CN112838045A - Silicon wafer processing device and processing technology for chip preparation - Google Patents
Silicon wafer processing device and processing technology for chip preparation Download PDFInfo
- Publication number
- CN112838045A CN112838045A CN202011641584.2A CN202011641584A CN112838045A CN 112838045 A CN112838045 A CN 112838045A CN 202011641584 A CN202011641584 A CN 202011641584A CN 112838045 A CN112838045 A CN 112838045A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- silicon wafer
- belt pulley
- polishing
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of silicon wafer processing devices, and discloses a silicon wafer processing device for chip preparation and a processing technology, wherein a silicon wafer is polished by a polishing disc, a booster pump is started, water in a water tank is discharged into a water inlet pipe and then into the booster pump through the water inlet pipe, cooling liquid is discharged into the water inlet pipe and then into the water outlet pipe through the boosting action of the booster pump, and finally the cooling liquid is sprayed out through a porous spray head, so that the water cooling effect on the silicon wafer is realized during polishing, a coupler drives an input shaft to rotate, the input shaft drives a first driving belt pulley and a second driving belt pulley to rotate, the first driving belt pulley and the second driving belt pulley respectively drive a first driven belt pulley and a second driven belt pulley to rotate through a first transmission belt and a second transmission belt, so that two heat dissipation fans rotate, and scraps generated during polishing can be processed through the rotation of the heat dissipation fans, prevent that the piece from influencing the sight of polishing.
Description
Technical Field
The invention relates to the technical field of silicon wafer processing devices, in particular to a silicon wafer processing device for chip preparation and a processing technology.
Background
The element silicon is a grey, brittle, tetravalent non-metallic chemical element, 27.8% of the earth's crust elements are constituted by silicon elements, second only to the oxygen element content, silicon is a relatively rich element in nature, found in quartz, agate, flint and general beach stone, silicon wafers, also known as wafers, are processed from silicon ingots on which millions of transistors can be etched by specialized processes, are widely used in the manufacture of integrated circuits, silicon is a semiconductor material whose electrical conductivity is not very good, however, its resistivity can be precisely controlled by the addition of suitable dopants, before the semiconductor is manufactured, it must be converted into wafers starting from the growth of the silicon ingot, which is a solid with atoms formed in three-dimensional spatial mode cycles, which mode extends through the entire material, polysilicon is formed solely from many small single crystals having different crystal orientations and cannot be used in semiconductor circuits. Polysilicon must be melted to a single crystal in order to be processed into wafers for semiconductor applications, and processing silicon wafers to produce a silicon ingot takes from a week to a month depending on a number of factors including size, quality and end-user requirements, and the silicon wafers require a grinding process before they are placed into service.
Among the prior art, common silicon wafer grinding device is mostly more crude, some grinding device lack corresponding silicon wafer clamping device, make silicon wafer when polishing take place the skew because of lack centre gripping or centre gripping unstability lead to the silicon wafer when polishing, then influenced the effect of polishing of silicon wafer, on the other hand, silicon wafer can locally can produce high temperature when polishing, long-time local polishing can make the polishing part of silicon wafer lead to whole silicon wafer to take place to soften and warp because of the high temperature, thereby influenced the size of polishing, indirectly influenced the effect of polishing, and need in time handle to the tiny piece that produces among the polishing process, otherwise probably influence operating personnel's sight, lead to polishing the effect unsatisfactory, therefore we have publicly developed a silicon wafer processingequipment for chip preparation and satisfy the demand.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a silicon wafer processing device for chip preparation, which has the advantages of clamping and fixing a silicon wafer 4, cooling by air cooling and water cooling and the like, and solves the problems that the silicon wafer 4 is easy to deviate due to lack of a clamping device and is softened and deformed due to overhigh temperature.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a silicon wafer processing device for chip preparation comprises a bottom plate, wherein a supporting column is fixedly connected to the top of the bottom plate, a supporting table is fixedly connected to the top of the supporting column, a silicon wafer is arranged at the top of the supporting table, two fixing plates are fixedly connected to the top of the bottom plate, rotating holes are formed in the side walls of one side of the two fixing plates, the two rotating holes are rotatably sleeved with the same two-way threaded rod, two ends of the two-way threaded rod respectively penetrate through the rotating holes and extend to the outer sides of the two fixing plates, a hand wheel is fixedly connected to one end of the two-way threaded rod, two sliding blocks are rotatably screwed on the two-way threaded rod, a through hole is formed in the side wall of one side of each of the two sliding blocks, the two through holes are slidably sleeved with the same horizontal, the top ends of the two sliding blocks are fixedly connected with first fixing columns, the top of the bottom plate is fixedly connected with two supporting columns, the positions of the two supporting columns correspond to the positions of the two fixing plates, the top ends of the two supporting columns are fixedly connected with second fixing columns, and arc-shaped plates are fixedly sleeved on the two first fixing columns and the second fixing columns on the same side.
Preferably, two equal fixedly connected with arc splint in one side that the arc is close to each other, the top fixedly connected with L type fixed column of bottom plate, the position of L type fixed column with the position of silicon wafer is corresponding, one side fixedly connected with arc elasticity clamp splice of L type fixed column, be equipped with a polishing section of thick bamboo in the arc elasticity clamp splice, the top of polishing a section of thick bamboo is equipped with the shorting post, the shorting post with the same coupling hose of one end fixedly connected with of a polishing section of thick bamboo.
Preferably, one side of a section of thick bamboo of polishing is equipped with the antiskid cover, fixedly connected with fixed disk in the section of thick bamboo of polishing, two the same motor of one side fixedly connected with that the fixed disk is close to each other, the output fixedly connected with shaft coupling of motor, the one end fixedly connected with input shaft of shaft coupling, the through-hole has been seted up to the bottom of a section of thick bamboo of polishing, the one end of input shaft runs through the through-hole, and extends to the section of thick bamboo outside of polishing.
Preferably, the bottom fixedly connected with of input shaft grinds the dish, the fixed cover has been connect with first drive belt pulley and second drive belt pulley on the input shaft, the fixed cover has been connect with the contract board on the section of thick bamboo that grinds, two bottom fixedly connected with connecting plates of contract board, two the position of connecting plate with the position of a section of thick bamboo that grinds corresponds.
Preferably, the bottom ends of the two connecting plates are fixedly connected with a first cooling column and a second cooling column respectively, round holes are formed in the bottom ends of the first cooling column and the second cooling column respectively, a first rotating shaft is connected to the first cooling column in a rotating mode, a second rotating shaft is connected to the second cooling column in a rotating mode, one end of the first rotating shaft and one end of the second rotating shaft penetrate through the round holes correspondingly respectively, and extend to the outer sides of the first cooling column and the second cooling column respectively.
Preferably, fixed cover has been connected with first driven pulley in the first pivot, fixed second driven pulley that has cup jointed in the second pivot, polish a section of thick bamboo with the rectangular hole has all been seted up to one side of first cooling column, second cooling column, first drive pulley with common tensioning has same first drive belt on the first driven pulley, the second drive pulley with common tensioning has same second drive belt on the second driven pulley.
Preferably, one end of each of the first transmission belt and the second transmission belt penetrates through the corresponding rectangular hole, the bottom ends of the first rotating shaft and the second rotating shaft are fixedly connected with heat dissipation fans, the top of each of the L-shaped fixing columns is fixedly connected with a placing plate, the top of each of the placing plates is fixedly connected with a water tank, and one side of each of the water tanks is fixedly connected with a base.
Preferably, the top fixedly connected with booster pump of base, the one end fixedly connected with inlet tube of booster pump, the apopore has been seted up to one side of water tank, the one end of inlet tube runs through the apopore extends to in the water tank, the other end fixedly connected with outlet pipe of booster pump.
Preferably, the one end fixedly connected with circulation hose of outlet pipe, the one end fixedly connected with stereoplasm connecting pipe of circulation hose, one side fixedly connected with diaphragm of a section of thick bamboo of polishing, the hole has been seted up at the top of diaphragm, the one end of stereoplasm connecting pipe is run through to the hole, and extends to the diaphragm outside, the bottom fixedly connected with porous shower nozzle of stereoplasm connecting pipe, the position of porous shower nozzle with the position of the mill of polishing is corresponding.
A silicon wafer processing process for chip preparation using the silicon wafer processing apparatus for chip preparation as set forth in any one of claims 1 to 3.
(III) advantageous effects
Compared with the prior art, the invention provides a silicon wafer processing device for chip preparation, which has the following beneficial effects:
1. this silicon wafer processingequipment is used in chip preparation through rotating the hand wheel for two-way threaded rod rotates, and two arcs are driven to two-way threaded rod, make two arcs remove along the horizontal guide arm direction, make keep away from each other or be close to between two arcs, thereby carry out the centre gripping through two arc splint to silicon wafer fixed, prevent that silicon wafer from taking place the skew when polishing and influencing the effect of polishing.
2. This silicon wafer processingequipment is used in chip preparation, it rotates to drive the input shaft through the shaft coupling, the input shaft drives first drive pulley and second drive pulley and rotates, first drive pulley and second drive pulley drive first driven pulley and second driven pulley rotation respectively through first driving belt and second driving belt, and then make first pivot and second pivot rotate, thereby make two heat dissipation fan rotate, it can handle the piece that produces when polishing to rotate through heat dissipation fan, prevent that the sight of polishing is influenced by the piece.
3. This silicon wafer processingequipment for chip preparation realizes the air-cooled effect through the rotation of heat dissipation fan, thereby cooperation water-cooling can prevent that the high temperature when silicon wafer from polishing from causing whole silicon wafer softening deformation.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a schematic perspective view of an arc-shaped plate and an arc-shaped clamping block according to the present invention;
FIG. 4 is a schematic perspective view of an L-shaped fixing post according to the present invention;
FIG. 5 is a schematic perspective view of the water tank of the present invention;
FIG. 6 is a partially enlarged perspective view of FIG. 4 according to the present invention;
FIG. 7 is a schematic sectional view of a cooling column according to the present invention;
FIG. 8 is a perspective view of the engagement plate of the present invention.
In the figure: 1. a base plate; 2. a support pillar; 3. a support table; 4. a silicon wafer; 5. a fixing plate; 6. a bidirectional threaded rod; 7. a horizontal guide rod; 8. a hand wheel; 9. a slider; 10. a first fixed column; 11. a pillar; 12. a second fixed column; 13. an arc-shaped plate; 14. an arc-shaped splint; 15. an L-shaped fixing column; 16. an arc-shaped elastic clamping block; 17. polishing the barrel; 18. a shorting post; 19. a connecting hose; 20. an anti-slip sleeve; 21. fixing the disc; 22. a motor; 23. an input shaft; 24. grinding disc; 25. a second drive pulley; 26. a first drive pulley; 27. a wedging plate; 28. a connecting plate; 29. a first cooling column; 30. a second cooling column; 31. a first rotating shaft; 32. a second rotating shaft; 33. a first driven pulley; 34. a second driven pulley; 35. a first drive belt; 36. a second drive belt; 37. a heat dissipation fan; 38. placing the plate; 39. a water tank; 40. a base; 41. a booster pump; 42. a water inlet pipe; 43. a water outlet pipe; 44. a flow-through hose; 45. a hard connecting pipe; 46. a porous spray head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background of the invention, there are disadvantages in the prior art, and in order to solve the above technical problems, the present application proposes a silicon wafer processing apparatus for chip preparation
Example 1
In a typical embodiment of the present application, as shown in fig. 1-8, a silicon wafer processing device for chip preparation comprises a bottom plate 1, a supporting column 2 is fixedly connected to the top of the bottom plate 1, a supporting table 3 is fixedly connected to the top of the supporting column 2, a silicon wafer 4 is arranged on the top of the supporting table 3, two fixing plates 5 are fixedly connected to the top of the bottom plate 1, rotating holes are respectively formed on one side wall of each of the two fixing plates 5, the same two-way threaded rod 6 is rotatably sleeved in the two rotating holes, two ends of the two-way threaded rod 6 respectively penetrate through the rotating holes and extend to the outer sides of the two fixing plates 5, a hand wheel 8 is fixedly connected to one end of the two-way threaded rod 6, two sliding blocks 9 are rotatably screwed on the two-way threaded rod 6, through holes are respectively formed on one side wall of each of the two sliding blocks 9, the same horizontal guide rod, the equal first fixed column 10 of fixedly connected with in top of two sliding blocks 9, two pillars 11 of the top fixedly connected with of bottom plate 1, the position of two pillars 11 all is corresponding with the position of two fixed plates 5, the equal fixedly connected with second fixed column 12 in top of two pillars 11, and it has arc 13 all to fix the cover on two first fixed columns 10 and the second fixed column 12 with one side.
Further, in the above scheme, two equal fixedly connected with arc splint 14 in one side that arc 13 is close to each other, the top fixedly connected with L type fixed column 15 of bottom plate 1, L type fixed column 15's position is corresponding with silicon wafer 4's position, one side fixedly connected with arc elasticity clamp splice 16 of L type fixed column 15, be equipped with a section of thick bamboo 17 of polishing in the arc elasticity clamp splice 16, the top of a section of thick bamboo 17 of polishing is equipped with short connecting column 18, short connecting column 18 and the same coupling hose 19 of the one end fixedly connected with of a section of thick bamboo 17 of polishing, through two arc 13 and two arc splint 14's setting, be convenient for carry out the centre gripping fixedly to silicon wafer 4.
Further, in the above scheme, one side of a polishing section of thick bamboo 17 is equipped with antiskid cover 20, fixedly connected with fixed disk 21 in the polishing section of thick bamboo 17, the same motor 22 of one side fixedly connected with that two fixed disk 21 are close to each other, the output fixedly connected with shaft coupling of motor 22, the one end fixedly connected with input shaft 23 of shaft coupling, the through-hole has been seted up to the bottom of a polishing section of thick bamboo 17, the through-hole is run through to the one end of input shaft 23, and extends to the polishing section of thick bamboo 17 outside.
Further, in the above scheme, the bottom end of the input shaft 23 is fixedly connected with the polishing disc 24, the input shaft 23 is fixedly sleeved with the first driving belt pulley 26 and the second driving belt pulley 25, the polishing cylinder 17 is fixedly sleeved with the engagement plate 27, the bottom of the engagement plate 27 is fixedly connected with the two connection plates 28, and the positions of the two connection plates 28 correspond to the position of the polishing cylinder 17.
Further, in the above scheme, the bottom of two connecting plates 28 is first cooling column 29 and second cooling column 30 of fixedly connected with respectively, the round hole has all been seted up to the bottom of first cooling column 29 and second cooling column 30, first cooling column 29 internal rotation is connected with first pivot 31, second cooling column 30 internal rotation is connected with second pivot 32, the one end of first pivot 31 and second pivot 32 runs through two corresponding round holes respectively outside, and extend to first cooling column 29 respectively, the outside of second cooling column 30, setting through two connecting plates 28, be convenient for first cooling column 29 and second cooling column 30 fixed, through the setting of round hole, be convenient for first pivot 31 and second pivot 32 rotate.
Further, in the above scheme, a first driven pulley 33 is fixedly sleeved on the first rotating shaft 31, a second driven pulley 34 is fixedly sleeved on the second rotating shaft 32, rectangular holes are formed in one side of the polishing cylinder 17, one side of the first cooling column 29 and one side of the second cooling column 30, the same first driving belt 35 is tensioned on the first driving pulley 26 and the first driven pulley 33 together, the same second driving belt 36 is tensioned on the second driving pulley 25 and the second driven pulley 34 together, and the first driven pulley and the second driven pulley 34 can rotate through the arrangement of the first driving belt 35 and the second driving belt 36; further, the first transmission belt 35 and the second transmission belt 36 are convenient to rotate through the arrangement of the rectangular holes.
Further, in the above scheme, corresponding rectangular hole is run through respectively to first drive belt 35 and second drive belt 36's one end, the equal fixedly connected with heat dissipation fan 37 in bottom of first pivot 31 and second pivot 32, board 38 is placed to the top fixedly connected with of L type fixed column 15, place the top fixedly connected with water tank 39 of board 38, one side fixedly connected with base 40 of water tank 39, through the setting of two heat dissipation fans 37, be convenient for carry out the forced air cooling heat dissipation to the silicon wafer 4 in polishing, through can handling the piece, prevent that the piece from influencing the sight of polishing.
Further, in the above scheme, the top of the base 40 is fixedly connected with the booster pump 41, one end of the booster pump 41 is fixedly connected with the water inlet pipe 42, one side of the water tank 39 is provided with a water outlet hole, one end of the water inlet pipe 42 penetrates through the water outlet hole and extends into the water tank 39, the other end of the booster pump 41 is fixedly connected with the water outlet pipe 43, and through the arrangement of the water outlet hole, the cooling liquid can be conveniently discharged into the water inlet pipe 42.
Further, in the above scheme, the one end fixedly connected with circulation hose 44 of outlet pipe 43, the one end fixedly connected with stereoplasm connecting pipe 45 of circulation hose 44, one side fixedly connected with diaphragm of a section of thick bamboo 17 polishes, the hole has been seted up at the top of diaphragm, the one end of stereoplasm connecting pipe 45 runs through the hole, and extend to the diaphragm outside, the bottom fixedly connected with porous shower nozzle 46 of stereoplasm connecting pipe 45, the position of porous shower nozzle 46 is corresponding with the position of dish 24 of polishing, through inlet tube 42, booster pump 41, outlet pipe 43 and porous shower nozzle 46's setting, thereby realize the water-cooling effect to silicon wafer 4 in the polishing.
A silicon wafer processing process for chip preparation using the silicon wafer processing apparatus for chip preparation as set forth in any one of claims 1 to 3.
When the silicon wafer polishing device is used, the hand wheel 8 is rotated to enable the bidirectional threaded rod 6 to rotate, the bidirectional threaded rod 6 drives the two arc-shaped plates 13, the two arc-shaped plates 13 move along the direction of the horizontal guide rod 7, the two arc-shaped plates 13 are far away from or close to each other, and therefore the silicon wafer 4 is clamped and fixed through the two arc-shaped clamping plates 14, and the silicon wafer 4 is prevented from shifting during polishing to influence the polishing effect; taking out a polishing cylinder 17 in the arc-shaped elastic clamping block 16, polishing the silicon wafer 4 through the polishing disc 24, starting the booster pump 41, discharging water in the water tank 39 into the water inlet pipe 42, further discharging the water into the booster pump 41 through the water inlet pipe 42, discharging cooling liquid into and out of the water pipe 43 through the boosting effect of the booster pump 41, and finally spraying the cooling liquid through the porous spray nozzle 46, thereby realizing the water-cooling effect on the silicon wafer 4 during polishing.
The motor 22 is started, the output end of the motor 22 drives the input shaft 23 to rotate through the coupler, the input shaft 23 drives the first driving belt pulley 26 and the second driving belt pulley 25 to rotate, the first driving belt pulley 26 and the second driving belt pulley 25 respectively drive the first driven belt pulley 33 and the second driven belt pulley 34 to rotate through the first transmission belt 35 and the second transmission belt 36, further the first rotating shaft 31 and the second rotating shaft 32 are enabled to rotate, therefore, the two heat dissipation fans 34 are enabled to rotate, debris generated during polishing can be processed through rotation of the heat dissipation fans 34, and the polishing sight line is prevented from being influenced by the debris; meanwhile, the air cooling effect is realized through the rotation of the heat dissipation fan 16, and the softening and deformation of the whole silicon wafer caused by overhigh temperature during the polishing of the silicon wafer 4 can be prevented by matching with water cooling; through the arrangement of the connecting hose 19 and the circulating hose 44, the polishing, air cooling and water cooling effects on the silicon wafer 4 at any position are facilitated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A silicon wafer processing apparatus for chip preparation, comprising a base plate (1), characterized in that: the top of the bottom plate (1) is fixedly connected with a support column (2), the top of the support column (2) is fixedly connected with a support table (3), the top of the support table (3) is provided with a silicon wafer (4), the top of the bottom plate (1) is fixedly connected with two fixed plates (5), one side wall of each of the two fixed plates (5) is provided with a rotary hole, the rotary holes are rotatably sleeved with the same two-way threaded rod (6), the two ends of the two-way threaded rod (6) respectively penetrate through the rotary holes and extend to the outer sides of the two fixed plates (5), one end of the two-way threaded rod (6) is fixedly connected with a hand wheel (8), the rotary screw on the two-way threaded rod (6) is connected with two sliding blocks (9) in a threaded manner, one side wall of the two fixed plates (9) is provided with a perforation, two ends of the horizontal guide rod (7) are respectively connected with the two corresponding fixed plates (5), the top ends of the two sliding blocks (9) are fixedly connected with first fixed columns (10), the top of the bottom plate (1) is fixedly connected with two supporting columns (11), the positions of the two supporting columns (11) are respectively corresponding to the positions of the two fixed plates (5), the top ends of the two supporting columns (11) are respectively fixedly connected with second fixed columns (12), and the two first fixed columns (10) and the second fixed columns (12) on the same side are respectively fixedly sleeved with an arc-shaped plate (13); one sides of the two arc plates (13) close to each other are fixedly connected with arc clamping plates (14); the top of the bottom plate (1) is fixedly connected with an L-shaped fixing column (15), the position of the L-shaped fixing column (15) corresponds to the position of the silicon wafer (4), one side of the L-shaped fixing column (15) is fixedly connected with an arc-shaped elastic clamping block (16), a polishing cylinder (17) is arranged in the arc-shaped elastic clamping block (16), the top end of the polishing cylinder (17) is provided with a short connecting column (18), and the short connecting column (18) and one end of the polishing cylinder (17) are fixedly connected with the same connecting hose (19); an anti-skidding sleeve (20) is arranged on one side of the grinding cylinder (17), fixed disks (21) are fixedly connected in the grinding cylinder (17), one side, close to each other, of each of the two fixed disks (21) is fixedly connected with the same motor (22), the output end of each motor (22) is fixedly connected with a coupler, one end of each coupler is fixedly connected with an input shaft (23), a through hole is formed in the bottom end of the grinding cylinder (17), and one end of each input shaft (23) penetrates through the through hole and extends to the outer side of the grinding cylinder (17); the bottom end of the input shaft (23) is fixedly connected with a polishing disc (24), the input shaft (23) is fixedly sleeved with a first driving belt pulley (26) and a second driving belt pulley (25), the polishing cylinder (17) is fixedly sleeved with a wedge plate (27), the bottom of the wedge plate (27) is fixedly connected with two connecting plates (28), and the positions of the two connecting plates (28) correspond to the positions of the polishing cylinder (17); the bottom ends of the two connecting plates (28) are fixedly connected with a first cooling column (29) and a second cooling column (30) respectively, round holes are formed in the bottom ends of the first cooling column (29) and the second cooling column (30), a first rotating shaft (31) is connected in the first cooling column (29) in a rotating mode, a second rotating shaft (32) is connected in the second cooling column (30) in a rotating mode, one end of each of the first rotating shaft (31) and the second rotating shaft (32) penetrates through the two corresponding round holes respectively and extends to the outer sides of the first cooling column (29) and the second cooling column (30) respectively; a first driven belt pulley (33) is fixedly sleeved on the first rotating shaft (31), a second driven belt pulley (34) is fixedly sleeved on the second rotating shaft (32), rectangular holes are formed in one sides of the grinding cylinder (17), the first cooling column (29) and the second cooling column (30), the first driving belt pulley (26) and the first driven belt pulley (33) are jointly tensioned with a same first transmission belt (35), and the second driving belt pulley (25) and the second driven belt pulley (34) are jointly tensioned with a same second transmission belt (36); the first transmission belt (35) and the one end of second transmission belt (36) run through corresponding respectively the rectangular hole, first pivot (31) with the equal fixedly connected with heat dissipation fan (37) in bottom of second pivot (32), board (38) is placed to the top fixedly connected with of L type fixed column (15), place top fixedly connected with water tank (39) of board (38), one side fixedly connected with base (40) of water tank (39).
2. The silicon wafer processing apparatus for chip preparation as set forth in claim 1, wherein: the top fixedly connected with booster pump (41) of base (40), the one end fixedly connected with inlet tube (42) of booster pump (41), the apopore has been seted up to one side of water tank (39), the one end of inlet tube (42) is run through the apopore extends to in the water tank (39), the other end fixedly connected with outlet pipe (43) of booster pump (41).
3. The silicon wafer processing apparatus for chip preparation as set forth in claim 2, wherein: the one end fixedly connected with circulation hose (44) of outlet pipe (43), the one end fixedly connected with stereoplasm connecting pipe (45) of circulation hose (44), one side fixedly connected with diaphragm of a section of thick bamboo (17) polishes, the hole has been seted up at the top of diaphragm, the one end of stereoplasm connecting pipe (45) is run through to the hole, and extend to the diaphragm outside, the bottom fixedly connected with porous shower nozzle (46) of stereoplasm connecting pipe (45), the position of porous shower nozzle (46) with the position of polishing dish (24) is corresponding.
4. A silicon wafer processing technology for chip preparation is characterized in that: a silicon wafer processing apparatus for chip preparation as claimed in any one of claims 1 to 3 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011641584.2A CN112838045A (en) | 2020-12-31 | 2020-12-31 | Silicon wafer processing device and processing technology for chip preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011641584.2A CN112838045A (en) | 2020-12-31 | 2020-12-31 | Silicon wafer processing device and processing technology for chip preparation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112838045A true CN112838045A (en) | 2021-05-25 |
Family
ID=75926982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011641584.2A Withdrawn CN112838045A (en) | 2020-12-31 | 2020-12-31 | Silicon wafer processing device and processing technology for chip preparation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112838045A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114734319A (en) * | 2022-03-20 | 2022-07-12 | 林小花 | Semiconductor material processing system and method |
| CN116403948A (en) * | 2023-06-08 | 2023-07-07 | 山东凯一达智能科技有限公司 | Semiconductor element manufacturing equipment and use method |
| CN118372178A (en) * | 2024-05-27 | 2024-07-23 | 浙江精瓷半导体有限责任公司 | Grinding disc cooling mechanism of chip grinder and cooling method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010074002A (en) * | 2008-09-19 | 2010-04-02 | Shin Etsu Handotai Co Ltd | Band saw cutting device, and method of cutting ingot |
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN208713572U (en) * | 2018-08-20 | 2019-04-09 | 深圳市拓海自动化设备有限公司 | A kind of surface grinding machine that can be quickly cooled down heat dissipation |
| CN109676515A (en) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | A kind of semiconductor crystal wafer grinding device with cleaning function |
| CN208811770U (en) * | 2018-09-19 | 2019-05-03 | 贵州磨立方机械设备有限公司 | Grinding device is used in a kind of machining |
| CN210060687U (en) * | 2019-04-04 | 2020-02-14 | 山东镔鹏精密机械有限公司 | Machining center for special-shaped mechanical parts |
-
2020
- 2020-12-31 CN CN202011641584.2A patent/CN112838045A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010074002A (en) * | 2008-09-19 | 2010-04-02 | Shin Etsu Handotai Co Ltd | Band saw cutting device, and method of cutting ingot |
| CN208713572U (en) * | 2018-08-20 | 2019-04-09 | 深圳市拓海自动化设备有限公司 | A kind of surface grinding machine that can be quickly cooled down heat dissipation |
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN208811770U (en) * | 2018-09-19 | 2019-05-03 | 贵州磨立方机械设备有限公司 | Grinding device is used in a kind of machining |
| CN109676515A (en) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | A kind of semiconductor crystal wafer grinding device with cleaning function |
| CN210060687U (en) * | 2019-04-04 | 2020-02-14 | 山东镔鹏精密机械有限公司 | Machining center for special-shaped mechanical parts |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114734319A (en) * | 2022-03-20 | 2022-07-12 | 林小花 | Semiconductor material processing system and method |
| CN114734319B (en) * | 2022-03-20 | 2023-08-22 | 深圳市陆和神州科技有限公司 | Semiconductor material processing system and method |
| CN116403948A (en) * | 2023-06-08 | 2023-07-07 | 山东凯一达智能科技有限公司 | Semiconductor element manufacturing equipment and use method |
| CN116403948B (en) * | 2023-06-08 | 2023-09-05 | 山东凯一达智能科技有限公司 | Semiconductor element manufacturing equipment and use method |
| CN118372178A (en) * | 2024-05-27 | 2024-07-23 | 浙江精瓷半导体有限责任公司 | Grinding disc cooling mechanism of chip grinder and cooling method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112838045A (en) | Silicon wafer processing device and processing technology for chip preparation | |
| US9649740B1 (en) | Vibration assistant polishing module | |
| KR101256013B1 (en) | Apparatus and method for manufacturing liquid crystal display device | |
| WO2005055302A1 (en) | Method for manufacturing single-side mirror surface wafer | |
| CN102172859B (en) | Processing method for ultrathin plain glass based on consolidated abrasive | |
| CN105070545A (en) | Surface treatment method of BaTiO3 ceramic substrate used for single-layer capacitor | |
| CN219234934U (en) | Back polishing device for producing semiconductor wafer | |
| JP4855571B2 (en) | Polishing pad and method of polishing a workpiece using the polishing pad | |
| CN103065935B (en) | Method of disposing of insulated gate bipolar translator (IGBT) silicon wafer polishing piece edge oxidation film in extrusion mode | |
| CN115533666A (en) | Quartz wafer round edge device and process | |
| CN103692337A (en) | Silicon wafer polishing method for adopting mixed fructose to paste silicon wafers | |
| KR20030025792A (en) | Method for manufacturing Liquid Crystal Display Device having thin thickness | |
| CN209998925U (en) | silicon wafer polishing device capable of improving adjustment precision | |
| CN217394564U (en) | Valve seat plane polishing equipment | |
| CN220592714U (en) | Processing device for double polished sheets | |
| CN217371658U (en) | Grinding device for silicon wafer production and processing | |
| KR100826590B1 (en) | Apparatus for chemical mechanical polishing | |
| CN218363749U (en) | Grinding device is used in semiconductor chip processing | |
| CN215588748U (en) | Adjustable abrasive belt device of polishing machine | |
| CN216577068U (en) | A dustless edging equipment for optical glass processing | |
| CN218461840U (en) | Silicon wafer polishing machine | |
| CN214722883U (en) | Single-column numerical control heavy vertical lathe | |
| CN116749359B (en) | Cutting equipment for processing silicon carbide epitaxial wafer | |
| CN218947227U (en) | Double-sided polishing device for optical lenses | |
| CN208841096U (en) | A kind of glass edging equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210525 |
|
| WW01 | Invention patent application withdrawn after publication |