CN107592755A - A kind of heavy copper method of the pcb board of high aspect ratio - Google Patents
A kind of heavy copper method of the pcb board of high aspect ratio Download PDFInfo
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- CN107592755A CN107592755A CN201710801143.6A CN201710801143A CN107592755A CN 107592755 A CN107592755 A CN 107592755A CN 201710801143 A CN201710801143 A CN 201710801143A CN 107592755 A CN107592755 A CN 107592755A
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Abstract
The present invention relates to pcb board preparation field, and in particular to a kind of heavy copper method of the pcb board of high aspect ratio.The heavy copper method of the pcb board of the high aspect ratio includes：(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, (2) pcb board obtained by step (1) is subjected to the first copper-coating according to first pass, (3) pcb board obtained by step (2) is subjected to the second copper-coating according to second procedure, the pcb board obtained by step (3) is carried out plating Copper treatment by (4).By using the heavy copper method of the present invention, enable to the logical inner hole deposition copper coverage effect of the pcb board of high aspect ratio good so that the useless rate of final circuit plate hole failure to disclose is reduced.
Description
Technical field
The present invention relates to pcb board preparation field, and in particular to a kind of heavy copper method of the pcb board of high aspect ratio.
Background technology
Pcb board is after drilling, to make circuit mutual conduction between each layer, is formed by heavy copper process on hole wall one layer thin
Copper is next conductive, hole wall copper thickness is increased into required value by way of plating, to reach the good conducting of each sandwich circuit.
With PCB high speed developments, thickness of slab is increasing, design hole aperture be intended to it is less and less, for aspect ratio >=
8:For 1 high aspect ratio wiring board, in heavy copper process, bubble is too difficult in hole drives out of with fresh drug shipwreck to be handed in access aperture
Change, have influence on heavy copper layers of copper coverage rate in hole, locally cause wiring board to scrap problem without copper so as to produce in hole.
The content of the invention
It is an object of the invention to for existing high aspect ratio pcb board sink process for copper existing for due in hole bubble it is too difficult
Drive out of with fresh drug shipwreck with circuit plate hole failure to disclose caused by being exchanged in access aperture give up rate it is high the defects of, there is provided it is a kind of
Pcb board inner hole deposition copper covers the heavy copper method of the pcb board of the low high aspect ratio of the useless rate of good circuit plate hole failure to disclose.
To achieve these goals, one aspect of the present invention provides a kind of heavy copper method of the pcb board of high aspect ratio, this method
Including：
(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, wherein, the pcb board is in length and breadth
Than for 8：More than 1；
(2) pcb board obtained by step (1) is subjected to the first copper-coating according to first pass, the first pass is：Remove
It is heavy that oil-washing-microetch-washing-first presoaks the chemistry of the-the first activation-washing-first acceleration-washing-first
Copper-washing；
(3) pcb board obtained by step (2) is subjected to the second copper-coating according to first pass, the second procedure is：The
Two preimpregnation the-the second activation-washing-second acceleration-washing-second electroless copper plating-washing-lower plates；
(4) pcb board obtained by step (3) is subjected to plating Copper treatment.
By using the heavy copper method of the present invention, the logical inner hole deposition copper coverage effect of the pcb board of high aspect ratio is enabled to
Well so that the useless rate of final circuit plate hole failure to disclose is reduced；Particularly, method of the invention can be realized is turned into automatically
Industry, it is easy to industrialize.
Embodiment
The end points of disclosed scope and any value are not limited to the accurate scope or value herein, these scopes or
Value should be understood to comprising the value close to these scopes or value.For number range, between the endpoint value of each scope, respectively
It can be combined with each other between the endpoint value of individual scope and single point value, and individually between point value and obtain one or more
New number range, these number ranges should be considered as specific open herein.
One aspect of the present invention provides a kind of heavy copper method of the pcb board of high aspect ratio, and this method includes：
(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, wherein, the pcb board is in length and breadth
Than for 8：More than 1；
(2) pcb board obtained by step (1) is subjected to the first copper-coating according to first pass, the first pass is：Remove
It is heavy that oil-washing-microetch-washing-first presoaks the chemistry of the-the first activation-washing-first acceleration-washing-first
Copper-washing；
(3) pcb board obtained by step (2) is subjected to the second copper-coating according to first pass, the second procedure is：The
Two preimpregnation the-the second activation-washing-second acceleration-washing-second electroless copper plating-washing-lower plates；
(4) pcb board obtained by step (3) is subjected to plating Copper treatment.
According to the present invention, method of the invention using sinking by the way of copper+once electroplate twice, compared to once sinking copper+one
For the existing process of secondary plating, method of the invention effectively avoids high aspect ratio pcb board during heavy copper in caused hole
Bubble and fresh drug shipwreck are with having no copper in the holes caused by being exchanged in access aperture, the problem of causing wiring board to scrap；In addition, with showing
Some once compare by+electric plating of whole board of heavy copper+secondary heavy copper+secondary electric plating of whole board, saves one of electric plating of whole board process, carries
High efficiency.
According to the present invention, the pcb board can be the conventional various pcb boards in this area, and the present invention has no special to this
Limit.The method of the present invention is directed to aspect ratio as 8：More than 1, preferably 8：1 to 15：1, preferably 8：1 to 12：1 PCB
Plate.Here, the aspect ratio refers to the ratio of pcb board thickness and minimum-value aperture.
In accordance with the present invention it is preferred that in step (1), the drilling processing make it that it is 0.1- that aperture is formed on the pcb board
0.5mm through hole.Drilling processing can use the conventional drilling technique in this area to realize that the present invention has no special limit to this
It is fixed.
According to the present invention, nog plate processing be in order to which the flash around the through hole after drilling is handled polishes, it is described to remove
Glue residue processing is in order to which the glue residue that will be remained on pcb board after drilling removes.Both processing can use the routine of this area
Method is carried out, and there is no particular limitation to this by the present invention.
According to the present invention, the purpose of step (2) is for layers of copper (i.e. in chemical deposition in the through hole that forms pcb board
One layers of copper), first copper-coating is using first pass, i.e. oil removing-washing-preimpregnation of microetch-washing-first-the
One activation-washing-the first acceleration-washing-the first electroless copper plating-washing.
Wherein, the oil removing is to remove the greasy dirt and grease on PCB.The process of the oil removing can use this area normal
The methods of rule is carried out, such as pcb board is soaked in degreaser, and the degreaser can be alkaline solution, it is of the invention to this simultaneously
Limited without special.The condition of the oil removing preferably includes：Time is 5-10min (preferably 5-8min), and temperature is 50-70 DEG C
(preferably 55-65 DEG C).
Wherein, the washing after the oil removing is to remove alkaline solution remained on pcb board etc., and the water-washing process can be with
For the conventional water-washing process in this area, there is no particular limitation to this by the present invention.
Wherein, ensuing microetch be in order to remove the degreaser that is remained on pcb board and roughening copper face, improve chemical copper with
The adhesion of base material copper.The process of the microetch can be that pcb board is soaked in etching decoction, the etching that the microetch uses
Decoction is preferably that (content of sulfuric acid for example can be 2-8 weight %, and sodium peroxydisulfate contains for the mixed solution of sulfuric acid and sodium peroxydisulfate
Amount for example can be 6-15 weight %).Preferably, the condition of the microetch includes：Time is that 1-3min (is, for example, 1-
1.5min), temperature is 20-35 DEG C (being, for example, 24-32 DEG C).
Wherein, need to be washed again after the microetch, to remove etching decoction remained on pcb board etc..This is water washed
Journey can be the conventional water-washing process in this area, and there is no particular limitation to this by the present invention.
Wherein, first preimpregnation is that upper oxidation material is impregnated on pcb board in order that obtaining, in order to avoid lived to ensuing first
The activation decoction of change pollutes.Therefore, first preimpregnation can be that pcb board is soaked in preimpregnation decoction, preimpregnation decoction is excellent
Electing the mixed solution of hydrochloric acid and sodium chloride as, (content of hydrochloric acid for example can be 2-8 weight %, and the content of sodium chloride for example can be with
For 10-30 weight %).Preferably, the condition of first preimpregnation includes：Time is 1-5min (be, for example, 1-3min), temperature
For 20-35 DEG C.
Wherein, first activation is to enclose palladium catalyst in order that obtaining in the through hole of pcb board, so as to be catalyzed then
Electroless copper plating process.Wherein, first activation can be that pcb board is soaked in activation decoction, and the activation decoction can be with
For the conventional various activation decoctions in this area, there is no particular limitation to this by the present invention.Preferably, the condition of first activation
Including：Time is 5-10min (preferably 6-8min), and temperature is 35-45 DEG C (being preferably 38-42 DEG C).
Wherein, the first activation needs are washed, to remove activation decoction remained on pcb board face etc., the water
Washed journey can be the conventional water-washing process in this area, and there is no particular limitation to this by the present invention.
Wherein, described first accelerates to be to take off the peptization of colloid palladium using degumming agent, palladium core is exposed the purpose of sample.
Preferably, the described first condition accelerated includes：Time is 2-5min (preferably 2-4min), and temperature is 35-45 DEG C and (is preferably
38-42℃)。
Wherein, need to be washed after first acceleration, to remove the liquid medicine of the residual on pcb board.This is water washed
Journey can be the conventional water-washing process in this area, and there is no particular limitation to this by the present invention.
Wherein, first electroless copper plating is preferably so that form the copper that thickness is 0.6-1.2 μm in the through hole of the pcb board
Layer.The first electroless copper plating process can be that pcb board is soaked in copper salt solution, in the presence of palladium catalyst, in through hole
Interior formation layers of copper.Mantoquita in the copper salt solution is preferably copper sulphate, and the concentration copper ion of preferably described copper salt solution contains
Measure as 1.5-2.5g/L.Preferably, the condition of first electroless copper plating includes：Time is 15-20min, and temperature is 25-35 DEG C
(being preferably 28-32 DEG C).
Wherein, need to be washed after first electroless copper plating, to remove the copper salt solution and PCB that remain on pcb board
Copper ashes that may be present in plate face.
According to the present invention, the pcb board in step (3) as obtained by by step (2) carries out secondary heavy copper so that pcb board
Chemical deposition forms the second layers of copper again in through hole.In second copper-coating, unlike the first copper-coating, this is second heavy
Copper treatment does not carry out the process of " oil removing-washing-microetch-washing " before preimpregnation, so can cause circuit plate hole not
Logical scrappage is lower.
Wherein, the process of second preimpregnation can be similar to the first prepreg process, and it is to be impregnated in order that obtaining on pcb board
The alkaline matter of upper oxide and residual, in order to avoid the activation decoction of the ensuing second activation is polluted.Therefore, this second
Preimpregnation can be that pcb board is soaked in preimpregnation decoction, and the preimpregnation decoction is as described above, can be used with the first preimpregnation
Preimpregnation decoction it is identical or different.Preferably, the condition of second preimpregnation includes：Time is that 1-5min (is, for example, 1-
3min), temperature is 20-35 DEG C.
Wherein, the process of second activation can be similar to the first activation process, and it is in order that obtaining the through hole of pcb board
Palladium catalyst is inside enclosed, so as to be catalyzed subsequent electroless copper plating process.Wherein, second activation can be by pcb board
It is soaked in activation decoction, the activation decoction is as described above, can be identical with the activation decoction that the first activation uses.It is excellent
Selection of land, the condition of second activation include：Time is 5-10min (preferably 6-8min), and it (is preferably 38- that temperature, which is 35-45 DEG C,
42℃)。
Wherein, the second activation needs are washed, to remove activation decoction remained on pcb board face etc., the water
Washed journey can be the conventional water-washing process in this area, and there is no particular limitation to this by the present invention.
Wherein, the described second process accelerated can be similar to the first accelerator, and it is colloid palladium using degumming agent
Peptization take off, palladium core is exposed the purpose of sample.Preferably, the described first condition accelerated includes：Time is that 2-5min is (excellent
Select 2-4min), temperature is 35-45 DEG C (being preferably 38-42 DEG C).
Wherein, need to be washed after second acceleration, to remove the liquid medicine of the residual on pcb board.This is water washed
Journey can be the conventional water-washing process in this area, and there is no particular limitation to this by the present invention.
Wherein, second electroless copper plating is preferably so that the thickness of layers of copper increases 0.6-1.2 μ in the through hole of the pcb board
m；Namely it is as described above, the first electroless copper plating to form the first layers of copper that thickness is 0.6-1.2 μm in the through hole of pcb board,
Second electroless copper plating to form the second layers of copper that thickness is 0.6-1.2 μm in the first layers of copper in the through hole of pcb board.And
And, it is often more important that, second copper-coating can copper that first time is heavy when because in bubble in hole and hole fresh drug shipwreck to enter
Caused by the heavy upper copper in local having no copper in the holes region.
The second electroless copper plating process is similar with the first electroless copper plating process, and it can be that pcb board is soaked in into mantoquita is molten
In liquid, in the presence of palladium catalyst, layers of copper is formed in through hole.The copper salt solution is as described in above, and this second
Electroless copper plating is identical with the copper salt solution that the first electroless copper plating uses.Preferably, the condition of second electroless copper plating includes：When
Between be 15-20min, temperature is 25-35 DEG C (being preferably 28-32 DEG C).
Wherein, need to be washed after second electroless copper plating, to remove the copper salt solution remained on pcb board.
According to the present invention, in step (4), by electroplate Copper treatment can the copper layer thickness of pcb board further increase,
It is preferred that carry out electric plating of whole board.The condition of the plating Copper treatment can suitably be adjusted according to required copper layer thickness, such as
It can include：Current density is 2.5-4.5ASD, electroplating time 8-20min.
The present invention will be described in detail by way of examples below.
In following examples and comparative example：
Circuit plate hole failure to disclose rate of giving up refers to that two sides conducts the pcb board quantity of failure and accounts for the percentage of total pcb board quantity.
Embodiment 1
The embodiment is used for the heavy copper method for illustrating the pcb board of the high aspect ratio of the present invention.
(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, wherein, the pcb board of gained leads to
Hole aperture is 0.2mm, and the aspect ratio of the pcb board is 8：1；
(2) it is according to flow by the pcb board obtained by step (1)：Oil removing-washing-the preimpregnation of microetch-washing-first-
First activation-washing-the first acceleration-washing-the first electroless copper plating-washing is to be handled, so as to obtain logical inner hole deposition
Product has pcb board of the thickness for 0.8 μm of layers of copper；
Wherein, the process of oil removing be by pcb board be soaked in degreaser (be purchased from Shenzhen Bei Jia Electron Material Co., Ltd, with
In similarly hereinafter), the condition of oil removing includes：Time is 6min, and temperature is 60 DEG C；
In order pcb board is soaked in into etching decoction, (mixed solution of sulfuric acid and sodium peroxydisulfate, sulfuric acid content are the process of microetch
5 weight %, sodium peroxydisulfate content is 10 weight %, as follows) in, the condition of microetch includes：Time is 1.5min, temperature 30
℃；
The process of first preimpregnation is that pcb board is soaked in into preimpregnation decoction (mixed solution of hydrochloric acid and sodium chloride, content of hydrochloric acid
For 5 weight %, the content of sodium chloride is 25 weight %, as follows) in, the condition of the first preimpregnation includes：Time is 2min, temperature
For room temperature (about 25 DEG C)；
First activation process be by pcb board be soaked in activation decoction (be purchased from Shenzhen Bei Jia Electron Material Co., Ltd, with
In similarly hereinafter), the condition of the first activation includes：Time is 8min, and temperature is 40 DEG C；
First process accelerated is colloid using degumming agent (being purchased from Shenzhen Bei Jia Electron Material Co., Ltd, as follows)
The peptization of palladium is taken off, and exposes palladium core, and the first condition accelerated includes：Time is 2.5min, and temperature is 40 DEG C；
For the process of first electroless copper plating for pcb board is soaked in copper salt solution, used copper salt solution is copper sulphate
The aqueous solution (content of copper ion 5g/L, as follows) of salt, the condition of the first electroless copper plating includes：Time is 18min, and temperature is
30℃；
(3) it is according to flow by the pcb board obtained by step (2)：Second preimpregnation the-the second activation-washing-the second adds
Speed-washing-the second electroless copper plating-washing-lower plate；It is 1.6 so as to obtain deposition in through hole to have gross thickness to be handled
The pcb board of μm layers of copper；
Wherein, the process of the second preimpregnation is that pcb board is soaked in preimpregnation decoction, and the condition of the second preimpregnation includes：Time
For 2min, temperature is room temperature (about 25 DEG C)；
The process of second activation is that pcb board is soaked in activation decoction, and the condition of the second activation includes：Time is
6min, temperature are 40 DEG C；
Second process accelerated is that the peptization of colloid palladium is taken off using degumming agent, exposes palladium core, the second acceleration
Condition includes：Time is 2.5min, and temperature is 40 DEG C；
For the process of second electroless copper plating for pcb board is soaked in copper salt solution, used copper salt solution is copper sulphate
The aqueous solution (content of copper ion 5g/L, as follows) of salt, the condition of the second electroless copper plating includes：Time is 18min, and temperature is
30℃；
(4) pcb board obtained by step (3) is subjected to electric plating of whole board Copper treatment, the condition of the plating Copper treatment includes：Electric current
Density 3.8ASD, electroplating time 10min.So as to which the gross thickness of layers of copper in the through hole of gained pcb board is 8 μm.According to the embodiment
Same method, carry out 100 experiments, the through hole of pcb board for determining gained conducts situation, obstructed to obtain circuit plate hole
Scrappage, its result are as shown in table 1.
Embodiment 2
The embodiment is used for the heavy copper method for illustrating the pcb board of the high aspect ratio of the present invention.
(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, wherein, the pcb board of gained leads to
Hole aperture is 0.2mm, and the aspect ratio of the pcb board is 12：1；
(2) it is according to flow by the pcb board obtained by step (1)：Oil removing-washing-the preimpregnation of microetch-washing-first-
First activation-washing-the first acceleration-washing-the first electroless copper plating-washing is to be handled, so as to obtain logical inner hole deposition
Product has pcb board of the thickness for 1 μm of layers of copper；
Wherein, the process of oil removing be by pcb board be soaked in degreaser (be purchased from Shenzhen Bei Jia Electron Material Co., Ltd, with
In similarly hereinafter), the condition of oil removing includes：Time is 7min, and temperature is 60 DEG C；
The process of microetch is that pcb board is soaked in etching decoction, and the condition of microetch includes：Time is 2min, and temperature is
28℃；
The process of first preimpregnation is that pcb board is soaked in preimpregnation decoction, and the condition of the first preimpregnation includes：Time is
2.5min, temperature are room temperature (about 25 DEG C)；
First activation process be by pcb board be soaked in activation decoction (in, first activation condition include：Time is
7min, temperature are 45 DEG C；
First process accelerated is that the peptization of colloid palladium is taken off using degumming agent, exposes palladium core, the first acceleration
Condition includes：Time is 3min, and temperature is 41 DEG C；
For the process of first electroless copper plating for pcb board is soaked in copper salt solution, used copper salt solution is copper content
The about 2g/l aqueous solution, the condition of the first electroless copper plating include：Time is 20min, and temperature is 32 DEG C；
(3) it is according to flow by the pcb board obtained by step (2)：Second preimpregnation the-the second activation-washing-the second adds
Speed-washing-the second electroless copper plating-washing-lower plate；It is 1.8 so as to obtain deposition in through hole to have gross thickness to be handled
The pcb board of μm layers of copper；
Wherein, the process of the second preimpregnation is that pcb board is soaked in preimpregnation decoction, and the condition of the second preimpregnation includes：Time
For 3min, temperature is room temperature (about 25 DEG C)；
The process of second activation is that pcb board is soaked in activation decoction, and the condition of the second activation includes：Time is
7min, temperature are 39 DEG C；
Second process accelerated is that the peptization of colloid palladium is taken off using degumming agent, exposes palladium core, the second acceleration
Condition includes：Time is 2min, and temperature is 45 DEG C；
For the process of second electroless copper plating for pcb board is soaked in copper salt solution, used copper salt solution is copper sulphate
The aqueous solution of salt, the condition of the second electroless copper plating include：Time is 20min, and temperature is 29 DEG C；
(4) pcb board obtained by step (3) is subjected to electric plating of whole board Copper treatment, the condition of the plating Copper treatment includes：Electric current
Density 3.8ASD, electroplating time 10min.So as to which the gross thickness of layers of copper in the through hole of gained pcb board is 8 μm.According to the embodiment
Same method, carry out 100 experiments, the through hole of pcb board for determining gained conducts situation, obstructed to obtain circuit plate hole
Scrappage, its result are as shown in table 1.
Embodiment 3
The embodiment is used for the heavy copper method for illustrating the pcb board of the high aspect ratio of the present invention.
According to the method described in embodiment 1, the difference is that, the condition of the first electroless copper plating includes：Time is 25min, temperature
Spend for 35 DEG C, deposition in through hole is obtained after the first electroless copper plating pcb board of the thickness for 1.5 μm of layers of copper；Second electroless copper plating
Condition include：Time is 12min, and temperature is 25 DEG C, and it is 1.6 that deposition in through hole is obtained after the second electroless copper plating gross thickness
The pcb board of μm layers of copper；
After each step, the gross thickness of layers of copper is 8 μm in the through hole of gained pcb board.According to the same of the embodiment
Method, carry out 100 experiments, the through hole of pcb board for determining gained conducts situation, given up to obtain circuit plate hole failure to disclose
Rate, its result are as shown in table 1.
Embodiment 4
The embodiment is used for the heavy copper method for illustrating the pcb board of the high aspect ratio of the present invention.
According to the method described in embodiment 1, the difference is that, the condition of the first electroless copper plating includes：Time is 10min, temperature
Spend for 25 DEG C, deposition in through hole is obtained after the first electroless copper plating pcb board of the thickness for 0.2 μm of layers of copper；Second electroless copper plating
Condition include：Time is 30min, and temperature is 35 DEG C, and it is 1.6 that deposition in through hole is obtained after the second electroless copper plating gross thickness
The pcb board of μm layers of copper；
After each step, the gross thickness of layers of copper is 8 μm in the through hole of gained pcb board.According to the same of the embodiment
Method, carry out 100 experiments, the through hole of pcb board for determining gained conducts situation, given up to obtain circuit plate hole failure to disclose
Rate, its result are as shown in table 1.
Comparative example 1
According to the method for embodiment 1, the difference is that, without step (3), but step is directly carried out afterwards in step (2)
(4), but it is by the condition setting of the first electroless copper plating：Time is 30min, and temperature is 38 DEG C, so as to obtain being deposited in through hole
There is pcb board of the gross thickness for 1.6 μm of layers of copper；
After each step, the gross thickness of layers of copper is 8 μm in the through hole of gained pcb board.According to the same of the embodiment
Method, carry out 100 experiments, the through hole of pcb board for determining gained conducts situation, given up to obtain circuit plate hole failure to disclose
Rate, its result are as shown in table 1.
Table 1
| The failure to disclose of circuit plate hole is given up rate | |
| Embodiment 1 | 0.5% |
| Embodiment 2 | 0.8% |
| Embodiment 3 | 2% |
| Embodiment 4 | 3.5% |
| Comparative example 1 | 10% |
The preferred embodiment of the present invention described in detail above, still, the present invention is not limited thereto.In the skill of the present invention
In art concept, technical scheme can be carried out a variety of simple variants, including each technical characteristic with it is any its
Its suitable method is combined, and these simple variants and combination should equally be considered as content disclosed in this invention, belong to
Protection scope of the present invention.
Claims (10)
1. a kind of heavy copper method of the pcb board of high aspect ratio, it is characterised in that this method includes：
(1) pcb board is carried out to drilling processing, nog plate processing and removing glue Slag treatment successively, wherein, the aspect ratio of the pcb board is
8：More than 1；
(2) pcb board obtained by step (1) is subjected to the first copper-coating according to first pass, the first pass is：Oil removing-
Washing-microetch-washing-first presoaks the-the first activation-washing-first acceleration-washing-first electroless copper plating-water
Wash；
(3) pcb board obtained by step (2) is subjected to the second copper-coating according to second procedure, the second procedure is：Second is pre-
Soak the-the second activation-washing-second acceleration-washing-second electroless copper plating-washing-lower plate；
(4) pcb board obtained by step (3) is subjected to plating Copper treatment.
2. according to the method for claim 1, wherein, in step (1), the aspect ratio of the pcb board is 8：1 to 15：1, it is excellent
Elect 8 as：1 to 12：1.
3. method according to claim 1 or 2, wherein, in step (1), the drilling processing causes shape on the pcb board
Into the through hole that aperture is 0.1-0.5mm.
4. according to the method described in any one in claim 1-3, wherein, the etching decoction that the microetch uses for sulfuric acid and
The mixed solution of sodium peroxydisulfate；
Preferably, the condition of the microetch includes：Time is 1-3min, and temperature is 20-35 DEG C.
5. according to the method described in any one in claim 1-4, wherein, first preimpregnation and the second preimpregnation use pre-
Leaching decoction is identical or different, and the preimpregnation decoction is the mixed solution of hydrochloric acid and sodium chloride；
Preferably, the condition of first preimpregnation includes：Time is 1-5min, and temperature is 20-35 DEG C；
Preferably, the condition of second preimpregnation includes：Time is 1-5min, and temperature is 20-35 DEG C.
6. according to the method described in any one in claim 1-5, wherein, the condition of first activation includes：Time is
5-10min, temperature are 35-45 DEG C；
The condition of second activation includes：Time is 5-10min, and temperature is 35-45 DEG C.
7. according to the method described in any one in claim 1-6, wherein, the described first condition accelerated includes：Time is
2-5min, temperature are 35-45 DEG C；
Described second condition accelerated includes：Time is 2-5min, and temperature is 35-45 DEG C.
8. according to the method described in any one in claim 1-7, wherein, first electroless copper plating causes the pcb board
Through hole in form thickness be 0.6-1.2 μm of layers of copper；
Preferably, the condition of first electroless copper plating includes：Time is 15-20min, and temperature is 25-35 DEG C.
9. according to the method described in any one in claim 1-8, wherein, second electroless copper plating causes the pcb board
Through hole in layers of copper thickness increase 0.6-1.2 μm；
The condition of second electroless copper plating includes：Time is 15-20min, and temperature is 25-35 DEG C.
10. according to the method described in any one in claim 1-9, wherein, in step (4), the bar of the plating Copper treatment
Part includes：Current density is 2.5-4.5ASD, electroplating time 8-20min.
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| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN109413873A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Ameliorative way of the high aspect ratio PCB aperture without copper |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN110306214A (en) * | 2019-07-05 | 2019-10-08 | 东莞市斯坦得电子材料有限公司 | A kind of reverse impulse copper-plating technique for high aspect ratio aperture printed wiring board the electroplates in hole |
| CN111511116A (en) * | 2020-04-15 | 2020-08-07 | 苏州市杰煜电子有限公司 | High-precision FPC flexible circuit board manufacturing process |
| CN112080779A (en) * | 2020-09-03 | 2020-12-15 | 四川易莱腾电子科技有限公司 | Copper deposition system for high-frequency microwave and working method thereof |
| CN113301729A (en) * | 2021-05-31 | 2021-08-24 | 枣庄睿诺光电信息有限公司 | Manufacturing method of circuit board |
| CN116095985A (en) * | 2022-12-19 | 2023-05-09 | 景旺电子科技(龙川)有限公司 | Back drilling method of printed circuit board and printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN109413873A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Ameliorative way of the high aspect ratio PCB aperture without copper |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN110306214A (en) * | 2019-07-05 | 2019-10-08 | 东莞市斯坦得电子材料有限公司 | A kind of reverse impulse copper-plating technique for high aspect ratio aperture printed wiring board the electroplates in hole |
| CN111511116A (en) * | 2020-04-15 | 2020-08-07 | 苏州市杰煜电子有限公司 | High-precision FPC flexible circuit board manufacturing process |
| CN111511116B (en) * | 2020-04-15 | 2023-06-30 | 苏州市杰煜电子有限公司 | Manufacturing process of high-precision FPC (Flexible printed Circuit) |
| CN112080779A (en) * | 2020-09-03 | 2020-12-15 | 四川易莱腾电子科技有限公司 | Copper deposition system for high-frequency microwave and working method thereof |
| CN112080779B (en) * | 2020-09-03 | 2022-04-12 | 四川易莱腾电子科技有限公司 | Copper deposition system for high-frequency microwave circuit board and working method thereof |
| CN113301729A (en) * | 2021-05-31 | 2021-08-24 | 枣庄睿诺光电信息有限公司 | Manufacturing method of circuit board |
| CN116095985A (en) * | 2022-12-19 | 2023-05-09 | 景旺电子科技(龙川)有限公司 | Back drilling method of printed circuit board and printed circuit board |
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