CN110457774A - A kind of high-power operation is laminated the calculation method of series feed synthesizer insertion loss - Google Patents
A kind of high-power operation is laminated the calculation method of series feed synthesizer insertion loss Download PDFInfo
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- CN110457774A CN110457774A CN201910657709.1A CN201910657709A CN110457774A CN 110457774 A CN110457774 A CN 110457774A CN 201910657709 A CN201910657709 A CN 201910657709A CN 110457774 A CN110457774 A CN 110457774A
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- insertion loss
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- microstrip line
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Abstract
The present invention is the calculation method that a kind of high-power operation is laminated series feed synthesizer insertion loss, belongs to radar antenna feeder technical field.Connector and printed board material simulation calculation parameter are primarily determined first, in accordance with Materials Handbook, and observation is laminated series feed synthesizer, is divided by structure, material, technique uniform portion in transmission line path.Classify to each component part, determine some types for influencing insertion loss, establish the Simulation Calculation group comprising same type, column write equation group.Simulation Calculation group is produced on same printed board material and is tested by operating condition, and insertion loss test value, solve system of equation are recorded.Finally, the printed board dielectric loss angle tangent of each section type of insertion loss is influenced by change, insertion loss simulation result and solution of equations and insertion loss test value is set to coincide, it determines the printed board dielectric loss angle tangent of each section type, and replaces the former series feed each component part printed board dielectric loss angle tangent of synthesizer of lamination.
Description
Technical field
The invention belongs to radar antenna feeder technical fields.
Background technique
Simulation result and the measured result gap for being laminated series feed synthesizer insertion loss are larger.Due to connector electrical property
Can unit for electrical property parameters inconsistency between difference, connector and microstrip line changeover portion assembling difference, pcb substrate, in substrate electrically
Energy parameter inhomogeneities, deposited copper roughness and cabling etching precision are affected by technological level, simply according to Materials Handbook
The insertion loss simulation result that simulation calculation parameter obtains is arranged to differ greatly with measured result, especially in high band, height
Power operating condition, this species diversity are more obvious.Need a kind of more acurrate simulation calculation high-power operation lamination series feed in engineering
The method of synthesizer insertion loss, the convenient high-power operation in design phase simulation calculation multi-stage cascade are laminated series feed synthesizer
Insertion loss.
Summary of the invention
The present invention is the calculation method that a kind of high-power operation is laminated series feed synthesizer insertion loss, simple for solving
It is asked according to the insertion loss simulation result that Materials Handbook setting simulation calculation parameter obtains with what measured result differed greatly
Topic.Board transmission line is uniformly printed for one section, simultaneously only changes printed board medium according to Materials Handbook setting simulation calculation parameter and damages
The simulation calculation parameter setting of consumption angle tangent can make insertion loss simulation result and reality in certain frequency range
It is almost the same to survey result.Therefore, one section of uniform printed board transmission in simulation calculation can be determined according to insertion loss measured result
The numerical value of line dielectric loss angle tangent makes insertion loss simulation result and measured result basic one in certain frequency range
It causes.It is laminated series feed synthesizer, connector and printed board material simulation calculation parameter can be primarily determined according to Materials Handbook, then press
Structure, material, technique uniform portion are divided in transmission line path.Then, classify to each component part, determining influences to insert
Enter some types of loss.According to some types for influencing insertion loss, the Simulation Calculation group comprising each type is established.
According to Simulation Calculation group, column write equation group.Simulation Calculation group is produced on same printed board material and presses work
Condition test records insertion loss test value.According to insertion loss test value solve system of equation.Finally, influencing to insert by change
The printed board dielectric loss angle tangent for entering each section type of loss makes insertion loss simulation result and solution of equations and inserts
Enter loss test value to coincide, determine the printed board dielectric loss angle tangent of each section type, and then replaces the former series feed synthesis of lamination
Each component part printed board dielectric loss angle tangent of device, can make insertion loss simulation result in certain frequency range with
Measured result is almost the same
Implementation steps of the invention are as follows:
Firstly, primarily determining connector and printed board material simulation calculation parameter according to Materials Handbook, then observe lamination string
Synthesizer is presented, is divided by structure, material, technique uniform portion in transmission line path.
Then, to each component part classification of series feed synthesizer is laminated, some types for influencing insertion loss are determined.According to
The some types of insertion loss are influenced, the Simulation Calculation group comprising same type is established.According to Simulation Calculation group, column
Write equation group.Simulation Calculation group is produced on same printed board material and is tested by actual operating conditions, record insertion
Loss test value.According to insertion loss test value solve system of equation.
Finally, influencing the printed board dielectric loss angle tangent of each section type of insertion loss by change, damage insertion
It consumes simulation result and solution of equations and insertion loss test value coincide, determine the printed board dielectric loss angle of each section type
Tangent, and replace the former series feed each component part printed board dielectric loss angle tangent of synthesizer of lamination.
Technical characterstic and remarkable advantage of the invention are as follows:
1. compared with the dielectric loss angle tangent provided using printed board Materials Handbook, the print that is obtained using the method for the present invention
Making sheet dielectric loss angle tangent is combined the insertion loss simulation calculation knot of the series feed synthesizer of a variety of laminations formed by same type
Fruit and measured result more coincide, especially more obvious in high band or high-power operation condition, advantage.
2. compared with the dielectric loss angle tangent provided using printed board Materials Handbook, using the method for the present invention, Neng Gou
The series feed synthesizer structure of a variety of laminations formed is combined under design phase more acurrate simulation calculation actual operating conditions by same type
At system insertion loss and system output power.
3. the emulated computation method that the present invention can be generalized to other types microwave device insertion loss.
Present invention is further described in detail with reference to the accompanying drawing.
Detailed description of the invention
A kind of series feed synthesizer structural schematic diagram of lamination of Fig. 1.
Fig. 2 connector and a kind of length microstrip line set of transitions are at Simulation Calculation.
Fig. 3 connector and another length microstrip line set of transitions are at Simulation Calculation.
Fig. 4 connector and microstrip line changeover portion, microstrip line, interlayer metallization blind hole form Simulation Calculation.
Fig. 5 connector and microstrip line changeover portion, microstrip line, interlayer metallization blind hole, defect ground structure form simulation calculation
Model.
Upper figure label meaning are as follows: 1- connector and microstrip line changeover portion, 2- microstrip line, 3- interlayer metallization blind hole, 4-
Microstrip line, 5- connector and microstrip line changeover portion, 6- defect ground structure, 7- microstrip line and load transitions section, 8- microstrip line, 9- connect
Connect device and microstrip line changeover portion, 10- defect ground structure, 11- microstrip line and load transitions section, 12- microstrip line, 13- connector with
Microstrip line changeover portion, 14- defect ground structure, 15- microstrip line and load transitions section, 16- microstrip line, 17- interlayer metallization blind hole,
18- connector and microstrip line changeover portion, 19- connector and microstrip line transition segment type, 20- microstrip line type, 21- interlayer metal
Change blind hole type, 22- defect ground structure type.
Specific embodiment
A kind of high-power operation proposed by the present invention is laminated the calculation method of series feed synthesizer insertion loss, specific embodiment party
Formula is following (referring to attached drawing):
1. primarily determining connector and printed board material simulation calculation parameter, including dielectric constant, magnetic according to Materials Handbook
Conductance, dielectric loss angle tangent, magnetic loss angle tangent, testing of materials frequency point etc..
2. being laminated series feed synthesizer in observation Fig. 1, drawn by structure, material, technique uniform portion in transmission line path
Point.Including connector and microstrip line changeover portion 1, microstrip line 2, interlayer metallization blind hole 3, microstrip line 4, connector and microstrip line mistake
Section 5, defect ground structure 6, microstrip line and load transitions section 7, microstrip line 8, connector and microstrip line changeover portion 9 are crossed, is tied to defect
Structure 10, microstrip line and load transitions section 11, microstrip line 12, connector and microstrip line changeover portion 13, defect ground structure 14, microstrip line
With load transitions section 15, microstrip line 16, interlayer metallization blind hole 17, connector and microstrip line changeover portion 18.
3. pair each component part classification.Including connector and microstrip line changeover portion Class1 9, microstrip line type 20, interlayer
Metalized blind vias type 21, defect ground structure type 22, microstrip line and load transitions segment type 7.
4. determining some types for influencing insertion loss.Including connector and microstrip line changeover portion Class1 9, insertion loss
It is denoted as A.Microstrip line type 20, unit length insertion loss are denoted as b.Interlayer metallization blind hole type 21, insertion loss is denoted as C.
Defect ground structure type 22, insertion loss is denoted as D.
5. establishing the Simulation Calculation group comprising same type according to some types for influencing insertion loss.Connector
With a kind of length microstrip line changeover portion, Simulation Calculation is formed, as shown in Figure 2.Connector and another length microstrip line mistake
Section is crossed, forms Simulation Calculation, as shown in Figure 3.Connector and microstrip line changeover portion, microstrip line, interlayer metallization blind hole group
At Simulation Calculation, as shown in Figure 4.Connector and microstrip line changeover portion, microstrip line, interlayer metallization blind hole are tied to defect
Structure forms Simulation Calculation, as shown in Figure 5.
6. column write equation group according to Simulation Calculation group.The equation left side is the sum of the insertion loss of various pieces, side
Item is total insertion loss on the right of journey, and Fig. 2 equation is 2A+bL1=T1, Fig. 3 equation is 2A+bL2=T2, Fig. 4 equation is 2A+bL3+2C
=T3.Fig. 5 intermediate connector connects matched load, and left side connector to right side connector total insertion loss is T4。L1、L2、L3It is to set
Definite value is known quantity.
7. producing Simulation Calculation group on same printed board material and by identical as series feed synthesizer is laminated in Fig. 1
Operating condition test, records insertion loss test value T1、T2、T3、T4.Operating condition can be high power state.
L known to 8.1、L2、L3、T1、T2、T3Solve system of equation obtains A, b, C.Pass through change connector and microstrip line transition
Segment type 19, microstrip line type 20, the printed board dielectric loss angle tangent of interlayer metallization blind hole type 21 keep insertion loss imitative
True calculated result and A, b, C coincide substantially, and generally, deviation can be considered as and coincide substantially within 5%.Determine connector with
Microstrip line changeover portion Class1 9, microstrip line type 20, the printed board new medium loss angle tangent of interlayer metallization blind hole type 21.
Generally, the above-mentioned type printed board new medium loss angle tangent is significantly greater than the result that printed board Materials Handbook provides.
9. by connector and microstrip line changeover portion Class1 9, microstrip line type 20, the print of interlayer metallization blind hole type 21
Making sheet new medium loss angle tangent brings Fig. 5 Simulation Calculation into, by the printed board medium for changing defect ground structure type 22
Loss angle tangent makes insertion loss simulation result and T4Substantially it coincide, determines that the printed board of defect ground structure type 22 is new
Dielectric loss angle tangent.So far, under operating condition identical as series feed synthesizer is laminated in Fig. 1, and same composition some types
Printed board new medium loss angle tangent determines.
10. microstrip line type 20, interlayer metallization blind hole type 21 lacks with connector and microstrip line changeover portion Class1 9
The printed board new medium loss angle tangent for falling into ground structure type 22, which is replaced, is laminated each component part printed board of series feed synthesizer in Fig. 1
Dielectric loss angle tangent, again simulation calculation insertion loss.
Claims (1)
1. the calculation method that a kind of high-power operation is laminated series feed synthesizer insertion loss, it is characterised in that:
Primarily determine that connector and printed board material simulation calculation parameter, including dielectric constant, magnetic conductivity are situated between according to Materials Handbook
Matter loss angle tangent, magnetic loss angle tangent, testing of materials frequency point；Observation is laminated series feed synthesizer, by structure in transmission line path,
Material, technique uniform portion are divided, and are classified to each component part, determine some types for influencing insertion loss, packet
Include connector and microstrip line transition segment type, microstrip line type, interlayer metallization blind hole type, defect ground structure type；According to
The some types of insertion loss are influenced, the Simulation Calculation group comprising same type, connector and a kind of length micro-strip are established
Line changeover portion forms Simulation Calculation, connector and another length microstrip line changeover portion, forms Simulation Calculation, even
Device and microstrip line changeover portion, microstrip line are connect, interlayer metallization blind hole forms Simulation Calculation, connector and microstrip line transition
Section, microstrip line, interlayer metallization blind hole, defect ground structure form Simulation Calculation；According to Simulation Calculation group, the side of writing is arranged
Journey group produces Simulation Calculation group and by operating condition identical as the original series feed synthesizer of lamination on same printed board material
Test records insertion loss test value, according to insertion loss test value solve system of equation, influences each of insertion loss by change
The printed board dielectric loss angle tangent of some types tests insertion loss simulation result and solution of equations and insertion loss
Value is coincide substantially, determines the printed board new medium loss angle tangent of each section type, and replaces the former series feed synthesizer each group of lamination
At part printed board dielectric loss angle tangent, simulation calculation insertion loss again.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910657709.1A CN110457774B (en) | 2019-07-20 | 2019-07-20 | Method for calculating insertion loss of high-power working laminated series-fed synthesizer |
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| CN201910657709.1A CN110457774B (en) | 2019-07-20 | 2019-07-20 | Method for calculating insertion loss of high-power working laminated series-fed synthesizer |
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| CN110457774B CN110457774B (en) | 2023-02-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024198211A1 (en) * | 2023-03-31 | 2024-10-03 | 安捷利（番禺）电子实业有限公司 | Insertion loss calculation model construction method and apparatus, device, and storage medium |
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| CN102426299A (en) * | 2011-11-01 | 2012-04-25 | 电子科技大学 | Method for measuring effective dielectric constant of double-sided metal-foil-clad plate |
| CN102539934A (en) * | 2010-12-30 | 2012-07-04 | 上海无线电设备研究所 | Method for testing dielectric constant and loss angle tangent parameter of antenna cap material |
| CN104865449A (en) * | 2015-05-25 | 2015-08-26 | 电子科技大学 | Dielectric substrate measurement apparatus based on multi-resonant waveguide substrate integration vibration cavity method and method thereof |
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2019
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| CN102539934A (en) * | 2010-12-30 | 2012-07-04 | 上海无线电设备研究所 | Method for testing dielectric constant and loss angle tangent parameter of antenna cap material |
| CN102426299A (en) * | 2011-11-01 | 2012-04-25 | 电子科技大学 | Method for measuring effective dielectric constant of double-sided metal-foil-clad plate |
| CN104865449A (en) * | 2015-05-25 | 2015-08-26 | 电子科技大学 | Dielectric substrate measurement apparatus based on multi-resonant waveguide substrate integration vibration cavity method and method thereof |
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| WO2024198211A1 (en) * | 2023-03-31 | 2024-10-03 | 安捷利（番禺）电子实业有限公司 | Insertion loss calculation model construction method and apparatus, device, and storage medium |
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