CN110462755A - Insulated electric conductor - Google Patents
Insulated electric conductor Download PDFInfo
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- CN110462755A CN110462755A CN201880019748.2A CN201880019748A CN110462755A CN 110462755 A CN110462755 A CN 110462755A CN 201880019748 A CN201880019748 A CN 201880019748A CN 110462755 A CN110462755 A CN 110462755A
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- insulated electric
- insulating layer
- layer
- electric conductor
- polyamide imide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
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Abstract
A kind of insulated electric conductor, the insulated electric conductor include the insulating layer of linear conductor and the outer peripheral surface for covering the conductor.The insulating layer includes polyimide layer and has the polyamide imide in multiple holes inside it.The porosity of polyamide imide is 20 volume % to 80 volume %.
Description
Technical field
The present invention relates to a kind of insulated electric conductors.
The application based on and require in the Japanese patent application submitted to Japanese Patent Office on April 3rd, 2017
The priority of No.2017-073755, all the contents of the application are herein incorporated by reference.
Background technique
The coil of insulated electric conductor is used as the component of household electric appliances and automotive electric equipment.It is this to form the exhausted of coil
Edge electric wire includes electric conductivity conductor made of metal, and further includes covering the conductor and insulating layer made of resin.
It is in the electrical equipment used under high voltage, when applying high voltage to the insulated electric conductor for constituting electrical equipment,
Shelf depreciation (corona discharge) is easy to happen on the surface of insulating layer.The generation of corona discharge may cause dielectric breakdown.Therefore,
Other than with excellent insulating properties and high-mechanical property, the insulated electric conductor of the electrical equipment used under high voltages also needs
Reduce corona discharge.In order to reduce the generation of corona discharge, using including the insulated electric conductor with the insulating layer of low-k
It is effective.As it is this include the insulated electric conductor with the insulating layer of low-k, it has been proposed that including with hole
The insulated electric conductor of insulating layer (for example, with reference to patent document 1).
Reference listing
Patent document
Patent document 1: Japanese Unexamined Patent Publication No.2012-224714 bulletin
Summary of the invention
According to the disclosure, a kind of insulated electric conductor includes the insulating layer of linear conductor and the outer peripheral surface for covering conductor.It should
Insulating layer includes polyamide imide and polyimide layer inside it with multiple holes.The hole of polyamide imide
Gap rate is 20 volume % or more, 80 volume % or less.
Detailed description of the invention
Fig. 1 is the section view for schematically showing the insulated electric conductor according to first embodiment；
Fig. 2 is the section view for schematically showing the insulated electric conductor of the first variation example according to first embodiment；
Fig. 3 is the section view for schematically showing the insulated electric conductor according to the second embodiment；
Fig. 4 is the section view for schematically showing the insulated electric conductor of the first variation example according to the second embodiment；
Fig. 5 is the section view for schematically showing the insulated electric conductor of the second variation example according to the second embodiment；
Fig. 6 is the section view for schematically showing the insulated electric conductor of the third variation example according to the second embodiment；
Fig. 7 is the section view for schematically showing the insulated electric conductor according to third embodiment；
Fig. 8 is the section view for schematically showing the insulated electric conductor of the first variation example according to third embodiment；
Fig. 9 is the section view for schematically showing the insulated electric conductor according to the 4th embodiment；
Figure 10 is the section view for schematically showing the insulated electric conductor of the first variation example according to the 4th embodiment；
Figure 11 is the section view for schematically showing the insulated electric conductor according to the 5th embodiment；And
Figure 12 is the section view for schematically showing the insulated electric conductor of the first variation example according to the 5th embodiment.
Specific embodiment
The disclosure will solve the problems, such as
In conventional insulated electric conductor, polyimides can be used as constituting the material of insulating layer.This is because polyimides has
There are excellent heat resistance and resist processing.However, it is expensive due to polyimides, so if polyimides is used as structure
At the material of insulating layer, then manufacturing cost can increase.
In view of the above circumstances, the object of the present invention is to provide a kind of insulated electric conductor, the insulated electric conductor include have it is excellent
Heat resistance and resist processing and the insulating layer with low-k and low cost.
The effect of the disclosure
According to the disclosure, it is possible to provide such a insulated electric conductor, the insulated electric conductor include having excellent heat resistance and resistance to
Processability and the insulating layer with low-k and low cost.
The description of the embodiment of the disclosure
Firstly, will be exemplified below and describe embodiment of the present invention.Insulated electric conductor according to the disclosure includes line
The insulating layer of the outer peripheral surface of the conductor and covering conductor of shape.The insulating layer includes polyamide acyl inside it with multiple holes
Imine layer and polyimide layer.The porosity of polyamide imide is 20 volume % or more, 80 volume % or less.
In the insulated electric conductor according to the disclosure, insulating layer includes polyimide layer.Therefore, the heat-resisting of insulating layer can be improved
Property and resist processing.Insulating layer includes polyamide imide.It therefore, can compared with when insulating layer only includes polyimide layer
Reduce the manufacturing cost of insulated electric conductor.The inside of polyamide imide has multiple holes.By by polyamide imide
Porosity is set as 20 volume % or more, can reduce the dielectric constant of polyamide imide.Polyamides with low-k
Amine imide layer reduces the dielectric constant of entire insulating layer.In addition, by the way that the porosity of polyamide imide is set as
80 volume % while reducing the dielectric constant of insulating layer hereinafter, can inhibit the reduction of insulating properties.As a result, according to this public affairs
Open, it is possible to provide such insulated electric conductor: the insulated electric conductor includes having excellent heat resistance and resist processing and having low Jie
The insulating layer of electric constant and low cost.The porosity of polyamide imide used herein is the total volume and packet of finger-hole
Include the ratio between the total volume of polyamide imide in hole.
In above-mentioned insulated electric conductor, polyamide imide can be solid layer.Therefore, insulation can more reliably be improved
The heat resistance and resist processing of layer.
In above-mentioned insulated electric conductor, polyimide layer can be arranged to include insulating layer outer peripheral surface.Therefore, it will insulate
In the case that electric wire is used in oil, it can prevent oil from infiltrating into insulating layer, therefore can inhibit the reduction of durability.
In above-mentioned insulated electric conductor, the average-size in the hole being formed in polyamide imide is preferably 1 μm or more 10 μ
M or less.Average-size by will be formed in the hole in polyamide imide is set as 1 μm or more, can reduce polyamide acyl
The dielectric constant of imine layer.Therefore, the dielectric constant of entire insulating layer can more reliably be reduced.On the contrary, if being formed in
The average-size in the hole in polyamide imide is more than 10 μm, even when dielectric constant reduces, the insulating properties of insulating layer
It will reduce.
In above-mentioned insulated electric conductor, the ratio between thickness and the thickness of insulating layer of polyamide imide are preferably 20% or more
90% or less.It, can be more by the way that the ratio between the thickness of the thickness of polyamide imide and insulating layer is set as 20% or more
Reliably reduce the manufacturing cost of insulated electric conductor.On the contrary, if the ratio between the thickness and the thickness of insulating layer of polyamide imide
More than 90%, then the heat resistance and resist processing of insulating layer will reduce.
In above-mentioned insulated electric conductor, prime coat may be provided between conductor and insulating layer.Therefore, become that conductor can be improved
Adherence between insulating layer.As a result, such as flexibility, wearability, the marresistance of insulated electric conductor can be effectively improved
With the performance of resist processing etc.
In above-mentioned insulated electric conductor, the periphery in each hole in multiple holes can be formed with shell.Therefore, hole is not easy that
This connection, to inhibit the reduction of the intensity of insulated electric conductor, insulating properties and solvent resistance.
The detailed content of embodiment of the present invention
Next, insulated electric conductor of the reference attached drawing to the embodiment according to the disclosure is described.In the accompanying drawings, phase
It is indicated by the same numbers together or partially accordingly, and its repetitive description will be omitted.
(first embodiment)
The insulated electric conductor 1 according to first embodiment is shown in FIG. 1.Fig. 1 is to schematically show perpendicular to insulation
The section view in the section of the longitudinal direction of electric wire 1.As shown in Figure 1, insulated electric conductor 1 has circular section shape.Insulated electric conductor 1
Insulating layer 20 including the linear conductor 10 with circular section shape and the outer peripheral surface for covering conductor 10.
(conductor)
In the present embodiment, the section of the longitudinal direction perpendicular to conductor 10 of conductor 10 has circular shape.Except such as
Other than the section in direction is transversely to the machine direction in the present embodiment as the round wires of circular shape, conductor 10, which also can be used, has rectangle shape
The square flat wire of shape or square line with square shape.In addition, the twisted wire being made of more lines can be used.
The material of conductor 10 is preferably the metal with high conductivity and high mechanical strength.In the present embodiment, conductor
10 are made of copper.Other than copper removal, conductor 10 can also be made of copper alloy, aluminium, aluminium alloy, nickel, silver, iron, steel or stainless steel.It can lead to
It crosses and arbitrary above-mentioned metal is formed as linear to obtain conductor 10 or conductor 10 with multilayered structure, wherein being formed as
Linear any of the above-described metal is by other metal coverings.The example of conductor 10 with multi-layer structure includes covering contra wire, covering silver
Copper wire covers copper aluminum steel and copper clad steel line.
(insulating layer)
As shown in Figure 1, the insulating layer 20 for constituting insulated electric conductor 1 includes polyimide layer 30 and polyamide imide 40.
As in the present embodiment, the insulating layer 20 for constituting insulated electric conductor 1 can only include polyimide layer 30 and polyamide imide
40.Alternatively, insulating layer 20 may have configurations that wherein be laminated with it is multiple include at least polyimide layer 30 and polyamide acyl
The insulating layer of imine layer 40.In addition, multipair polyamide imide 40 and polyimide layer 30 can be laminated.Polyamide imide
40 are arranged to the outer peripheral surface of covering conductor 10.The inside of polyamide imide 40 has multiple holes 15.The thickness of insulating layer 20
Degree is (for example) 5 μm or more 200 μm or less.By the way that by thickness setting, within the above range, insulating layer 20 can make conductor 10 abundant
Insulation.
Polyamide imide 40 is to make layer as main component containing polyamidoimide.Term used herein
" main component " refers in the ingredient for constituting polyamide imide 40, and content is the ingredient of 50 mass % or more.In this reality
It applies in scheme, polyamide imide 40 includes polyamidoimide, and surplus is made of inevitable impurity.Except polyamide acyl
Other than imines, the synthetic resin for constituting polyamide imide 40 may also include such as polyesterimide, polyetherimide, polyamides
Amine, polyurethane, polyester, polybenzimidazoles, melamine resin, polyvinyl formal, epoxy resin, phenolic resin, urea
The thermosetting resin of resin or acrylic resin etc.Furthermore, it may include such as polyamide, polycarbonate, poly terephthalic acid
Butanediol ester, polyethylene terephthalate, polybutylene naphthalate, polyethylene naphthalate, polysulfones, polyethers
Sulfone, polyphenylsulfone, polyetherimide, polyphenylene sulfide, polyether-ketone, poly(aryl ether ketone), tetrafluoroethylene-ethylene copolymer, polyether-ether-ketone or
The thermoplastic resin of polytetrafluoroethylene (PTFE) etc.
In the present embodiment, the thickness of polyamide imide 40 and the lower limit of the ratio between the thickness of insulating layer 20 are
20%.The upper limit of the thickness of polyamide imide 40 and the ratio between the thickness of insulating layer 20 is 90%.By the way that polyamide acyl is sub-
The thickness of amine layer 40 and the ratio between the thickness of insulating layer 20 are set as 20% or more, can more reliably reduce insulated electric conductor 1
Manufacturing cost.On the contrary, if the ratio between thickness of the thickness of polyamide imide 40 and insulating layer 20 insulate more than 90%
The heat resistance and resist processing of layer 20 will reduce.If should be noted that includes multilayer polyamide imide layer 40, so much strata
The ratio between the overall thickness of amide imide layer 40 and the thickness of insulating layer 20 are 20% or more 90% or less.
In the present embodiment, polyamide imide 40 has the multiple holes 15 of dispersion inside it.Constitute polyamide
The relative dielectric constant of the polyamidoimide of imide layer 40 is different with the relative dielectric constant of air.Therefore, by poly-
Multiple holes 15 are formed in amide imide layer 40, and the dielectric constant of entire polyamide imide 40 is made to change.Its result
It is that the dielectric constant of the entire insulating layer 20 including polyamide imide 40 changes.For example, the phase of polyamidoimide
Air (relative dielectric constant: relative dielectric constant about 1.0) is higher than to dielectric constant.Therefore, if polyamide imide
40 are formed by polyamidoimide, then compared with when polyamide imide 40 does not have hole 15, by sub- in polyamide acyl
Hole 15 is formed in amine layer 40, can reduce the dielectric constant of polyamide imide 40.
In the present embodiment, the ratio between the total volume (including hole 15) of the total volume Yu polyamide imide 40 in hole 15
The upper limit of (porosity) is 80 volume %.In addition, the lower limit of the porosity of polyamide imide 40 is 20 volume %.Passing through will
The porosity of polyamide imide 40 is set as 20 volume % or more, can reduce the dielectric constant of polyamide imide 40.
Therefore, the dielectric constant of entire insulating layer 20 can more reliably be reduced.On the contrary, if the hole of polyamide imide 40
Rate is more than 80 volume %, even when dielectric constant reduces, the insulating properties of insulating layer be will also decrease.From the viewpoint for keeping insulating properties
From the point of view of, the upper limit of the porosity of polyamide imide 40 is preferably 60 volume % or less.It is entire exhausted from more reliably reducing
From the viewpoint of the dielectric constant of edge layer 20, the lower limit of the porosity of polyamide imide 40 is preferably 25 volume % or more.
If insulating layer includes multiple polyamide imides 40, the total volume in hole with include multiple polyamides in insulating layer 20
The ratio between the total volume of amine imide layer 40 can be in the above range.Polyamide acyl can be calculated by formula (W1-W2) × 100/W1
The porosity of imine layer 40, wherein W2 indicates the actual mass for the polyamide imide 40 removed with conductor 10, and W1 table
Show that the quality of non-porous polyamide imide 40, the quality pass through the apparent volume V1 of polyamide imide 40 is (apparent
Volume V1 is calculated based on the shape of polyamide imide 40) it is obtained multiplied by the density of polyamide imide 40.
The lower limit of the average-size in the hole 15 formed in the polyamide imide 40 according to the present embodiment is 1 μm.
The upper limit of the average-size in the hole 15 formed in polyamide imide 40 is 10 μm.By will be in polyamide imide 40
The average-size in the hole 15 of middle formation is set as 1 μm or more, can reduce the dielectric constant of polyamide imide 40.Therefore, energy
Enough dielectric constants for more reliably reducing entire insulating layer 20.On the contrary, if the hole formed in polyamide imide 40
15 average-size is more than 10 μm, even when dielectric constant reduces, the insulating properties of insulating layer be will also decrease.The average ruler in hole 15
Very little is by using pore-size distribution measuring device (such as by Porous Material, the automatic aperture distribution measuring of Inc. manufacture
System) measurement section and the value that obtains.
Polyimide layer 30 is to make layer as main component containing polyimides.Term " main component " used herein
Refer in the ingredient for constituting polyimide layer 30, content is the ingredient of 50 mass % or more.In the present embodiment, polyamides is sub-
Amine layer 30 includes polyimides, and surplus is made of inevitable impurity.In addition to polyimides, polyimide layer 30 is constituted
Synthetic resin may also include such as polyesterimide, polyetherimide, polyamide, polyurethane, polyester, polybenzimidazoles, trimerization
The thermosetting property tree of melamine resin, polyvinyl formal, epoxy resin, phenolic resin, urea resin or acrylic resin etc
Rouge.Furthermore, it may include such as polyamide, polycarbonate, polybutylene terephthalate (PBT), polyethylene terephthalate,
Polybutylene naphthalate, polyethylene naphthalate, polysulfones, polyether sulfone, polyphenylsulfone, polyetherimide, polyphenylene sulfide,
The thermoplastic resin of polyether-ketone, poly(aryl ether ketone), tetrafluoroethylene-ethylene copolymer, polyether-ether-ketone or polytetrafluoroethylene (PTFE) etc.
Make polyimide precursor imidizate by synthesis of polyimides presoma, and by heating etc., thus shape
At the polyimides for constituting polyimide layer 30, wherein polyimide precursor passes through aromatic tetracarboxylic acid dianhydride and aromatic diamine
Polycondensation reaction obtains.The example of workable aromatic tetracarboxylic acid dianhydride includes pyromellitic acid anhydride (PMDA).Workable virtue
The example of race's diamines includes 4,4 '-diaminodiphenyl ethers (ODA).
As shown in Figure 1, being solid layer according to the polyimide layer 30 of the present embodiment.Term used herein is " solid
Layer " refers to without the layer for deliberately forming hole 15, that is, there is no the layer in hole 15.Specifically, for example, polyimide layer
30 porosity is 1 volume % or less.In this way it is possible to more reliably improve the heat resistance and resist processing of insulating layer 20
Property.In addition, polyimide layer 30 be arranged to include insulating layer 20 outer peripheral surface.In this way, it is used for by insulated electric conductor 1
It in the case where in oil, can prevent oil from infiltrating into insulating layer 20, and therefore can inhibit the reduction of durability.
Note that replacing as in the present embodiment without the solid layer in hole 15, polyimide layer 30 can also have more
A hole 15.Fig. 2 shows the insulated electric conductors 1 according to the first variation example of first embodiment.Fig. 2 is to schematically show vertically
Section view in the section of the longitudinal direction of insulated electric conductor.As shown in Fig. 2, polyimide layer 30 is arranged to include insulating layer
20 outer peripheral surface, and there are multiple holes 15 dispersed therein.In this way, entire insulating layer 20 can be further decreased
Dielectric constant.
In addition, insulating layer 20 includes polyimide layer 30 in the insulated electric conductor 1 according to the present embodiment.Therefore, it improves
The heat resistance and resist processing of insulating layer 20.In addition, insulating layer 20 includes polyamide imide 40.Therefore, with insulating layer
20 compare when only including polyimide layer 30, can reduce the manufacturing cost of insulated electric conductor 1.Polyamide imide 40 has multiple
Hole 15, and the porosity of polyamide imide 40 is set as 20 volume % or more.Therefore, polyamidoimide can be reduced
The dielectric constant of layer 40.Polyamide imide 40 with low-k reduces the dielectric constant of entire insulating layer 20.
In addition, by the way that the porosity of polyamide imide 40 is set as 80 volume % hereinafter, can be in the dielectric for reducing insulating layer 20
Inhibit the reduction of insulating properties while constant.As a result, insulated electric conductor 1 include have excellent heat resistance and resist processing,
And the insulating layer 20 with low-k and low cost.
(manufacturing method of insulated electric conductor)
Next, description to be used to manufacture the general introduction of the method for insulated electric conductor 1.For manufacturing the method packet of insulated electric conductor 1
It includes: preparing the process of conductor 10；Prepare the process of polyamide-imide resin varnish (it will become polyamide imide 40)；
Prepare the process of polyimide resin varnish (it will become polyimide layer 30)；Polyamide-imide resin varnish is coated on
On the outer peripheral surface of conductor 10, and the process for heating polyamide-imide resin varnish to form polyamide imide 40；With
And polyimide resin varnish is coated on the outer peripheral surface for the polyamide imide 40 being formed on conductor 10, and heat
Process of the polyimide resin varnish to form polyimide layer 30.
In the process for preparing conductor 10, prepare conductor 10, for by the wire rod of the formation such as copper conductor.Next, in standard
In the process of standby polyamide-imide resin varnish, prepares comprising polyamidoimide (it is thermosetting resin) and also include
The varnish of pyrolytic resin.By being coated with and heating varnish, pyrolytic resin decomposition simultaneously evaporates, and polyamidoimide
Solidification.As a result, can get the polyamide imide 40 with multiple holes 15.
The example of pyrolytic resin includes in the solidification lower than the polyamidoimide for forming polyamide imide 40
The resin particle thermally decomposed at a temperature of temperature.For example, (methyl) acrylic polymer of crosslinking can be used as pyrolytic tree
Rouge.
In addition, hollow formation respectively with nucleocapsid structure can be used instead of using above-mentioned single pyrolytic resin
Particle.Nucleocapsid structure, which has, makees core as main component comprising pyrolytic resin, and is higher than heat point comprising thermal decomposition temperature
The resin of the thermal decomposition temperature of solution property resin makees shell as main component.It include the pyrolytic in the hollow core for forming particle
Resin is gasified in roasting by thermal decomposition, across shell and is spread.Therefore, after baking, hollow formation particle becomes hollow
, and the hollow shell for forming particle remains.It is hollow to form what particle became only being made of shell that is, after baking
Hollow particle.As a result, forming hole 15 in insulating layer 20.As described above, because the hole 15 formed in insulating layer 20
Periphery is surrounded by shell, so the hollow space of hollow particle is not easy to interconnect, therefore the change in size in hole 15 is minimum
Change.In addition, dielectric breakdown voltage, which is higher than, to be had by single for having the insulating layer 20 in the hole 15 formed by hollow particle
The dielectric breakdown voltage of the insulating layer in the hole that pyrolytic resin is formed, is consequently formed the insulating layer with excellent insulating properties
20.Therefore, while reducing the dielectric constant of insulated electric conductor 1, the intensity, insulating properties and solvent resistance of insulating layer 20 be can inhibit
Reduction.Term " nucleocapsid structure " used herein refers to such structure: wherein formed particle core material with surround
The shell of core material it is different.
For being derived from the hole 15 of the hollow formation particle with nucleocapsid structure, the hollow formation particle being contained in varnish
Pyrolytic resin in roasting by thermal decomposition gasification, and the pyrolytic resin to gasify is across shell and spreading.
Therefore, the shell in hole 15 is at least partially the defect of such as cracking, crack or hole etc.Shell with this defect
It can ensure that the formation in hole 15.In addition, can enhance prevents because the defect formed on the shell is cracking, crack or hole
The effect that hole 15 interconnects.
Above-mentioned hole 15 is respectively preferably in flat spheroid form.In addition, if the short axle in each hole 15 is along perpendicular to leading
The direction on the surface of body is orientated, then hole 15 will be not easy to contact with each other in the vertical direction that external force is easy effect.Its result
It is that the connection between hole can be made to minimize, and can easily keep the hole 15 (separate wells) being separately formed.Therefore, it insulate
The insulating properties and solvent resistance of layer 20 are not easy to reduce.Terms used herein " flat spheroid form " refer to such sphere
Shape: being wherein set as predetermined ratio for the ratio between short axle and long axis hereinafter, wherein long axis is defined as through the maximum diagonal of center of gravity
Line length, and short axle is defined as the minimum catercorner length by center of gravity.For example, " flat spheroid form " refers to include
The ratio between short axle and long axis in the section of short axle and long axis are set as 0.95 spheroid form below.In addition, " along perpendicular to leading
The orientation in the direction on the surface of body " be finger-hole short axle and perpendicular to the differential seat angle between the direction of conductive surface be 20 degree with
Under.
In the hollow formation particle with nucleocapsid structure, the pyrolytic resin of the main component as core is without spy
It does not limit, as long as using in the at a temperature of resin particle that thermally decomposes of the solidification temperature lower than polyamidoimide.Example
Such as, (methyl) acrylic polymer of crosslinking can be used as pyrolytic resin.In addition, the main component of above-mentioned shell can be silicon
Resin.Main component by using silicone resin as shell makes shell have elasticity.In addition, being easy to improve insulating properties and resistance to
It is hot, so that the separate wells surrounded by shell be made to be maintained." main component " used herein refer to content it is maximum at
Point, for example, content is the ingredient of 50 mass % or more.
In addition, in addition to using pyrolytic resin to form hole 15 as described in the embodiment above, it can also be by using hair
Infusion carries out foaming to form hole 15.The example of foaming agent includes chemical foaming agent and thermal expansivity micro-capsule.It is sent out as chemistry
The organic foaming agent or nothing that nitrogen, carbon dioxide, carbon monoxide or ammonia are decomposed and generated by heating can be used in infusion
Machine foaming agent.As thermal expansivity micro-capsule, the micro- of the shell with the core material and covering core material that are made of foaming agent can be used
Capsule, and since the expansion sheath of core material can expand therewith.In addition, the varnish comprising high boiling solvent can be prepared to form hole
15.As high boiling solvent, it is (for example) 180 DEG C to 300 DEG C of solvent that boiling point, which can be used,.The example of high boiling solvent includes two
Glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ethylene glycol ether, tetraethyleneglycol dimethyl ether and tetraethylene glycol monomethyl ether.
Next, preparing the varnish containing polyimides during preparing polyimide resin varnish.Varnish is applied
It is distributed on the polyamide imide 40 for being formed in the outer peripheral surface of conductor 10, and heats to form polyimide layer 30.
As varnish to be coated on to the method for being formed in the polyamide imide 40 of the outer peripheral surface of conductor 10, can enumerate makes
With the method for such apparatus for coating, which includes the liquid composition slot for accommodating liquid varnish, and further includes
Coating die.In apparatus for coating, conductor 10 makes varnish be attached to the outer peripheral surface for being formed in conductor 10 by liquid composition slot
Polyamide imide 40, then, conductor 10 is coated with varnish with uniform thickness by coating die.
In the process of cured varnish, made by heating varnish curing to form insulating layer 20.For heating the dress of varnish
Setting can be the tubular roaster extended on the moving direction for the conductor 10 for having been coated with varnish.As heating means, heat can be used
Air heating, infrared heating or radio frequency heating.Heating temperature can be 300 DEG C or more 600 DEG C or less.
(other embodiments)
Next, by other embodiments for the insulated electric conductor 1 for describing the disclosure.Fig. 3 is to show according to the disclosure second
The figure of the insulated electric conductor 1 of embodiment.Fig. 4 is the figure for showing the insulated electric conductor 1 of the first variation example according to the second embodiment.
Fig. 5 is the figure for showing the insulated electric conductor 1 of the second variation example according to the second embodiment.Fig. 6 is to show according to the second embodiment party
The figure of the insulated electric conductor 1 of the third variation example of case.Fig. 3 to Fig. 6 is the longitudinal direction schematically shown perpendicular to insulated electric conductor 1
Section section view.Fig. 7 is the figure for showing the insulated electric conductor 1 according to the third embodiment of the disclosure.Fig. 8 is to show root
According to the figure of the insulated electric conductor 1 of the first variation example of third embodiment.Fig. 7 and Fig. 8 is to schematically show perpendicular to insulated electro
The section view in the section of the longitudinal direction of line 1.Fig. 9 is the insulated electric conductor 1 for showing the 4th embodiment according to the disclosure
Figure.Figure 10 is the figure for showing the insulated electric conductor 1 of the first variation example according to the 4th embodiment.Fig. 9 and Figure 10 is schematically
The section view in the section of the longitudinal direction perpendicular to insulated electric conductor 1 is shown.Figure 11 is to show to implement according to the 5th of the disclosure the
The figure of the insulated electric conductor 1 of scheme.Figure 12 is the figure for showing the insulated electric conductor 1 of the first variation example according to the 5th embodiment.Figure
11 and Figure 12 is the section view for schematically showing the section of the longitudinal direction perpendicular to insulated electric conductor 1.Implement according to second
The composition of the insulated electric conductor 1 of scheme, third embodiment, the 4th embodiment and the 5th embodiment is substantially implemented with first
The composition of scheme is identical.However, the second embodiment, third embodiment, the 4th embodiment and the 5th embodiment it is exhausted
Edge layer 20 is different from the insulating layer 20 of first embodiment.Hereinafter, by the difference of description and first embodiment.
As shown in figure 3, including the linear conductor with circular section shape according to the insulated electric conductor 1 of the second embodiment
10, and cover the insulating layer 20 of the outer peripheral surface of conductor 10.Insulating layer 20 includes the first polyimide layer 301, polyamide acyl Asia
Amine layer 40 and the second polyimide layer 302.First polyimide layer 301 is arranged to the outer peripheral surface of covering conductor 10.Polyamide
Imide layer 40, which is laminated in, to be arranged to include on the first polyimide layer 301 of the outer peripheral surface of conductor 10.Second polyimides
Layer 302 is laminated on polyamide imide 40, and the second polyimide layer 302 be arranged to include insulating layer 20 periphery
Face.First polyimide layer 301 and the second polyimide layer 302 are solid layer.In this way, it can more reliably improve absolutely
The heat resistance and resist processing of edge layer 20.As shown in figure 4, the first polyimide layer 301 can have multiple holes dispersed therein
15, and the second polyimide layer 302 can be solid layer.In addition, as shown in figure 5, the first polyimide layer 301 can be solid
Layer, and the second polyimide layer 302 can have multiple holes 15 dispersed therein.In addition, as shown in fig. 6, the first polyamides is sub-
Amine layer 301 and the second polyimide layer 302 can respectively have multiple holes 15 dispersed therein.It in this way, can be further
Reduce the dielectric constant of entire insulating layer 20.Note that insulating layer 20 may include the first polyimide layer of multiple groups 301, polyamide acyl
Imine layer 40 and the second polyimide layer 302.
As shown in fig. 7, including the linear conductor with circular section shape according to the insulated electric conductor 1 of third embodiment
10, and cover the insulating layer 20 of the outer peripheral surface of conductor 10.Insulating layer 20 includes polyimide layer 30 and polyamide imide
40.Polyimide layer 30 is arranged to the outer peripheral surface of covering conductor 10.Polyamide imide 40, which is laminated in, to be arranged to cover
On the polyimide layer 30 of the outer peripheral surface of conductor 10, and polyamide imide 40 is arranged to the periphery of covering insulating layer 20
Face.Polyimide layer 30 is solid layer.As shown in figure 8, polyimide layer 30 can have multiple holes 15 dispersed therein.Note
Meaning, insulating layer 20 may include multipair polyimide layer 30 and polyamide imide 40.
As shown in figure 9, including the linear conductor with circular section shape according to the insulated electric conductor 1 of the 4th embodiment
10, and cover the insulating layer 20 of the outer peripheral surface of conductor 10.Insulating layer 20 includes the first polyimide layer 301, the second polyamides Asia
Amine layer 302 and polyamide imide 40.First polyimide layer 301 is arranged to the outer peripheral surface of covering conductor 10.Second is poly-
Imide layer 302 is laminated on the first polyimide layer 301.Polyamide imide 40 is laminated in the second polyimide layer 302
On, and polyamide imide 40 be arranged to include insulating layer 20 outer peripheral surface.First polyimide layer 301 is solid
Layer, and the second polyimide layer 302 has multiple holes 15 dispersed therein.As shown in Figure 10, the first polyimide layer 301
There can be multiple holes 15 dispersed therein, and the second polyimide layer 302 can be solid layer.Note that insulating layer 20 can wrap
Include multiple groups the first polyimide layer 301, the second polyimide layer 302 and polyamide imide 40.
It as shown in figure 11, include that there is the linear of circular section shape to lead according to the insulated electric conductor 1 of the 5th embodiment
Body 10, and cover the insulating layer 20 of the outer peripheral surface of conductor 10.Insulating layer 20 includes polyamide imide 40, the first polyamides Asia
Amine layer 301 and the second polyimide layer 302.Polyamide imide 40 is arranged to the outer peripheral surface of covering conductor 10.First is poly-
Imide layer 301 is laminated on polyamide imide 40.In addition, the second polyimide layer 302 is laminated in the first polyimides
Layer 301 on, and the second polyimide layer 302 be arranged to include insulating layer 20 outer peripheral surface.First polyimide layer 301 is
Solid layer, and the second polyimide layer 302 has multiple holes 15 dispersed therein.As shown in figure 12, the first polyimides
Layer 301 can have multiple holes 15 dispersed therein, and the second polyimide layer 302 can be solid layer.Note that insulating layer 20
It may include multiple groups polyamide imide 40, the first polyimide layer 301 and the second polyimide layer 302.
It is identical as first embodiment, it is real according to the second embodiment, third embodiment, the 4th embodiment and the 5th
Apply scheme, it is possible to provide the insulated electric conductor 1 including such insulating layer 20, the insulating layer 20 have excellent heat resistance and resist processing
Property, and there is low-k and low manufacturing cost.
It should be understood that embodiment disclosed herein is illustrative in all respects, and it is not intended to any side
Formula is limited.The scope of the present invention is not limited by above description, is limited by the scope of the claims, and is intended to wrap
Include all modifications in the meaning and scope being equal with the scope of the claims.
For example, can be arranged between conductor 10 and insulating layer 20 according to the insulated electric conductor 1 of any of the above-described embodiment all
Such as other layers of prime coat etc.Prime coat is set with the adherence between enhancement layer, and prime coat can be by known resin
Composition is formed.
If prime coat is arranged between conductor 10 and insulating layer 20, the resin combination for forming prime coat may include
One of polyimides, polyamidoimide, polyesterimide, polyester and phenoxy resin or various kinds of resin.In addition, being formed
The resin combination of prime coat may include the additive of such as adherence reinforcing agent etc.By conductor 10 and insulating layer 20 it
Between the prime coat that is formed by this resin combination is set, the adherence between conductor and insulating layer can be enhanced.As a result, can
Effectively improve the performance of such as flexibility, wearability, marresistance and resist processing etc of insulated electric conductor 1.
In addition, the resin combination for forming prime coat also may include such as epoxy in addition to above-mentioned one or more resins
Other any resins of resin, phenoxy resin or melamine resin etc.In addition, can be by commercially available liquid composition (absolutely
Edge varnish) it is used as each resin in the resin combination for forming prime coat included.
The lower limit of the average thickness of prime coat is preferably 1 μm, and more preferably 2 μm.The average thickness of prime coat it is upper
Preferably 30 μm of limit, and more preferably 20 μm.If the average thickness of prime coat be less than above-mentioned lower limit, prime coat with lead
The adherence of body 10 may be insufficient.On the contrary, if the average thickness of prime coat be more than the above-mentioned upper limit, insulated electric conductor 1 it is straight
Diameter increases in which may not be necessary.
Description of symbols
1 insulated electric conductor
10 conductors
15 holes
20 insulating layers
30 polyimide layers
301 first polyimide layers
302 second polyimide layers
40 polyamide imides
Claims (7)
1. a kind of insulated electric conductor, comprising:
Linear conductor；And
Cover the insulating layer of the outer peripheral surface of the conductor；
Wherein the insulating layer includes
Inside it with the polyamide imide in multiple holes, and
Polyimide layer, and
Wherein the porosity of the polyamide imide is 20 volume % or more, 80 volume % or less.
2. insulated electric conductor according to claim 1, wherein the polyimide layer is solid layer.
3. insulated electric conductor according to claim 2, wherein the polyimide layer is arranged to include the insulating layer
Outer peripheral surface.
4. insulated electric conductor according to any one of claim 1 to 3, wherein being formed in the polyamide imide
The average-size in the hole is 1 μm or more 10 μm or less.
5. insulated electric conductor according to any one of claim 1 to 4, wherein the thickness of the polyamide imide and institute
Stating the ratio between thickness of insulating layer is 20% or more 90% or less.
6. insulated electric conductor according to any one of claim 1 to 5, wherein being set between the conductor and the insulating layer
It is equipped with prime coat.
7. insulated electric conductor according to any one of claim 1 to 6, wherein the periphery in each hole in the multiple hole
It is formed with shell.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017073755 | 2017-04-03 | ||
| JP2017-073755 | 2017-04-03 | ||
| PCT/JP2018/012828 WO2018186259A1 (en) | 2017-04-03 | 2018-03-28 | Insulated electric wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110462755A true CN110462755A (en) | 2019-11-15 |
Family
ID=63712908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880019748.2A Pending CN110462755A (en) | 2017-04-03 | 2018-03-28 | Insulated electric conductor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2018186259A1 (en) |
| CN (1) | CN110462755A (en) |
| WO (1) | WO2018186259A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627618A (en) * | 2020-06-18 | 2020-09-04 | 台一铜业(广州)有限公司 | Production and processing technology of enameled wire for automobile oil-cooled driving motor |
| CN117393208A (en) * | 2023-11-14 | 2024-01-12 | 三元科技（深圳）有限公司 | High-performance superfine ultrasonic cable |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881342A (en) * | 2021-09-27 | 2023-03-31 | 日立金属株式会社 | Insulated wire and method for manufacturing insulated wire |
| WO2023153063A1 (en) * | 2022-02-08 | 2023-08-17 | 住友電気工業株式会社 | Insulated electrical wire and method for manufacturing insulated electrical wire |
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Also Published As
| Publication number | Publication date |
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| JPWO2018186259A1 (en) | 2020-02-13 |
| WO2018186259A1 (en) | 2018-10-11 |
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Application publication date: 20191115 |