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CN104582311A - Method for preparing flexible-inflexible printed circuit board - Google Patents

Method for preparing flexible-inflexible printed circuit board Download PDF

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Publication number
CN104582311A
CN104582311A CN201510011426.1A CN201510011426A CN104582311A CN 104582311 A CN104582311 A CN 104582311A CN 201510011426 A CN201510011426 A CN 201510011426A CN 104582311 A CN104582311 A CN 104582311A
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
preparation
copper
copper column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510011426.1A
Other languages
Chinese (zh)
Inventor
钟山
李保忠
林伟健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEJIAN TECHNOLOGY (ZHUHAI) Co Ltd
Original Assignee
LEJIAN TECHNOLOGY (ZHUHAI) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEJIAN TECHNOLOGY (ZHUHAI) Co Ltd filed Critical LEJIAN TECHNOLOGY (ZHUHAI) Co Ltd
Priority to CN201510011426.1A priority Critical patent/CN104582311A/en
Publication of CN104582311A publication Critical patent/CN104582311A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention provides a method for preparing a flexible-inflexible printed circuit board. The method comprises the steps that 1, a flexible circuit board with a conductive pattern formed on the surface is provided, wherein the flexible circuit board comprises a bent area and a laminated area; 2, a conductive copper cylinder electrically connected with the conductive pattern is formed in the laminated area, wherein the conductive copper cylinder extends perpendicular to and away from the laminated area; 3, an insulating bonding layer and the flexible circuit board are laminated and pressed together, wherein the insulating bonding layer covers the conductive copper cylinder and is provided with an opening corresponding to the bent area of the flexible circuit board; 4, the insulating bonding layer is thinned so as to enable the conductive copper cylinder to be exposed; 5, a copper-clad layer is formed on the surface of the insulating bonding layer and the surface of the conductive copper cylinder; 6, the copper-clad layer is machined by means of pattern transfer to obtain the conductive pattern. By the adoption of the method, alignment between the flexible circuit board and an inflexible circuit board and between different layers of inflexible circuit boards can be achieved effectively, and then the qualified rate of products is increased greatly and production cost is reduced.

Description

A kind of soft or hard is in conjunction with the preparation method of printed circuit board (PCB)
Technical field
The present invention relates to a kind of preparation method of printed circuit board (PCB); More particularly, the present invention relates to the preparation method of a kind of soft or hard in conjunction with printed circuit board (PCB).
Background technology
Soft or hard refers to the printed circuit board (PCB) comprising at least one rigid region and at least one flexible region in conjunction with printed circuit board (PCB), it has the characteristic of rigid printed circuit board (also known as printed circuit board) and flexible printed wiring board (also known as flexible or flexible print wiring board) concurrently, the package size of electronic product, weight can be reduced, avoid online mistake, increase assembling flexibility, realize the 3 D stereo assembling under different assembled condition, be particularly suitable for the application in the precise electronics such as portable type electronic product, medical electronics product, military equipment.
Chinese patent application 201310049360.6 discloses a kind of manufacture method of soft or hard composite circuit board, comprising: provide a rigid wiring board; There is provided an insulating barrier and a Flexible Printed Circuit, wherein this insulating barrier is configured in this Flexible Printed Circuit, and this insulating barrier has an opening, and this opening exposes a part for this Flexible Printed Circuit; This Flexible Printed Circuit of pressing, this insulating barrier and this rigid wiring board, to make this insulating barrier be connected between this rigid wiring board and this Flexible Printed Circuit, wherein define a closed area between this opening of this insulating barrier, this rigid wiring board and this Flexible Printed Circuit; Form multiple first conductive through hole in this insulating barrier, wherein respectively one end of this first conductive through hole connects this Flexible Printed Circuit, and respectively the other end of this first conductive through hole connects this rigid wiring board; And be a location datum mark with this closed area, remove a part for this rigid wiring board being positioned at this overthe openings, and expose this part of this Flexible Printed Circuit.
Chinese patent 201110020728.7 discloses a kind of flex-rigid wiring board and manufacture method thereof, and this manufacture method comprises following operation: prepare flexible electric circuit board; Prepare the first insulating barrier, this first insulating barrier has the first conductor being filled into by coating and obtaining in through hole; Prepare the second insulating barrier, this second insulating barrier has the second conductor being filled into by coating and obtaining in through hole; Prepare the 3rd insulating barrier, the 3rd insulating barrier has the 3rd conductor being filled into by coating and obtaining in through hole; Above-mentioned second insulating barrier and above-mentioned 3rd insulating barrier is utilized to clip the end of above-mentioned flexible electric circuit board and above-mentioned first insulating barrier and form duplexer with above-mentioned first conductor, above-mentioned second conductor and the above-mentioned 3rd conductor mode be configured on same axis; And above-mentioned duplexer pressurizes and heated make above-mentioned first conductor, above-mentioned second conductor and above-mentioned 3rd conductor mutual conduction.
Chinese patent 200580010261.0 discloses a kind of manufacture method of rigid-flexible board, wherein rigid plate and flexible board are connected with each other, the method comprises the following steps: make rigid plate be formed with step, and the connector that wherein distribution region horizontal in is connected is exposed to this step place; Make flexible board be formed with connector, this connector is arranged in a join domain; And the connector of rigid plate is electrically connected with the connector of flexible board.
In above preparation method, require very high to the alignment precision between flexible circuit board and hard circuit board and between each layer of hard circuit board, the alignment issues of the alignment issues between flexible circuit board and hard circuit board and each interlayer of hard circuit board, all may cause the batch of product to be scrapped.
Summary of the invention
The object of this invention is to provide the preparation method of a kind of soft or hard in conjunction with printed circuit board (PCB), it can effectively solve between flexible circuit board and hard circuit board and the alignment issues of each interlayer of hard circuit board.
In order to realize foregoing invention object, the invention provides the preparation method of a kind of soft or hard in conjunction with printed circuit board (PCB), it comprises the steps:
1. provide surface to be formed with the flexible circuit board of conductive pattern, this flexible circuit board comprises bending region and lamination area;
2. form the conduction copper column is electrically connected with conductive pattern in lamination area, this conduction copper column is vertically and extend away from the direction of lamination area;
3. stacked and pressing insulating bond and flexible circuit board, this insulating bond covers conduction copper column and also has the opening corresponding with the bending region of flexible circuit board;
4. reduction processing is carried out to expose conduction copper column to insulating bond;
5. copper clad layers is formed on the surface of insulating bond and conduction copper column;
6. the method for Graphic transitions is utilized copper clad layers to be processed to the conductive pattern obtaining being electrically connected with conduction copper column.
Selectively, soft or hard of the present invention in conjunction with the preparation method of printed circuit board (PCB) be included in further step 6. after repeat step successively 2. to 6., to obtain the soft or hard of more multi-layered number in conjunction with printed circuit board (PCB).
From above technical scheme, first preparation method of the present invention prepares the conduction copper column be electrically connected with last conductive pattern, then insulating bond is prepared, finally form on insulating bond surface the rear conductive pattern be electrically connected with conduction copper column, therefore, there is not the alignment issues between the conductive pattern of front and back in preparation method of the present invention, also the alignment issues with regard to not existing between flexible circuit board and hard circuit board and between each layer of hard circuit board, thus significantly improve conforming product rate, reduce production cost.
When the number of plies of the conductive pattern particularly formed in flexible circuit board both sides is more, such as, when repetition step is 2. to 6. more than twice or three times (such as 5,7,10 times) time, the above-mentioned advantage adopting preparation method of the present invention to have will be more outstanding.
In addition, in above technical scheme, owing to directly forming copper clad layers on insulating bond, instead of pressing copper-clad plate, therefore, the thinner soft or hard of thickness can be obtained in conjunction with printed circuit board (PCB).
Preferably, the conduction copper column that each step is 2. formed is positioned on same axis, and this axis passes lamination area, to reduce the plate area of soft or hard in conjunction with printed circuit board (PCB).
According to an embodiment of the present invention, the step 2. middle conduction copper column that formed comprises:
(1) form plating resist dry film on flexible circuit board surface, this plating resist dry film is formed with through hole in the position of conduction copper column to be formed;
In the through hole of plating resist dry film electro-coppering to obtain conduction copper column;
(3) remove plating resist dry film.
When forming plating resist dry film, very meticulous through hole can be obtained in plating resist dry film through exposure and development, thus step (2) in formed and there is the conduction copper column of minute diameter, to obtain the soft or hard of high precision in conjunction with printed circuit board (PCB).The thickness of the plating resist dry film used in actual production is usually at 30 μm to 50 μm, therefore, when the height of conduction copper column to be formed is greater than thickness (or plating resist dry film adds the thickness of coverlay) of plating resist dry film, step 2. in (1) and (2) need to repeat successively step, and property removes whole plating resist dry film the last time.Certainly, the plating resist dry film that disposable formation is equal with conduction copper column height to be prepared is also fine.
Preferably, the height of conduction copper column is 50 μm to 200 μm.Preferred, the height of conduction copper column is 80 μm to 150 μm.Preferred, the height of conduction copper column is 100 μm to 120 μm.By by the Altitude control of the first conduction copper column in above-mentioned number range, make soft or hard have less thickness and good electric property in conjunction with printed circuit board (PCB), be convenient to simultaneously manufacture.
In addition, above-mentioned steps (2) in Screen-printed conductive copper also can be adopted to starch method formed conduction copper column.
According to another embodiment of the present invention, step 3. in opening, place occupy-place block, occupy-place block plays occupy-place effect, with prevent insulating bond when pressing overflow to bending region.Such as, in opening, release film or silica gel piece is placed as occupy-place block.
According to another embodiment of the present invention, step 4. in utilize ceramic polish-brush grind insulating bond to carry out reduction processing to it.Ceramic grinding brushing tool has hard abrasive material, therefore can grind insulating bond expeditiously, thus enhance productivity.
According to another embodiment of the present invention, the step 5. middle copper clad layers that formed comprises:
(1) form conductive substrates on the surface of insulating bond and conduction copper column, such as, utilize shadow method or electroless copper plating method;
(2) plating thickeies copper on conductive substrates.
According to another embodiment of the present invention, flexible circuit board is multi-layer soft circuit board, and it relative two is all formed with conductive pattern on the surface.Multi-layer soft circuit board refers to that the number of plies of conductive pattern is more than or equal to the flexible circuit board of 2.Adopt multi-layer soft circuit board can meet the demand of complex precise electronic product to high precision circuit better, provide certain rigidity of support in the starting stage of preparation method for printed circuit board (PCB) simultaneously, be convenient to the manufacture of printed circuit board (PCB).
According to another embodiment of the present invention, step 2. to each step in be 6. all carry out in two apparent surface sides of multi-layer soft circuit board simultaneously.The benefit done like this can significantly improve manufacture efficiency.
According to another embodiment of the present invention, step 1. in the preparation of multi-layer soft circuit board comprise the following steps:
(1) provide double side flexible copper coated board and laser drill is carried out to it;
(2) remove the glue slag in hole;
(3) the inwall in hole forms conductive substrates, such as, utilize shadow method or electroless copper plating method;
(4) in hole, copper is filled out in plating, is electrically connected to make the Copper Foil of flexibility coat copper plate two apparent surface;
(5) utilize the method for Graphic transitions to make conductive pattern two apparent surfaces of flexibility coat copper plate.
What above step obtained is double-deck flexible circuit board, selectable, performs following steps further to obtain four layers of flexible circuit board:
(6) stack gradually and pressing insulating bond and single-face flexibility copper-clad board in the both sides of the step (5) double-deck flexible circuit board of gained, the copper face of this single-face flexibility copper-clad board outwardly;
(7) (6) obtained to step laminated sheet carries out laser drill;
(8) remove glue slag in hole;
(9) utilize shadow method or the electroless copper plating method inwall in hole to form conductive substrates;
(10) in hole, copper is filled out in plating, is electrically connected with the conductive pattern making the Copper Foil on single-face flexibility copper-clad board surface and step (5) obtained;
(11) utilize the method for Graphic transitions to make conductive pattern on the surface of single-face flexibility copper-clad board.
As required, step can be repeated (6) to (11), to obtain the multi-layer soft circuit board of more multi-layered number.
Preparation method of the present invention not only can obtain high precision, miniaturized soft or hard in conjunction with printed circuit board (PCB), and the qualification rate of products obtained therefrom is high, production cost is low.
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of the double side flexible copper coated board after laser drill;
Fig. 2 is the structural representation of double-deck flexible circuit board;
Fig. 3 is the structural representation of the double-deck flexible circuit board being provided with coverlay;
Fig. 4 is the structural representation of resultant layer pressing plate after the two face side pressing insulating bond and single-face flexibility copper-clad board of the double-deck flexible circuit board of Fig. 2;
Fig. 5 is the structural representation of laminated sheet after laser drill of Fig. 4;
Fig. 6 is the structural representation of four layers of flexible circuit board;
Fig. 7 is the structural representation of the four layers of flexible circuit board being provided with coverlay;
Fig. 8 represents that two face side at the double-deck flexible circuit board of Fig. 3 form the schematic diagram of plating resist dry film;
Fig. 9 represents the interior schematic diagram forming conduction copper column of the through hole of plating resist dry film in fig. 8;
Figure 10 is the schematic diagram of the two face side pressing insulating bond represented at double-deck flexible circuit board;
Figure 11 is the structural representation of the laminated sheet that the step of pressing shown in Figure 10 obtains;
Figure 12 represents the schematic diagram insulating bond in Figure 11 being carried out to reduction processing;
Figure 13 represents that the surface of insulating bond and conduction copper column in fig. 12 forms the schematic diagram of conductive pattern;
Figure 14 represents that two face side at Figure 13 gained printed circuit board (PCB) form the schematic diagram of plating resist dry film;
Figure 15 represents the interior schematic diagram forming conduction copper column of the through hole of plating resist dry film in fig. 14;
Figure 16 is the schematic diagram of the two face side pressing insulating bond represented at Figure 15 gained printed circuit board (PCB);
Figure 17 is the structural representation of the laminated sheet that the step of pressing shown in Figure 16 obtains;
Figure 18 represents the schematic diagram insulating bond in Figure 17 being carried out to reduction processing;
Figure 19 is that the surface of insulating bond and conduction copper column in figure 18 forms six layers of soft or hard obtaining after conductive pattern structural representation in conjunction with printed circuit board (PCB).
Embodiment
Embodiment 1
The present embodiment, to comprise six layers of soft or hard of double-deck flexible circuit board in conjunction with printed circuit board (PCB), describes preparation method of the present invention in detail.These six layers of soft or hards comprise the steps: in conjunction with the preparation method of printed circuit board (PCB)
The first step, prepare double-deck flexible circuit board as follows:
(1) provide double side flexible copper coated board, as shown in Figure 1, it Copper Foil 11 ' comprising flexible insulating substrate 12 and be respectively formed at flexible insulating substrate 12 liang of face side, carries out laser drill to this double side flexible copper coated board and obtains through hole 13;
(2) remove the glue slag in through hole 13;
(3) utilize shadow method to form carbon black conductive substrate at the inwall of through hole 13;
(4) in the through hole 13 being formed with conductive substrates, plating is filled out copper and forms the first conduction copper column 14, is electrically connected to make the Copper Foil 11 ' of double side flexible copper coated board two apparent surface;
(5) utilize the method for Graphic transitions to process Copper Foil 11 ' and make conductive pattern 11 with two apparent surfaces at double side flexible copper coated board, obtain double-deck flexible circuit board 10 as shown in Figure 2;
(6) as shown in Figure 3, be the coverlay 15 of 40 μm at the surperficial pressing thickness of double-deck flexible circuit board 10, coverlay 15 is formed with through hole 151 in the position of the second conduction copper column to be formed, and conductive pattern 11 is exposed by through hole 151.
By above step obtain double-deck flexible circuit board comprise one bending region A2 and lay respectively at bending A2 both sides, region two lamination area A1, wherein bend region A2 and refer to that lamination area A1 refers to the region of rigid circuit plate portion to be formed for soft or hard to provide the region of flexible bending function in conjunction with printed circuit board (PCB).
Second step, forms the second conduction copper column be electrically connected with its conductive pattern 11 as follows respectively in the two apparent surface sides of double-deck flexible circuit board 10 lamination area A1:
(1) as shown in Figure 8, form on two surfaces of double-deck flexible circuit board 10 the plating resist dry film 21 that thickness is 40 μm respectively, plating resist dry film 21 is by being formed with through hole 211 in the position of conduction copper column to be formed after development, exposure, and conductive pattern 11 is exposed by through hole 211;
In the through hole of plating resist dry film 21 and coverlay 15 electro-coppering to obtain being highly the conduction copper column of 40 μm;
(3) repeat step (1) and (2) once successively, as shown in Figure 9, obtaining is highly second conduction copper column 31 of 120 μm;
(4) remove plating resist dry film 21.
3rd step, as shown in Figure 10, in two apparent surface sides of double-deck flexible circuit board 10, respectively stacked and pressing is as the prepreg 41 ' of insulating bond, prepreg 41 ' has the opening 411 corresponding with the bending region A2 of flexible circuit board, place in opening 411 during pressing and fill as the silica gel piece 51 of occupy-place block, and place release film (not shown) in the outside of prepreg 41 ' and silica gel piece 51.As shown in figure 11, prepreg 41 ' forms cured sheets 41 and covers the second conduction copper column 31 after pressing.After pressing completes, remove release film but retain silica gel piece 51, thus being conducive to carrying out follow-up reduction processing.
4th step, as shown in figure 12, utilizes ceramic polish-brush to grind cured sheets 41 to exposing the second conduction copper column 31.The silica gel piece 51 be placed in opening 411 is removed after having ground.
5th step, forms copper clad layers on the surface of cured sheets 41 and the second conduction copper column 31 as follows:
(1) form graphite substrate by shadow method on the surface of cured sheets 41 and conduction copper column 31;
(2) on graphite substrate, plating thickeies copper.
6th step, utilizes the method for Graphic transitions to process to prepare conductive pattern 61 to copper clad layers, obtains printed circuit board (PCB) as shown in fig. 13 that.
Then, above second step is repeated once to the 6th step, that is:
Second step, as Figure 14, forms the plating resist dry film 22 with through hole 221 respectively in the two apparent surface sides of double-deck flexible circuit board 10 lamination area A1; As shown in figure 15, in through hole 221, formation and the 6th step gained conductive pattern 61 are electrically connected, are highly second conduction copper column 32 of 120 μm, and the second conduction copper column 31 and 32 is located across on the same axis of lamination area A1.
Need equally to remove plating resist dry film 22 after the second conduction copper column 32 completes.It should be noted that owing to now there is no coverlay 15, therefore need to make the gross thickness of plating resist dry film 22 to reach 120 μm and just can obtain being highly second conduction copper column 32 of 120 μm.
3rd step, as shown in figure 16, the again respectively stacked and pressing prepreg 42 ' in two apparent surface sides of double-deck flexible circuit board 10, prepreg 42 ' has the opening 421 corresponding with the bending region A2 of flexible circuit board, and during pressing, opening 421 in, placement silica gel piece 52 is filled; As shown in figure 17, prepreg 42 ' forms cured sheets 42 and covers the second conduction copper column 32 after pressing.
4th step, as shown in figure 18, utilizes ceramic polish-brush to grind cured sheets 42 to exposing the second conduction copper column 32.The silica gel piece 52 be placed in opening 421 is removed after having ground.
5th step, forms copper clad layers on the surface of cured sheets 42 and conduction copper column 32.
6th step, utilizes the method for Graphic transitions to process to obtain conductive pattern 62 to copper clad layers, obtains six layers of soft or hard as shown in figure 19 in conjunction with printed circuit board (PCB).
Finally, carry out welding resistance making, surface treatment and the conventional print-circuit board manufacture craft such as shaping and obtain six layers of soft or hard in conjunction with finished printed circuit board product.
Embodiment 2
The difference of the present embodiment and embodiment 1 is to use four layers of flexible circuit board in the present embodiment, and what therefore the present embodiment obtained is that a kind of eight layers of soft or hard are in conjunction with printed circuit board (PCB).
Below be only described the preparation method of four layers of flexible circuit board, it comprises the steps:
(1) double-deck flexible circuit board 10 is as shown in Figure 2 provided;
(2) as shown in Figure 4, stack gradually and pressing double faced adhesive tape 16 and single-face flexibility copper-clad board 17 ' in two face side of double-deck flexible circuit board 10, the copper face of single-face flexibility copper-clad board 17 ' outwardly;
(3) as shown in Figure 5, (2) obtained to step laminated sheet carries out laser drill and obtains through hole 18;
(4) remove the glue slag in through hole 18;
(5) utilize shadow method to form graphite substrate at the inwall of through hole 18;
(6) as shown in Figure 6, in through hole 18, plating is filled out copper and is formed the first conduction copper column 19, is electrically connected with the Copper Foil and conductive pattern 11 that make two single-face flexibility copper-clad board surfaces;
(7) utilize the Copper Foil of the method for Graphic transitions to single-face flexibility copper-clad board surface to process to make conductive pattern;
(8) as shown in Figure 7, in two surface pressure coverlays 15 of (7) the obtained four layers of flexible circuit board 10 ' of step, coverlay 15 is formed with through hole 151 in the position of the second conduction copper column to be formed, and conductive pattern 17 is exposed by through hole 151.
Although the present invention illustrates as above with preferred embodiment, and be not used to limit scope of the invention process.Those of ordinary skill in the art, not departing from invention scope of the present invention, can also make many equal improvement according to inventive concept of the present invention.Such as, flexible circuit board can be single-layer flexible circuit board, and rigid circuit plate portion is only formed in a face side of single-layer flexible circuit board; Rigid circuit plate portion only can be formed in a face side of multi-layer soft circuit board; The number of plies of the rigid circuit plate portion of flexible circuit board two face side can not be identical; The occupy-place block be placed in prepreg opening can not be removed after having ground, and when shaping again property take out all occupy-place blocks; Electroless copper plating method is utilized to form conductive substrates on cured sheets surface; First conduction copper column of the second conduction copper column and electrical connection multi-layer soft flexible circuit board two surface conductance pattern can arrange on the same axis to reduce the plate area of soft or hard in conjunction with printed circuit board (PCB) further; Rigid circuit plate portion can have the more number of plies; Etc..These equal improvement also should be invention scope of the present invention and contained.

Claims (10)

1. soft or hard is in conjunction with a preparation method for printed circuit board (PCB), and it comprises the steps:
1. provide surface to be formed with the flexible circuit board of conductive pattern, described flexible circuit board comprises bending region and lamination area;
2. form the conduction copper column is electrically connected with described conductive pattern in described lamination area, described conduction copper column extends on the direction vertically and away from described lamination area;
3. stacked and pressing insulating bond and described flexible circuit board, described insulating bond covers described conduction copper column and has the opening corresponding with the bending region of described flexible circuit board;
4. reduction processing is carried out to expose described conduction copper column to described insulating bond;
5. copper clad layers is formed on the surface of described insulating bond and described conduction copper column;
6. the method for Graphic transitions is utilized to process to obtain conductive pattern to described copper clad layers.
2. preparation method according to claim 1, it is included in step further and 6. repeats step afterwards successively 2. extremely 6..
3. preparation method according to claim 1, wherein, the step 2. described conduction copper column of middle formation comprises:
(1) form plating resist dry film on described flexible circuit board surface, described plating resist dry film is formed with through hole in the position of conduction copper column to be formed;
In the through hole of described plating resist dry film electro-coppering to obtain described conduction copper column;
(3) remove described plating resist dry film.
4. preparation method according to claim 1, wherein, the height of described conduction copper column is 50 μm to 200 μm.
5. preparation method according to claim 1, wherein, step 3. in described opening, place occupy-place block, with prevent described insulating bond when pressing overflow to described bending region.
6. preparation method according to claim 1, wherein, step 4. in utilize ceramic polish-brush to grind described insulating bond to carry out reduction processing to it.
7. preparation method according to claim 1, wherein, the step 5. described copper clad layers of middle formation comprises:
(1) form conductive substrates on the surface of described insulating bond and described conduction copper column;
(2) in described conductive substrates, plating thickeies copper.
8. preparation method according to claim 1, wherein, described flexible circuit board is multi-layer soft circuit board, and it relative two is all formed with conductive pattern on the surface.
9. preparation method according to claim 8, wherein, step 2. to each step in be 6. all carry out in two apparent surface sides of described flexible circuit board simultaneously.
10. preparation method according to claim 8, wherein, step 1. described in the preparation of multi-layer soft circuit board comprise the following steps:
(1) provide double side flexible copper coated board and laser drill is carried out to it;
(2) remove the glue slag in described hole;
(3) the inwall in described hole forms conductive substrates;
(4) in described hole, copper is filled out in plating, is electrically connected to make the Copper Foil on described flexibility coat copper plate two surface;
(5) utilize the method for Graphic transitions to make conductive pattern on two surfaces of described flexibility coat copper plate.
CN201510011426.1A 2015-01-09 2015-01-09 Method for preparing flexible-inflexible printed circuit board Pending CN104582311A (en)

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Application Number Priority Date Filing Date Title
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CN112423472A (en) * 2019-08-22 2021-02-26 庆鼎精密电子(淮安)有限公司 Rigid-flexible circuit board and manufacturing method thereof
CN114980572A (en) * 2021-02-25 2022-08-30 深南电路股份有限公司 Rigid-flexible circuit board and processing method

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CN102548222A (en) * 2010-12-30 2012-07-04 北大方正集团有限公司 Method and device for manufacturing circuit board and circuit board
CN103648240A (en) * 2013-12-19 2014-03-19 博敏电子股份有限公司 Method for manufacturing symmetrical rigid-flexible printed circuit board

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Publication number Priority date Publication date Assignee Title
US20050016764A1 (en) * 2003-07-25 2005-01-27 Fumio Echigo Wiring substrate for intermediate connection and multi-layered wiring board and their production
CN101610645A (en) * 2008-06-17 2009-12-23 欣兴电子股份有限公司 The manufacture method of rigid-flex
CN102548222A (en) * 2010-12-30 2012-07-04 北大方正集团有限公司 Method and device for manufacturing circuit board and circuit board
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Publication number Priority date Publication date Assignee Title
CN112423472A (en) * 2019-08-22 2021-02-26 庆鼎精密电子(淮安)有限公司 Rigid-flexible circuit board and manufacturing method thereof
CN112423472B (en) * 2019-08-22 2022-03-08 庆鼎精密电子(淮安)有限公司 Rigid-flexible circuit board and manufacturing method thereof
CN114980572A (en) * 2021-02-25 2022-08-30 深南电路股份有限公司 Rigid-flexible circuit board and processing method

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