CN112510116A - 一种抗LeTID钝化接触太阳能电池及其生产工艺 - Google Patents
一种抗LeTID钝化接触太阳能电池及其生产工艺 Download PDFInfo
- Publication number
- CN112510116A CN112510116A CN202011377994.0A CN202011377994A CN112510116A CN 112510116 A CN112510116 A CN 112510116A CN 202011377994 A CN202011377994 A CN 202011377994A CN 112510116 A CN112510116 A CN 112510116A
- Authority
- CN
- China
- Prior art keywords
- laser
- layer
- passivation
- doping
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002161 passivation Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 36
- 239000010703 silicon Substances 0.000 claims abstract description 36
- 229910052796 boron Inorganic materials 0.000 claims abstract description 35
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000009792 diffusion process Methods 0.000 claims abstract description 30
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 20
- 229910004205 SiNX Inorganic materials 0.000 claims abstract description 18
- 238000005245 sintering Methods 0.000 claims abstract description 16
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract description 13
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 11
- 229910017107 AlOx Inorganic materials 0.000 claims abstract description 10
- 238000003475 lamination Methods 0.000 claims abstract description 7
- 238000004528 spin coating Methods 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 229910019213 POCl3 Inorganic materials 0.000 claims description 8
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 8
- 125000004437 phosphorous atom Chemical group 0.000 claims description 8
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl chloride Substances ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910020489 SiO3 Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000003667 anti-reflective effect Effects 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 4
- 239000002003 electrode paste Substances 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 101100260935 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) TOD6 gene Proteins 0.000 claims description 2
- 101150092317 pbf1 gene Proteins 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 abstract description 10
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000011160 research Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 4
- 239000011267 electrode slurry Substances 0.000 description 4
- 210000002268 wool Anatomy 0.000 description 4
- 238000012216 screening Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006388 chemical passivation reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明涉及太阳能电池制造技术领域,具体涉及一种抗LeTID钝化接触太阳能电池及其生产工艺,所述生产工艺包括(1)制绒;(2)扩散;(3)激光二次扩散;(4)刻蚀水洗;(5)PECVD:在电池正面沉积减反膜;(6)磁控溅射:在电池背面沉积SiC层;(7)背面钝化:在电池背面设置钝化叠层,所述钝化叠层为AlOx+SiNx;(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂;(9)丝印烧结。本发明抗LeTID钝化接触太阳能电池采用SiC层阻挡氢向硅沉底迁移,通过对重掺杂、叠层钝化及硼点背场的研究,使电池转化效率达到23.28%,少子寿命达到4500μs。
Description
技术领域
本发明涉及太阳能电池制造技术领域,具体涉及一种抗LeTID钝化接触太阳能电池及其生产工艺。
背景技术
随着工业化进程的不断推进和人民生活水平的日益提高,人们对能源的需求越来越大,石油、煤炭等传统化石能源储量有限,可替代传统化石能源的绿色可再生能源逐渐进入研究者视野,太阳能作为一种取之不尽用之不竭的清洁能源受到极大关注。现阶段,对太阳能的研究主要集中在光热利用、光电利用和光化利用等领域。
太阳能电池是太阳能光电利用的一种主要方式,其基本原理是利用光生伏特效应将太阳辐射能直接转换为电能。太阳能电池的生产工艺主要包括制绒→扩散→刻蚀→等离子体增强化学的气相沉积(PECVD)→钝化→丝印烧结等步骤,其中钝化的目的在于降低电池表面态密度,通常采用化学钝化或场钝化的方式,化学钝化中应用较多的是氢钝化,钝化层释放出的氢能够进入硅中,形成弱氢键,钝化缺陷。然而氢的含量并非越高越好,这些弱氢键在一定的温度和光照作用下很容易被破坏,并释放出弱碱氢,造成电池的衰减,这就是热辅助光致衰减(LeTID)。
基于此,有必要提供一种抗LeTID钝化接触太阳能电池及其生产工艺。
发明内容
针对现有太阳能电池钝化层中的氢在加热和光照下会造成电池衰减的技术问题,本发明提供一种抗LeTID钝化接触太阳能电池及其生产工艺,本发明抗LeTID钝化接触太阳能电池采用SiC层阻挡氢向硅沉底迁移,通过对重掺杂、叠层钝化及硼点背场的研究,使电池转化效率达到23.28%,少子寿命达到4500μs。
第一方面,本发明提供一种抗LeTID钝化接触太阳能电池的生产工艺,所述生产工艺包括如下步骤:
(1)制绒;
(2)扩散;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗;
(5)PECVD:在电池正面沉积减反膜;
(6)磁控溅射:在电池背面沉积SiC层;
(7)背面钝化:在电池背面设置钝化叠层,所述钝化叠层为AlOx+SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,并进行烧结。
进一步的,所述生产工艺包括如下步骤:
(1)制绒:清洗硅片后,使用腐蚀液处理硅片,在硅片表面形成绒面;
(2)扩散:将P型硅片放置于扩散炉中,并通入含POCl3的氮气,POCl3与硅片反应得到磷原子,磷原子进入硅片内部,形成N型半导体,N型半导体和P型硅片之间形成PN结;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗:用含有HF的刻蚀液将硅片上多余的扩散层去除;
(5)PECVD:在电池正面沉积减反膜;
(6)磁控溅射:在电池背面沉积SiC层;
(7)背面钝化:采用PECVD在电池背面依次沉积AlOx和SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂,硼源选自B2H6、TMB、PBF1、B40或Al-BSF中的一种,激光功率为3~8w,开窗方式为水平间断线开窗;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,并进行烧结,烧结温度为725℃,烧结时间为40s。
进一步的,所述步骤(1)中使用的硅片为单晶硅,腐蚀液为NaOH、Na2SiO3和IPA的混合水溶液,所述腐蚀液中NaOH、Na2SiO3和IPA的质量百分比分别为10%、10%和50%,制绒温度为80℃,制绒时间为1h。
进一步的,所述步骤(5)减反膜为SiNx减反膜。
进一步的,所述步骤(6)SiC层的沉积方法为直接用SiC靶进行磁控溅射。
进一步的,所述步骤(8)中硼掺杂的浓度为每平方厘米1~5×1020个原子。
进一步的,所述步骤(8)每条水平间隔线的开窗比例为开窗50%、不开窗50%。
进一步的,所述步骤(9)中,所述正电极为Ni/Cu/Ag电极,丝网印刷电极浆料后在150~200℃烘干,所述背电极为铝电极,丝网印刷电极浆料后在150~200℃烘干,之后对电池进行烧结,烧结温度为725℃,烧结时间为40s。
第二方面,本发明提供一种采用上述生产工艺制得的抗LeTID钝化接触太阳能电池,所述太阳能电池包括正电极、减反膜、n++重掺杂区、n型扩散层、p型晶体硅基底、SiC层、AlOx层、SiNx层、硼点背场和背电极。
进一步的,所述减反膜的厚度为0.1~0.5μm,所述n型扩散层的厚度为0.05~0.5μm,所述p型晶体硅基底的厚度为100~200μm,所述SiC层的厚度为0.05~0.2μm,所述AlOx层的厚度为0.05~0.075μm,所述SiNx层的厚度为0.025~0.05μm。
本发明的有益效果在于,
本发明提供一种太阳能电池生产工艺,该工艺通过激光二次扩散实现局部重掺杂,提升电池转换效率;在电池背面引入B掺杂,进一步提高电池效率;在电池背面沉积SiC层,利用其能够阻挡氢渗透的特性,减少氢向硅衬底的迁移,提升太阳能电池抗LeTID的能力。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明抗LeTID钝化接触太阳能电池的结构示意图。
图中,1-正电极,2-减反膜,3-n++重掺杂区,4-n型扩散层,5-p型晶体硅基底,6-SiC层,7-AlOx层,8-SiNx层,9-硼点背场,10-背电极。
具体实施方式
为了使本技术领域的人员更好地理解本发明中的技术方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。
实施例1
如图1所示,一种抗LeTID钝化接触太阳能电池,该电池包括正电极1、减反膜2、n++重掺杂区3、n型扩散层4、p型晶体硅基底5、SiC层6、AlOx层7、SiNx层8、硼点背场9和背电极10,其中减反膜2的厚度为0.125μm,n型扩散层4的厚度为0.08μm,p型晶体硅基底5的厚度为120μm,SiC层6的厚度为0.075μm,AlOx层7的厚度为0.05μm,SiNx层8的厚度为0.05μm;
该太阳能电池的生产工艺包括如下步骤:
(1)制绒:清洗单晶硅片后,使用腐蚀液处理硅片,在硅片表面形成绒面,腐蚀液为质量百分比分别为10%、10%和50%的NaOH、Na2SiO3和IPA的混合水溶液,制绒温度为80℃,制绒时间为1h;
(2)扩散:将P型硅片放置于扩散炉中,并通入含POCl3的氮气,POCl3与硅片反应得到磷原子,磷原子进入硅片内部,形成N型半导体,N型半导体和P型硅片之间形成PN结;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗:用含有HF的刻蚀液将硅片上多余的扩散层去除;
(5)PECVD:在电池正面沉积SiNx减反膜;
(6)磁控溅射:直接用SiC靶进行磁控溅射,在电池背面沉积SiC层;
(7)背面钝化:采用PECVD在电池背面依次沉积AlOx和SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂,硼源为TMB,硼掺杂的浓度为每平方厘米2×1020个原子,激光功率为5w,开窗方式为水平间断线开窗,相邻两条水平间隔线之间的间距为0.5mm,每条水平间隔线的开窗比例为开窗50%、不开窗50%;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,正电极为Ni/Cu/Ag电极,丝网印刷电极浆料后在180℃烘干,背电极为铝电极,丝网印刷电极浆料后在180℃烘干,之后对电池进行烧结,烧结温度为725℃,烧结时间为40s。
实施例2
如图1所示,一种抗LeTID钝化接触太阳能电池,该电池包括正电极1、减反膜2、n++重掺杂区3、n型扩散层4、p型晶体硅基底5、SiC层6、AlOx层7、SiNx层8、硼点背场9和背电极10,其中减反膜2的厚度为0.25μm,n型扩散层4的厚度为0.4μm,p型晶体硅基底5的厚度为180μm,SiC层6的厚度为0.15μm,AlOx层7的厚度为0.075μm,SiNx层8的厚度为0.025μm;
该太阳能电池的生产工艺包括如下步骤:
(1)制绒:清洗单晶硅片后,使用腐蚀液处理硅片,在硅片表面形成绒面,腐蚀液为质量百分比分别为10%、10%和50%的NaOH、Na2SiO3和IPA的混合水溶液,制绒温度为80℃,制绒时间为1h;
(2)扩散:将P型硅片放置于扩散炉中,并通入含POCl3的氮气,POCl3与硅片反应得到磷原子,磷原子进入硅片内部,形成N型半导体,N型半导体和P型硅片之间形成PN结;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗:用含有HF的刻蚀液将硅片上多余的扩散层去除;
(5)PECVD:在电池正面沉积SiNx减反膜;
(6)磁控溅射:直接用SiC靶进行磁控溅射,在电池背面沉积SiC层;
(7)背面钝化:采用PECVD在电池背面依次沉积AlOx和SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂,硼源为B2H6,硼掺杂的浓度为每平方厘米4×1020个原子,激光功率为6w,开窗方式为水平间断线开窗,相邻两条水平间隔线之间的间距为0.5mm,每条水平间隔线的开窗比例为开窗50%、不开窗50%;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,正电极为Ni/Cu/Ag电极,丝网印刷电极浆料后在180℃烘干,背电极为铝电极,丝网印刷电极浆料后在180℃烘干,之后对电池进行烧结,烧结温度为725℃,烧结时间为40s。
实施例1、实施例2的电池的电池转换效率(Eta)、开路电压(Voc)、填充因子(FF)和Jsc如下表1所示。
表1实施例1、2电池性能
项目 | E<sub>ta</sub>(%) | V<sub>oc</sub>(mV) | F<sub>F</sub>(%) | J<sub>sc</sub>(mA/cm<sup>2</sup>) |
实施例1 | 22.67 | 689.4 | 80.51% | 40.85 |
实施例2 | 23.28 | 690.1 | 80.66% | 41.84 |
筛选例1
对水平间隔线的开窗比例进行筛选,控制其他变量与实施例2相同,设置不同开窗比例,①组开窗80%、不开窗20%,②组开窗60%、不开窗40%,③组开窗50%、不开窗50%,④组开窗40%、不开窗60%,⑤组开窗20%、不开窗80%。①~⑤组电池的性能如下表2所示,可以看出,当开窗比例为开窗50%,不开窗50%时,对电池转换效率的提升效果最明显。
表2①~⑤组电池性能
序号 | ① | ② | ③ | ④ | ⑤ |
E<sub>ta</sub>(%) | 22.58 | 22.63 | 23.28 | 22.56 | 22.40 |
V<sub>oc</sub>(mV) | 687.3 | 688.5 | 690.1 | 688.9 | 687.1 |
筛选例2
对硼掺杂的激光功率进行筛选,控制其他变量与实施例2相同,设置不同激光功率,a~d组激光功率依次为4w、5w、6w和7w,a~d组电池的性能如下表3所示,可以看出,当激光功率为6w时,对电池转换效率的提升效果最明显。
表3a~d组电池性能
序号 | a | b | c | d |
E<sub>ta</sub>(%) | 22.39 | 22.51 | 23.28 | 22.49 |
V<sub>oc</sub>(mV) | 687.1 | 687.3 | 690.1 | 687.2 |
尽管通过参考附图并结合优选实施例的方式对本发明进行了详细描述,但本发明并不限于此。在不脱离本发明的精神和实质的前提下,本领域普通技术人员可以对本发明的实施例进行各种等效的修改或替换,而这些修改或替换都应在本发明的涵盖范围内/任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求所述的保护范围为准。
Claims (10)
1.一种抗LeTID钝化接触太阳能电池的生产工艺,其特征在于,所述生产工艺包括如下步骤:
(1)制绒;
(2)扩散;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗;
(5)PECVD:在电池正面沉积减反膜;
(6)磁控溅射:在电池背面沉积SiC层;
(7)背面钝化:在电池背面设置钝化叠层,所述钝化叠层为AlOx+SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,并进行烧结。
2.如权利要求1所述的生产工艺,其特征在于,所述生产工艺包括如下步骤:
(1)制绒:清洗硅片后,使用腐蚀液处理硅片,在硅片表面形成绒面;
(2)扩散:将P型硅片放置于扩散炉中,并通入含POCl3的氮气,POCl3与硅片反应得到磷原子,磷原子进入硅片内部,形成N型半导体,N型半导体和P型硅片之间形成PN结;
(3)激光二次扩散:采用扩散磷硅玻璃作为掺杂源,激光选择性作用在正面金属电极区域实现发射极选择性重掺杂区n++;
(4)刻蚀水洗:用含有HF的刻蚀液将硅片上多余的扩散层去除;
(5)PECVD:在电池正面沉积减反膜;
(6)磁控溅射:在电池背面沉积SiC层;
(7)背面钝化:采用PECVD在电池背面依次沉积AlOx和SiNx;
(8)背面掺硼、激光开窗:在电池背面旋涂硼源,之后用激光对硼源进行掺杂,硼源选自B2H6、TMB、PBF1、B40或Al-BSF中的一种,激光功率为3~8w,开窗方式为水平间断线开窗;
(9)丝印烧结:通过丝网印刷制作正电极和背电极,并进行烧结,烧结温度为725℃,烧结时间为40s。
3.如权利要求2所述的生产工艺,其特征在于,所述步骤(1)中使用的硅片为单晶硅,腐蚀液为NaOH、Na2SiO3和IPA的混合水溶液,所述腐蚀液中NaOH、Na2SiO3和IPA的质量百分比分别为10%、10%和50%,制绒温度为80℃,制绒时间为1h。
4.如权利要求2所述的生产工艺,其特征在于,所述步骤(5)减反膜为SiNx减反膜。
5.如权利要求2所述的生产工艺,其特征在于,所述步骤(6)SiC层的沉积方法为直接用SiC靶进行磁控溅射。
6.如权利要求2所述的生产工艺,其特征在于,所述步骤(8)中硼掺杂的浓度为每平方厘米1~5×1020个原子。
7.如权利要求2所述的生产工艺,其特征在于,所述步骤(8)每条水平间隔线的开窗比例为开窗50%、不开窗50%。
8.如权利要求2所述的生产工艺,其特征在于,所述步骤(9)中,所述正电极为Ni/Cu/Ag电极,丝网印刷电极浆料后在150~200℃烘干,所述背电极为铝电极,丝网印刷电极浆料后在150~200℃烘干,之后对电池进行烧结,烧结温度为725℃,烧结时间为40s。
9.一种如权利要求1~8任一项所述的生产工艺制得的抗LeTID钝化接触太阳能电池,其特征在于,所述太阳能电池包括正电极、减反膜、n++重掺杂区、n型扩散层、p型晶体硅基底、SiC层、AlOx层、SiNx层、硼点背场和背电极。
10.如权利要求9所述的抗LeTID钝化接触太阳能电池,其特征在于,所述减反膜的厚度为0.1~0.5μm,所述n型扩散层的厚度为0.05~0.5μm,所述p型晶体硅基底的厚度为100~200μm,所述SiC层的厚度为0.05~0.2μm,所述AlOx层的厚度为0.05~0.075μm,所述SiNx层的厚度为0.025~0.05μm。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011377994.0A CN112510116A (zh) | 2020-11-30 | 2020-11-30 | 一种抗LeTID钝化接触太阳能电池及其生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011377994.0A CN112510116A (zh) | 2020-11-30 | 2020-11-30 | 一种抗LeTID钝化接触太阳能电池及其生产工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112510116A true CN112510116A (zh) | 2021-03-16 |
Family
ID=74968756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011377994.0A Pending CN112510116A (zh) | 2020-11-30 | 2020-11-30 | 一种抗LeTID钝化接触太阳能电池及其生产工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112510116A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113571602A (zh) * | 2021-07-23 | 2021-10-29 | 横店集团东磁股份有限公司 | 一种二次扩散的选择性发射极及其制备方法和应用 |
CN115125510A (zh) * | 2022-06-22 | 2022-09-30 | 中威新能源(成都)有限公司 | 化学气相沉积方法、载具、电池片及异质结电池 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101916795A (zh) * | 2010-07-05 | 2010-12-15 | 晶澳太阳能有限公司 | 一种晶体硅太阳电池背面钝化的方法 |
CN105810769A (zh) * | 2016-05-24 | 2016-07-27 | 晋能清洁能源科技有限公司 | 一种背钝化太阳能电池的激光开槽结构 |
CN205845974U (zh) * | 2016-05-24 | 2016-12-28 | 晋能清洁能源科技有限公司 | 一种背钝化太阳能电池的激光开槽结构 |
CN207938619U (zh) * | 2018-03-28 | 2018-10-02 | 通威太阳能(成都)有限公司 | 一种基于perc的双面太阳电池背面导电结构 |
CN209071343U (zh) * | 2018-12-18 | 2019-07-05 | 苏州阿特斯阳光电力科技有限公司 | 一种电池片的背面开槽结构及电池片 |
CN111029436A (zh) * | 2019-10-14 | 2020-04-17 | 中建材浚鑫科技有限公司 | 可改善LeTID现象的P型单晶PERC电池及其制作方法 |
CN211125676U (zh) * | 2019-11-29 | 2020-07-28 | 晋能光伏技术有限责任公司 | 一种背钝化激光开槽导电结构 |
CN111816714A (zh) * | 2020-07-28 | 2020-10-23 | 通威太阳能(眉山)有限公司 | 一种激光硼掺杂背钝化太阳能电池及其制备方法 |
-
2020
- 2020-11-30 CN CN202011377994.0A patent/CN112510116A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101916795A (zh) * | 2010-07-05 | 2010-12-15 | 晶澳太阳能有限公司 | 一种晶体硅太阳电池背面钝化的方法 |
CN105810769A (zh) * | 2016-05-24 | 2016-07-27 | 晋能清洁能源科技有限公司 | 一种背钝化太阳能电池的激光开槽结构 |
CN205845974U (zh) * | 2016-05-24 | 2016-12-28 | 晋能清洁能源科技有限公司 | 一种背钝化太阳能电池的激光开槽结构 |
CN207938619U (zh) * | 2018-03-28 | 2018-10-02 | 通威太阳能(成都)有限公司 | 一种基于perc的双面太阳电池背面导电结构 |
CN209071343U (zh) * | 2018-12-18 | 2019-07-05 | 苏州阿特斯阳光电力科技有限公司 | 一种电池片的背面开槽结构及电池片 |
CN111029436A (zh) * | 2019-10-14 | 2020-04-17 | 中建材浚鑫科技有限公司 | 可改善LeTID现象的P型单晶PERC电池及其制作方法 |
CN211125676U (zh) * | 2019-11-29 | 2020-07-28 | 晋能光伏技术有限责任公司 | 一种背钝化激光开槽导电结构 |
CN111816714A (zh) * | 2020-07-28 | 2020-10-23 | 通威太阳能(眉山)有限公司 | 一种激光硼掺杂背钝化太阳能电池及其制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113571602A (zh) * | 2021-07-23 | 2021-10-29 | 横店集团东磁股份有限公司 | 一种二次扩散的选择性发射极及其制备方法和应用 |
CN115125510A (zh) * | 2022-06-22 | 2022-09-30 | 中威新能源(成都)有限公司 | 化学气相沉积方法、载具、电池片及异质结电池 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109994553B (zh) | 一种三层介电钝化膜perc太阳电池及制作工艺 | |
CN201699033U (zh) | 双面受光型晶体硅太阳能电池 | |
CN110880541A (zh) | 一种新结构n型晶硅PERT双面电池及其制备方法 | |
Wu et al. | Efficiency enhancement of bifacial PERC solar cells with laser‐doped selective emitter and double‐screen‐printed Al grid | |
CN102842646A (zh) | 一种基于n型衬底的ibc电池的制备方法 | |
CN209232797U (zh) | 硅基太阳能电池及光伏组件 | |
CN102683493A (zh) | N型晶体硅双面背接触太阳电池的制备方法 | |
CN105206699A (zh) | 一种背面结n型双面晶体硅电池及其制备方法 | |
CN113644142A (zh) | 一种具有钝化接触的太阳能电池及其制备方法 | |
CN102403369A (zh) | 一种用于太阳能电池的钝化介质膜 | |
CN100334744C (zh) | 一种硅太阳电池的结构与制作方法 | |
CN103632933A (zh) | N型硅片的硼扩散方法、晶体硅太阳能电池及其制作方法 | |
CN103632934A (zh) | N型硅片的硼扩散方法、晶体硅太阳能电池及其制作方法 | |
CN102916087B (zh) | 太阳能电池及其制作方法 | |
CN111816714A (zh) | 一种激光硼掺杂背钝化太阳能电池及其制备方法 | |
CN110034193A (zh) | 一种Topcon钝化结构的多细栅IBC电池及其制备方法 | |
CN115274913B (zh) | 一种带有钝化接触结构的ibc太阳电池的制备方法及电池、组件和系统 | |
CN110459638A (zh) | 一种Topcon钝化的IBC电池及其制备方法 | |
CN112510116A (zh) | 一种抗LeTID钝化接触太阳能电池及其生产工艺 | |
CN111952381B (zh) | 一种硅异质结太阳电池及其制备方法 | |
CN111524982A (zh) | 太阳电池 | |
CN109599456A (zh) | 一种perc二次印刷多晶太阳能电池片的制备方法 | |
US20230361227A1 (en) | Laminated passivation structure of solar cell and preparation method thereof | |
CN116864548A (zh) | 一种p型背结TOPCon电池及其制备方法 | |
CN111755563B (zh) | 一种p型单晶硅硼背场双面电池及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210316 |
|
RJ01 | Rejection of invention patent application after publication |