CN110120639A - A kind of electronic equipment and electrical cabinet comprising it - Google Patents

Abstract

The embodiment of the present disclosure provides a kind of electronic equipment and the electrical cabinet comprising it, the electronic equipment includes shell and is arranged in the intracorporal substrate of shell, the multiple electronic components to form circuit are provided on substrate, shell includes the air outlet set on the air inlet of its first side and set on its second side, at least one heat dissipation channel is formed on substrate, heat dissipation channel is connected to air inlet and air outlet.Air inlet and air outlet is respectively set by the bottom and top of the shell in electronic equipment in the disclosure, and at least one heat dissipation channel is formed between the electronic component in electronic equipment, heat dissipation channel increases the contact area of electronic component and outer gas stream, significantly reduce the heat of electronic component, increase radiating efficiency, air inlet and air outlet make electronic equipment that can reach the demand of high efficiency and heat radiation in the case where fan-free, improve the long-term running reliability of system.

Description

An electronic device and an electrical cabinet containing the same

technical field

The present disclosure relates to the field of electronic equipment, in particular to an electronic equipment and an electrical cabinet containing the same.

Background technique

Since electrical cabinets usually involve storing large components, such as inductors, it is difficult for manufacturers to modularize or miniaturize electrical cabinets when producing them. The switching power supply in the electrical cabinet is one of the important components in the electrical cabinet, and its heat dissipation effect has a great impact on its life itself. At present, the cooling of the switching power supply is only made by opening holes in the closed shell, which cannot effectively Dissipate the heat in the switching power supply, which will reduce the life of the switching power supply and affect the use of the electrical cabinet.

Contents of the invention

In view of the above-mentioned technical problems in the prior art, the present disclosure provides an electronic device and an electrical cabinet containing the same, so as to effectively increase the heat dissipation efficiency of the electronic device.

An embodiment of the present disclosure provides an electronic device, which includes a casing and a substrate disposed in the casing, on which a plurality of electronic components forming a circuit are arranged, and the casing includes a The air inlet and the air outlet are arranged on the second side thereof, and at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel communicates with the air inlet and the air outlet.

In some embodiments, the substrate is provided with a plurality of heat dissipation plates, and heat dissipation channels are formed between the heat dissipation plates and the housing and/or between the heat dissipation plates.

In some embodiments, the heat dissipation plate is provided with a heat conduction layer against the inner wall of the housing.

In some embodiments, the electronic components are arranged on the heat dissipation channel or the heat dissipation plate.

In some embodiments, the circuit is a DC-DC conversion circuit, the electronic components include input terminals and output terminals at the first end of the substrate, and clockwise or counterclockwise A bus capacitor, a double-transistor forward primary circuit, a forward transformer and a secondary rectification filter circuit are connected in sequence in the direction, and a boost circuit is provided between the input terminal and the bus capacitor.

In some embodiments, the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, the heat dissipation channel is formed between the first heat dissipation plate and the second heat dissipation plate, and the bus capacitor and the positive The excitation transformer is arranged in the heat dissipation channel.

In some embodiments, it also includes a vertical plate, which is arranged on the second end portion of the base plate opposite to the first end portion, and is vertically connected with the base plate, between the vertical plate and the heat dissipation plate form heat dissipation channels.

In some embodiments, a flyback circuit is provided on the vertical plate.

In some embodiments, heat dissipation ribs are provided on the side plate of the housing.

In some embodiments, the housing further includes a mounting plate vertically disposed on the substrate, and the input terminal and the output terminal are disposed close to the mounting plate.

An embodiment of the present disclosure also provides an electrical cabinet, including a cabinet body and an air supply assembly for supplying air to the cabinet body, the electrical cabinet also includes the above-mentioned electronic equipment, and the airflow generated by the air supply assembly flows through the The air inlet and the air outlet.

Compared with the prior art, the beneficial effect of the embodiments of the present disclosure is that: the present disclosure sets an air inlet and an air outlet on the bottom and top of the casing of the electronic device respectively, and at least one air outlet is formed between the electronic components in the electronic device. The heat dissipation channel, the external air flow enters the electronic equipment through the air inlet, and the heat of the electronic components is discharged from the air outlet through the heat dissipation channel. The heat dissipation channel increases the contact area between the electronic components and the external air flow, effectively reducing the electronic components. The heat increases the heat dissipation efficiency, and the air inlet and air outlet enable the electronic equipment to meet the needs of efficient heat dissipation without fans, improving the reliability of the long-term operation of the system. The electrical cabinet can cool down and dissipate heat in time through the above-mentioned electronic equipment, prolonging the service life.

Description of drawings

In the drawings, which are not necessarily to scale, like reference numerals may depict similar parts in the different views. The same reference number with a letter suffix or a different letter suffix may indicate different instances of similar components. The drawings illustrate various embodiments generally by way of example and not limitation, and together with the description and claims serve to describe the disclosed embodiments. Where appropriate, the same reference numbers will be used throughout the drawings to refer to the same or like parts. Such embodiments are illustrative, and not intended to be exhaustive or exclusive embodiments of the apparatus or method.

FIG. 1 is a schematic structural diagram of a casing of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of another partial structure of an electronic device according to an embodiment of the present disclosure;

4 is a circuit diagram of an electronic device according to an embodiment of the present disclosure;

5 is a top view of an electronic device according to an embodiment of the present disclosure;

Fig. 6 is a schematic structural diagram of an electrical cabinet according to an embodiment of the present disclosure.

Components represented by reference numerals in the figure:

1-housing; 101-air inlet; 102-air outlet; 2-substrate; 3-radiating rib; 4-radiating plate; 401-first heat dissipating plate; Output terminal; 7-bus capacitor; 8-double-tube forward primary circuit; 9-forward transformer; 10-secondary side rectification filter circuit; 11-boost circuit; 12-input EMI filter circuit; 13-output EMI filter Circuit; 14-vertical board; 15-electric cabinet; 151-cabinet body; 152-air supply component; 153-electronic equipment; 16-installation board; 17-flyback circuit.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Embodiments of the present disclosure will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, but are not intended to limit the present disclosure.

"First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. Words like "comprising" or "comprising" mean that the elements preceding the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements. "Up", "Down", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

In the present disclosure, when it is described that a specific device is located between a first device and a second device, there may or may not be an intervening device between the specific device and the first device or the second device. When it is described that a specific device is connected to other devices, the specific device may be directly connected to the other device without an intervening device, or may not be directly connected to the other device but has an intervening device.

All terms (including technical terms or scientific terms) used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, general-purpose dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in idealized or extremely formalized meanings, unless explicitly stated herein Defined like this.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

An embodiment of the present disclosure provides an electronic device. As shown in FIG. 1 and FIG. 2 , the electronic device includes a casing 1 and a substrate 2 disposed in the casing 1, and a plurality of electronic components forming a circuit are arranged on the substrate 2 Devices, electronic components will emit a certain amount of heat during use; the housing 1 includes an air inlet 101 on one side and an air outlet 102 on the other side, and the air inlet 101 and the air outlet 102 can be arranged according to Arranged in a certain order, the number and arrangement of the air inlet 101 and the air outlet 102 can be selected according to the requirements of heat dissipation; at least one heat dissipation channel is formed on the substrate 2, and a plurality of electronic components are arranged on the heat dissipation channel, and the heat dissipation channel is connected to the heat dissipation channel. Air outlet 101 and air outlet 102.

Specifically, in this embodiment, a DC-DC conversion circuit can be arranged on the substrate 2, which is used to carry the circuit structure of this embodiment, as shown in FIG. 3, at the first end of the substrate 2 The input terminal 5 and the output terminal 6 are set, and the bus capacitor 7, the double-tube forward primary circuit 8, the forward transformer 9, and the secondary rectification filter are also arranged on the substrate 2 sequentially connected clockwise or counterclockwise. In the circuit 10, setting the input terminal 5 and the output terminal 6 at the same end of the substrate 2 can make the connection between the DC-DC conversion circuit on the substrate 2 and the external circuit more convenient. The forward primary circuit 8, the forward transformer 9 and the secondary rectification and filtering circuit 10 can be arranged in several shapes; further, the devices between the input terminal 5 and the output terminal 6 are connected in sequence and for example clockwise or counterclockwise. The circular arrangement in the direction of the hour hand can make the arrangement of electronic components on the substrate 2 more reasonable, not only can maximize the use of the space on the substrate, but also avoid problems such as circuit failure caused by signal or line connection crossover.

Furthermore, an external airflow supply device is provided outside the electronic device, and the generated external airflow can enter the casing 1 through the air inlet 101 of the electronic equipment, flow through the heat dissipation channel, and finally be discharged through the air outlet 102. The heat generated by the operation of multiple electronic components on the substrate 2 can be taken away, so that the electronic equipment does not need to be dissipated by fans, and efficient heat dissipation can be realized by improving the structure.

In the present disclosure, an air inlet 101 and an air outlet 102 are respectively provided at the bottom and top of the casing 1 of the electronic device, and at least one heat dissipation channel is formed in the electronic device, and a plurality of electronic components are arranged on the heat dissipation channel, so that the external airflow Enter the electronic equipment through the air inlet 101, and discharge the heat generated by the electronic components from the air outlet 102 through the heat dissipation channel. The setting of the heat dissipation channel increases the contact area between the electronic components and the external airflow, effectively reducing the heat dissipation of the electronic components The heat increases the heat dissipation efficiency. The air inlet 101 and the air outlet 102 enable the electronic equipment to meet the requirements of efficient heat dissipation without a fan, and improve the reliability of the long-term operation of the system. The electric cabinet 15 can cool down and dissipate heat in time through the above-mentioned electronic equipment, prolonging the service life.

As mentioned above, at least one heat dissipation channel is formed on the substrate 2. In order to form the heat dissipation channel, in some embodiments, as shown in FIG. The direction from the air inlet 101 to the air outlet 102 is arranged, so that at least one heat dissipation channel along the air inlet 101 to the air outlet 102 can be formed between the heat dissipation plate 4 and the housing 1 and between the plurality of heat dissipation plates 4, and a plurality of electrons Components can be arranged on the heat dissipation passage formed between the heat dissipation plate 4 and the housing 1. Arranging the electronic components on the heat dissipation passage can make the airflow entering from the air inlet 101 flow along the heat dissipation passage and flow to the heat dissipation passage. electronic components for heat dissipation.

In addition, the electronic components can also be arranged on the cooling plate 4, so that the heat of the electronic components can be directly dissipated through the direct contact between the cooling plate 4 and the electronic components while not blocking the flow of the external airflow in the housing 1. Conducted to the heat dissipation plate 4, the small-area high temperature of the electronic components is converted into a large-area low temperature, the efficiency of external airflow to remove heat is increased, and the heat dissipation effect is further enhanced. In addition, the utilization rate of the internal space of the housing 1 can also be improved.

In some embodiments, in order to enhance the heat dissipation effect, the heat dissipation plate 4 can be made of materials such as copper or graphite to conduct heat efficiently. In terms of structure, the heat dissipation plate 4 can adopt the structure of heat dissipation scales, and the heat dissipation scales are arranged by multiple layers at intervals. The flat plates are formed so that the external airflow can flow smoothly in the gaps between the plates, while saving space and increasing the heat dissipation efficiency. This application does not specifically limit the material and structure of the heat dissipation plate 4 here, so that the purpose of efficient heat dissipation can be achieved. Can.

In some embodiments, the heat dissipation plate 4 is provided with a heat conduction layer (not shown) against the inner wall of the housing 1, so as to transfer the heat of the heat dissipation plate 4 to the housing 1 through direct contact, through the shell The heat dissipation of the body 1 can increase the heat dissipation area and heat dissipation efficiency of the electronic device.

Furthermore, the material of the heat conduction layer should be able to conduct heat efficiently, such as heat conduction silicone grease, graphene, copper and other materials, or the heat conduction layer adopts G800 heat conduction pad, and the G800 heat conduction pad can fit the heat exchange surface to ensure the heat conduction effect. The application does not specifically limit the material of the heat conduction layer here, as long as it can ensure the heat conduction effect.

Further, as shown in FIG. 3 and FIG. 5, an input terminal 5 and an output terminal 6 are provided at the first end of the substrate 2, the input terminal 5 may be arranged close to the air inlet 101, the output terminal 6 may be arranged close to the air outlet 102, and other Electronic components, such as a bus capacitor 7, a dual-tube forward primary circuit 8, a forward transformer 9, and a secondary rectification filter circuit 10, a booster circuit 11 is provided between the input terminal 5 and the bus capacitor 7 on the substrate 2 They are connected sequentially in the form of several characters. When the input voltage value of the DC-DC converter is reduced to a predetermined voltage value, the booster circuit 11 is used to provide an output voltage higher than the input voltage value of the DC-DC converter to supply power to the bus capacitor 7 , to maintain the voltage value of the bus capacitor 7 higher than the minimum operating voltage of the dual-transistor forward primary circuit 8, the forward transformer 9 and the secondary rectification filter circuit 10 of the subsequent stage.

In some embodiments, the heat dissipation plate 4 includes a first heat dissipation plate 401 and a second heat dissipation plate 402, the first heat dissipation plate 401 and the second heat dissipation plate 402 are arranged oppositely and a heat dissipation channel is formed between them, the bus capacitor 7 and the forward transformer 9 is arranged in the heat dissipation channel, and the bus capacitor 7 and the forward transformer 9 are vertically arranged in sequence along the direction from the air inlet 101 to the air outlet 102, and the first heat dissipation plate 401 is arranged vertically along the direction from the air inlet 101 to the air outlet 102 , so that the external airflow flows through the first heat dissipation plate 401 to take away heat, and the first heat dissipation plate includes at least one heat dissipation fin.

In some embodiments, the base plate 2 also includes a vertical plate 14, which is arranged on the second end portion of the base plate 2 opposite to the first end portion. As shown in FIG. The direction from the air inlet 101 to the air outlet 102 is vertically arranged to avoid blocking the circulation of the external air flow. The vertical board 14 is provided with a flyback circuit 17 (as shown in FIG. 5 ). In this way, between the side of the casing 1 and the vertical plate 14, between the vertical plate 14 and the first heat dissipation plate 401, between the first heat dissipation plate 401 and the second heat dissipation plate 402, between the second heat dissipation plate 402 and the housing 1 A plurality of cooling channels can be formed between them, and the vertical plate 14 is installed perpendicular to the base plate 2, which can not only save the space occupied by the vertical plate 14, but also reduce the length and size of the equipment. The first cooling plate 401 is relatively The plate 402 is arranged close to the vertical plate 14 to reduce the wiring distance on the substrate 2 and increase the anti-interference performance of the components on the first heat dissipation plate.

Corresponding to the DC-DC conversion circuit involved in this embodiment, multiple electronic components can be arranged on different heat dissipation plates 4 , so as to further improve the heat dissipation effect in the casing 1 .

In some embodiments, as shown in FIG. 3 , FIG. 4 and FIG. 5 , the boost circuit 11 includes, for example: a third diode ( D3 ), a first inductor ( L1 ), a third power electronic switch ( T3 ) and The first capacitor (C1), the third diode (D3) and the third power electronic switch (T3) can be arranged on the side of the first heat sink 401, and the third power electronic switch (T3) is attached to the first heat sink plate 401 to improve the heat dissipation efficiency of the third power electronic switch (T3).

In some embodiments, continuing to refer to FIG. 3 to FIG. 5 , the dual-transistor forward primary-side circuit 8 includes: a fourth diode (D4), a fifth diode (D5), a first power electronic switch (T1) and a second power electronic switch (T2), wherein the fourth diode and the fifth diode are arranged on one side of the first heat sink 401, the first power electronic switch and the second power electronic switch are arranged on the first On the other side of the cooling plate 401.

In some embodiments, referring again to FIG. 3 to FIG. 5 , the secondary side rectification and filtering circuit 10 includes: a sixth diode (D6), a seventh diode (D7), an eighth diode (D8), a Nine diodes (D9), the second inductor (L2), the third inductor (L3), the third capacitor (C3) and the fourth capacitor (C4), wherein, the sixth diode (D6) and the seventh The pole diode ( D7 ) is arranged on one side of the third heat dissipation plate 403 , and the eighth diode ( D8 ) and the ninth diode ( D9 ) are arranged on the other side of the third heat dissipation plate 403 .

In some embodiments, the DC-DC conversion circuit on the substrate 2 further includes: an input EMI filter circuit 12 and an output EMI filter circuit 13, the input EMI filter circuit 12 is arranged between the input terminal 5 and the bus capacitor 7, and is connected to the riser The voltage circuit 11 is connected, the output EMI filter circuit 13 is arranged between the secondary rectification filter circuit 10 and the output terminal 6, the input EMI filter circuit 12 and the output EMI filter circuit 13 are respectively arranged at two corners of the first end, That is, the input EMI filter circuit 12 is arranged close to the input terminal 5 , and the output EMI filter circuit 13 is arranged close to the output terminal 6 .

In some embodiments, as shown in Figure 1, the side plate of the housing 1 is provided with cooling ribs 3, through which the contact area between the external airflow and the housing 1 is increased to accelerate the heat dissipation of the housing 1, the structure is simple And the cost is low, which is conducive to the market promotion of the product.

In some embodiments, as shown in FIG. 2 , the housing 1 further includes a mounting plate 16 vertically arranged on the substrate 2, the electronic device is vertically installed through the mounting plate 16, and the input terminal 5 and the output terminal 6 are arranged close to the mounting plate 16. The fixed cables connecting the electronic components can be fixed on the installation surface 16 to increase the connection reliability between the electronic components.

The embodiment of the present disclosure also provides an electrical cabinet 15. As shown in FIG. The top of the cabinet 15 forms a negative pressure, that is, the bottom-up airflow generated by the cooling fan carried by the compressor. The electrical cabinet 15 also includes the above-mentioned electronic equipment. As shown in Figure 6, the airflow generated by the air supply assembly 152 is sequentially Flowing through the air inlet 101, the heat dissipation channel and the air outlet 102, the electronic device 153 can effectively improve the heat dissipation efficiency through the external airflow generated by the air supply assembly 152, without using a fan or other air supply components for heat dissipation.

Furthermore, while exemplary embodiments have been described herein, the scope includes any and all implementations having equivalent elements, modifications, omissions, combinations (eg, cross-cutting aspects of various embodiments), adaptations, or changes based on this disclosure. example. Elements in the claims are to be interpreted broadly based on the language employed in the claims and are not limited to examples described in this specification or during the practice of the application, which examples are to be construed as non-exclusive. It is therefore intended that the specification and examples be considered as illustrations only, with a true scope and spirit being indicated by the following claims, along with their full scope of equivalents.

The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. Additionally, in the above Detailed Description, various features may be grouped together in order to simplify the disclosure. This is not to be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, disclosed subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, where each claim stands on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

The above embodiments are only exemplary embodiments of the present disclosure, and are not intended to limit the present disclosure, and the protection scope of the present disclosure is defined by the claims. Those skilled in the art may make various modifications or equivalent replacements to the present disclosure within the spirit and protection scope of the present disclosure, and such modifications or equivalent replacements shall also be deemed to fall within the protection scope of the present disclosure.

Claims (11)

1. An electronic device, comprising a housing and a substrate arranged in the housing, the substrate is provided with a plurality of electronic components forming a circuit, characterized in that the housing includes a The air inlet and the air outlet are arranged on the second side thereof, and at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel communicates with the air inlet and the air outlet. 2. The electronic device according to claim 1, wherein a plurality of heat dissipation plates are arranged on the substrate, and the heat dissipation plate is formed between the heat dissipation plate and the housing and/or between the heat dissipation plates. cooling channels. 3 . The electronic device according to claim 2 , wherein a heat conduction layer is provided on the heat dissipation plate against the inner wall of the housing. 4 . 4. The electronic device according to claim 2, wherein the electronic components are arranged on the heat dissipation channel or the heat dissipation plate. 5. The electronic device according to claim 2, wherein the circuit is a DC-DC conversion circuit, the electronic component includes an input terminal and an output terminal at the first end of the substrate, and The bus capacitor, double-transistor forward primary side circuit, forward transformer, and secondary side rectification filter circuit are sequentially connected clockwise or counterclockwise on the substrate, and a booster is provided between the input terminal and the bus capacitor. voltage circuit. 6. The electronic device according to claim 5, wherein the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, and the heat dissipation plate is formed between the first heat dissipation plate and the second heat dissipation plate. channel, the bus capacitor and the forward transformer are arranged in the heat dissipation channel. 7. The electronic device according to claim 5, further comprising a vertical plate, which is arranged on the second end portion opposite to the first end portion on the substrate, and is vertically connected to the substrate, A heat dissipation channel is formed between the vertical plate and the heat dissipation plate. 8. The electronic device according to claim 7, wherein a flyback circuit is provided on the vertical plate. 9. The electronic device according to claim 1, wherein a cooling rib is provided on the side plate of the casing. 10 . The electronic device according to claim 5 , wherein the housing further comprises a mounting plate vertically disposed on the substrate, and the input terminal and the output terminal are disposed close to the mounting plate. 11 . 11. An electrical cabinet, comprising a cabinet body and an air supply assembly for supplying air to the cabinet body, characterized in that the electrical cabinet further includes the electronic device according to any one of claims 1-10, the The airflow generated by the air supply assembly flows through the air inlet and the air outlet in sequence.