CN112004315A - PCB and special-shaped bonding pad structure suitable for BGA chip thereof - Google Patents
PCB and special-shaped bonding pad structure suitable for BGA chip thereof Download PDFInfo
- Publication number
- CN112004315A CN112004315A CN202010850191.6A CN202010850191A CN112004315A CN 112004315 A CN112004315 A CN 112004315A CN 202010850191 A CN202010850191 A CN 202010850191A CN 112004315 A CN112004315 A CN 112004315A
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- special
- bonding pad
- shaped bonding
- structure suitable
- pad structure
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- 238000009826 distribution Methods 0.000 claims abstract description 7
- 206010066054 Dysmorphism Diseases 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 15
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003860 storage Methods 0.000 description 2
- 101100406366 Caenorhabditis elegans pad-2 gene Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a special-shaped bonding pad structure suitable for a BGA chip, which comprises a PCB substrate and a plurality of special-shaped bonding pads arranged on the surface of the PCB substrate in an array distribution, wherein a notch for reserving a routing avoiding space is arranged on one side of each special-shaped bonding pad facing a routing channel. According to the special-shaped bonding pad structure suitable for the BGA chip, the lack edges are formed on the special-shaped bonding pads, namely, a small part of area is marked on the edge of the existing circular bonding pad to serve as the compensation area of the routing channel, so that the routing distance between the bonding pads can be increased on the basis of reducing the area of the bonding pads as small as possible. Therefore, the invention can ensure that the bonding pads have proper routing space, avoid the influence of signal crosstalk and avoid the loss of excessive bonding pad area. The invention also discloses a PCB, which has the beneficial effects as described above.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a special-shaped bonding pad structure suitable for a BGA chip. The invention also relates to a PCB board.
Background
With the development of the electronic technology in China, more and more electronic devices have been widely used.
Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application program server, a WEB server and the like according to different service types provided by the server.
In the big data era, a large number of IT devices are centrally located in a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each IT device is composed of various hardware board cards, such as a computing module, a memory module, a storage module, a chassis and the like.
With the development of cloud computing applications, informatization gradually covers various fields of society. People's daily life more and more exchanges through the network, and the network data volume is also constantly increasing, also higher to the performance requirement of server, and the consumption is higher and higher, and the circuit on the PCB integrated circuit board is more and more complicated.
In PCB design, BGA (Ball Grid Array) packaged chips are heavily used in server boards to reduce space occupation. When the chip is installed, the back surface of the chip needs to be attached to the surface of the PCB substrate, and then in the welding process, the solder balls on the back surface of the chip are melted in the welding process and are tiled on the bonding pads, so that the chip is welded and connected with the PCB substrate.
The BGA package is more and more integrated and miniaturized at present, the distance between every two bonding pads is 1mm, 0.8mm, 0.5mm and the like, the smaller size results are that the design and the production manufacture are more and more bottlenecks, the line width between the bonding pads is thinner and thinner, and the distance between the lines and the bonding pads is smaller and smaller. Present BGA encapsulation pad is circular, and the interval of pad is less, and the line space of walking between the pad is not enough, causes the influence aggravation of crosstalking between the signal, and the PCB board is difficult to guarantee production quality man-hour, and the design is disjointed mutually with production, does not compromise each other.
Therefore, how to ensure that the pads have a proper routing space therebetween, avoid the influence of signal crosstalk, and avoid the loss of excessive pad area is a technical problem faced by those skilled in the art.
Disclosure of Invention
The invention aims to provide a special-shaped bonding pad structure suitable for a BGA chip, which can ensure that a proper routing space is formed between bonding pads, avoid the influence of signal crosstalk and avoid the loss of excessive bonding pad area. Another object of the present invention is to provide a PCB board.
In order to solve the technical problem, the invention provides a special-shaped bonding pad structure suitable for a BGA chip, which comprises a PCB substrate and a plurality of special-shaped bonding pads arranged on the surface of the PCB substrate in an array distribution, wherein one side, facing a routing channel, of each special-shaped bonding pad is provided with a lacking edge for reserving a routing avoiding space.
Preferably, each of the missing edges is a plane extending along the length direction of the corresponding routing channel.
Preferably, the side edge of each special-shaped pad deviating from the corresponding routing channel is an arc with equal curvature radius.
Preferably, each special-shaped bonding pad is a regular n-polygon, and each side edge of the special-shaped bonding pad is the corresponding notch edge; wherein n is more than or equal to 4.
Preferably, each of the special-shaped bonding pads is in a regular octagon shape.
Preferably, the missing edges of two adjacent special-shaped bonding pads in the array direction are opposite to each other.
Preferably, the line width distance from each of the missing edges to the corresponding routing channel is greater than or equal to 0.1 mm.
The invention also provides a PCB board which comprises the special-shaped bonding pad structure suitable for the BGA chip.
The special-shaped bonding pad structure suitable for the BGA chip mainly comprises a PCB substrate and a special-shaped bonding pad. The PCB substrate is a bottom layer structure of the pad structure and is an important component of the PCB, and the BGA chip is mounted on the surface of the PCB substrate and specifically located in a preset mounting area. The special-shaped bonding pads are arranged on the surface of the PCB substrate, are specifically positioned in the mounting area, are generally arranged simultaneously in a plurality, are distributed in a preset array, and correspond to the solder balls arranged on the back of the BGA chip so as to form welding connection with the BGA chip. Importantly, the default edge is arranged on one side of each special-shaped bonding pad facing the preset wiring channel (generally formed between adjacent special-shaped bonding pads), so that the special-shaped bonding pads leave a part of wiring avoiding space for the corresponding wiring channel through the default edge, the wiring space and the wiring width of the wiring channel are correspondingly increased, and further wiring can be more conveniently performed. Compared with the prior art, the special-shaped bonding pad structure suitable for the BGA chip, provided by the invention, is equivalent to a small part of area which is marked on the edge of the existing circular bonding pad and is used as the compensation area of the routing channel by arranging the notch on each special-shaped bonding pad, so that the routing distance between the bonding pads can be increased on the basis of reducing the area of the bonding pads as small as possible. Therefore, the invention can ensure that the bonding pads have proper routing space, avoid the influence of signal crosstalk and avoid the loss of excessive bonding pad area.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic diagram of a distribution structure of the special-shaped bonding pads.
Fig. 3 is a schematic diagram of another distribution structure of the special-shaped bonding pads.
Wherein, in fig. 1-3:
a routing channel-a;
PCB base plate-1, dysmorphism pad-2, lack limit-3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
In one embodiment provided by the invention, the special-shaped bonding pad structure suitable for the BGA chip mainly comprises a PCB substrate 1 and a special-shaped bonding pad 2.
The PCB substrate 1 is a bottom layer structure of the pad structure and is also an important component of the PCB, and the BGA chip is mounted on the surface of the PCB substrate 1 and specifically located in a preset mounting area.
The special-shaped bonding pads 2 are arranged on the surface of the PCB substrate 1, are specifically positioned in the mounting area, are generally arranged in a plurality of rows at the same time, are distributed in a preset array, and correspond to the solder balls arranged on the back of the BGA chip so as to form welding connection with the BGA chip.
Importantly, the notch 3 is arranged on one side of each special-shaped pad 2 facing to the preset wiring channel a (generally formed between the adjacent special-shaped pads 2), so that the special-shaped pads 2 leave part of wiring avoiding space for the corresponding wiring channel a through the arrangement of the notch 3, the wiring space and the wiring width of the wiring channel a are correspondingly increased, and further wiring can be more conveniently carried out.
Compare in prior art, the dysmorphism pad structure suitable for BGA chip that this embodiment provided, through set up scarce limit 3 on each special-shaped pad 2, draw the compensation area of small part area as walking line passageway a on the edge of present circular pad in other words to can be on the basis that reduces the pad area as far as possible, increase the line interval between the pad. Therefore, the embodiment can ensure that a proper wiring space is formed between the pads, avoid signal crosstalk influence and avoid excessive pad area loss.
In a preferred embodiment of the missing edge 3, in order to ensure that the trace width of each trace channel a is constant and prevent the signal impedance from changing abruptly, in this embodiment, each missing edge 3 is a plane extending along the length direction of the corresponding trace channel a. Of course, each of the cutaway sides 3 may also have an arc-shaped surface or the like.
In a preferred embodiment of the special-shaped bonding pads 2, each special-shaped bonding pad 2 is a regular n-polygon, such as a regular quadrangle, a regular pentagon, a regular hexagon, a regular heptagon, a regular octagon, etc., in order to facilitate the manufacturing process. Each special-shaped bonding pad 2 can be externally connected with a reference circle, the reference circle can be a circular surface corresponding to a solder ball on the BGA chip, and meanwhile, each side edge of each regular n-edge shape is a notch edge 3 arranged on the special-shaped bonding pad 2.
As shown in fig. 2, fig. 2 is a schematic diagram of a distribution structure of the irregular bonding pad 2.
Taking the example that each irregular bonding pad 2 is a regular octagon, the area of the regular octagon is 94% of the area of the reference circle, only 6% of the area of the reference plane is reduced, the difference is not large, and the stability influence on the welding yield is negligible (generally, when the area of the bonding pad is reduced to be less than 60% of the area of the reference circle, the influence on the welding yield is significant). Meanwhile, the distance between the two adjacent regular octagons is 0.28r (r is the radius of the reference circle) more than that between the two adjacent reference circles, and the width of the routing channel a between the two adjacent special-shaped bonding pads 2 is obviously increased. Obviously, the larger the number of sides of the regular n-polygon (generally, at least 4 sides are required), the larger the proportion of the area of the reference circle is, the smaller the increase degree of the width of the routing channel a is, and the number of sides of the special-shaped bonding pad 2 can be selected according to needs in practical use.
As shown in fig. 3, fig. 3 is a schematic view of another distribution structure of the irregular bonding pad 2.
In another preferred embodiment of the special-shaped bonding pad 2, considering that the side edge of a part of the special-shaped bonding pad 2 does not obstruct the width of the corresponding routing channel a, and in order to avoid reducing too much welding area as much as possible, in this embodiment, the side edge of each special-shaped bonding pad 2 deviating from the corresponding routing channel a is kept as an arc with equal curvature radius, that is, the part of the side edge on the special-shaped bonding pad 2 keeps the reference arc unchanged, and only the part facing the routing channel a is opened as the notch 3. At this time, the specific shape of each irregular bonding pad 2 may be different according to the relative position of each irregular bonding pad 2. Specifically, 2, 3 or 4 missing edges may be formed on part of the special-shaped bonding pad 2.
In addition, considering that no matter the shapes of the special-shaped bonding pads 2 are the same or different, in order to ensure that the short edges 3 formed on the special-shaped bonding pads can be converted into the width contribution to the routing channel a with the maximum utilization rate, in the embodiment, the short edges 3 formed on two adjacent special-shaped bonding pads 2 in the array direction (generally, also in the routing direction) are opposite to each other.
Generally, the line width distance from each notch 3 to its corresponding trace channel a is greater than or equal to 0.1mm, which can satisfy the process capability of conventional PCB manufacturers, and the crosstalk effect between signals is slight. In addition, the line width of the routing channel a can be kept about 0.1mm, so that the 50 Ω impedance of the common single-ended routing can be kept.
The embodiment further provides a PCB, which mainly includes a circuit structure scribed on the surface of the PCB substrate 1 and a special-shaped bonding pad structure disposed on the PCB and adapted to the BGA chip, wherein the specific content of the special-shaped bonding pad structure adapted to the BGA chip is the same as the related content, and is not repeated herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The utility model provides a dysmorphism pad structure suitable for BGA chip, its characterized in that includes PCB base plate (1) and sets up in a plurality of on its surface be array distribution dysmorphism pad (2), each towards one side of walking line passageway (a) on dysmorphism pad (2) offer and be used for keeping away the limit (3) that lacks of walking the line and dodging the space.
2. The special-shaped bonding pad structure suitable for BGA chips as claimed in claim 1, wherein each of the missing edges (3) is a plane extending along the length direction of the corresponding routing channel (a).
3. The special-shaped bonding pad structure suitable for the BGA chip as claimed in claim 2, wherein the side of each special-shaped bonding pad (2) away from the corresponding routing channel (a) is a circular arc with equal curvature radius.
4. The special-shaped bonding pad structure suitable for the BGA chip as claimed in claim 2, wherein each special-shaped bonding pad (2) is a regular n-polygon, and each side of the special-shaped bonding pad is each absent side (3); wherein n is more than or equal to 4.
5. The special-shaped bonding pad structure suitable for BGA chips as claimed in claim 4, wherein each of the special-shaped bonding pads (2) is in a regular octagon shape.
6. The special-shaped bonding pad structure suitable for BGA chips as claimed in claim 3 or 4, wherein the missing edges (3) of two adjacent special-shaped bonding pads (2) in the array direction are opposite to each other.
7. The special-shaped bonding pad structure suitable for the BGA chip as claimed in claim 6, wherein the line width distance from each of the missing edges (3) to the corresponding routing channel (a) is greater than or equal to 0.1 mm.
8. A PCB board comprising the shaped pad structure suitable for BGA chips of any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850191.6A CN112004315A (en) | 2020-08-21 | 2020-08-21 | PCB and special-shaped bonding pad structure suitable for BGA chip thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850191.6A CN112004315A (en) | 2020-08-21 | 2020-08-21 | PCB and special-shaped bonding pad structure suitable for BGA chip thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112004315A true CN112004315A (en) | 2020-11-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010850191.6A Pending CN112004315A (en) | 2020-08-21 | 2020-08-21 | PCB and special-shaped bonding pad structure suitable for BGA chip thereof |
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| Country | Link |
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| CN (1) | CN112004315A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113204933A (en) * | 2021-04-29 | 2021-08-03 | 上海移远通信技术股份有限公司 | Method and device for determining jointed PCB (printed circuit board), electronic equipment and storage medium |
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|---|---|---|---|---|
| JP2004134647A (en) * | 2002-10-11 | 2004-04-30 | Seiko Epson Corp | Circuit board, mounting structure of semiconductor element with bumps, electro-optical device, and electronic apparatus |
| CN101150103A (en) * | 2007-10-18 | 2008-03-26 | 晶方半导体科技（苏州）有限公司 | A crystal wafer chip dimension encapsulation line and its making method |
| CN101859747A (en) * | 2009-04-08 | 2010-10-13 | 日月光半导体制造股份有限公司 | Baseplate structure |
| CN102097333A (en) * | 2010-11-01 | 2011-06-15 | 华为终端有限公司 | Method for designing circuit board, circuit board and electronic device |
| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
-
2020
- 2020-08-21 CN CN202010850191.6A patent/CN112004315A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134647A (en) * | 2002-10-11 | 2004-04-30 | Seiko Epson Corp | Circuit board, mounting structure of semiconductor element with bumps, electro-optical device, and electronic apparatus |
| CN101150103A (en) * | 2007-10-18 | 2008-03-26 | 晶方半导体科技（苏州）有限公司 | A crystal wafer chip dimension encapsulation line and its making method |
| CN101859747A (en) * | 2009-04-08 | 2010-10-13 | 日月光半导体制造股份有限公司 | Baseplate structure |
| CN102097333A (en) * | 2010-11-01 | 2011-06-15 | 华为终端有限公司 | Method for designing circuit board, circuit board and electronic device |
| CN103167736A (en) * | 2011-12-16 | 2013-06-19 | 北大方正集团有限公司 | Printed circuit board (PCB) compensation processing method, equipment and PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113204933A (en) * | 2021-04-29 | 2021-08-03 | 上海移远通信技术股份有限公司 | Method and device for determining jointed PCB (printed circuit board), electronic equipment and storage medium |
| CN113204933B (en) * | 2021-04-29 | 2024-05-03 | 上海移远通信技术股份有限公司 | PCB jointed board determination method and device, electronic equipment and storage medium |
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Application publication date: 20201127 |
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