CN111909519A - 一种柔性导热硅橡胶及其制备方法和应用 - Google Patents
一种柔性导热硅橡胶及其制备方法和应用 Download PDFInfo
- Publication number
- CN111909519A CN111909519A CN202010731948.XA CN202010731948A CN111909519A CN 111909519 A CN111909519 A CN 111909519A CN 202010731948 A CN202010731948 A CN 202010731948A CN 111909519 A CN111909519 A CN 111909519A
- Authority
- CN
- China
- Prior art keywords
- modified
- parts
- flexible heat
- conducting
- calcium carbonate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 52
- 239000004945 silicone rubber Substances 0.000 claims abstract description 35
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 26
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 239000003063 flame retardant Substances 0.000 claims abstract description 11
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000003085 diluting agent Substances 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 229920002545 silicone oil Polymers 0.000 claims description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 8
- 230000002209 hydrophobic effect Effects 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
- BVBBZEKOMUDXMZ-UHFFFAOYSA-N n,n-diethyl-3-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN(CC)CC BVBBZEKOMUDXMZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 claims description 2
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- RLTQHDXGJNBSEC-UHFFFAOYSA-N CCCC(=O)CC(=O)OC(C)C.CCCC(=O)CC(=O)OC(C)C Chemical compound CCCC(=O)CC(=O)OC(C)C.CCCC(=O)CC(=O)OC(C)C RLTQHDXGJNBSEC-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- BTXFTCVNWMNXKH-UHFFFAOYSA-N NC1=CC=CC=C1.CCO[Si](C)(OCC)OCC Chemical compound NC1=CC=CC=C1.CCO[Si](C)(OCC)OCC BTXFTCVNWMNXKH-UHFFFAOYSA-N 0.000 claims description 2
- 229920000388 Polyphosphate Polymers 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 2
- OPARTXXEFXPWJL-UHFFFAOYSA-N [acetyloxy-bis[(2-methylpropan-2-yl)oxy]silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)(C)C)OC(C)(C)C OPARTXXEFXPWJL-UHFFFAOYSA-N 0.000 claims description 2
- KXJLGCBCRCSXQF-UHFFFAOYSA-N [diacetyloxy(ethyl)silyl] acetate Chemical compound CC(=O)O[Si](CC)(OC(C)=O)OC(C)=O KXJLGCBCRCSXQF-UHFFFAOYSA-N 0.000 claims description 2
- VYTZBDRGROFEND-UHFFFAOYSA-N [diacetyloxy(ethyl)silyl] propanoate Chemical compound CCC(=O)O[Si](CC)(OC(C)=O)OC(C)=O VYTZBDRGROFEND-UHFFFAOYSA-N 0.000 claims description 2
- DKGZKEKMWBGTIB-UHFFFAOYSA-N [diacetyloxy(propyl)silyl] acetate Chemical compound CCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O DKGZKEKMWBGTIB-UHFFFAOYSA-N 0.000 claims description 2
- NGRIJPGOMJMFID-UHFFFAOYSA-N [diacetyloxy(propyl)silyl] propanoate Chemical compound CCC(=O)O[Si](OC(C)=O)(OC(C)=O)CCC NGRIJPGOMJMFID-UHFFFAOYSA-N 0.000 claims description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 2
- IXQMGECVDWVOFK-UHFFFAOYSA-N dichloromethyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C(Cl)Cl IXQMGECVDWVOFK-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 2
- GBFVZTUQONJGSL-UHFFFAOYSA-N ethenyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](OC(C)=C)(OC(C)=C)C=C GBFVZTUQONJGSL-UHFFFAOYSA-N 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000002480 mineral oil Substances 0.000 claims description 2
- 235000010446 mineral oil Nutrition 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- ZLDHYRXZZNDOKU-UHFFFAOYSA-N n,n-diethyl-3-trimethoxysilylpropan-1-amine Chemical compound CCN(CC)CCC[Si](OC)(OC)OC ZLDHYRXZZNDOKU-UHFFFAOYSA-N 0.000 claims description 2
- KPIIDEIURMTGCD-UHFFFAOYSA-N n-ethyl-n-(trimethoxysilylmethyl)ethanamine Chemical compound CCN(CC)C[Si](OC)(OC)OC KPIIDEIURMTGCD-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000001205 polyphosphate Substances 0.000 claims description 2
- 235000011176 polyphosphates Nutrition 0.000 claims description 2
- 150000003376 silicon Chemical class 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical group CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 2
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 claims description 2
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 claims description 2
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 claims description 2
- HXOGQBSDPSMHJK-UHFFFAOYSA-N triethoxy(6-methylheptyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC(C)C HXOGQBSDPSMHJK-UHFFFAOYSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 2
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000008439 repair process Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开一种柔性导热硅橡胶及其制备方法和应用，所述柔性导热硅橡胶的原料包括基胶100份、稀释剂100～500份、导热填料300～800份、阻燃剂100～600份、碳酸钙100～400份、交联剂0.05～5份、催化剂0.05～5份，本发明的柔性导热硅橡胶具有良好的柔性、低界面应力、导热性能和力学性能，易于返修，能够满足电子行业对导热及易返修性能的要求。
Description
技术领域
本发明属于橡胶材料技术领域，尤其涉及一种柔性导热硅橡胶及其制备方法和应用。
背景技术
随着电子产品电子技术高速发展，元器件趋于密度化、小型化，其工作环境的温度急速上升，如不能快速散发元器件温度，会极大的降低元器件的使用寿命。导热硅橡胶能够有效的快速散热元器件产生的热量，提高元器件的使用寿命及工作效率。填充型导热硅橡胶是由高分子材料和高导热填料组成的复合物，其中导热填料的量提高到一定程度时，硅橡胶普遍出现硬度高、界面应力大、具有一定粘接性的现象，以致施工过程中无法进行返修，易造成元器件的报废，因此导致了生产成本增加及生产效率的降低。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明的第一个目的是提供一种柔性导热硅橡胶，具有良好的柔性，易返修，同时具有良好的力学性能。
本发明为实现该目的所采取的技术方案为：
一种柔性导热硅橡胶，包括如下质量份的原料：
基胶100份
稀释剂100～500份
导热填料300～800份
阻燃剂100～600份
碳酸钙100～400份
交联剂0.05～5份
催化剂0.05～5份
所述基胶选用羟基硅油、烷氧基硅油、乙烯基硅油、MQ硅树脂的一种或几种。
在25℃下，羟基硅油的粘度范围为500～55000mPa.s，烷氧基硅油的粘度范围为500～50000mPa.s，乙烯基硅油的粘度范围为300～12000mPa.s，MQ硅树脂的粘度范围为200～10000mPa.s。
所述稀释剂为二甲基硅油、MDT型硅油、白油、矿物油、苯基硅油的一种或几种。
所述导热填料为氧化铝、改性氧化铝、氧化锌、改性氧化锌、氧化镁、改性氧化镁、硅微粉、改性硅微粉、铝粉、改性铝粉、银粉、改性银粉、碳化硅、改性碳化硅、氮化硼、改性氮化硼、氮化铝、改性氮化铝、石墨烯、改性石墨烯的一种或几种。
所述阻燃剂为三聚氰胺氰尿酸盐、聚磷酸盐、氢氧化铝、改性氢氧化铝、氢氧化镁、改性氢氧化镁、硼酸锌、改性硼酸锌的一种或几种。
所述碳酸钙为重质碳酸钙、轻质碳酸钙、纳米碳酸钙、疏水重质碳酸钙、疏水轻质碳酸钙、疏水纳米碳酸钙的一种或几种。
所述交联剂为正硅酸甲酯、正硅酸乙酯、正硅酸丙酯、聚硅酸乙酯、甲基三甲氧基硅烷、甲基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、异丁基三乙氧基硅烷、异辛基三乙氧基硅烷、乙烯基甲基二甲氧基硅烷、乙烯基三异丙烯氧基硅烷、四异丙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、甲基三乙酰氧基硅烷、改性甲基三乙酰氧基硅烷、乙基三乙酰氧基硅烷、丙基三乙酰氧基硅烷、甲丙基三乙酰氧基硅烷、甲乙基三乙酰氧基硅烷、二叔丁氧基二乙酰氧基硅烷、甲基三丁酮肟基硅烷、乙烯基三丁酮肟基硅烷、苯基三丁酮肟基硅烷、四丁酮肟基硅烷、甲基三丙酮肟基硅烷、二乙胺基甲基三甲氧基硅烷、3-二乙胺基丙基三乙氧基硅烷、二氯甲基三乙氧基硅烷、苯胺甲基三乙氧基硅烷、3-氯丙基三甲氧基硅烷、含氢硅油的一种或几种。
所述催化剂为二月桂酸二丁基锡、二醋酸二丁基锡、螯合锡、二(乙酰乙酸乙酯)钛酸二异丙酯、钛酸四丁酯、钛酸四异丙酯、二(乙酰丙酮)-1,3-丙二氧基钛、二(乙酰丙酮)钛酸二异丙酯、钛酸酯螯合物、钛酸酯络合物、3-二乙胺基丙基三甲氧基硅烷、3-二乙胺基丙基三乙氧基硅烷、铂金催化剂的一种或几种。
本发明的第二个目的是提供上述柔性导热硅橡胶的制备方法。
一种柔性导热硅橡胶的制备方法，包括如下步骤：
(1)将基胶、稀释剂、导热填料、阻燃剂和碳酸钙共混进行反应；
(2)加入交联剂和催化剂，搅拌得到柔性导热硅橡胶。
步骤(1)中，所述反应物温度为80～140℃，反应时间为60～150min。
步骤(1)中，所述反应在真空条件下进行，真空度为-0.06MPa～-0.1MPa。
步骤(2)中，在与步骤(1)相同的真空条件下加入交联剂和催化剂。
本发明的另一个目的是提供所述柔性导热硅橡胶的应用，具体的本发明提供所述柔性导热硅橡胶用于电子元器件的散热，降低了界面应力，起到散热和易返修的作用。
相对于现有技术，本发明通过合理搭配材料，降低硅橡胶的交联密度，从而降低了硬度，使硅橡胶具有良好的柔性和导热性能，易于返修，同时具有良好的力学性能，能够满足电子行业对导热及易返修性能的要求。
具体实施方式
以下结合具体的实施例进一步说明本发明的技术方案。
实施例1
本实施例提供一种柔性导热硅橡胶，其原料如表1所示。
所述柔性导热硅橡胶的制备方法包括如下步骤：
(1)将羟基硅油100份、二甲基硅油200份、氧化铝500份、氢氧化铝120份、纳米碳酸钙120份分别按计量在搅拌机中混合60min，真空条件及115℃高温条件下继续搅拌120min，冷却至室温后继续真空条件下搅拌20min。
(2)依次加入甲基三甲氧基硅烷2份、钛酸酯络合物1份搅拌均匀，将上述物料在惰性气体的保护下出料即可。
实施例2
本实施例提供一种柔性导热硅橡胶，其原料如表1所示。
所述柔性导热硅橡胶的制备方法包括如下步骤：
(1)将烷氧基硅油100份、白油400份、氧化铝500份、氧化锌300份、氢氧化镁420份、疏水轻质碳酸钙320份分别按计量在搅拌机中混合60min，真空条件及95℃高温条件下继续搅拌110min，冷却至室温后继续真空条件下搅拌60min。
(2)依次加入甲基三甲氧基硅烷1份、3-二乙胺基丙基三乙氧基硅烷2份搅拌均匀，将上述物料在惰性气体的保护下出料即可。
实施例3
本实施例提供一种柔性导热硅橡胶，其原料如表1所示。
所述柔性导热硅橡胶的制备方法包括如下步骤：
(1)将羟基硅油100份、二甲基硅油350份、硅微粉420份、氧化镁50份、三聚氰胺氰尿酸盐250份、硼酸锌80份、疏水重质碳酸钙220份分别按计量在搅拌机中混合60min，真空条件及130℃高温条件下继续搅拌30min,冷却至室温后继续真空条件下搅拌60min。
(2)依次加入甲基三丁酮肟基硅烷3份、乙烯基三丁酮肟基硅烷2份、螯合锡0.2份搅拌均匀，将上述物料在惰性气体的保护下出料即可。
对比例1
本对比例与实施例1相似，不同之处在于：省去碳酸钙。
对比例2
本对比例与实施例2相似，不同之处在于：省去阻燃剂。
对比例3
本对比例与实施例3相似，不同之处在于：将基胶替换成聚氨酯。
表1柔性导热硅橡胶原料配比
| 实施例1 | 实施例2 | 实施例3 | |
| 基胶 | 100 | 100 | 100 |
| 稀释剂 | 200 | 400 | 350 |
| 导热填料 | 500 | 800 | 470 |
| 阻燃剂 | 120 | 420 | 330 |
| 碳酸钙 | 120 | 320 | 220 |
| 交联剂 | 2 | 1 | 5 |
| 催化剂 | 1 | 2 | 0.2 |
性能检测
对上述柔性导热硅橡胶进行性能测试，结果如下表2所示：
其中表干时间按GB/T13477.5-2002测试，力学性能按GBT531-1999测定固化7天后的硬度，导热系数按ISO/DIS 22007测试，拉伸强度和伸长率按ASTM D412测试。
表2柔性导热硅橡胶性能测试结果
根据测试结果可知，本发明的柔性导热硅橡胶具有较低的硬度，降低了界面应力，具有良好的柔性，同时具有较好的导热系数和力学性能，能够满足电子行业所要求的优秀导热、低界面应力、易返修性能。而当在原料中省去碳酸钙或阻燃剂，或将基胶替换成聚氨酯后，虽然硅橡胶依然保持较好的柔性，但其力学性能明显降低，可见碳酸钙、阻燃剂和基胶对于降低硅橡胶硬度，同时保持良好的力学性能具有重要影响。
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。
Claims (10)
1.一种柔性导热硅橡胶，其特征在于：包括如下质量份的原料：
基胶100份
稀释剂100～500份
导热填料300～800份
阻燃剂100～600份
碳酸钙100～400份
交联剂0.05～5份
催化剂0.05～5份
所述基胶选用羟基硅油、烷氧基硅油、乙烯基硅油、MQ硅树脂的一种或几种。
2.根据权利要求1所述柔性导热硅橡胶，其特征在于：在25℃下，所述羟基硅油的粘度范围为500～55000mPa.s，所述烷氧基硅油的粘度范围为500～50000mPa.s，所述乙烯基硅油的粘度范围为300～12000mPa.s，所述MQ硅树脂的粘度范围为200～10000mPa.s。
3.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述稀释剂为二甲基硅油、MDT型硅油、白油、矿物油、苯基硅油的一种或几种。
4.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述导热填料为氧化铝、改性氧化铝、氧化锌、改性氧化锌、氧化镁、改性氧化镁、硅微粉、改性硅微粉、铝粉、改性铝粉、银粉、改性银粉、碳化硅、改性碳化硅、氮化硼、改性氮化硼、氮化铝、改性氮化铝、石墨烯、改性石墨烯的一种或几种。
5.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述阻燃剂为三聚氰胺氰尿酸盐、聚磷酸盐、氢氧化铝、改性氢氧化铝、氢氧化镁、改性氢氧化镁、硼酸锌、改性硼酸锌的一种或几种。
6.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述碳酸钙为重质碳酸钙、轻质碳酸钙、纳米碳酸钙、疏水重质碳酸钙、疏水轻质碳酸钙、疏水纳米碳酸钙的一种或几种。
7.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述交联剂为正硅酸甲酯、正硅酸乙酯、正硅酸丙酯、聚硅酸乙酯、甲基三甲氧基硅烷、甲基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、异丁基三乙氧基硅烷、异辛基三乙氧基硅烷、乙烯基甲基二甲氧基硅烷、乙烯基三异丙烯氧基硅烷、四异丙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、甲基三乙酰氧基硅烷、改性甲基三乙酰氧基硅烷、乙基三乙酰氧基硅烷、丙基三乙酰氧基硅烷、甲丙基三乙酰氧基硅烷、甲乙基三乙酰氧基硅烷、二叔丁氧基二乙酰氧基硅烷、甲基三丁酮肟基硅烷、乙烯基三丁酮肟基硅烷、苯基三丁酮肟基硅烷、四丁酮肟基硅烷、甲基三丙酮肟基硅烷、二乙胺基甲基三甲氧基硅烷、3-二乙胺基丙基三乙氧基硅烷、二氯甲基三乙氧基硅烷、苯胺甲基三乙氧基硅烷、3-氯丙基三甲氧基硅烷、含氢硅油的一种或几种。
8.根据权利要求1所述柔性导热硅橡胶，其特征在于：所述催化剂为二月桂酸二丁基锡、二醋酸二丁基锡、螯合锡、二(乙酰乙酸乙酯)钛酸二异丙酯、钛酸四丁酯、钛酸四异丙酯、二(乙酰丙酮)-1,3-丙二氧基钛、二(乙酰丙酮)钛酸二异丙酯、钛酸酯螯合物、钛酸酯络合物、3-二乙胺基丙基三甲氧基硅烷、3-二乙胺基丙基三乙氧基硅烷、铂金催化剂的一种或几种。
9.一种权利要求1～8任意一项所述柔性导热硅橡胶的制备方法，其特征在于：包括如下步骤：
(1)将基胶、稀释剂、导热填料、阻燃剂和碳酸钙共混进行反应；
(2)加入交联剂和催化剂，搅拌得到柔性导热硅橡胶。
10.权利要求1～8任意一项所述柔性导热硅橡胶在电子元器件散热中的应用。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010731948.XA CN111909519A (zh) | 2020-07-27 | 2020-07-27 | 一种柔性导热硅橡胶及其制备方法和应用 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010731948.XA CN111909519A (zh) | 2020-07-27 | 2020-07-27 | 一种柔性导热硅橡胶及其制备方法和应用 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111909519A true CN111909519A (zh) | 2020-11-10 |
Family
ID=73280124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010731948.XA Pending CN111909519A (zh) | 2020-07-27 | 2020-07-27 | 一种柔性导热硅橡胶及其制备方法和应用 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111909519A (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112521750A (zh) * | 2020-11-23 | 2021-03-19 | 晟大科技(南通)有限公司 | 一种改性硅橡胶组合物及其制备方法和应用 |
| CN113956834A (zh) * | 2021-10-25 | 2022-01-21 | 广州集泰化工股份有限公司 | 一种硅酮密封胶及其制备方法和应用 |
| CN114621511A (zh) * | 2022-04-18 | 2022-06-14 | 惠州量子导通新材料有限公司 | 一种非硅导热脂组合物及其制备方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008101081A (ja) * | 2006-10-18 | 2008-05-01 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
| CN101407635A (zh) * | 2008-11-14 | 2009-04-15 | 成都硅宝科技股份有限公司 | 一种加成型导热硅橡胶及其制造方法 |
| CN102618208A (zh) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | 一种无卤阻燃导热有机硅电子灌封胶及其制备工艺 |
| CN103059576A (zh) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | 一种高导热柔性硅胶垫片及其制备方法 |
| CN104098914A (zh) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | 有机硅导热界面材料 |
| CN106753202A (zh) * | 2016-12-23 | 2017-05-31 | 上海回天新材料有限公司 | 一种光伏背板修复胶组合物及其制备方法 |
| CN106751904A (zh) * | 2016-12-27 | 2017-05-31 | 中蓝晨光化工研究设计院有限公司 | 一种导热有机硅凝胶及其制备方法 |
| CN107141815A (zh) * | 2017-06-24 | 2017-09-08 | 肇庆皓明有机硅材料有限公司 | 一种耐高温低模量导热有机硅材料及其制备方法 |
| CN110776745A (zh) * | 2019-10-09 | 2020-02-11 | 苏州欣天新精密机械有限公司 | 一种热界面材料的制备方法 |
-
2020
- 2020-07-27 CN CN202010731948.XA patent/CN111909519A/zh active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008101081A (ja) * | 2006-10-18 | 2008-05-01 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
| CN101407635A (zh) * | 2008-11-14 | 2009-04-15 | 成都硅宝科技股份有限公司 | 一种加成型导热硅橡胶及其制造方法 |
| CN102618208A (zh) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | 一种无卤阻燃导热有机硅电子灌封胶及其制备工艺 |
| CN103059576A (zh) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | 一种高导热柔性硅胶垫片及其制备方法 |
| CN104098914A (zh) * | 2014-07-02 | 2014-10-15 | 深圳市安品有机硅材料有限公司 | 有机硅导热界面材料 |
| CN106753202A (zh) * | 2016-12-23 | 2017-05-31 | 上海回天新材料有限公司 | 一种光伏背板修复胶组合物及其制备方法 |
| CN106751904A (zh) * | 2016-12-27 | 2017-05-31 | 中蓝晨光化工研究设计院有限公司 | 一种导热有机硅凝胶及其制备方法 |
| CN107141815A (zh) * | 2017-06-24 | 2017-09-08 | 肇庆皓明有机硅材料有限公司 | 一种耐高温低模量导热有机硅材料及其制备方法 |
| CN110776745A (zh) * | 2019-10-09 | 2020-02-11 | 苏州欣天新精密机械有限公司 | 一种热界面材料的制备方法 |
Non-Patent Citations (1)
| Title |
|---|
| 丁绍兰等: "《革制品材料学》", 31 January 2019, 中国轻工业出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112521750A (zh) * | 2020-11-23 | 2021-03-19 | 晟大科技(南通)有限公司 | 一种改性硅橡胶组合物及其制备方法和应用 |
| CN113956834A (zh) * | 2021-10-25 | 2022-01-21 | 广州集泰化工股份有限公司 | 一种硅酮密封胶及其制备方法和应用 |
| CN113956834B (zh) * | 2021-10-25 | 2023-01-24 | 广州集泰化工股份有限公司 | 一种硅酮密封胶及其制备方法和应用 |
| CN114621511A (zh) * | 2022-04-18 | 2022-06-14 | 惠州量子导通新材料有限公司 | 一种非硅导热脂组合物及其制备方法 |
| CN114621511B (zh) * | 2022-04-18 | 2024-03-12 | 惠州量子导通新材料有限公司 | 一种非硅导热脂组合物及其制备方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111909519A (zh) | 一种柔性导热硅橡胶及其制备方法和应用 | |
| CN109312159B (zh) | 导热性有机硅组合物及其固化物 | |
| JP3543663B2 (ja) | 熱伝導性シリコーンゴム組成物及びその製造方法 | |
| CN109735112B (zh) | 加成型有机硅导热凝胶及其制备方法 | |
| CN106905698B (zh) | 绝缘散热片材 | |
| CN111393855A (zh) | 一种具有优异耐候性的高导热凝胶组合物 | |
| JP3836649B2 (ja) | 半導体封止用樹脂組成物およびその成型品 | |
| CN1390246A (zh) | 阻燃环氧树脂组合物和由其制得的层压物 | |
| JP7100636B2 (ja) | 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法 | |
| KR20150009944A (ko) | 열전도성 실리콘 그리스 조성물 | |
| CN102618208A (zh) | 一种无卤阻燃导热有机硅电子灌封胶及其制备工艺 | |
| CN111718486A (zh) | 一种触变剂及含有该触变剂的双组份硅酮密封胶 | |
| CN111073591A (zh) | 一种单组分室温固化液体硅橡胶及制备方法 | |
| KR20200007234A (ko) | 고방열 액상 실리콘 조성물 | |
| KR101801728B1 (ko) | 고방열 액상 실리콘 부가형 접착제 조성물 | |
| CN113897172A (zh) | 一种低粘高导热有机硅灌封胶及其制备方法 | |
| CN106753215B (zh) | 低应力导热硅凝胶组合物 | |
| CN113881390A (zh) | 双组分型有机硅灌封胶、用于形成其的组合物及应用 | |
| CN111875852B (zh) | 一种复合导热材料、硅橡胶及其制备方法和应用 | |
| CN114423825B (zh) | 导热性有机硅组合物及其制造方法、以及半导体装置 | |
| CN116376292A (zh) | 一种高弹导热硅胶材料、高弹导热硅胶垫片及制备方法 | |
| CN115368858A (zh) | 一种用于电路板的导热胶及其制备方法 | |
| JPH0680142B2 (ja) | フエノ−ル系樹脂組成物 | |
| CN114231036A (zh) | 一种高强度协效阻燃室温硫化硅橡胶及其制备方法 | |
| JP2021176931A (ja) | 絶縁放熱シートの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201110 |
|
| RJ01 | Rejection of invention patent application after publication |