CN111627895A - LED light-emitting device with double-color temperature structure - Google Patents
LED light-emitting device with double-color temperature structure Download PDFInfo
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- CN111627895A CN111627895A CN202010438019.XA CN202010438019A CN111627895A CN 111627895 A CN111627895 A CN 111627895A CN 202010438019 A CN202010438019 A CN 202010438019A CN 111627895 A CN111627895 A CN 111627895A
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- chip
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- glue
- cups
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- 239000003292 glue Substances 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 7
- 239000011324 bead Substances 0.000 abstract description 5
- 238000005286 illumination Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an LED light-emitting device with a double-color temperature structure, and relates to the technical field of LED lighting sources. The anti-blocking bracket comprises bracket bowl cups, key alloy wires, chips, crystal fixing glue, white channels, brackets, bracket anti-blocking mark points and fluorescent glue, wherein two bracket bowl cups are arranged in each bracket, each bowl cup is separated into a positive electrode area and a negative electrode area through the white channels, the chip is fixed at the bottom in each bowl cup through the crystal fixing glue, each chip is connected with the positive electrode area and the negative electrode area in the corresponding bracket bowl cup through the key alloy wires, the fluorescent glue is filled in the surface of each chip and the bracket bowl cups, the fluorescent glue with different fluorescent powder ratios is filled in the two bowl cups respectively, and the bracket anti-blocking mark points are arranged on the side edges of the brackets. The invention adopts two lamp cups to realize two color temperature matching, realizes double-color temperature illumination, meets the requirements of different illumination scenes, reduces the surface mounting process of finished lamps, reduces the failure rate of lamp beads, prolongs the service life of the lamp beads and has wide application prospect.
Description
Technical Field
The invention relates to the technical field of LED lighting sources, in particular to an LED light-emitting device with a double-color temperature structure.
Background
Paster LED, also known as SMD LED or EMC LED, LED lamp pearl wafer attaches on the support, and one end is the negative pole, and the positive pole of power is connected to the other end, makes whole wafer encapsulated by epoxy. The semiconductor wafer is composed of two parts, one part is a P-type semiconductor, holes are dominant, the other part is an N-type semiconductor, mainly electrons, when the two semiconductors are connected, a P-N junction is formed between the two semiconductors, when current is applied to the wafer through a conducting wire, electrons are pushed to a P region, the electrons and the holes are recombined in the P region, and then energy is emitted in the form of photons. The surface mounted LED has small size, thin thickness, light weight and no shape limitation, so the surface mounted LED is widely applied to various industries, and the purpose of packaging is to adopt an automatic surface mounted machine for operation when an application end is produced. But current paster LED lamp pearl single structure mainly concentrates on traditional single colour temperature monochromatic light, and inconvenient the carrying on colour transform, paster LED lamp pearl direct mount does not have independent heat sink on electrically conductive PCB board simultaneously, and the heat dissipation is not good makes the lamp pearl damage easily in the later stage use, influences the life of lamp pearl.
In order to solve the above problems, it is particularly necessary to design a new type of LED light emitting device with a dual color temperature structure.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the LED light-emitting device with the double-color-temperature structure, which is simple in structure and reasonable in design, the two lamp cups of one LED lamp bead are matched with each other in two color temperatures, double-color-temperature illumination is realized, different illumination scene requirements are met, meanwhile, the surface mounting process of a finished lamp is reduced, the failure rate of the lamp bead is reduced, the service life of the lamp bead is prolonged, and the LED light-emitting device is easy to popularize and use.
In order to achieve the purpose, the invention is realized by the following technical scheme: a double-color temperature structure LED light-emitting device comprises support bowl cups, key alloy wires, chips, crystal fixing glue, white channels, supports, support foolproof mark points and fluorescent glue, wherein two support bowl cups are arranged in each support, each support bowl cup is divided into a positive electrode area and a negative electrode area through the white channels, the chip is fixed at the bottom of each bowl cup through the crystal fixing glue, each chip is connected with the positive electrode area and the negative electrode area in the corresponding support bowl cup through the key alloy wires, the fluorescent glue is filled in the surfaces of the chips and the support bowl cups, the fluorescent glue with different fluorescent powder ratios is respectively filled in the two bowl cups, different fluorescent powder ratios are used, the color temperatures of the two bowl cups are different, the white light is generated by exciting and compounding the fluorescent glue on the surfaces of the chips, and the light modulation of the color temperatures of the two bowl cups is realized; the side of the bracket is provided with a bracket fool-proof mark point.
Preferably, the positive electrode and the negative electrode of the chip are both welded and connected with a bonding alloy wire, the other end of the bonding alloy wire connected with the positive electrode of the chip is welded in the positive electrode area of the bracket bowl, and the other end of the bonding alloy wire connected with the negative electrode of the chip is welded in the negative electrode area of the bracket bowl.
Preferably, the fluorescent glue is formed by high-temperature baking and curing.
The invention has the beneficial effects that: this device realizes two kinds of colour temperature collocation, realizes double-colored temperature illumination, realizes different colour temperatures, reaches different effects, satisfies different lighting scene demands, and this structure effectively reduces finished product lamps and lanterns paster process simultaneously, reduces lamp pearl fault rate, improves the life of lamp pearl, and application prospect is wide.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a rack bowl of the present invention;
FIG. 3 is a schematic diagram of the connection of the chip of the present invention;
fig. 4 is a schematic diagram of the package of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1 to 4, the following technical solutions are adopted in the present embodiment: the utility model provides a double-colored warm structure LED luminescent device, includes support bowl cup 1, bonding gold wire 2, chip 3, solid crystal glue 4, white way 5, support 6, support prevent slow-witted mark point 7, fluorescent glue 8, be provided with two support bowl cups 1 in the support 6, all separate positive pole region and negative pole region through white way 5 in every support bowl cup 1, the bottom all is fixed with chip 3 through solid crystal glue 4 in each bowl cup, every chip 3 links to each other with the positive negative pole region in corresponding support bowl cup 1 through key alloy wire 2, the surface of chip 3 and support bowl cup 1 intussuseption are filled with fluorescent glue 8, fill respectively in two bowl cups and have the fluorescent glue 8 of different phosphor powder ratios, the side of support 6 be provided with support prevent slow-witted mark point 7.
It is worth noting that the bonding alloy wires 2 are welded and connected to the positive electrode and the negative electrode of the chip 3, the other end of the bonding gold wire 2 connected to the positive electrode of the chip 3 is welded in the positive electrode area of the bracket bowl 1, and the other end of the bonding gold wire 2 connected to the negative electrode of the chip 3 is welded in the negative electrode area of the bracket bowl 1.
This embodiment divides into two little bowls with a complete bowl cup, inlay in every support bowl cup 1 and be fixed with white way 5, white way 5 is located between support positive pole and the negative pole, use solid crystal glue 4 to fix chip 3 in support bottom region, all weld with bonding gold wire 2's one end on chip 3's the positive pole and the negative pole, bond alloy wire 2's the other end weld fixation is regional at the positive negative pole of support respectively, the same chip is placed to two bowls of support, every bowl cup intussuseption is equipped with fluorescent glue 8, fluorescent glue 8 encapsulates on chip 3 surfaces, through high temperature baking solidification shaping, two bowls use different phosphor powder ratios, it is different to realize two cups colour temperature, the fluorescent glue 8 on chip 3 surfaces arouses the complex and produces white light, realize that two bowls cup different colour temperatures adjust luminance.
This embodiment mode's same lamp pearl has two lamp cups respectively, different colour temperatures are realized to the different fluorescent glues of different lamp cup points, reach different effects, this double-colored temperature lamp pearl can realize warm white 3000K and the collocation of natural white 4000K, positive white 6000K collocation, perhaps natural white 4000K and positive white 6000K collocation, two kinds of colour temperature collocation are realized to a LED lamp pearl, can independent circuit control, white light and warm white light switch, satisfy different lighting scene demands, can also realize different colours yellow, red, green, the blue light is adjusted luminance, realize different scenes and freely switch, lamp pearl height integration simultaneously, reduce finished product lamps and lanterns paster process, effectively reduce lamp pearl fault rate, wide market perspective has.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A double-color temperature structure LED light-emitting device is characterized by comprising support bowl cups (1), bonding gold wires (2), chips (3), crystal-fixing glue (4), a white channel (5), supports (6), support foolproof mark points (7) and fluorescent glue (8), wherein two support bowl cups (1) are arranged in each support (6), an anode region and a cathode region are separated from each other in each support bowl cup (1) through the white channel (5), the chip (3) is fixed at the bottom of each bowl cup through the crystal-fixing glue (4), each chip (3) is connected with the anode region and the cathode region in the corresponding support bowl cup (1) through the bonding alloy wires (2), the fluorescent glue (8) is filled in each support bowl cup (1), and the fluorescent glue (8) with different fluorescent powder ratios is filled in the two bowl cups respectively, the side of the bracket (6) is provided with a bracket fool-proof mark point (7).
2. The LED luminescent device with the double-color temperature structure according to claim 1, wherein the bonding alloy wire (2) is welded on both the positive electrode and the negative electrode of the chip (3), the other end of the bonding alloy wire (2) connected with the positive electrode of the chip (3) is welded on the positive electrode area in the support bowl (1), and the other end of the bonding alloy wire (2) connected with the negative electrode of the chip (3) is welded on the negative electrode area in the support bowl (1).
3. The LED luminescent device with the bicolor temperature structure according to claim 1, wherein fluorescent glue (8) with different fluorescent powder ratios is respectively filled in two bowls of the bracket (6), the fluorescent glue (8) is packaged on the surface of the chip (3), different fluorescent powder ratios are used to realize different color temperatures of the two bowls, the fluorescent glue (8) on the surface of the chip (3) is used to excite and compound white light, and dimming of the two bowls with different color temperatures is realized.
4. The LED light-emitting device with the bicolor temperature structure as claimed in claim 3, wherein the fluorescent glue (8) is formed by high-temperature baking and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010438019.XA CN111627895A (en) | 2020-05-21 | 2020-05-21 | LED light-emitting device with double-color temperature structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010438019.XA CN111627895A (en) | 2020-05-21 | 2020-05-21 | LED light-emitting device with double-color temperature structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111627895A true CN111627895A (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010438019.XA Pending CN111627895A (en) | 2020-05-21 | 2020-05-21 | LED light-emitting device with double-color temperature structure |
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| Country | Link |
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| CN (1) | CN111627895A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540315A (en) * | 2021-06-11 | 2021-10-22 | 东莞市立德达光电科技有限公司 | Plant lighting LED packaging method |
-
2020
- 2020-05-21 CN CN202010438019.XA patent/CN111627895A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540315A (en) * | 2021-06-11 | 2021-10-22 | 东莞市立德达光电科技有限公司 | Plant lighting LED packaging method |
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