CN110430666A - A kind of preparation method of 3D printing circuit board - Google Patents
A kind of preparation method of 3D printing circuit board Download PDFInfo
- Publication number
- CN110430666A CN110430666A CN201910615328.7A CN201910615328A CN110430666A CN 110430666 A CN110430666 A CN 110430666A CN 201910615328 A CN201910615328 A CN 201910615328A CN 110430666 A CN110430666 A CN 110430666A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- circuit board
- preparation
- printing circuit
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses a kind of preparation method of 3D printing circuit board, comprising the following steps: (1) prepares conducting wire: making conducting wire using 3D printing technique；(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface, the preparation method with homogenous material can print, simplify equipment and technique, while the bending that can effectively avoid insulating layer and conductive layer from occurring in layer-by-layer printing by difference in material properties such as thermal expansion coefficients, the defects of being not connected firmly or burning.
Description
Technical field
The present invention relates to wiring board technology fields, more particularly to a kind of preparation method of 3D printing circuit board.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and English name is (Printed Circuit Board)
PCB, (Flexible Printed Circuit board) (FPC wiring board is also known as flexible circuitry board flexible circuit to FPC wiring board
Plate is that have height reliability, excellent pliable printed circuit using polyimides or polyester film as one kind made of substrate
Plate.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.) and Rigid Flex (reechas, Soft and
Hard combination plate)-FPC and PCB birth and development, expedited the emergence of this new product of Rigid Flex.Therefore,
Rigid Flex is exactly that flexible circuit board and rigid wiring board are combined by related process requirement one by processes such as pressings
It rises, the wiring board with FPC characteristic and PCB characteristic of formation；3D printing is usually that digital technology file printing machine is used to come in fact
Existing.Often be used for modeling in fields such as mold manufacture, industrial designs, after be gradually available for the direct manufactures of some products,
Have using components made of the printing of this technology.The technology is in jewelry, footwear, industrial design, building, engineering and construction
(AEC), automobile, aerospace, dentistry and medical industries, education, GIS-Geographic Information System, civil engineering, gun and other necks
It is all applied in domain.
Existing circuit board can also use 3D printing technique in the process of production, at present in the 3D printing technique system of use
When standby circuit board, usually using the method printing conductive layer or insulating layer successively printed, but this method not only to beat
Printing apparatus and its printing technology are complicated, improve preparation difficulty, while needing to print a variety of heterogeneity materials, so that electric
The bending that the difference in material properties such as meeting thermal expansion coefficients occur in layer-by-layer printing of the insulating layer and conductive layer of road plate, connection are not
Jail or the defects of burn.
Summary of the invention
A kind of preparation of 3D printing circuit board is provided it is an object of the invention to avoid shortcoming in the prior art
Method, which can use the printing of homogenous material, simplify equipment and technique, while can effectively avoid insulating layer and lead
Bending that electric layer occurs in layer-by-layer printing by difference in material properties such as thermal expansion coefficients, the defects of being not connected firmly or burning.
The purpose of the present invention is achieved through the following technical solutions:
A kind of preparation method of 3D printing circuit board, comprising the following steps:
(1) it prepares conducting wire: making conducting wire using 3D printing technique；
(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；
(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface.
Further, in step (1), the 3D printing technique is selective laser melting (SLM) molding technology, precinct laser sintering
One of forming technique, laser fusing-covering forming technique, electron-beam melting technology and fusion sediment forming technique technology.
Further, in step (1), the material of the conducting wire is metal conductive materials, composite non-metal conduction
One of material conductive material, the metal conductive materials are copper, silver, one of gold conductive metal or a variety of alloy conductives
Metal；The composite non-metal conductive material is one of conductivity ceramics, electroconductive resin, conductive rubber composite non-metal
Conductive material.
Further, in step (2), the insulating liquid is epoxy resin, in polyether-ether-ketone, polyimides, polyether sulfone
A kind of resin.
Further, in step (2), the conducting wire is being applied in the process that shoe dielectric applies shoe dielectric, conductive
Route will extract repeatedly in insulating liquid.
It further, is high-frequency vibration state when the conducting wire is immersed in insulating liquid in step (2).
Further, the frequency of the high-frequency vibration is not less than 20KHz.
Further, in step (3), after the curing molding, position to exposed circuits in conducting wire into
Row cutting.
Further, in step (3), during cured, conducting wire will rotate the conducting wire.
Further, in step (3), the curing mode is photocuring.
The utility model has the advantages that since the preparation method with 3D printing technique first by being manufactured, so that conducting wire is in production
The printing of homogenous material can be used in process, and then simplifies equipment and technique, then by being immersed in insulating liquid, so that
Conducting wire surface cure insulating layer, and then can effectively avoid insulating layer and conductive layer in layer-by-layer printing because of thermal expansion coefficient
Etc. the difference in material properties bending occurred, the defects of being not connected firmly or burning.
Detailed description of the invention
Invention is described further using attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to the following drawings
Its attached drawing.
Fig. 1 is a kind of process flow chart of the preparation method of 3D printing circuit board of the invention.
Fig. 2 is a kind of operational flowchart of the preparation method of 3D printing circuit board of the invention.
Include in figure: conducting wire 1, insulating liquid 2.
Specific embodiment
The invention will be further described with the following Examples.
As shown in Figs. 1-2, the present embodiment provides a kind of preparation methods of 3D printing circuit board, comprising the following steps:
(1) it prepares conducting wire 1: making conducting wire 1 using 3D printing technique；
(2) it applies and carries out dielectric: conducting wire 1 is immersed in insulating liquid 2；
(3) curing molding: curing molding is carried out, so that insulating liquid 2 is attached to 1 surface of conducting wire.
In a preferred embodiment, in step (1), the 3D printing technique includes selective laser melting (SLM) molding technology, choosing
Area's laser sintering and moulding technology, laser fusing-covering forming technique, electron-beam melting technology and fusion sediment forming technique.
In a preferred embodiment, in step (1), the material of the conducting wire 1 is metal conductive materials, nonmetallic compound
One of type conductive material conductive material, the metal conductive materials are copper, silver, one of gold conductive metal or a variety of conjunctions
Golden conductive metal；The composite non-metal conductive material is that one of conductivity ceramics, electroconductive resin, conductive rubber are nonmetallic
Compound-type conducting material；
In a preferred embodiment, in step (2), the insulating liquid 2 is epoxy resin, polyether-ether-ketone, polyimides, polyether sulfone
One of resin.
In a preferred embodiment, in step (2), the conducting wire 1 is worked as in the process for applying shoe dielectric painting shoe dielectric
In, conducting wire will extract repeatedly in insulating liquid 2, and conducting wire 1 can be improved and solidify quality and rate.
It in a preferred embodiment, is high-frequency vibration shape when the conducting wire 1 is immersed in insulating liquid 2 in step (2)
State, further, the frequency of the high-frequency vibration are not less than 20KHz, can eliminate the bubble in resin.
It in a preferred embodiment,, be to exposed circuits in conducting wire 1 after the curing molding in step (3)
Position is cut, and can make exposure is used locally for connecting electronic component.
In a preferred embodiment, in step (3), during cured, conducting wire 1 will occur the conducting wire 1
Rotation, further, the curing mode are photocuring, and the uniform of photocuring can be improved.
Embodiment 1
The present embodiment provides a kind of preparation methods of 3D printing circuit board, comprising the following steps:
(1) it prepares conducting wire: making conducting wire using 3D printing technique；Concrete technology is: using precinct laser fusion at
Type technology successively prints copper wire；
(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；Concrete technology is: conducting wire is immersed in insulation
In sensitive liquid, conducting wire extracts repeatedly while overclocking low amplitude shakes, and the frequency of the high-frequency vibration is 21KHz,
The insulating liquid is epoxy resin；
(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface；Concrete technology is: will impregnate
Conducting wire afterwards carries out photocuring, and guarantees that conducting wire rotates in the process of photocuring, finally will be right
The position of exposed circuits is cut in conducting wire, and exposure is used locally for connecting electronic component, obtains final 3D printing
Pcb board material.
Embodiment 2
The present embodiment provides a kind of preparation methods of 3D printing circuit board, comprising the following steps:
(1) it prepares conducting wire: making conducting wire using 3D printing technique；Concrete technology is: using precinct laser sintering at
Type technology successively prints silver wire road；
(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；Concrete technology is: conducting wire is immersed in insulation
In sensitive liquid, conducting wire extracts repeatedly while overclocking low amplitude shakes, and the frequency of the high-frequency vibration is 22KHz,
The insulating liquid is polyether-ether-ketone；
(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface；Concrete technology is: will impregnate
Conducting wire afterwards carries out photocuring, and guarantees that conducting wire rotates in the process of photocuring, finally will be right
The position of exposed circuits is cut in conducting wire, and exposure is used locally for connecting electronic component, obtains final 3D printing
Pcb board material.
Embodiment 3
The present embodiment provides a kind of preparation methods of 3D printing circuit board, comprising the following steps:
(1) it prepares conducting wire: making conducting wire using 3D printing technique；Concrete technology is: using precinct laser fusion at
Type technology successively prints golden circuit；
(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；Concrete technology is: conducting wire is immersed in insulation
In sensitive liquid, conducting wire extracts repeatedly while overclocking low amplitude shakes, and the frequency of the high-frequency vibration is 20KHz,
The insulating liquid is polyimides；
(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface；Concrete technology is: will impregnate
Conducting wire afterwards carries out photocuring, and guarantees that conducting wire rotates in the process of photocuring, finally will be right
The position of exposed circuits is cut in conducting wire, and exposure is used locally for connecting electronic component, obtains final 3D printing
Pcb board material.
Beneficial effects of the present invention: since the preparation method with 3D printing technique first by being manufactured, so that conducting wire
The printing of homogenous material can be used in the process of production, and then simplifies equipment and technique, then by being immersed in dielectric
In body so that conducting wire surface cure insulating layer, and then can effectively avoid insulating layer and conductive layer in layer-by-layer printing because
Bending that the difference in material properties such as thermal expansion coefficient occur, the defects of being not connected firmly or burning.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (10)
1. a kind of preparation method of 3D printing circuit board, it is characterised in that: the following steps are included:
(1) it prepares conducting wire: making conducting wire using 3D printing technique；
(2) it applies and carries out dielectric: conducting wire is immersed in insulating liquid；
(3) curing molding: curing molding is carried out, so that insulating liquid is attached to conducting wire surface.
2. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: in step (1), the 3D is beaten
Print technology is selective laser melting (SLM) molding technology, precinct laser sintering forming technique, laser fusing-covering forming technique, electron-beam melting
One of technology and fusion sediment forming technique technology.
3. a kind of preparation method of 3D printing circuit board as described in claim 1, it is characterised in that: described to lead in step (1)
The material of electric line is one of metal conductive materials, composite non-metal conductive material conductive material, the metallic conduction
Material is copper, silver, one of gold conductive metal or a variety of alloy conductive metals；The composite non-metal conductive material is to lead
One of electroceramics, electroconductive resin, conductive rubber composite non-metal conductive material.
4. a kind of preparation method of 3D printing circuit board as described in claim 1, it is characterised in that: described exhausted in step (2)
Edge liquid is one of epoxy resin, polyether-ether-ketone, polyimides, polyether sulfone resin.
5. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: in step (2), the conduction
Route is applying in the process that shoe dielectric applies shoe dielectric, and conducting wire will extract repeatedly in insulating liquid.
6. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: in step (2), the conduction
It is high-frequency vibration state when route is immersed in insulating liquid.
7. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: the frequency of the high-frequency vibration
Not less than 20KHz.
8. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: in step (3), the solidification
After molding, the position of exposed circuits in conducting wire is cut.
9. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: in step (3), the conduction
During cured, conducting wire will rotate route.
10. a kind of preparation method of 3D printing circuit board as described in right wants 1, it is characterised in that: described solid in step (3)
Change mode is photocuring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910615328.7A CN110430666B (en) | 2019-07-09 | 2019-07-09 | Preparation method of 3D printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910615328.7A CN110430666B (en) | 2019-07-09 | 2019-07-09 | Preparation method of 3D printed circuit board |
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| Publication Number | Publication Date |
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| CN110430666A true CN110430666A (en) | 2019-11-08 |
| CN110430666B CN110430666B (en) | 2020-12-11 |
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ID=68410367
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910615328.7A Active CN110430666B (en) | 2019-07-09 | 2019-07-09 | Preparation method of 3D printed circuit board |
Country Status (1)
| Country | Link |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074090A (en) * | 2020-09-08 | 2020-12-11 | 北京大华博科智能科技有限公司 | Circuit board 3D printing preparation method and prepared circuit board |
| CN112739029A (en) * | 2021-01-08 | 2021-04-30 | 深圳市溪猫网络科技有限公司 | Manufacturing method and control method for manufacturing 3D circuit board based on photocuring |
| CN113543503A (en) * | 2021-09-16 | 2021-10-22 | 新恒汇电子股份有限公司 | Preparation method of novel carrier band with conductive ceramic coating |
| WO2022006787A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | 3d printed circuit board manufacturing method |
| WO2022006792A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Preparation method for electroplated circuit board |
| CN114512781A (en) * | 2022-02-25 | 2022-05-17 | 南京理工大学 | Coaxial shielding cable based on 3D printing and manufacturing method thereof |
| WO2023236412A1 (en) * | 2022-06-08 | 2023-12-14 | 芯体素(杭州)科技发展有限公司 | High-precision multilayer circuit board and 3d printing preparation method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022006787A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | 3d printed circuit board manufacturing method |
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| CN114512781A (en) * | 2022-02-25 | 2022-05-17 | 南京理工大学 | Coaxial shielding cable based on 3D printing and manufacturing method thereof |
| WO2023236412A1 (en) * | 2022-06-08 | 2023-12-14 | 芯体素(杭州)科技发展有限公司 | High-precision multilayer circuit board and 3d printing preparation method therefor |
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|---|---|
| CN110430666B (en) | 2020-12-11 |
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