CN110344002B - Evaporation device and evaporation method - Google Patents
Evaporation device and evaporation method Download PDFInfo
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- CN110344002B CN110344002B CN201910500772.4A CN201910500772A CN110344002B CN 110344002 B CN110344002 B CN 110344002B CN 201910500772 A CN201910500772 A CN 201910500772A CN 110344002 B CN110344002 B CN 110344002B
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- 238000001704 evaporation Methods 0.000 title claims abstract description 97
- 230000008020 evaporation Effects 0.000 title claims abstract description 90
- 238000000576 coating method Methods 0.000 claims abstract description 130
- 239000011248 coating agent Substances 0.000 claims abstract description 129
- 239000000463 material Substances 0.000 claims abstract description 86
- 239000011261 inert gas Substances 0.000 claims abstract description 64
- 239000007888 film coating Substances 0.000 claims description 31
- 238000009501 film coating Methods 0.000 claims description 31
- 239000007789 gas Substances 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000007740 vapor deposition Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000001154 acute effect Effects 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 abstract description 16
- 230000008016 vaporization Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 238000002309 gasification Methods 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application discloses coating by vaporization device and coating by vaporization method, coating by vaporization device include the coating by vaporization room, set up in coating by vaporization room bottom, splendid attire and heat coating material's crucible and set up in coating by vaporization room top and relative with the crucible, the anchor clamps of centre gripping product of waiting to plate film. The bottom of the coating chamber is provided with at least one first air inlet, inert gas is introduced into the coating chamber through the first air inlet, and the coating chamber is provided with at least one exhaust hole. The evaporation material is heated, sublimated and gasified, is diffused out of the crucible, and is driven by the inert gas to rapidly move towards the product to be coated, so that the coating speed is higher, and the production efficiency is high. In the gasification movement process of the evaporation material, the inert gas can uniformly mix the evaporation material, so that the density of each area of the evaporation material before the evaporation material is plated on a product to be coated is more consistent, the uniformity of the coating is good, the film forming quality is better, and the precision is higher.
Description
Technical Field
The application relates to the technical field of display, in particular to an evaporation device and an evaporation method.
Background
The evaporation device is widely applied to various coating processes, for example, an Organic Light-Emitting Diode (OLED), and the OLED has advantages of active Light emission, no need of a backlight source, wide viewing angle, high contrast, fast reaction speed, wearability, wide temperature range, simple structure and manufacturing process, and the like, and is widely regarded by the display technology field.
Compared with TFT-LCD, OLED has obvious disadvantages in production cost, etc., especially OLED generally adopts vacuum evaporation in the evaporation process, and evaporation material has poor uniformity, slow movement, poor coating uniformity and low production efficiency after sublimation and gasification in vacuum environment.
Disclosure of Invention
The application aims to provide an evaporation device and an evaporation method, which can improve the uniformity and the production efficiency of a coating film.
The application discloses coating by vaporization device, the coating by vaporization device include the coating film room, set up in coating film room bottom, splendid attire and heat the crucible of coating film material and set up in coating film room top and with the crucible is relative, and the anchor clamps of coating film product are treated to the centre gripping. The bottom of the coating chamber is provided with at least one first air inlet, inert gas is introduced into the coating chamber through the first air inlet, and the coating chamber is provided with at least one exhaust hole.
Optionally, the first air inlet hole and the product to be coated are arranged in a vertical direction in an opposite manner.
Optionally, the first air inlet holes are multiple, and the first air inlet holes are equally spaced and uniformly distributed around the crucible in a matrix arrangement.
Optionally, the side wall of the coating chamber is provided with at least one second air inlet, and the coating chamber is filled with inert gas through the second air inlet.
Optionally, the second air inlet is disposed on the sidewall of the coating chamber, and the height of the second air inlet corresponds to the area between the product to be coated and the crucible.
Optionally, the coating film chamber lateral wall is provided with at least a pair of second inlet port, and is every right the second inlet port includes third inlet port and fourth inlet port, the third inlet port sets up one of them of coating film chamber lateral wall is in, the fourth inlet port sets up on the opposite face that the third was admitted air, just the third inlet port with the fourth inlet port is located same water flat line.
Optionally, the height of the second gas inlet hole at the bottommost part is greater than or equal to the height of the top of the crucible.
Optionally, an included angle between the opening direction of each second air inlet hole and the horizontal line is an acute angle, and the opening direction of each second air inlet hole faces the top of the coating chamber along the air inlet direction.
The application also discloses an evaporation device which is characterized by comprising a coating chamber, a crucible arranged at the bottom of the coating chamber and used for containing and heating coating materials, and a clamp arranged at the top of the coating chamber, opposite to the crucible and used for clamping a product of a display panel to be coated; the bottom of the coating chamber is provided with a plurality of first air inlets opposite to the product to be coated, a plurality of second air inlets are arranged in the corresponding region between the crucible and the product to be coated on the side wall of the coating chamber, inert gas is introduced into the coating chamber through the first air inlets and the second air inlets, and a plurality of exhaust holes are formed in the top of the coating chamber.
The application also discloses an evaporation method for the evaporation device, which comprises the following steps:
placing the coating material in the crucible; clamping the product to be coated on the clamp;
continuously introducing the inert gas into the film coating chamber through a first gas inlet;
and heating the coating material for evaporation.
In the application, a first air inlet hole for introducing inert gas is formed in the bottom of the coating chamber. Before vapor deposition, inert gas is firstly introduced into the film coating chamber to exhaust air, and the film coating chamber is filled with the inert gas. Meanwhile, in the evaporation process, the inert gas is continuously introduced, the evaporation material is heated, sublimated and gasified, and is diffused out of the crucible, and then the evaporation material is driven by the inert gas to rapidly move towards the direction of a product to be coated, so that the coating speed is higher, and the production efficiency is high. In the gasification movement process of the evaporation material, the inert gas can uniformly mix the evaporation material, so that the density of each area of the evaporation material before the evaporation material is plated on a product to be coated is more consistent, the uniformity of the coating is good, the film forming quality is better, and the precision is higher.
Because the chemical property of the filled inert gas is inactive, the inert gas is not easy to react with the evaporation material, even if the film coating chamber is not in the original relative vacuum environment, the evaporation material can not be influenced by air and moisture under the protection of the inert gas, and the quality of the evaporation material is ensured to be unchanged. The coating film forming device improves the film forming quality and precision, improves the production efficiency, and ensures that the evaporation material cannot be influenced by air and moisture under the condition that a coating chamber is not relatively vacuum.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic view of an evaporation apparatus according to an embodiment of the present disclosure;
FIG. 2 is a flow chart of a method for evaporation according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of a first venting arrangement according to an embodiment of the present application;
fig. 4 is a schematic view of another evaporation apparatus according to an embodiment of the present application;
fig. 5 is a schematic view of another evaporation apparatus according to an embodiment of the present application.
Wherein, 1, a film coating chamber; 11. a bottom; 12. a first air intake hole; 13. an exhaust hole; 14. a side wall; 15. a second air intake hole; 151. a third air inlet hole; 152. a fourth air intake hole; 16. a top portion; 2. a crucible; 3. a clamp; 4. products to be coated; 5. an inert gas; 6. evaporating a material; 7. and (5) a recovery device.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
The application discloses coating by vaporization device, as shown in figure 1 be coating by vaporization device's schematic diagram, coating by vaporization device include coating by vaporization room 1, set up in coating by vaporization room 1's bottom 11, splendid attire and heating coating material's crucible 2, and set up in coating by vaporization room 1's top 16 and with crucible 2 is relative, and the anchor clamps 3 of coating by vaporization product 4 are treated in the centre gripping. The bottom 11 of the coating chamber 1 is provided with at least one first air inlet 12, the coating chamber 1 is filled with inert gas 5 through the first air inlet 12, and the coating chamber 1 is provided with at least one exhaust hole 13.
When vapor deposition is performed by using the vapor deposition device, a corresponding vapor deposition method, as shown in fig. 2, includes the steps of:
s1: placing the coating material in the crucible; clamping the product to be coated on the clamp;
s2: continuously introducing the inert gas into the film coating chamber through a first gas inlet;
s3: and heating the coating material for evaporation.
After the coating material is gasified, the coating material is mixed with the inert gas 5 and pushed to form a film on the product 4 to be coated.
After the evaporation material 6 is sublimated and gasified in a relatively vacuum environment, the gasified evaporation material 6 is randomly and slowly diffused to the periphery, the movement is slow, the film coating efficiency is low, and the production efficiency is low; the vaporized evaporation materials 6 can also be diffused to other non-product 4 areas of the film coating chamber 1 in a large amount, so that the expensive evaporation materials 6 are wasted; meanwhile, the density of the evaporated material 6 in the coating chamber 1 is different, resulting in poor coating uniformity.
In particular, in the field of OLEDs, the evaporation material 6 used in the evaporation process is very expensive and is very susceptible to oxidation by air and moisture. For the above reasons, vacuum evaporation is generally adopted in the evaporation process in the industry, the existing film coating chamber has good sealing performance, and vacuum pumping is also required to perform film coating in a relatively vacuum environment, so that the film coating material is prevented from being oxidized due to the influence of air and moisture, and the requirements of high film forming quality and high precision of the OLED on evaporation are ensured. However, since the OLED has very high requirements for uniformity and precision of the deposited film, for example, the thickness of the deposited film is very thin and the uniformity requirement is very high, the oxidized coating material is deposited on the product 4, which has a very large influence on the OLED.
In the application, the bottom 11 of the film coating chamber 1 is provided with a first air inlet 12 for introducing the inert gas 5, so that the prejudice that the industry has to be vacuumized is broken. Before vapor deposition, inert gas 5 is firstly introduced into the film coating chamber 1 to exhaust air, and the film coating chamber 1 is filled with the inert gas 5. Meanwhile, in the evaporation process, the inert gas 5 is continuously introduced, the evaporation material 6 is heated, sublimated and gasified, is diffused from the crucible 2, and is driven by the inert gas 5 to rapidly move towards the direction of the product to be coated, so that the coating speed is higher, and the production efficiency is high. In the process of gasification movement of the evaporation material 6, the inert gas 5 can also uniformly mix the evaporation material 6, so that the density of each area of the evaporation material 6 before being plated on the product 4 to be plated is more consistent, the uniformity of the plated film is good, the quality of the formed film is better, and the precision is higher.
Because the chemical property of the filled inert gas 5 is inactive, the inert gas is not easy to react with the evaporation material 6, even if the film coating chamber 1 is not in the original relative vacuum environment, the evaporation material 6 of the OLED can not be influenced by air and moisture under the protection of the inert gas 5, and the quality of the evaporation material 6 is ensured to be unchanged. This application has improved film quality, precision and has improved production efficiency simultaneously, still under the condition of coating film room 1 relative vacuum, has guaranteed that coating by vaporization material 6 also can not receive the influence of air and moisture.
Specifically, the arrangement positions of the first air inlets 12 may be staggered with the arrangement positions of the crucible 2, so that all the first air inlets 12 can be ensured to normally and smoothly intake air, and the fixation of the crucible 2 cannot be influenced. The first air inlet holes 12 are arranged opposite to the product 4 to be coated in the vertical direction. The first air inlet holes 12 are aligned with the product 4 to be coated, and the inert gas 5 is discharged from the first air inlet holes 12 and then brings the gasified evaporation materials 6 to the product 4 to be coated more accurately for coating, so that the deviation is small, the coating efficiency is high, and the waste of coating materials can be reduced.
The number of the first air inlet holes 12 can be multiple, the area where the multiple first air inlet holes 12 are located corresponds to the position of the product 4 to be coated, and the orthographic projection of the product 4 to be coated is completely overlapped with the area where the first air inlet holes 12 are located. The area of the first air inlet hole 12 completely corresponds to the size of the product 4 to be coated and is aligned, so that the inert gas 5 and the evaporation material 6 are further saved while the coating efficiency and the coating effect are considered, and the cost is reduced. The area of the first air inlet hole 12 is smaller than the size of the product 4 to be coated, so that the coating efficiency and the coating effect are not good; the inert gas 5 and the evaporation material 6 which are larger than the product 4 to be coated and larger than the area of the product 4 to be coated are not easy to evaporate on the product 4 to be coated, so that the waste of the inert gas 5 and the evaporation material 6 is caused.
In addition, the side wall 14 of the film coating chamber 1 can be further provided with at least one second air inlet 15, and the inert gas 5 is introduced into the film coating chamber 1 through the first air inlet 12 and the second air inlet 15. During the deposition, the vaporized deposition material 6 tends to diffuse around and adhere to the side walls 14 of the deposition chamber 1, resulting in waste of the deposition material 6. The inert gas 5 is introduced into the second air inlet 15, so that the evaporation materials 6 facing the side wall 14 of the coating chamber 1 can be pushed to the middle area of the coating chamber 1, the evaporation materials 6 are not easy to adhere to the side wall 14 of the coating chamber 1, and the evaporation materials 6 are saved.
The second air inlet hole 15 can be arranged on the side wall of the coating chamber, and the height of the second air inlet hole 15 corresponds to the area between the product 4 to be coated and the crucible 2. The vaporized evaporation material 6 diffuses out of the crucible 2, so that most of the vaporized evaporation material 6 is located in the region between the product 4 to be coated and the crucible 2. The second air inlet holes 15 are formed in the side wall 14 of the coating chamber 1 corresponding to the region between the product 4 to be coated and the crucible 2, the introduced inert gas 5 is directly mixed and drives the evaporation gas in the region, the mixing and driving effects are better, and the utilization rate of the evaporation material 6 and the inert gas 5 can be improved to a greater extent.
In addition, the second air inlet holes 15 can be a plurality of, and are arranged on the side wall 14 around the coating chamber 1. During the deposition, the vaporized deposition material 6 tends to diffuse around and adhere to the peripheral side walls 14 of the deposition chamber 1, resulting in waste of the deposition material 6. The uniform matrix arrangement is distributed around the side wall 14, the evaporation materials 6 close to the side wall 14 around the coating chamber 1 can be pushed to the middle area of the coating chamber 1, the evaporation materials 6 are not easy to adhere to the side wall 14 around the coating chamber 1, and the evaporation materials 6 are saved.
Specifically, each second air inlet hole 15 may be equally spaced and arranged in a uniform matrix. Like this, second inlet port 15 sets up the density unanimity, and inert gas 5's unit lets in the volume the same, and inert gas 5 gives the thrust unanimity of evaporation plating material 6 after the gasification all around, and the back locking that evaporation plating material 6 can be better is in the middle zone of coating film room 1, when further preventing 6 adhesions of evaporation plating material 14, can also more evaporation plating material 6 by the propelling movement treat coating film product 4 on, save evaporation plating material 6, the coating film efficiency is also high.
In addition, the coating chamber side wall is provided with at least one pair of second air inlet holes 15, each pair of second air inlet holes 15 comprises a third air inlet hole 151 and a fourth air inlet hole 152, the third air inlet hole 151 is arranged on one side of the coating chamber 1 side wall 14, the fourth air inlet hole 152 is arranged on the opposite side of the third air inlet, and the third air inlet hole 151 and the fourth air inlet hole 152 are located on the same horizontal line. For the gas evaporation materials 6 on the same horizontal line, the two ends are both pushed by the inert gas 5, so that the inert gas 5 is better locked in the middle area of the film coating chamber 1, the evaporation materials 6 are further prevented from being adhered to the side wall 14, the evaporation materials 6 are saved, and the film coating efficiency is improved.
The height of the second gas inlet hole 15 at the bottommost portion may be greater than or equal to the height of the top of the crucible 2. The vaporized evaporation material 6 enters the coating chamber 1 from the top 16 of the crucible 2, and the height of the second air inlet 15 at the bottommost part can be larger than or equal to the height of the top of the crucible 2, so that the pertinence is stronger, and the use of the inert gas 5 can be saved.
In addition, the second air inlets 15 can be arranged from the same horizontal line on the side wall 14 of the coating chamber 1 and the product 4 to be coated to the direction of the crucible 2. The vaporized evaporation material 6 can be ensured to be locked near the product 4 to be coated without diffusing around before being attached to the product 4 to be coated, and the coating quality and efficiency are improved. Of course, the second air inlets 15 can be arranged from the side wall 14 of the coating chamber 1 above the horizontal line of the product 4 to be coated, and towards the crucible 2.
As a specific embodiment, the air intake speed per unit area of the first air intake hole 12 may be greater than the air intake speed per unit area of the second air intake hole 15, so as to avoid the inert gas 5 in the second air intake hole 15 changing the tendency of the gas moving upward, and keep the tendency of the evaporation material 6 moving toward the product 4 to be coated.
In addition, the exhaust hole 13 may be disposed at the top 16 of the coating chamber 1, and the inert gas 5 is exhausted from the coating chamber 1 through the exhaust hole 13. The exhaust hole 13 is opposite to the first air inlet 12 of the bottom 11 of the film coating chamber 1, the flowing direction of the inert gas 5 between the air inlet and the exhaust hole 13 is consistent with the moving direction of the evaporation material 6, so that the inert gas 5 is favorable for pushing the evaporation material 6 to move and uniformly mix the evaporation material 6, and meanwhile, the inert gas 5 is smoothly discharged from the film coating chamber 1.
The top 16 of the film coating chamber 1 can be an outward convex arc surface, and the exhaust hole 13 is arranged in the middle area of the top 16 of the film coating chamber 1. The top 16 of the coating chamber 1 in the arc shape plays a role in collecting the evaporated evaporation material 6 and the inert gas 5, and the exhaust speed is increased.
As shown in fig. 3, the first gas inlet holes 12 may be arranged in a uniform matrix around the crucible 2, and the intervals between the first gas inlet holes 12 may be equal. Therefore, the arrangement density of each first air inlet hole 12 is consistent, the unit input amount of the inert gas 5 is the same, the pushing force given to the vaporized evaporation material 6 is consistent, the evaporation material 6 can uniformly reach the product 4 to be coated, the coating uniformity is good, and the film forming quality is high.
As shown in fig. 4, an included angle between the opening direction of each second air inlet hole 15 and a horizontal line is an acute angle, and the opening direction of the second air inlet hole 15 faces the top of the coating chamber along the air inlet direction. After the inert gas 5 is introduced into the film coating chamber 1, the inert gas moves obliquely upwards to drive the evaporation material 6 to move towards the middle area, and simultaneously, the inert gas also drives the evaporation material 6 to move towards the product 4 to be coated, so that the film coating speed is higher, and the film coating efficiency is higher.
In this application, coating film chamber 1 can heat, and heating temperature is unanimous with 2 heating temperature of crucible, guarantees that coating film chamber 1 is unanimous with 2 temperatures of crucible, and evaporation coating material 6 after the gasification is difficult to recondens the flower again after spreading coating film chamber 1. In addition, the inert gas 5 can be preheated, the heating temperature is consistent with the temperature of the coating chamber 1 and the temperature of the crucible 2, and the temperature of the coating chamber 1 is not changed after the inert gas 5 enters the coating chamber 1, so that the film forming is influenced.
The inert gas 5 in the film coating chamber 1 can be directly exhausted to the outside through the exhaust holes 13, or as shown in the schematic diagram of the evaporation device shown in fig. 5, a recovery device 7 is arranged, and the recovery device 7 is connected with the exhaust holes 13 to compress and recover the inert gas 5.
When the inert gas 5 in the coating chamber 1 can be directly exhausted to the outside through the exhaust hole 13, the pressure in the coating chamber 1 can be higher than the outside pressure, and the outside air is not easy to enter the coating chamber 1 from the exhaust hole 13.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For example, the inert gas described herein may be any one of helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), radon (Rn), and gas oxygen (Og). For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. An evaporation apparatus, comprising:
a film coating chamber;
the crucible is arranged at the bottom of the coating chamber and is used for containing and heating a coating material; and
the fixture is arranged at the top of the coating chamber, is opposite to the crucible and clamps a product to be coated;
the bottom of the coating chamber is provided with at least one first air inlet, and inert gas is introduced into the coating chamber through the first air inlet;
the coating chamber is also provided with at least one exhaust hole;
at least one pair of second air inlets are formed in the side wall of the coating chamber corresponding to the region between the product to be coated and the crucible, and inert gas is introduced into the coating chamber through the second air inlets; each pair of the second air inlets comprises a third air inlet and a fourth air inlet, the third air inlet is arranged on one surface of the side wall of the coating chamber, the fourth air inlet is arranged on the opposite surface of the third air inlet, and the third air inlet and the fourth air inlet are positioned on the same horizontal line;
and the included angle between the opening direction of each second air inlet hole and the horizontal line is an acute angle, and the opening direction of each second air inlet hole faces the top of the coating chamber along the air inlet direction.
2. The evaporation apparatus according to claim 1, wherein the first gas inlet hole is vertically disposed opposite to the product to be coated.
3. The evaporation apparatus according to claim 1, wherein said first gas inlet holes are provided in a plurality, and each of said first gas inlet holes is equally spaced and uniformly arranged around said crucible in a matrix.
4. The vapor deposition apparatus according to claim 1, wherein the deposition chamber has at least one second gas inlet hole formed in a sidewall thereof.
5. The vapor deposition apparatus according to claim 4, wherein the second gas inlet hole is provided at a height on the side wall of the coating chamber corresponding to a region between the product to be coated and the crucible.
6. The evaporation apparatus according to claim 5, wherein the height of the second gas inlet hole at the bottommost portion is greater than or equal to the height of the crucible top portion.
7. The vapor deposition apparatus according to claim 1, wherein said exhaust hole is provided at a top of said coating chamber, said exhaust hole is provided opposite to said first gas inlet hole, and a flow direction of the inert gas between said gas inlet hole and said exhaust hole coincides with a movement direction of the deposition material.
8. The evaporation apparatus according to claim 7, further comprising a recovery device connected to the exhaust hole for compressing and recovering the inert gas.
9. An evaporation apparatus, comprising:
a film coating chamber;
the crucible is arranged at the bottom of the coating chamber and is used for containing and heating a coating material; and
the fixture is arranged at the top of the film coating chamber, is opposite to the crucible and clamps a product of the display panel to be coated;
the bottom of the coating chamber is provided with a plurality of first air inlets which are arranged opposite to the products of the display panel to be coated, the side wall of the coating chamber is provided with a plurality of second air inlets corresponding to the area between the products of the display panel to be coated and the crucible, the coating chamber is filled with inert gas through the first air inlets and the second air inlets, and the top of the coating chamber is provided with a plurality of air outlets;
at least one pair of second air inlet holes are formed in the side wall of the coating chamber corresponding to the area between the product to be coated and the crucible, each pair of second air inlet holes comprises a third air inlet hole and a fourth air inlet hole, the third air inlet hole is formed in one surface of the side wall of the coating chamber, the fourth air inlet hole is formed in the opposite surface of the third air inlet hole, and the third air inlet hole and the fourth air inlet hole are located on the same horizontal line;
and the included angle between the opening direction of each second air inlet hole and the horizontal line is an acute angle, and the opening direction of each second air inlet hole faces the top of the coating chamber along the air inlet direction.
10. An evaporation method used for the evaporation apparatus according to any one of claims 1 to 9, comprising the steps of:
placing the coating material in the crucible; clamping the product to be coated on the clamp;
continuously introducing the inert gas into the film coating chamber through a first gas inlet;
and heating the coating material for evaporation.
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| CN109943809B (en) * | 2019-03-26 | 2021-09-28 | 云谷（固安）科技有限公司 | Evaporation plating equipment |
| CN110684963B (en) * | 2019-10-21 | 2022-05-20 | 江苏菲沃泰纳米科技股份有限公司 | Airflow dispersion device for film coating equipment and application thereof |
| CN110684962B (en) * | 2019-10-21 | 2022-03-29 | 江苏菲沃泰纳米科技股份有限公司 | Airflow dispersion device for coating equipment and application thereof |
| CN112899637B (en) * | 2019-12-04 | 2023-03-31 | 江苏菲沃泰纳米科技股份有限公司 | Air inlet system of film coating device |
| CN110983243B (en) * | 2019-12-26 | 2022-03-18 | 襄阳襄车铁达缸套铸业有限公司 | Soft nitriding treatment method for surface of cylinder sleeve |
| CN112759274B (en) * | 2020-12-31 | 2022-12-06 | 中建材（内江）玻璃高新技术有限公司 | Automatic glass coating system and method |
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