WO2016197957A1 - Led light metal frame - Google Patents
Led light metal frame Download PDFInfo
- Publication number
- WO2016197957A1 WO2016197957A1 PCT/CN2016/085352 CN2016085352W WO2016197957A1 WO 2016197957 A1 WO2016197957 A1 WO 2016197957A1 CN 2016085352 W CN2016085352 W CN 2016085352W WO 2016197957 A1 WO2016197957 A1 WO 2016197957A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lead
- led lamp
- heat
- wire
- heat dissipation
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 11
- 239000002184 metal Substances 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/10—Pendants, arms, or standards; Fixing lighting devices to pendants, arms, or standards
- F21V21/116—Fixing lighting devices to arms or standards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
Definitions
- the invention relates to a mounting bracket for an LED lamp, in particular to an LED lamp hardware bracket.
- LED Light Emitting Diode
- the heart of the LED is a semiconductor wafer with one end attached to a holder, one end being the negative pole and the other end connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy.
- the semiconductor wafer consists of two parts, one part is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a 'P-N junction' between them. When a current is applied to the wafer through the wire, the electrons are pushed toward the P region.
- the electrons recombine with the holes, and then the energy is emitted in the form of photons.
- This is the principle of LED illumination.
- the wavelength of light which is the color of light, is determined by the material that forms the P-N junction.
- the practical and commercialization of high-performance LEDs has brought a new revolution in lighting technology.
- the pixel lamp composed of a plurality of ultra-high-brightness red, blue and green LEDs not only emits various color lights with continuously adjustable wavelengths, but also emits white light having a brightness of tens to 100 candles, thereby becoming an illumination source.
- the latter consumes only 10%-20% of the former.
- white LEDs are made by coating a blue LED with a light yellow phosphor coating.
- This yellow phosphor is usually mixed by grinding the yttrium-doped yttrium aluminum garnet crystals into powder. Made from a dense binder.
- the LED chip emits blue light, part of the blue light is efficiently converted by this crystal into a broad spectrum of mainly yellow light. Since the yellow light stimulates the red and green light receptors in the naked eye, the blue light of the LED itself is mixed. Make it look like white light.
- the existing LED lamps are generally mounted directly on the mounting board.
- the mounting board is generally a sheet-like structure, including three layers: a heat dissipation layer for heat dissipation, an insulation layer for insulation under the heat dissipation layer, and an insulation layer.
- the circuit layer to be wired wherein the heat dissipation layer is generally an aluminum foil or an aluminum alloy sheet; the circuit layer is generally made of copper foil for wiring layout.
- the LED lamp is mounted on the heat sink layer and soldered to the circuit layer.
- the heat dissipation performance of the mounting plate of this type of LED largely depends on the thermal conductivity index of the insulating layer, and the thermal conductivity index of the insulating layer is often not high, resulting in poor heat dissipation performance of the entire LED lamp mounting strip.
- the entire LED lamp mounting plate has only one layer, that is, the heat dissipation layer, and the LED lamp strip is directly soldered to the LED lamp mounting plate, so as to better dissipate heat. Since the insulation layer and the wiring layer are eliminated, the energization of the LED strip can only be connected by wires. However, if the wires are distributed on the mounting plate, since the LED lamps generate a large amount of heat during the illuminating process, the insulating layer on the outer surface of the wires is melted by heat, which may cause an open circuit or even cause an accident.
- an LED lamp hardware bracket including:
- Each of the substrate strips includes a first lead, a second lead, and a hot lead, wherein the first lead, the second lead, and the hot lead are disposed in parallel, and the substrate strip is alternately disposed with a light emitting area and a heat dissipating area in a lateral direction, in the light emitting area
- the first wire is a symmetrically disposed inverted 'L' shape, and the heat conductor in the heat dissipation zone has a downward projection.
- the hot wire has a through hole in a portion of the light emitting region.
- the shape of the protruding portion of the heat wire in the heat dissipation region is trapezoidal.
- the portion of the heat wire protruding in the heat dissipation region includes a concave slope and a concave bottom plate.
- the LED lamp hardware bracket is made of copper or aluminum.
- first wires are broken at the light emitting region.
- the LED lamp metal bracket of the invention is integrally made of hardware material, and a plurality of substrate strips are formed at one time, and the substrate strip is used for installing LED lights, and the LED lamps are no longer connected by insulated wires, but are directly connected;
- the heat wire is added, and the downwardly convex portion of the heat wire in the heat dissipation region thereof can be connected to the heat sink by welding or the like, so that the heat dissipation performance of the substrate tape is better.
- FIG. 1 is a schematic structural view of a specific embodiment of an LED lamp hardware bracket of the present invention
- FIG. 2 is a partial enlarged view of a specific embodiment of the LED lamp hardware bracket of the present invention.
- an LED lamp metal bracket of the present invention includes a plurality of substrate strips disposed in parallel; each of the substrate strips includes a first lead 1, a second lead 2, and a hot lead 3, wherein the first The wire 1, the second wire 2 and the heat wire 3 are arranged in parallel, and the substrate strip is alternately provided with the light-emitting region 4 and the heat-dissipating region 5 in the lateral direction.
- the first wire 1 is symmetrically arranged in an 'L' shape, and the heat dissipation region The downwardly protruding portion of the hot wire 3 within 5.
- the LED lamp metal bracket of the invention is integrally formed by the hub processing device. According to actual needs, the metal bracket processed each time may comprise a plurality of substrate strips, and the length of the substrate strip can be adjusted as needed.
- the heat conductor 3 has a through hole in a portion of the light-emitting region 4.
- An LED lamp bead will be disposed on the light-emitting area 4, and the through-hole of the heat wire 3 can transfer heat to the heat-dissipating area.
- the convex portion of the heat wire 3 in the heat radiating region 5 is preferably trapezoidal.
- the trapezoid is used for soldering or bonding to other heat conductors or thermally conductive sheets to make it more heat-dissipating. Preferably, it can be soldered directly to a mounting strip made of metal.
- an LED lamp hardware bracket includes a plurality of parallel substrate strips; each of the substrate strips includes a first lead 1, a second lead 2, and a hot lead 3, wherein the first lead 1
- the second wire 2 and the heat wire 3 are arranged in parallel, and the substrate strip is alternately disposed with the light-emitting area 4 and the heat-dissipating area 5 in the lateral direction.
- the first wire 1 is symmetrically disposed in an 'L' shape, and the heat-dissipating area 5 is
- the hot wire 3 has a downward projection.
- the heat conductor 3 includes a concave slope 6 and a concave bottom plate 7 at the projection of the heat dissipation zone 5.
- the concave slope 6 allows the projection to extend obliquely downward, and the concave bottom plate 7 is used for welding or bonding to other heat conductors or thermally conductive sheets, so that the heat dissipation performance is stronger, and preferably, it can be directly welded to the metal.
- the mounting plate is attached.
- the material is copper or aluminum. Copper or aluminum has good thermal conductivity and is inexpensive.
- the parallel or series connection of the LED lamps on the entire string can be realized by the communication or disconnection of the first wires under some of the lamp beads.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
An LED light metal frame comprising multiple substrate strips in a parallel arrangement. Each substrate strip comprises a first lead (1), a second lead (2), and a thermal lead (3). Light-emitting areas (4) and heat dissipation areas (5) are alternately provided on the substrate strips. The first leads (1) within the light-emitting areas (4) are inverted "L" shapes in symmetrical arrangements. The thermal leads (3) of the heat dissipation areas (5) protrude downwards. The LED light metal frame has the multiple substrate strips formed at once and the substrate strips directly connected. With the addition of the thermal leads, heat dissipation performance is improved.
Description
技术领域 Technical field
本发明涉及一种LED灯的安装支架，尤其是涉及一种LED灯五金支架。 The invention relates to a mounting bracket for an LED lamp, in particular to an LED lamp hardware bracket.
背景技术 Background technique
LED （Light Emitting
Diode），发光二极管，是一种固态的半导体器件，它可以直接把电转化为光。LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。半导体晶片由两部分组成，一部分是P型半导体，在它里面空穴占主导地位，另一端是N型半导体，在这边主要是电子。但这两种半导体连接起来的时候，它们之间就形成一个'P-N结'。当电流通过导线作用于这个晶片的时候，电子就会被推向P区，在P区里电子跟空穴复合，然后就会以光子的形式发出能量，这就是LED发光的原理。而光的波长也就是光的颜色，是由形成P-N结的材料决定的。 LED (Light Emitting
Diode), a light-emitting diode, is a solid-state semiconductor device that converts electricity directly into light. The heart of the LED is a semiconductor wafer with one end attached to a holder, one end being the negative pole and the other end connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy. The semiconductor wafer consists of two parts, one part is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a 'P-N junction' between them. When a current is applied to the wafer through the wire, the electrons are pushed toward the P region. In the P region, the electrons recombine with the holes, and then the energy is emitted in the form of photons. This is the principle of LED illumination. The wavelength of light, which is the color of light, is determined by the material that forms the P-N junction.
高性能LED的实用化和商品化，使照明技术面临一场新的革命。由多个超高亮度红、蓝、绿三色LED组成的像素灯不仅可以发出波长连续可调的各种色光，而且还可以发出亮度可达几十到一百烛光的白色光成为照明光源，对于相同发光亮度的白炽灯和LED固体照明灯来说，后者的功耗只占前者的10%-20%。
The practical and commercialization of high-performance LEDs has brought a new revolution in lighting technology. The pixel lamp composed of a plurality of ultra-high-brightness red, blue and green LEDs not only emits various color lights with continuously adjustable wavelengths, but also emits white light having a brightness of tens to 100 candles, thereby becoming an illumination source. For incandescent lamps and LED solid-state lamps of the same luminous brightness, the latter consumes only 10%-20% of the former.
现时生产的白光LED大部分是通过在蓝光LED上覆盖一层淡黄色荧光粉涂层制成的，这种黄色磷光体通常是通过把掺了铈的钇铝石榴石晶体磨成粉末后混合在一种稠密的粘合剂中而制成的。当LED芯片发出蓝光，部分蓝光便会被这种晶体很高效地转换成一个光谱较宽的主要为黄色的光，由于黄光会刺激肉眼中的红光和绿光受体，再混合LED本身的蓝光，使它看起来就像白色光。
Most of the currently produced white LEDs are made by coating a blue LED with a light yellow phosphor coating. This yellow phosphor is usually mixed by grinding the yttrium-doped yttrium aluminum garnet crystals into powder. Made from a dense binder. When the LED chip emits blue light, part of the blue light is efficiently converted by this crystal into a broad spectrum of mainly yellow light. Since the yellow light stimulates the red and green light receptors in the naked eye, the blue light of the LED itself is mixed. Make it look like white light.
现有的LED灯一般是直接安装在安装板上，安装板一般是片状结构，包括三层：用来散热的散热层、散热层之下用来绝缘的绝缘层、绝缘层之下的用来布线的线路层，其中散热层一般为铝箔或者铝合金片；线路层一般为铜箔制成，用来做线路布局。LED灯安装在散热层上，与线路层焊接。该种类型的LED的安装板散热性能很大程度上取决于绝缘层的热导指数，而绝缘层的热导指数往往不高，造成整个LED灯安装板带的散热性能不佳。
The existing LED lamps are generally mounted directly on the mounting board. The mounting board is generally a sheet-like structure, including three layers: a heat dissipation layer for heat dissipation, an insulation layer for insulation under the heat dissipation layer, and an insulation layer. The circuit layer to be wired, wherein the heat dissipation layer is generally an aluminum foil or an aluminum alloy sheet; the circuit layer is generally made of copper foil for wiring layout. The LED lamp is mounted on the heat sink layer and soldered to the circuit layer. The heat dissipation performance of the mounting plate of this type of LED largely depends on the thermal conductivity index of the insulating layer, and the thermal conductivity index of the insulating layer is often not high, resulting in poor heat dissipation performance of the entire LED lamp mounting strip.
最理想的情况就是整个LED灯安装板只有一层，那就是散热层，LED灯带直接焊接到LED灯安装板上，这样才能更好地散热。由于取消了绝缘层和线路层，LED灯带的通电只能通过电线连接。但是如果电线分布在安装板上，由于LED灯在发光过程中会产生大量的热，电线外表的绝缘层就会受热融化，从而造成断路，甚至会酿成事故。
The most ideal situation is that the entire LED lamp mounting plate has only one layer, that is, the heat dissipation layer, and the LED lamp strip is directly soldered to the LED lamp mounting plate, so as to better dissipate heat. Since the insulation layer and the wiring layer are eliminated, the energization of the LED strip can only be connected by wires. However, if the wires are distributed on the mounting plate, since the LED lamps generate a large amount of heat during the illuminating process, the insulating layer on the outer surface of the wires is melted by heat, which may cause an open circuit or even cause an accident.
发明内容 Summary of the invention
为了克服现有技术的不足，本发明提出一种LED灯五金支架包括： In order to overcome the deficiencies of the prior art, the present invention provides an LED lamp hardware bracket including:
多条平行设置的基板带； a plurality of substrate strips arranged in parallel;
每条基板带包括第一导线、第二导线和热导线，其中所述第一导线、第二导线和热导线平行设置，基板带横向方向交替地设置有发光区和散热区，在发光区内第一导线为对称设置的倒'L'形，散热区内的热导线具有向下的凸出部。
Each of the substrate strips includes a first lead, a second lead, and a hot lead, wherein the first lead, the second lead, and the hot lead are disposed in parallel, and the substrate strip is alternately disposed with a light emitting area and a heat dissipating area in a lateral direction, in the light emitting area The first wire is a symmetrically disposed inverted 'L' shape, and the heat conductor in the heat dissipation zone has a downward projection.
进一步地，所述热导线在发光区的部分具有通孔。 Further, the hot wire has a through hole in a portion of the light emitting region.
进一步地，所述热导线在散热区的凸出部的形状为梯形。 Further, the shape of the protruding portion of the heat wire in the heat dissipation region is trapezoidal.
进一步地，所述热导线在散热区凸出的部分包括下凹斜坡及下凹底板。 Further, the portion of the heat wire protruding in the heat dissipation region includes a concave slope and a concave bottom plate.
进一步地，所述LED灯五金支架其材质为铜或铝。 Further, the LED lamp hardware bracket is made of copper or aluminum.
进一步地，若干第一导线在发光区处断开。 Further, a number of first wires are broken at the light emitting region.
本发明所述的LED灯五金支架，为五金材料整体制成，一次性形成多条基板带，基板带用于安装LED灯，各个LED灯之间不再使用绝缘导线连接，而是直接连接；增加了热导线，热导线在其散热区的向下凸起的部分可以通过焊接等方式连接到散热片上，使得基板带的散热性能更好。
The LED lamp metal bracket of the invention is integrally made of hardware material, and a plurality of substrate strips are formed at one time, and the substrate strip is used for installing LED lights, and the LED lamps are no longer connected by insulated wires, but are directly connected; The heat wire is added, and the downwardly convex portion of the heat wire in the heat dissipation region thereof can be connected to the heat sink by welding or the like, so that the heat dissipation performance of the substrate tape is better.
附图说明 DRAWINGS
为了更清楚地说明本发明的实施例，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一个实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
In order to more clearly illustrate the embodiments of the present invention, the accompanying drawings, which are used in the description of the embodiments, will be briefly described below. It is obvious that the drawings in the following description are only one embodiment of the present invention. For ordinary technicians, other drawings can be obtained based on these drawings without paying for creative labor.
图1是本发明LED灯五金支架一个具体实施例结构示意图； 1 is a schematic structural view of a specific embodiment of an LED lamp hardware bracket of the present invention;
图2是本发明LED灯五金支架一个具体实施例局部放大图。 2 is a partial enlarged view of a specific embodiment of the LED lamp hardware bracket of the present invention.
图中：1-第一导线；2-第二导线；3-导热线；4-发光区；5-散热区；6-下凹斜坡；7-下凹底板。 In the figure: 1-first wire; 2-second wire; 3-heat-conducting wire; 4-light-emitting region; 5--heat-dissipation zone; 6-dip slope; 7-dip bottom plate.
具体实施方式 detailed description
下面结合具体实施方式对本发明作进一步的说明。其中，附图仅用于示例性说明，表示的仅是示意图，而非实物图，不能理解为对本专利的限制；为了更好地说明本发明的实施例，附图某些部件会有省略、放大或缩小，并不代表实际产品的尺寸；对本领域技术人员来说，附图中某些公知结构及其说明可能省略是可以理解的。
The invention will now be further described in conjunction with specific embodiments. The drawings are for illustrative purposes only, and are merely illustrative, rather than actual, and are not to be construed as limiting the scope of the invention; Zooming in or out does not represent the size of the actual product; it will be understood by those skilled in the art that certain known structures and their description may be omitted.
实施例1，请参见图1，本发明一种LED灯五金支架包括多条平行设置的基板带；每条基板带包括第一导线1、第二导线2和热导线3，其中所述第一导线1、第二导线2和热导线3平行设置，基板带横向方向交替地设置有发光区4和散热区5，在发光区4内第一导线1为对称设置的'L'形，散热区5内的热导线3向下的凸出部。
Embodiment 1, referring to FIG. 1, an LED lamp metal bracket of the present invention includes a plurality of substrate strips disposed in parallel; each of the substrate strips includes a first lead 1, a second lead 2, and a hot lead 3, wherein the first The wire 1, the second wire 2 and the heat wire 3 are arranged in parallel, and the substrate strip is alternately provided with the light-emitting region 4 and the heat-dissipating region 5 in the lateral direction. In the light-emitting region 4, the first wire 1 is symmetrically arranged in an 'L' shape, and the heat dissipation region The downwardly protruding portion of the hot wire 3 within 5.
本发明一种LED灯五金支架通过轮毂加工装置整体制成，根据实际需要的不同，每次加工成的五金支架可以包括多条基板带，基板带的长度可以根据需要进行调整。
The LED lamp metal bracket of the invention is integrally formed by the hub processing device. According to actual needs, the metal bracket processed each time may comprise a plurality of substrate strips, and the length of the substrate strip can be adjusted as needed.
基于散热地进一步考虑，所述热导线3在发光区4的部分具有通孔。发光区4上将会设置有LED灯珠，热导线3的通孔可以使得热量更好地传递到散热区去。
Further considering the heat dissipation, the heat conductor 3 has a through hole in a portion of the light-emitting region 4. An LED lamp bead will be disposed on the light-emitting area 4, and the through-hole of the heat wire 3 can transfer heat to the heat-dissipating area.
另外，热导线3在散热区5中的凸出的部分优选为梯形。梯形用于焊接或粘接到其它导热体或导热片上，使得其散热性能更强，优选地，可以直接焊接到金属制成的安装板带上。
Further, the convex portion of the heat wire 3 in the heat radiating region 5 is preferably trapezoidal. The trapezoid is used for soldering or bonding to other heat conductors or thermally conductive sheets to make it more heat-dissipating. Preferably, it can be soldered directly to a mounting strip made of metal.
实施例2，请参见图2，一种LED灯五金支架包括多条平行设置的基板带；每条基板带包括第一导线1、第二导线2和热导线3，其中所述第一导线1、第二导线2和热导线3平行设置，基板带横向方向交替地设置有发光区4和散热区5，在发光区4内第一导线1为对称设置的'L'形，散热区5内的热导线3具有向下的凸出部。热导线3在散热区5的凸出部包括下凹斜坡6及下凹底板7。下凹斜坡6使得凸出部斜向下延伸，而下凹底板7则用于焊接到或粘接到其它导热体或导热片上，使得其散热性能更强，优选地，可以直接焊接到金属制成的安装板带上。
Embodiment 2, referring to FIG. 2, an LED lamp hardware bracket includes a plurality of parallel substrate strips; each of the substrate strips includes a first lead 1, a second lead 2, and a hot lead 3, wherein the first lead 1 The second wire 2 and the heat wire 3 are arranged in parallel, and the substrate strip is alternately disposed with the light-emitting area 4 and the heat-dissipating area 5 in the lateral direction. In the light-emitting area 4, the first wire 1 is symmetrically disposed in an 'L' shape, and the heat-dissipating area 5 is The hot wire 3 has a downward projection. The heat conductor 3 includes a concave slope 6 and a concave bottom plate 7 at the projection of the heat dissipation zone 5. The concave slope 6 allows the projection to extend obliquely downward, and the concave bottom plate 7 is used for welding or bonding to other heat conductors or thermally conductive sheets, so that the heat dissipation performance is stronger, and preferably, it can be directly welded to the metal. The mounting plate is attached.
在本发明LED灯五金支架其材质为铜或铝。铜或铝的导热性能好，并且价格便宜。 In the LED lamp hardware bracket of the invention, the material is copper or aluminum. Copper or aluminum has good thermal conductivity and is inexpensive.
而通过针对若干第一导线1在发光区设置成断开的状态，即基板带中部分数量的第一导线为断开，而剩余的第一导线则连通，断开部分可通过注塑加工直接形成。应用本发明的基板带制成的LED灯串中，通过某些灯珠下方的第一导线的连通或断开，可以实现整个灯串上LED灯的并联或串联。
And by setting a disconnected state in the light-emitting area for a plurality of first wires 1, that is, a part of the first wires in the substrate tape is disconnected, and the remaining first wires are connected, and the broken portions can be directly formed by injection molding. . In the LED lamp string made by applying the substrate strip of the present invention, the parallel or series connection of the LED lamps on the entire string can be realized by the communication or disconnection of the first wires under some of the lamp beads.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., which are included in the spirit and scope of the present invention, should be included in the present invention. Within the scope of protection.
Claims (6)
- 一种LED灯五金支架，其特征在于，包括： An LED lamp hardware bracket, characterized in that it comprises:多条平行设置的基板带；a plurality of substrate strips arranged in parallel;每条基板带包括第一导线、第二导线和热导线，其中所述第一导线、第二导线和热导线平行设置，基板带纵向方向间隔地设置有发光区和散热区，在发光区内第一导线为对称设置的倒“L”形，散热区的热导线具有向下的凸出部。 Each of the substrate strips includes a first lead, a second lead, and a hot lead, wherein the first lead, the second lead, and the hot lead are disposed in parallel, and the substrate strip is disposed with a light emitting area and a heat dissipating area at intervals in a longitudinal direction, in the light emitting area The first wire is a symmetrically disposed inverted "L" shape, and the heat conductor of the heat dissipation zone has a downward projection.
- 根据权利要求1所述的LED灯五金支架，其特征在于，所述热导线在发光区的部分具有通孔。The LED lamp hardware holder according to claim 1, wherein the heat wire has a through hole in a portion of the light emitting region.
- 根据权利要求1所述的LED灯五金支架，其特征在于，所述热导线凸出部的形状为梯形。The LED lamp metal bracket according to claim 1, wherein the heat wire projection has a trapezoidal shape.
- 根据权利要求3所述的LED灯五金支架，其特征在于，所述热导线凸出部包括下凹斜坡及下凹底板。The LED lamp hardware bracket according to claim 3, wherein the heat conductor projection comprises a concave slope and a concave bottom plate.
- 根据权利要求1所述的LED灯五金支架，其特征在于，所述LED灯五金支架材质为铜或铝。The LED lamp hardware bracket according to claim 1, wherein the LED lamp hardware bracket is made of copper or aluminum.
- 根据权利要求1所述的LED灯五金支架，其特征在于，所述若干第一导线在发光区处断开。The LED lamp hardware holder according to claim 1, wherein the plurality of first wires are disconnected at the light emitting region.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510319281.1 | 2015-06-11 | ||
| CN201510319281.1A CN104930476A (en) | 2015-06-11 | 2015-06-11 | Metallic LED (light emitting diode) lamp support |
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| WO2016197957A1 true WO2016197957A1 (en) | 2016-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2016/085352 WO2016197957A1 (en) | 2015-06-11 | 2016-06-08 | Led light metal frame |
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| CN (1) | CN104930476A (en) |
| WO (1) | WO2016197957A1 (en) |
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| CN105047787A (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | Packaging support for LED lamp |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN105161602B (en) * | 2015-09-25 | 2018-03-16 | 临安市新三联照明电器有限公司 | A kind of LED circuit board with reinforcement |
| CN105276534A (en) * | 2015-09-25 | 2016-01-27 | 吴少健 | LED circuit board |
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