CN112080779B - Copper deposition system for high-frequency microwave circuit board and working method thereof - Google Patents
Copper deposition system for high-frequency microwave circuit board and working method thereof Download PDFInfo
- Publication number
- CN112080779B CN112080779B CN202010917354.8A CN202010917354A CN112080779B CN 112080779 B CN112080779 B CN 112080779B CN 202010917354 A CN202010917354 A CN 202010917354A CN 112080779 B CN112080779 B CN 112080779B
- Authority
- CN
- China
- Prior art keywords
- stirring
- copper deposition
- cleaning
- same structure
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 76
- 239000010949 copper Substances 0.000 title claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 230000008021 deposition Effects 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 62
- 238000004140 cleaning Methods 0.000 claims abstract description 53
- 239000002253 acid Substances 0.000 claims abstract description 46
- 238000007605 air drying Methods 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 27
- 238000005260 corrosion Methods 0.000 claims abstract description 26
- 230000007797 corrosion Effects 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005406 washing Methods 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 85
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 210000000078 claw Anatomy 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 7
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 2
- 239000002994 raw material Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 4
- 230000001133 acceleration Effects 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a copper deposition system for high-frequency microwaves and a working method thereof, wherein the copper deposition system comprises the following operation steps of S1, microwave oil removal; step S2, microwave water washing; step S3, micro-etching by microwave; step S4, removing acid by microwave; step S5, depositing copper by microwave; the invention has the advantages that the raw material plate is sequentially conveyed to the oil removing table, the cleaning table, the corrosion table, the acid removing table and the copper deposition air drying table through the conveying structure, the oil removing, the cleaning, the corrosion and the acid removing are more rapid and convenient through the ultrasonic vibration structure, and the dirt layer is dispersed, emulsified and stripped to achieve the cleaning purpose through the direct and indirect action of the cavitation action, the acceleration action and the direct current action of ultrasonic waves in liquid on the liquid and the dirt, so that the non-uniform effect is avoided.
Description
Technical Field
The invention relates to the technical field of electroplating copper deposition, in particular to a copper deposition system for high-frequency microwave and a working method thereof.
Background
At present, the running speed of electronic products is faster and higher, the frequency of the electronic products is higher and higher, the electronic products have entered the microwave stage, namely radio waves, the frequency of the microwave is higher than that of common radio waves, the electronic products have made many requirements on the electrical performance of the circuit board after entering the microwave stage, quality factors such as dielectric constant, characteristic impedance and the like, the electrical performance of the circuit board is determined by the circuit board substrate, copper deposition is a common name of chemical copper deposition, the purpose of copper deposition is to deposit a uniform conducting layer in the hole wall of a through hole on the PCB by utilizing the chemical principle, so that the originally insulated hole wall has conductivity, the subsequent board surface electroplating is facilitated, and the conduction between the PCB boards is realized. In the production process of the PCB, a copper deposition process is a key link of the production of the PCB, the quality of copper deposition is directly related to the performance of the PCB, and the cleaning liquid is easy to generate non-uniformity in the existing ultrasonic cleaning and oil removing processes, so that problems occur in the cleaning process.
Disclosure of Invention
The invention aims to solve the problems, designs a copper deposition system for high-frequency microwave and a working method thereof, and solves the problems of non-uniform oil removal, cleaning, corrosion and acid removal in the prior art.
The technical scheme of the invention for realizing the aim is as follows: a copper deposition working method for high-frequency microwave comprises the following operation steps of S1, microwave degreasing, S2, microwave water washing; step S3, micro-etching by microwave; step S4, removing acid by microwave; step S5, depositing copper by microwave;
the step S1: inserting the plate into an oil removing table, and cleaning the anti-rust oil on the outer side of the plate by using an oil removing agent in the ultrasonic vibration oil removing table;
the step S2: inserting the deoiled plate into a cleaning table, and simultaneously cleaning and dehumidifying the deoiling agent on the outer side of the plate by flowing water;
the step S3: inserting the cleaned plate into an etching table, and etching the oxide on the outer side of the plate by using etching liquid;
the step S4: cleaning and dehumidifying acid outside the plate by inserting the corroded plate into an acid removal table;
the step S5: and inserting the plate subjected to corrosion cleaning into a copper deposition air drying table, and electroplating copper to the outer side of the plate by an electroplating principle.
In step S3, the etching solution is a mixed solution of sulfuric acid and sodium persulfate.
In the step S3, the corrosion time is controlled to be between 1 and 3min, the temperature is controlled to be between 20 and 35 ℃, and the film is presoaked for a plurality of times.
Stirring structures are arranged in the oil removing table, the cleaning table and the acid removing table, ultrasonic vibration structures are arranged in the oil removing table, the cleaning table, the corrosion table, the acid removing table and the copper deposition air drying table, carrying structures are arranged on the oil removing table, the cleaning table, the corrosion table, the acid removing table and the copper deposition air drying table, and copper deposition air drying structures are arranged in the copper deposition air drying table;
the carrying structure comprises: the conveying device comprises a conveying support, a pair of conveying lead screw modules with the same structure, a conveying plate, a pair of telescopic hydraulic push rods with the same structure and a pair of conveying claws with the same structure;
the carrying support is arranged on the oil removing table, the cleaning table, the corrosion table, the acid removing table and the copper deposition air drying table, the carrying lead screw modules are horizontally arranged on the carrying support in parallel, the carrying plate is arranged on the moving ends of the carrying lead screw modules, the telescopic hydraulic push rods are arranged on the carrying plate, and the carrying claws are arranged on the pushing ends of the carrying hydraulic push rods.
The stirring structure includes: the stirring device comprises three stirring driving machines with the same structure, three stirring driving shafts with the same structure, a plurality of stirring blades with the same structure, a plurality of stirring gears with the same structure and three stirring chains with the same structure;
it is three the stirring driver installs respectively in removing oil platform, clean bench and deacidification bench, a plurality of the (mixing) shaft is respectively through bearing activity cartridge in removing oil platform, clean bench and deacidification bench, three the stirring drive shaft is respectively through bearing activity cartridge in removing oil platform, clean bench and deacidification bench, and three the stirring drive shaft is connected respectively in three on the stirring driver drive end, a plurality of the stirring leaf is installed respectively in a plurality of on (mixing) shaft and three on the stirring drive shaft, a plurality of the stirring gear is installed respectively in a plurality on the (mixing) shaft, it is three the stirring chain suit is in a plurality of respectively on the stirring gear.
The ultrasonic vibration structure includes: the ultrasonic vibration device comprises a plurality of concave limiting blocks with the same structure, a plurality of ultrasonic vibrators with the same structure, a plurality of limiting convex moving blocks with the same structure and a plurality of limiting springs with the same structure;
the ultrasonic vibrator is characterized in that a plurality of concave limiting blocks are respectively installed on two sides in an oil removing table, a cleaning table, an etching table, an acid removing table and a copper deposition air drying table, a plurality of ultrasonic vibrators are evenly installed on the oil removing table, the cleaning table, the etching table, the acid removing table and the copper deposition air drying table, a plurality of telescopic grooves with the same structure are respectively formed in the concave limiting blocks, a plurality of limiting springs are respectively installed in the telescopic grooves, a plurality of limiting convex moving blocks are respectively installed on the limiting springs, and a plurality of limiting convex moving blocks are respectively movably installed in the telescopic grooves.
The heavy copper air-dry structure contains: the lifting hydraulic push rods are arranged on the lifting hydraulic push rods and are connected with the lifting hydraulic push rods through a connecting rod;
the lifting support is installed on the copper deposition air drying table, the two pairs of lifting hydraulic push rods are installed on the lifting support, the square-shaped lifting plates are installed on the two pairs of lifting hydraulic push rod pushing ends, the metal rods are installed at the bottom ends of the square-shaped lifting plates, and the electric appliance box is installed on the square-shaped lifting plates.
And the plurality of concave limiting blocks, the plurality of convex limiting moving blocks and the plurality of limiting springs are provided with anticorrosive layers.
The plurality of limiting convex moving blocks are respectively provided with a moving slide block, and the plurality of telescopic grooves are respectively provided with a moving slide way.
And a sealing anti-corrosion pad is arranged on the limiting convex moving block.
According to the copper deposition system for the high-frequency microwave and the working method thereof, the raw material plate is sequentially conveyed into the oil removal table, the cleaning table, the corrosion table, the acid removal table and the copper deposition air drying table through the conveying structure, the oil removal, the cleaning, the corrosion and the acid removal are faster and more convenient through the ultrasonic vibration structure, and the dirt layer is dispersed, emulsified and stripped to achieve the cleaning purpose through the direct and indirect action of cavitation, acceleration and direct current action of ultrasonic waves in liquid and dirt, so that the uneven effect is avoided.
Drawings
Fig. 1 is a schematic structural view of a copper deposition system for high-frequency microwave and a working method thereof according to the present invention.
Fig. 2 is a schematic side view of the copper deposition system for high-frequency microwave and the working method thereof according to the present invention.
Fig. 3 is a schematic top view of the copper deposition system for high-frequency microwave and the working method thereof according to the present invention.
Fig. 4 is a schematic carrying structure diagram of the copper deposition system for high-frequency microwave and the working method thereof according to the present invention.
Fig. 5 is a schematic diagram of a stirring structure of the copper deposition system for high-frequency microwave and the working method thereof according to the present invention.
In the figure: 1-oil removal platform; 2-a washing table; 3-etching the platform; 4-acid removal table; 5-copper deposition air drying table; 6-carrying the bracket; 7-carrying lead screw module; 8-carrying plate; 9-carrying hydraulic push rods; 10-a stirring driver; 11-stirring drive shaft; 12-a stirring shaft; 13-stirring blade; 14-stirring gear; 15-stirring chains; 16-a concave stopper; 17-an ultrasonic vibrator; 18-limiting convex moving blocks; 19-a limit spring; 20-a metal rod; 21-an electrical box; 22-a lifting support; 23-lifting hydraulic push rod; 24-square lifting plate.
Detailed Description
The invention will be described in detail with reference to the accompanying drawings, and as shown in fig. 1-5, a copper deposition method for high-frequency microwave comprises the following steps of step S1, removing oil by microwave, step S2, washing by microwave water; step S3, micro-etching by microwave; step S4, removing acid by microwave; step S5, depositing copper by microwave; the step S1: inserting the plate into the oil removing table 1, and cleaning the anti-rust oil outside the plate by using the oil removing agent in the ultrasonic vibration oil removing table 1, wherein the step S2: inserting the degreased plate into the cleaning table 2, and simultaneously, flowing water to clean and dehumidify the degreasing agent on the outer side of the plate, wherein the step S3: inserting the cleaned plate into the etching table 3, and etching the oxide on the outer side of the plate by the etching solution, wherein the step S4: cleaning and dehumidifying the acid outside the sheet material by inserting the corroded sheet material into the acid removing table 4, the step S5: inserting the plate subjected to corrosion cleaning into a copper deposition air drying table 5, and electroplating copper to the outer side of the plate by an electroplating principle; the etching liquid medicine in the step S3 is a mixed solution of sulfuric acid and sodium persulfate; in the step S3, the corrosion time is controlled to be 1-3min, the temperature is controlled to be 20-35 ℃, and the film is presoaked for a plurality of times; stirring structures are arranged in the oil removing table 1, the cleaning table 2 and the acid removing table 4, ultrasonic vibration structures are arranged in the oil removing table 1, the cleaning table 2, the corrosion table 3, the acid removing table 4 and the copper deposition air drying table 5, conveying structures are arranged on the oil removing table 1, the cleaning table 2, the corrosion table 3, the acid removing table 4 and the copper deposition air drying table 5, and copper deposition air drying structures are arranged in the copper deposition air drying table 5; the carrying structure comprises: the conveying device comprises a conveying bracket 6, a pair of conveying lead screw modules 7 with the same structure, a conveying plate 8, a pair of conveying hydraulic push rods 9 with the same structure and a pair of conveying claws with the same structure; the conveying support 6 is arranged on the oil removing table 1, the cleaning table 2, the corrosion table 3, the acid removing table 4 and the copper deposition air drying table 5, the pair of conveying screw modules 7 are horizontally arranged on the conveying support 6 in parallel, the conveying plate 8 is arranged on the moving ends of the pair of conveying screw modules 7, the pair of conveying hydraulic push rods 9 is arranged on the conveying plate 8, and the pair of conveying claws is arranged on the pushing ends of the pair of conveying hydraulic push rods 9; the stirring structure includes: the stirring device comprises three stirring driving machines 10 with the same structure, three stirring driving shafts 11 with the same structure, a plurality of stirring shafts 12 with the same structure, a plurality of stirring blades 13 with the same structure, a plurality of stirring gears 14 with the same structure and three stirring chains 15 with the same structure; the three stirring drivers 10 are respectively installed on the oil removal platform 1, the cleaning platform 2 and the acid removal platform 4, the stirring shafts 12 are respectively movably inserted in the oil removal platform 1, the cleaning platform 2 and the acid removal platform 4 through bearings, the three stirring driving shafts 11 are respectively connected to driving ends of the three stirring drivers 10, the stirring blades 13 are respectively installed on the stirring shafts 12 and the three stirring driving shafts 11, the stirring gears 14 are respectively installed on the stirring shafts 12, and the stirring chains 15 are respectively sleeved on the stirring gears 14; the ultrasonic vibration structure includes: a plurality of concave limiting blocks 16 with the same structure, a plurality of ultrasonic vibrators 17 with the same structure, a plurality of limiting convex moving blocks 18 with the same structure and a plurality of limiting springs 19 with the same structure; the plurality of concave limiting blocks 16 are respectively installed on two sides in the oil removing table 1, the cleaning table 2, the corrosion table 3, the acid removing table 4 and the copper deposition air drying table 5, the plurality of ultrasonic vibrators 17 are uniformly installed on the oil removing table 1, the cleaning table 2, the corrosion table 3, the acid removing table 4 and the copper deposition air drying table 5, a plurality of telescopic grooves with the same structure are respectively formed in the plurality of concave limiting blocks 16, a plurality of limiting springs 19 are respectively installed in the plurality of telescopic grooves, a plurality of limiting convex moving blocks 18 are respectively installed on the plurality of limiting springs 19, and a plurality of limiting moving block convex blocks 18 are respectively movably installed in the plurality of telescopic grooves; the heavy copper air-dry structure contains: the lifting device comprises a plurality of metal rods 20 with the same structure, an electrical box 21, a lifting support 22, two pairs of lifting hydraulic push rods 23 with the same structure and a square lifting plate 24; the lifting support 22 is installed on the copper deposition air drying table 5, the two pairs of lifting hydraulic push rods 23 are installed on the lifting support 22, the square lifting plate 24 is installed on the pushing ends of the two pairs of lifting hydraulic push rods 23, the plurality of metal rods are installed at the bottom end of the square lifting plate 24, and the electrical box 21 is installed on the square lifting plate 24; an anticorrosive layer is arranged on the plurality of concave limiting blocks 16, the plurality of limiting convex moving blocks 18 and the plurality of limiting springs 19; a plurality of limiting convex moving blocks 18 are respectively provided with a moving slide block, and a plurality of telescopic grooves are respectively provided with a moving slide way; and a sealing anti-corrosion pad is arranged on the limiting convex moving block 18.
The method is characterized by comprising the following operation steps of S1, microwave oil removal, S2, microwave water washing; step S3, micro-etching by microwave; step S4, removing acid by microwave; step S5, depositing copper by microwave; step S1: inserting the plate into the oil removing table, and cleaning the anti-rust oil outside the plate by using the oil removing agent in the ultrasonic vibration oil removing table, wherein the step S2: inserting the deoiled plate into a cleaning table, and simultaneously, flowing water to clean and dehumidify the deoiling agent on the outer side of the plate, and the step S3: inserting the cleaned plate into an etching table, and etching the oxide on the outer side of the plate by using the etching solution, step S4: cleaning and dehumidifying the acid outside the plate by inserting the corroded plate into an acid removing table, and step S5: inserting the plate subjected to corrosion cleaning into a copper deposition air drying table, and electroplating copper to the outer side of the plate by an electroplating principle; has the beneficial effects.
All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.
Example (b): the conveying screw module 7 is driven to move horizontally by the conveying screw module 7, the conveying hydraulic push rods 9 on the conveying hydraulic push rods 9 are driven to move up and down by the telescopic ends of the conveying hydraulic push rods 9, the raw material plate is inserted into a pair of concave limit blocks 16 in an ultrasonic vibration structure on the oil removing table 1 in the oil removing table 1 by the pair of conveying claws, the raw material plate is extruded and fixed in the pair of concave limit blocks 16 by a plurality of convex limit moving blocks 18 in the pair of concave limit blocks 16, the stirring driving shaft 11 on the driving end of the stirring driving machine 10 is driven to rotate by the operation of the stirring driving machine 10 on the oil removing table 1, the stirring gear 14 on the stirring driving shaft 11 is driven to rotate by the stirring driving shaft 11, the stirring chain 15 on the stirring gear is driven to rotate by the stirring chain 15, and the stirring gear 14 on the stirring chain is driven to rotate by the stirring chain 15, the stirring shafts 12 on the stirring gears 14 are respectively driven to rotate through the stirring gears 14, the stirring blades 13 on the stirring shafts 11 are driven to rotate through the stirring driving shafts 11 and the stirring shafts 12, so that the oil removing liquid in the oil removing table 1 is uniformly stirred, and meanwhile, through the ultrasonic vibrator 17 on the oil removing table 1, the liquid and dirt are directly and indirectly acted through the cavitation action, the acceleration action and the direct-current action of ultrasonic waves in the liquid, so that the dirt layer is dispersed, emulsified and stripped to achieve the cleaning purpose. In the currently used ultrasonic cleaning machine, cavitation and direct current action are applied more, antirust oil on a plurality of raw material plates is cleaned, the cleaned raw material is conveyed to a plurality of concave limit blocks 16 in an ultrasonic vibration structure in a cleaning table 2 through a conveying structure, an oil removing agent on the raw material plates is cleaned through the ultrasonic vibration structure and a stirring structure, then the cleaned raw material is conveyed to a plurality of concave limit blocks 16 in the ultrasonic vibration structure of an ultrasonic vibration table 3 through the conveying structure, the raw material plates are corroded through a mixed solution of sulfuric acid and sodium persulfate, an oxide layer on the outer sides of the raw material plates is corroded, the corroded raw material is conveyed to an acid removing table 4 through the conveying structure, acid liquor on the raw material plates is cleaned, then the raw material plates are conveyed to a copper deposition air drying table 5 through the conveying structure, and the raw material plates are stretched through two pairs of lifting hydraulic push rods 23 on a lifting support 22, go up and down two pairs of hydraulic push rods 23 promotion end on the mouth style of calligraphy lifter plate 24, insert two pairs of metal bars 20 on the mouth style of calligraphy lifter plate 24 in heavy copper air-dries platform 5, produce the trace electricity through electrical apparatus box 21, transmit the trace electricity for two pairs of metal bars 20 on, dry the liquid in the platform 5 to heavy copper air-dries through two pairs of metal bars 20 and transmit electricity to reach and air-dry the interior raw material plate of platform 5 to heavy copper and electroplate.
The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications to some parts of the technical solutions by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.
Claims (6)
1. The copper deposition system for the high-frequency microwave is characterized by comprising an oil removal table (1), a cleaning table (2), a corrosion table (3), an acid removal table (4) and a copper deposition air drying table (5), wherein stirring structures are arranged in the oil removal table (1), the cleaning table (2) and the acid removal table (4), ultrasonic vibration structures are arranged in the oil removal table (1), the cleaning table (2), the corrosion table (3), the acid removal table (4) and the copper deposition air drying table (5), carrying structures are arranged on the oil removal table (1), the cleaning table (2), the corrosion table (3), the acid removal table (4) and the copper deposition air drying table (5), and a copper deposition air drying structure is arranged in the copper deposition air drying table (5);
the carrying structure comprises: the conveying device comprises a conveying bracket (6), a pair of conveying lead screw modules (7) with the same structure, a conveying plate (8), a pair of conveying hydraulic push rods (9) with the same structure and a pair of conveying claws with the same structure;
the conveying support (6) is arranged on the oil removing table (1), the cleaning table (2), the corrosion table (3), the acid removing table (4) and the copper deposition air drying table (5), a pair of conveying lead screw modules (7) are horizontally and parallelly arranged on the conveying support (6), the conveying plate (8) is arranged on the moving ends of the pair of conveying lead screw modules (7), a pair of conveying hydraulic push rods (9) is arranged on the conveying plate (8), and a pair of conveying claws is arranged on the pushing ends of the pair of conveying hydraulic push rods (9);
the stirring structure includes: the stirring device comprises three stirring driving machines (10) with the same structure, three stirring driving shafts (11) with the same structure, a plurality of stirring shafts (12) with the same structure, a plurality of stirring blades (13) with the same structure, a plurality of stirring gears (14) with the same structure and three stirring chains (15) with the same structure;
the three stirring driving machines (10) are respectively arranged on the oil removing platform (1), the cleaning platform (2) and the acid removing platform (4), the stirring shafts (12) are respectively movably inserted on the oil removing platform (1), the cleaning platform (2) and the acid removing platform (4) through bearings, the three stirring driving shafts (11) are respectively movably inserted on the oil removing platform (1), the cleaning platform (2) and the acid removing platform (4) through bearings, the three stirring driving shafts (11) are respectively connected to the driving ends of the three stirring driving machines (10), the stirring blades (13) are respectively arranged on the stirring shafts (12) and the three stirring driving shafts (11), the stirring gears (14) are respectively arranged on the stirring shafts (12), and the three stirring chains (15) are respectively sleeved on the stirring gears (14);
a plurality of concave limiting blocks (16) with the same structure, a plurality of ultrasonic vibrators (17) with the same structure, a plurality of limiting convex moving blocks (18) with the same structure and a plurality of limiting springs (19) with the same structure;
the ultrasonic vibration device comprises a plurality of concave limiting blocks (16), an ultrasonic vibrator, a plurality of limit springs (19), a plurality of limit convex moving blocks (18), a cleaning table (2), an etching table (3), an acid removal table (4) and a copper deposition air drying table (5), wherein the concave limiting blocks (16) are respectively arranged on two inner sides of the oil removal table (1), the cleaning table (2), the etching table (3), the acid removal table (4) and the copper deposition air drying table (5), the ultrasonic vibrator (17) is uniformly arranged on the oil removal table (1), the cleaning table (2), the etching table (3), the acid removal table (4) and the copper deposition air drying table (5), a plurality of telescopic grooves with the same structure are respectively formed in the concave limiting blocks (16), the limit springs (19) are respectively arranged in the telescopic grooves, the limit convex moving blocks (18) are respectively arranged on the limit springs (19), and the limit convex moving blocks (18) are respectively movably arranged in the telescopic grooves;
the heavy copper air-dry structure contains: a plurality of metal rods (20) with the same structure, an electrical box (21), a lifting bracket (22), two pairs of lifting hydraulic push rods (23) with the same structure and a square lifting plate (24);
the lifting support (22) is installed on the copper deposition air drying table (5), the two pairs of lifting hydraulic push rods (23) are installed on the lifting support (22), the square-shaped lifting plate (24) is installed on the pushing ends of the two pairs of lifting hydraulic push rods (23), the plurality of metal rods (20) are installed at the bottom end of the square-shaped lifting plate (24), and the electric appliance box (21) is installed on the square-shaped lifting plate (24);
the working method comprises the following operation steps of S1 microwave degreasing, S2 microwave water washing; step S3, micro-etching by microwave; step S4, removing acid by microwave; step S5, depositing copper by microwave;
the step S1: inserting the plate into the oil removing table (1), and cleaning the anti-rust oil outside the plate by using the oil removing agent in the ultrasonic vibration oil removing table (1);
the step S2: inserting the deoiled plate into a cleaning table (2), and simultaneously cleaning and dehumidifying the deoiling agent on the outer side of the plate by flowing water;
the step S3: inserting the cleaned plate into an etching table (3), and etching the oxide on the outer side of the plate by using etching liquid;
the step S4: the corroded board is inserted into an acid removal table (4) to clean and remove the acid on the outer side of the board;
the step S5: and inserting the plate subjected to corrosion cleaning into a copper deposition air drying table (5), and electroplating copper to the outer side of the plate by an electroplating principle.
2. The system for high-frequency microwave copper deposition according to claim 1, wherein the etching solution in step S3 is a mixed solution of sulfuric acid and sodium persulfate.
3. The electroless copper plating system for high frequency microwaves according to claim 1, wherein the etching time in step S3 is controlled to be 1-3min, the temperature is controlled to be 20-35 ℃, and the copper plating is performed for a plurality of times.
4. The copper deposition system for high-frequency microwaves according to claim 1, wherein an anticorrosive layer is arranged on a plurality of concave limiting blocks (16), a plurality of convex limiting moving blocks (18) and a plurality of limiting springs (19).
5. The copper deposition system for high-frequency microwaves as claimed in claim 4, wherein a plurality of the convex limiting moving blocks (18) are respectively provided with a moving sliding block, and a plurality of the telescopic grooves are respectively provided with a moving slideway.
6. The copper deposition system for high-frequency microwaves as claimed in claim 5, wherein the limiting convex moving block (18) is provided with a sealing anti-corrosion gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010917354.8A CN112080779B (en) | 2020-09-03 | 2020-09-03 | Copper deposition system for high-frequency microwave circuit board and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010917354.8A CN112080779B (en) | 2020-09-03 | 2020-09-03 | Copper deposition system for high-frequency microwave circuit board and working method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112080779A CN112080779A (en) | 2020-12-15 |
| CN112080779B true CN112080779B (en) | 2022-04-12 |
Family
ID=73731413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010917354.8A Expired - Fee Related CN112080779B (en) | 2020-09-03 | 2020-09-03 | Copper deposition system for high-frequency microwave circuit board and working method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112080779B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710010A (en) * | 2021-08-23 | 2021-11-26 | 广州广合科技股份有限公司 | Processing method for preventing copper deposition and copper surface of PCB from being rough |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050001029A (en) * | 2003-06-26 | 2005-01-06 | 영풍전자 주식회사 | Method for manufacturing double side a flexible printed circuit board |
| CN104213156A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT plate electroplating process |
| CN104378924A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | PCB two-sided copper deposition system |
| CN107592755A (en) * | 2017-09-07 | 2018-01-16 | 信丰文峰电子科技有限公司 | A kind of heavy copper method of the pcb board of high aspect ratio |
| CN109862710A (en) * | 2019-04-08 | 2019-06-07 | 四川锐宏电子科技有限公司 | A kind of pcb board thickness uniformly sinks process for copper and its device |
| CN209034998U (en) * | 2018-09-21 | 2019-06-28 | 赣州邦德电路科技有限公司 | A kind of pcb board processing heavy copper cash degreasing unit |
| CN209731732U (en) * | 2018-10-26 | 2019-12-03 | 江西荣晖电子有限公司 | PCB heavy copper cash oil removing ultrasonic activation slot |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100499008B1 (en) * | 2002-12-30 | 2005-07-01 | 삼성전기주식회사 | Two-sided PCB without via hole and the manufacturing method thereof |
| KR20140086523A (en) * | 2012-12-28 | 2014-07-08 | 삼성전기주식회사 | Printed circuit board having copper plated layer with roughness and producing method thereof |
-
2020
- 2020-09-03 CN CN202010917354.8A patent/CN112080779B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050001029A (en) * | 2003-06-26 | 2005-01-06 | 영풍전자 주식회사 | Method for manufacturing double side a flexible printed circuit board |
| CN104378924A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | PCB two-sided copper deposition system |
| CN104213156A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT plate electroplating process |
| CN107592755A (en) * | 2017-09-07 | 2018-01-16 | 信丰文峰电子科技有限公司 | A kind of heavy copper method of the pcb board of high aspect ratio |
| CN209034998U (en) * | 2018-09-21 | 2019-06-28 | 赣州邦德电路科技有限公司 | A kind of pcb board processing heavy copper cash degreasing unit |
| CN209731732U (en) * | 2018-10-26 | 2019-12-03 | 江西荣晖电子有限公司 | PCB heavy copper cash oil removing ultrasonic activation slot |
| CN109862710A (en) * | 2019-04-08 | 2019-06-07 | 四川锐宏电子科技有限公司 | A kind of pcb board thickness uniformly sinks process for copper and its device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112080779A (en) | 2020-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112080779B (en) | Copper deposition system for high-frequency microwave circuit board and working method thereof | |
| CN204295092U (en) | The automatic immersion tin device of terminal sleeve | |
| CN105297128A (en) | Horizontal electrolytic decoating line production device | |
| CN109862706B (en) | Circuit board printing process | |
| CN113969417B (en) | Electroplating method of circuit board and circuit board | |
| CN212640607U (en) | Copper deposition reminding system for high-frequency microwave circuit board | |
| CN101628288B (en) | Cleaning device and cleaning system | |
| CN210394578U (en) | Electroplating device for processing PCB (printed circuit board) | |
| CN102348335A (en) | Plugging device and circuit substrate plugging method | |
| CN104213170A (en) | Copper plating method for high-order high-density circuit board | |
| CN210609901U (en) | Cleaning machine | |
| CN113500051B (en) | Circuit board soldering tin removing device and method | |
| CN216752276U (en) | High-efficient immersion cleaning structure of circuit board | |
| CN216389269U (en) | Tin stripping device for semiconductor | |
| CN215713476U (en) | Vertical continuous nickel and gold electroplating equipment for PCB | |
| CN116356395A (en) | Automatic gold plating processing technology and device for flexible circuit board | |
| CN202841725U (en) | Printed circuit board processing equipment | |
| CN220468147U (en) | Equipment for improving gold plating efficiency | |
| CN220110912U (en) | Efficient electric heating blending kettle for heat conduction oil processing | |
| CN212463667U (en) | Vertical transmission equipment | |
| CN213342836U (en) | Industrial control circuit board processing device | |
| CN216606383U (en) | Film removing device | |
| CN215251317U (en) | Novel PCB plate surface gold plating equipment | |
| CN204836821U (en) | Circuit board moves back washes device | |
| CN102892254B (en) | Printed circuit board machining process and process equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220412 |