CN112924255B - 一种阳性样品微孔加工方法及其应用 - Google Patents
一种阳性样品微孔加工方法及其应用 Download PDFInfo
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- CN112924255B CN112924255B CN202110123936.3A CN202110123936A CN112924255B CN 112924255 B CN112924255 B CN 112924255B CN 202110123936 A CN202110123936 A CN 202110123936A CN 112924255 B CN112924255 B CN 112924255B
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- 238000003672 processing method Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 40
- 238000004458 analytical method Methods 0.000 claims abstract description 17
- 239000005361 soda-lime glass Substances 0.000 claims description 29
- 239000005388 borosilicate glass Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 57
- 239000011521 glass Substances 0.000 description 26
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 3
- 229910001948 sodium oxide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910021532 Calcite Inorganic materials 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011181 container closure integrity test Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009512 pharmaceutical packaging Methods 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/227—Measuring photoelectric effect, e.g. photoelectron emission microscopy [PEEM]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims (4)
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CN202110123936.3A CN112924255B (zh) | 2021-01-29 | 2021-01-29 | 一种阳性样品微孔加工方法及其应用 |
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CN112924255A CN112924255A (zh) | 2021-06-08 |
CN112924255B true CN112924255B (zh) | 2023-08-15 |
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CN118603442A (zh) * | 2024-08-07 | 2024-09-06 | 山东齐都药业有限公司 | 用于密封性试验的输液高阻隔包装阳性样品及其制备方法 |
Citations (20)
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US4220205A (en) * | 1978-11-28 | 1980-09-02 | E. I. Du Pont De Nemours And Company | Method of producing self-propping fluid-conductive fractures in rock |
KR20070054811A (ko) * | 2005-11-24 | 2007-05-30 | 삼성전자주식회사 | 2종의 분석 현미경에 적용되는 분석시편의 제작 방법 |
CN101576381A (zh) * | 2008-05-08 | 2009-11-11 | 比亚迪股份有限公司 | 一种监测镀件表面金属镀层厚度的方法 |
CN102929210A (zh) * | 2012-11-22 | 2013-02-13 | 南京航空航天大学 | 基于特征的数控加工过程控制和优化系统及方法 |
CN102928451A (zh) * | 2012-11-01 | 2013-02-13 | 白雪冰 | 玻璃熔片均匀性的检验方法 |
CN103185733A (zh) * | 2011-12-30 | 2013-07-03 | 北大方正集团有限公司 | 一种印制电路板上钻孔质量的检测方法 |
CN203854110U (zh) * | 2014-05-28 | 2014-10-01 | 蓝思科技股份有限公司 | 一种凹槽多孔产品装夹加工装置 |
CN104457635A (zh) * | 2014-10-10 | 2015-03-25 | 北京理工大学 | 基于Welch法谱估计的超薄涂层厚度均匀性无损检测方法 |
CN204649500U (zh) * | 2014-11-19 | 2015-09-16 | 徐州卧牛山新型防水材料有限公司 | 一种试样加工模具 |
CN105946249A (zh) * | 2016-06-15 | 2016-09-21 | 保定华翼风电叶片研究开发有限公司 | 一种测试用复合板材试样的制备装置及方法 |
CN106041703A (zh) * | 2016-06-06 | 2016-10-26 | 重庆万斯金属特种成形有限公司 | 用于厚度不均的玻璃板钻孔方法 |
CN106128938A (zh) * | 2016-08-01 | 2016-11-16 | 中国电子科技集团公司第四十六研究所 | 一种VDMOS器件用薄Sb衬底上制备厚层外延的方法 |
CN106793572A (zh) * | 2016-11-23 | 2017-05-31 | 深圳崇达多层线路板有限公司 | 多层线路板激光成盲孔的打孔方法 |
CN108872281A (zh) * | 2018-07-06 | 2018-11-23 | 中国电子科技集团公司第四十六研究所 | 一种能谱分析粉末样品的阵列式快速制备方法 |
CN109406235A (zh) * | 2018-11-07 | 2019-03-01 | 河北省农林科学院农业资源环境研究所 | 土壤标本制作打孔装置 |
CN109596531A (zh) * | 2018-10-29 | 2019-04-09 | 酒泉钢铁(集团)有限责任公司 | 一种超纯铁素体不锈钢光谱标准样品的制备方法 |
CN109900616A (zh) * | 2019-03-19 | 2019-06-18 | 江苏安全技术职业学院 | 一种泡沫浆体材料泡孔均匀度定量表征方法 |
CN110514503A (zh) * | 2019-10-14 | 2019-11-29 | 上海宝冶工程技术有限公司 | 一种纯铜试样的制备方法 |
CN110548795A (zh) * | 2019-08-24 | 2019-12-10 | 张家港海运金属冷挤压有限公司 | 一种高精度异形件的加工装置及方法 |
CN212217182U (zh) * | 2020-03-31 | 2020-12-25 | 李玉兰 | 一种生产加工用打孔装置 |
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KR102525730B1 (ko) * | 2015-02-13 | 2023-04-27 | 닛본 이따 가라스 가부시끼가이샤 | 레이저 가공용 유리 및 그것을 사용한 구멍 있는 유리의 제조 방법 |
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KR20070054811A (ko) * | 2005-11-24 | 2007-05-30 | 삼성전자주식회사 | 2종의 분석 현미경에 적용되는 분석시편의 제작 방법 |
CN101576381A (zh) * | 2008-05-08 | 2009-11-11 | 比亚迪股份有限公司 | 一种监测镀件表面金属镀层厚度的方法 |
CN103185733A (zh) * | 2011-12-30 | 2013-07-03 | 北大方正集团有限公司 | 一种印制电路板上钻孔质量的检测方法 |
CN102928451A (zh) * | 2012-11-01 | 2013-02-13 | 白雪冰 | 玻璃熔片均匀性的检验方法 |
CN102929210A (zh) * | 2012-11-22 | 2013-02-13 | 南京航空航天大学 | 基于特征的数控加工过程控制和优化系统及方法 |
CN203854110U (zh) * | 2014-05-28 | 2014-10-01 | 蓝思科技股份有限公司 | 一种凹槽多孔产品装夹加工装置 |
CN104457635A (zh) * | 2014-10-10 | 2015-03-25 | 北京理工大学 | 基于Welch法谱估计的超薄涂层厚度均匀性无损检测方法 |
CN204649500U (zh) * | 2014-11-19 | 2015-09-16 | 徐州卧牛山新型防水材料有限公司 | 一种试样加工模具 |
CN106041703A (zh) * | 2016-06-06 | 2016-10-26 | 重庆万斯金属特种成形有限公司 | 用于厚度不均的玻璃板钻孔方法 |
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Address after: 200438 room 110, No.2, Lane 139, Guowei Road, Yangpu District, Shanghai Patentee after: Shanghai microspectrum Testing Technology Group Co.,Ltd. Address before: 200438 room 110, No.2, Lane 139, Guowei Road, Yangpu District, Shanghai Patentee before: SHANGHAI MICROSPECTRUM CHEMICAL TECHNOLOGY SERVICE Co.,Ltd. |
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Effective date of registration: 20231221 Address after: 200438 room 110, No.2, Lane 139, Guowei Road, Yangpu District, Shanghai Patentee after: Shanghai microspectrum Testing Technology Group Co.,Ltd. Patentee after: Microspectrum Biotechnology Co.,Ltd. Address before: 200438 room 110, No.2, Lane 139, Guowei Road, Yangpu District, Shanghai Patentee before: Shanghai microspectrum Testing Technology Group Co.,Ltd. |
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