CN106753215B - 低应力导热硅凝胶组合物 - Google Patents
低应力导热硅凝胶组合物 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 26
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 32
- 239000000499 gel Substances 0.000 claims abstract description 24
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 22
- 239000001257 hydrogen Substances 0.000 claims abstract description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003054 catalyst Substances 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 15
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 7
- 239000012767 functional filler Substances 0.000 claims abstract description 5
- -1 polydimethylsiloxane Polymers 0.000 claims description 36
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 19
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
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- DDCDEKHXBABHHI-UHFFFAOYSA-N acetylene cyclohexanol Chemical compound C1(CCCCC1)O.C#C DDCDEKHXBABHHI-UHFFFAOYSA-N 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 150000003609 titanium compounds Chemical class 0.000 claims description 4
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 4
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- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 claims description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 2
- GSCOPSVHEGTJRH-UHFFFAOYSA-J [Ti+4].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O Chemical compound [Ti+4].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O GSCOPSVHEGTJRH-UHFFFAOYSA-J 0.000 claims description 2
- 239000003377 acid catalyst Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 2
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- 239000011787 zinc oxide Substances 0.000 claims description 2
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract description 20
- 230000035882 stress Effects 0.000 abstract description 10
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- 238000004132 cross linking Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 15
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 6
- 239000008213 purified water Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
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- 230000017525 heat dissipation Effects 0.000 description 2
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- 239000000843 powder Substances 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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Abstract
本发明公开了一种低应力导热硅凝胶组合物，包括含乙烯基的聚二有机硅氧烷、功能性填料、含氢硅氧烷、扩联剂、助粘剂，在催化剂的作用下交联成型。该低应力导热硅凝胶组合物具有低应力、强粘附力、导热、阻燃，可以保护受机械应力和热应力的电子元器件。
Description
技术领域
本发明涉及硅凝胶领域，特别涉及一种低应力导热硅凝胶组合物。
背景技术
近年来，伴随着电子元器件向更小和更轻的方向发展，电子元器件的强度更容易受到温度变化的影响。因此，需要一种具有柔韧性好、强度高、导热性强等特性的材料，对电子元器件进行密封或填充，以保护受机械应力和热应力的电子元器件。
低应力导热硅凝胶组合物可以通过固化而具有良好的应力松弛、电气性能、耐候性能、导热阻燃性能，因此被广泛应用于电气、电子元器件的密封填充，以保护电子元器件的整体稳定性，延长使用寿命。公开号为CN102516775A的发明专利公开了一种用于灌封精密电子元器件的高粘附行硅凝胶。由于没有添加导热填料，其制品的导热率极低(只有0.2w/mk)，很难满足电子元器件的散热要求。专利CN105482465、CN104513487、CN105419339等均涉及到导热硅凝胶的制备方法，但是都没有解决使硅凝胶具备良好粘附性的问题。
发明内容
本发明的目的是提供一种低应力导热硅凝胶组合物，具有良好的低应力、粘附性、导热性，保护受机械应力和热应力的电子元器件，改善运行的环境，提高电子元器件的稳定性和可靠性，延长使用寿命。
本发明的上述技术目的是通过以下技术方案得以实现的：
一种低应力导热硅凝胶组合物，包括如下重量份的组分组成：
含乙烯基的聚二有机硅氧烷，100份
功能性填料，0～200份
交联剂，0.05～5份
扩联剂，3～30份
助粘剂，0～3份
催化剂，0.03～3份。
进一步设置为：所述含乙烯基的聚二有机硅氧烷可以选自端乙烯基聚二甲基硅氧烷、端乙烯基聚二甲基-甲基乙烯基硅氧烷、端乙烯基聚甲基苯基-甲基乙烯基硅氧烷、侧含乙烯基的聚二甲基-甲基乙烯基硅氧烷、侧含乙烯基的聚甲基苯基-甲基乙烯基硅氧烷的一种或几种。
进一步设置为：所选含乙烯基的聚二有机硅氧烷的粘度范围为100～5000cs。
进一步设置为：所述交联剂为含氢支链硅氧烷，含氢量为0.2～1.2wt％。
进一步设置为：所述的交联剂为六甲基二硅氧烷、八甲基环四硅氧烷、四甲基环四硅氧烷和(2，3-环氧丙氧)丙基三甲氧基硅烷按照3～5∶10～50∶10～50∶3～10共水解聚合产物。
进一步设置为：所述的扩联剂为二甲基氢基封端的聚二甲基硅氧烷。
进一步设置为：所述二甲基氢基封端的聚二甲基硅氧烷的粘度范围为10～130cs，含氢量为0.04～0.18wt％。
进一步设置为：所述的催化剂为铂金催化剂，所述铂金催化剂选用氯铂酸催化剂、氯铂酸-异丙醇催化剂、氯铂酸-二乙烯基四甲基二硅氧烷催化剂中的一种，所述铂金属含量优选3000～5000ppm，优选的铂金属添加量为低应力导热硅凝胶组合物总重的5ppm～10ppm。
进一步设置为：还包括添加量占低应力导热硅凝胶组合物总重的5ppm～15ppm的反应控制剂，所述反应控制剂选用乙炔环己醇、二乙烯基四甲基二硅氧烷、苯并三唑中的一种。
进一步设置为：所述的功能性填料可以选自氢氧化铝、氧化铝、氧化锌、氮化硼、硅微粉、石墨烯、硼酸锌等中的一种或几种。
进一步设置为：所述的助粘剂可以选自钛化合物、铝化合物、锆化合物中一种，所述钛化合物选用二异丙氧基双(乙基乙酰乙酸)钛和钛酸四丁基酯中的一种，所述铝化合物选用乙基乙酰乙酸二异丙酸铝和三(乙酰丙酮酸)铝中的一种，所述锆化合物选用乙酰丙酮酸锆，所述助粘剂添加量为低应力导热硅凝胶组合物总重的0.1％～0.5％。
为了具备良好的粘附性和粘接稳定性，本发明采用交联剂与扩联剂混合使用，提高整体柔韧性和表面粘附性，更优选交联剂含有少量的烷氧基、羟基以及环氧基，增加极性基团含量，增加粘接稳定性。
低应力导热硅凝胶组合物可以配制成单组份或者双组份使用。当配制单组份时，优选采用在0℃～10℃下储存。
综上所述，本发明具有以下有益效果：
1，低应力导热硅凝胶组合物，具有粘附性和粘接性，可以用于密封填充电子元器件，起到整体性和防水性。
2，低应力导热硅凝胶组合物，具有导热阻燃性能，提高电子元器件的散热效率。
3，低应力导热硅凝胶组合物，具有低应力和高强度，保护受热应力和机械应力的电子元器件。
4，低应力导热硅凝胶组合物，具有良好的可操作性，便于高密度电子元器件的灌封、密封。
具体实施方式
本具体实施例仅仅是对本发明的解释，其并不是对本发明的限制，本领域技术人员在阅读完本说明书后可以根据需要对本实施例做出没有创造性贡献的修改，但只要在本发明的权利要求范围内都受到专利法的保护。
交联剂含氢支链硅氧烷的合成1：
在装有搅拌器、回流冷凝管和温度计的三口瓶中，加入3份六甲基二硅氧烷、30份八甲基环四硅氧烷、30份四甲基环四硅氧烷和5份(2，3-环氧丙氧)丙基三甲氧基硅烷、2份水，升温到80℃，持续混合30分钟，加入1份阳离子酸性交换树脂，在此温度下反应4小时后，过滤，脱低，得到支链含氢硅氧烷。
交联剂含氢支链硅氧烷的合成2：
在装有搅拌器、回流冷凝管和温度计的三口瓶中，加入3份六甲基二硅氧烷、30份八甲基环四硅氧烷、30份四甲基环四硅氧烷和5份甲基三甲氧基硅烷、2份水，在90℃持续搅拌混合30分钟，加入2份阳离子酸性交换树脂，在此温度下反应4小时后，过滤，脱低，得到支链含氢硅氧烷。
交联剂含氢支链硅氧烷的合成3：
在装有搅拌器、回流冷凝管和温度计的三口瓶中，加入5份六甲基二硅氧烷、40份八甲基环四硅氧烷、30份四甲基环四硅氧烷和5份(2，3-环氧丙氧)丙基三甲氧基硅烷、3份水，在70℃持续搅拌混合30分钟，加入2份阳离子酸性交换树脂，在此温度下反应4小时后，过滤，脱低，得到支链含氢硅氧烷。
实施例1：
100份端乙烯基聚二甲基硅氧烷，60份氢氧化铝，100份氧化铝，5份石墨烯，3份六甲基二硅氮烷，0.5份纯净水，加入行星动力搅拌机中混合1小时，升温至150℃，搅拌脱低2小时，1份的氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成A组分。
100份端乙烯基聚二甲基硅氧烷，60份氢氧化铝，80份氧化铝，20份硅微粉，5份石墨烯，3份六甲基二硅氧烷，0.5份纯净水，加入行星动力搅拌机中混合1小时，升温至150℃，搅拌脱低2小时，1份交联剂(含氢支链硅氧烷的合成1)，3份扩联剂，1.2份乙炔环己醇搅拌分散均匀制备成B组分。
最后，将A组分和B组分按质量比为1∶1混合搅拌均匀，常温或者升温制备成低应力导热硅凝胶。结果检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成1制备的交联剂。
实施例2：
100份端乙烯基聚二甲基-甲基乙烯基硅氧烷，60份氢氧化铝，30份氧化铝，60份硅微粉，2.4份六甲基二硅氮烷，0.5份水加入行星动力搅拌机中，室温下搅拌1小时，于150℃搅拌脱低2小时，加入1份的氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成A组分。
100份端乙烯基聚二甲基-甲基乙烯基硅氧烷，60份氢氧化铝，30份氧化铝，60份硅微粉，2.4份六甲基二硅氮烷，0.5份纯净水，加入行星动力搅拌机中，室温下搅拌1小时，于150℃搅拌脱低2小时，1.2份乙炔环己醇，2份交联剂(含氢支链硅氧烷的合成3)，5份扩联剂，搅拌分散均匀制备成B组分。
最后，将A组分和B组分按质量比为1∶1混合搅拌均匀，常温或者升温制备成低应力导热硅凝胶。结果检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成3制备的交联剂。
实施例3：
95份端乙烯基聚二甲基硅氧烷，5份侧含乙烯基的聚二甲基-甲基乙烯基硅氧烷，10份硅树脂粉末，加入行星动力搅拌机中，升温于120℃搅拌脱低2小时，加入1份的氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成A组分。
95份端乙烯基聚二甲基硅氧烷，5份侧含乙烯基的聚二甲基-甲基乙烯基硅氧烷，10份硅树脂粉末，加入行星动力搅拌机中，升温于120℃搅拌脱低2小时，加入1份乙炔环己醇，1份交联剂(含氢支链硅氧烷的合成1)，6份扩联剂，搅拌分散均匀制成B组分。
最后，将A组分和B组分按质量比为1∶1混合搅拌均匀，常温或者升温制备成低应力导热硅凝胶。结果检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成1制备的交联剂。
实施例4：
100份端乙烯基聚二甲基-甲基乙烯基硅氧烷，5份硼酸锌，5份白炭黑，150份硅微粉，2份钛酸四丁酯，加入行星动力搅拌机中，升温于150℃搅拌脱低2小时，冷却到室温加入1份苯并三唑，1份乙炔环己醇，5份交联剂(含氢支链硅氧烷的合成3)，2份扩联剂，份1.2份氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成单组份低应力导热硅凝胶。
放置在0度下储存。结果检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成3制备的交联剂。
实施例5：
100份端乙烯基聚甲基苯基-甲基乙烯基硅氧烷，5份氮化硼，5份白炭黑，100份硅微粉，60份氢氧化铝，2份乙基乙酰乙酸二异丙酸铝，加入行星动力搅拌机中，升温于150℃搅拌脱低2小时，冷却到室温加入1份苯并三唑，1份乙炔环己醇，3份交联剂(含氢支链硅氧烷的合成1)，2份扩联剂，份1.2份氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成单组份低应力导热硅凝胶。
放置在0度下储存。结果检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成1制备的交联剂。
对比例1：
100份端乙烯基聚二甲基硅氧烷，60份氢氧化铝，100份氧化铝，5份石墨烯，3份六甲基二硅氮烷，0.5份纯净水，加入行星动力搅拌机中混合1小时，升温至150℃，搅拌脱低2小时，1份的氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成A组分。
100份端乙烯基聚二甲基硅氧烷，60份氢氧化铝，80份氧化铝，20份硅微粉，5份石墨烯，3份六甲基二硅氧烷，0.5份纯净水，加入行星动力搅拌机中混合1小时，升温至150℃，搅拌脱低2小时，3份侧链含氢硅油，2份扩联剂，1.2份乙炔环己醇搅拌分散均匀制备成B组分。
最后，将A组分和B组分按质量比为1∶1混合搅拌均匀，常温或者升温制备成低应力导热硅凝胶。结构检测如表1。
对比例2
100份端乙烯基聚二甲基硅氧烷，100份氢氧化铝，150份氧化铝加入行星动力搅拌机，150℃搅拌脱低2小时，加入1.2份的氯铂酸-二乙烯基四甲基二硅氧烷催化剂分散均匀制备成A组分。
100份端乙烯基聚二甲基硅氧烷，100份氢氧化铝，150份氧化铝加入行星动力搅拌机，150℃搅拌脱低2小时，加入1.2份甲基丁炔醇，3份交联剂(含氢支链硅氧烷的合成2)，5份扩联剂搅拌均匀制备成B组分。
最后，将A组分和B组分按质量比为1∶1混合搅拌均匀，常温或者升温制备成低应力导热硅凝胶。结构检测如表1。
交联剂采用按照交联剂含氢支链硅氧烷的合成2制备的交联剂。
表1
Claims (7)
1.一种低应力导热硅凝胶组合物，其特征在于：包括如下重量份的组分组成：
含乙烯基的聚二有机硅氧烷 100份，
功能性填料 0~200份，
交联剂 0.05~5份，
扩链剂 3~30份，
助粘剂 0~3份，
催化剂 0.03~3份；
所述含乙烯基的聚二有机硅氧烷为端乙烯基聚二甲基硅氧烷、端乙烯基聚二甲基-甲基乙烯基硅氧烷、端乙烯基聚甲基苯基-甲基乙烯基硅氧烷中的一种，或为混合95重量份端乙烯基聚二甲基硅氧烷和5重量份侧含乙烯基的聚二甲基-甲基乙烯基硅氧烷配制得到；
所述的交联剂为六甲基二硅氧烷、八甲基环四硅氧烷、四甲基环四硅氧烷和（2，3-环氧丙氧)丙基三甲氧基硅烷按照3~5:10~50:10~50:3~10共水解聚合产物，且含氢量为0.2~1.2wt%。
2.根据权利要求1所述低应力导热硅凝胶组合物，其特征在于：所述的扩链剂为二甲基氢基封端的聚二甲基硅氧烷。
3.根据权利要求2所述低应力导热硅凝胶组合物，其特征在于：所述二甲基氢基封端的聚二甲基硅氧烷的粘度范围为10~130cs，含氢量为0.04~0.18wt%。
4.根据权利要求1所述低应力导热硅凝胶组合物，其特征在于：所述的催化剂为铂金催化剂，所述铂金催化剂选用氯铂酸催化剂、氯铂酸-异丙醇催化剂、氯铂酸-二乙烯基四甲基二硅氧烷催化剂中的一种，所述铂金属在铂金催化剂中含量为3000~5000ppm，且铂金属添加量为低应力导热硅凝胶组合物总重的5ppm~10ppm。
5.根据权利要求1所述低应力导热硅凝胶组合物，其特征在于：还包括添加量占低应力导热硅凝胶组合物总重的5ppm~15ppm的反应控制剂，所述反应控制剂选用乙炔环己醇、二乙烯基四甲基二硅氧烷、苯并三唑中的一种。
6.根据权利要求1所述低应力导热硅凝胶组合物，其特征在于：所述的功能性填料选自氢氧化铝、氧化铝、氧化锌、氮化硼、硅微粉、石墨烯、硼酸锌中的一种或几种。
7.根据权利要求1所述低应力导热硅凝胶组合物，其特征在于：所述的助粘剂选自钛化合物、铝化合物、锆化合物中一种，所述钛化合物选用二异丙氧基双（乙基乙酰乙酸）钛和钛酸四丁基酯中的一种，所述铝化合物选用乙基乙酰乙酸二异丙酸铝和三（乙酰丙酮酸）铝中的一种，所述锆化合物选用乙酰丙酮酸锆，所述助粘剂添加量为低应力导热硅凝胶组合物总重的0.1%~0.5%。
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| JP2008112972A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置 |
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