 4 and the second imaging unit 5. The feature points may be printed or engraved patterns, recesses, or through holes. When the holding portion 31b to which the mark ma is to be provided is a transparent plate material such as glass, the mark ma does not necessarily need to be provided on the lower end surface of the holding portion 31b, and the mark ma may be provided on the surface of the holding portion 31b opposite to the surface on which the electronic component C is held. In this case, the first imaging unit 4 and the second imaging unit 5 can image the mark ma as well, and errors can be suppressed. In addition, if the through hole is formed, even if the holding portion 31b is not made of a transparent material, one hole can be imaged by the first imaging portion 4 and the second imaging portion 5, and thus errors can be suppressed.
For example, the through-hole 23a formed in the movable plate 23 of the substrate support mechanism 2 may be a transparent member such as a transparent glass plate, and a mark may be provided on the transparent member instead of the mounting head 31. The portion of the through hole 23a is a portion for capturing an image of the electronic component C by the first capturing section 4, and therefore does not interfere with the substrate S.
Other embodiments
While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as examples, and are not intended to limit the scope of the invention. The novel embodiments described above may be implemented in various other forms, and various omissions, substitutions, and changes may be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

Claims (8)

1. An electronic component mounting apparatus, comprising:
A mounting mechanism for mounting the electronic component on the substrate;
A substrate supporting mechanism supporting the substrate on which the electronic component is mounted;
A mounting head provided to the mounting mechanism and having a transmission portion that allows the transmission portion to transmit a mark for identifying the substrate while the electronic component is held;
A first imaging unit configured to capture an image of a mark of the electronic component held by the mounting head in a state in which the mounting head mounts the electronic component on the substrate at a mounting position on the substrate and the substrate is retracted from the mounting position;
A second imaging unit which is disposed above the mounting head at the mounting position and which images the mark of the substrate through the transmission unit; and
A positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks captured by the first imaging unit and the second imaging unit,
Wherein,
The mounting head is provided with a mark which can be shot by the first shooting part and can be shot by the second shooting part, and the mark of the mounting head is arranged at a position which is not overlapped with the holding position of the electronic part in a state of holding the electronic part
The positioning mechanism performs positioning of the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the mark of the electronic component and the mark of the mounting head simultaneously captured by the first capturing section and the images of the mark of the substrate and the mark of the mounting head simultaneously captured by the second capturing section.
2. The electronic component mounting apparatus according to claim 1, wherein the first imaging unit and the second imaging unit are provided so as to be stationary with respect to the mounting position.
3. The mounting apparatus for electronic parts according to claim 1, wherein the second photographing section has a camera capable of photographing the mark of the electronic part in a transparent manner, and
The positioning mechanism performs positioning of the substrate and the electronic component based on the mark of the substrate and the mark of the electronic component imaged by the second imaging unit.
4. The electronic component mounting apparatus according to claim 3, wherein the positioning means performs positioning of the electronic component based on a position of the electronic component obtained from an image of the mark of the electronic component captured by the first capturing section before positioning of the substrate and the electronic component based on the mark of the substrate captured by the second capturing section and the mark of the electronic component.
5. The mounting apparatus for electronic parts according to claim 1, wherein the first photographing section has a camera capable of photographing a mark of the electronic part in a transparent manner, and
The positioning mechanism performs positioning of the electronic component based on the position of the electronic component obtained from the image of the mark of the electronic component captured by the first capturing unit, and then performs positioning of the substrate and the electronic component based on the mark of the substrate and the mark of the electronic component captured by the second capturing unit.
6. The mounting apparatus for electronic parts according to claim 1, wherein,
The positioning mechanism performs positioning of the substrate and the electronic component based on a positional relationship between the mark of the electronic component and the mark of the mounting head obtained from the images of the mark of the electronic component and the mark of the mounting head simultaneously captured by the first capturing unit, a positional relationship between the mark of the substrate and the mark of the mounting head obtained from the images of the mark of the substrate and the mark of the mounting head simultaneously captured by the second capturing unit, and a positional shift amount of the mark of the mounting head with respect to each reference position obtained from the images of the mark of the mounting head captured by the first capturing unit and the second capturing unit before the mounting head holds the electronic component.
7. The mounting apparatus for electronic parts according to claim 1, wherein the transmission portion has a transparent plate-like member.
8. The mounting apparatus for electronic parts according to any one of claims 1 to 7, comprising a transfer mechanism that delivers the electronic parts to the mounting head at the mounting position.
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KR20190116981A (en) * 2017-02-09 2019-10-15 본드테크 가부시키가이샤 Component mounting system, resin molding apparatus, resin mounting apparatus, component mounting method and resin molding method

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