CN221687359U - Laminated ceramic inductor - Google Patents

Abstract

The utility model discloses a laminated ceramic inductor, comprising a dielectric layer, two groups of terminal electrodes are symmetrically arranged at both ends of the dielectric layer, a plurality of groups of heat conducting plates are arrayed on a side wall of the dielectric layer, a shell is arranged at one end of the heat conducting plate, and a semiconductor refrigerator is installed in the shell. The beneficial effect is that the utility model arranges the heat conducting plate, the semiconductor refrigerator, the motor and the fan blades, and during the use of the inductor, the semiconductor refrigerator can reduce the temperature of one end of the heat conducting plate, increase the temperature difference between the two ends of the heat conducting plate, and thus enable it to quickly export the heat, and the motor drives the fan blades to rotate at a high speed, thereby accelerating the air flow rate in the shell, dissipating the heat at the heat dissipation end of the semiconductor refrigerator, thereby ensuring its cooling effect on the heat conducting plate, so that the heat conducting plate can continuously and efficiently dissipate the heat in the dielectric layer, on the one hand effectively improving the heat dissipation performance of the inductor, and on the other hand improving the service life of the inductor.

Description

A multilayer ceramic inductor

Technical Field

The utility model relates to the technical field of inductors, in particular to a laminated chip type ceramic inductor.

Background Art

An inductor is a component that can convert electrical energy into magnetic energy and store it. The structure of an inductor is similar to that of a transformer, but it has only one winding. An inductor has a certain inductance and only hinders the change of current. If there is no current passing through the inductor, it will try to hinder the current from flowing through it when the circuit is connected. If there is current passing through the inductor, it will try to maintain the current unchanged when the circuit is disconnected. An inductor is also called a choke, a reactor, or a dynamic reactor. There are many types of inductors, the most common of which are stacked chip inductors, and stacked chip inductors are stacked chip inductors, which can be referred to as chip inductors for short. Like other chip components, it is a new generation of leadless or short-lead microelectronic components suitable for surface mount technology. Stacked chip inductors can better absorb power supply noise. At present, in order to adapt to new electronic equipment, stacked chip inductors have the design requirements of small size and light weight. Stacked chip inductors have gradually developed in the direction of high frequency, miniaturization, and power.

Existing multilayer ceramic inductors are often used to dissipate the heat generated by the internal coil by providing a thermal conductive layer during use, so as to achieve heat dissipation of the inductor. Since the above method is passive heat dissipation, when the ambient temperature of the inductor is high, its heat dissipation effect will be affected, resulting in the inability to quickly discharge the internal heat, which can easily cause the inductor to burn out, resulting in poor heat dissipation performance on the one hand and a short service life on the other.

Utility Model Content

1. Technical issues to be resolved

The technical problem to be solved by the utility model is aimed at the current status of the prior art, and a multilayer ceramic inductor is provided, which can accelerate the heat dissipation inside the inductor and ensure continuous and efficient heat dissipation of the inductor, has good heat dissipation effect, high heat dissipation performance and long service life.

(II) Technical solution

The utility model is realized by the following technical scheme: the utility model proposes a laminated ceramic inductor, comprising a dielectric layer, two groups of terminal electrodes are symmetrically arranged at both ends of the dielectric layer, a plurality of groups of heat conducting plates are arrayed on one side wall of the dielectric layer, a shell is arranged at one end of the heat conducting plate, a semiconductor refrigerator is installed in the shell, two groups of shells are symmetrically installed on the side of the semiconductor refrigerator opposite to the heat conducting plate, a motor is installed in the middle of the shell, four groups of fan blades are circumferentially distributed on the output shaft of the motor, a through cavity is opened on the side wall of the shell opposite to the heat conducting plate, a dustproof net is installed in the through cavity, during the use of the inductor, the semiconductor refrigerator can reduce the temperature of one end of the heat conducting plate, increase the temperature difference between the two ends of the heat conducting plate, and then enable it to quickly extract heat, and the motor drives the fan blades to rotate at a high speed, thereby accelerating the air flow rate in the shell, dissipating heat at the heat dissipation end of the semiconductor refrigerator, thereby ensuring its cooling effect on the heat conducting plate, so that the heat conducting plate continuously and efficiently dissipates heat in the dielectric layer, on the one hand effectively improves the heat dissipation performance of the inductor, and on the other hand improves the service life of the inductor.

Furthermore, the material of the dielectric layer is ceramic, and the material of the terminal electrode is nickel.

By adopting the above technical solution, the dielectric layer and the terminal electrode can be combined to form a multilayer ceramic inductor.

Furthermore, the terminal electrodes are bonded to both ends of the dielectric layer, wherein one group of the terminal electrodes is a positive electrode, and the other group of the terminal electrodes is a negative electrode.

By adopting the above technical solution, the terminal electrode can be easily connected to an external connection line, so that the dielectric layer can be put into operation as an inductor.

Furthermore, one end of the heat conducting plate is placed inside the medium layer, and the other end of the heat conducting plate is inside the shell. The heat conducting plate is made of a material with a high thermal conductivity coefficient, and the connections between the heat conducting plate, the shell and the medium layer are sealed.

By adopting the above technical solution, during the use of the inductor, the heat conducting plate can conduct away the heat generated inside the dielectric layer, thereby dissipating the heat inside the dielectric layer, avoiding excessive internal temperature, and ensuring the normal performance of the inductor.

Furthermore, the semiconductor refrigerator is fixed inside the shell by screws, and one end of the heat conduction plate is fixed on the cooling end of the semiconductor refrigerator.

By adopting the above technical solution, the semiconductor refrigerator can reduce the temperature of one end of the heat conducting plate and increase the temperature difference between the two ends of the heat conducting plate, thereby enabling it to quickly export heat, while also ensuring continuous and efficient heat dissipation within the dielectric layer, which effectively improves the heat dissipation performance of the inductor on the one hand, and increases the service life of the inductor on the other.

Furthermore, the outer shell is fixed in the housing by bolts, and the outer shell is located at the heat dissipation end of the semiconductor refrigerator.

By adopting the above technical solution, the shell provides installation space for the motor and the fan blades. The motor and the fan blades can be combined to form a heat dissipation fan, which can dissipate the heat dissipation end of the semiconductor refrigerator, thereby ensuring its cooling capacity for the heat conduction plate.

Furthermore, the motor is fixed inside the housing, the fan blades are fixed to the output shaft of the motor by screws, and there are four groups of fan blades.

By adopting the above technical solution, during the use of the inductor, the motor drives the fan blades to rotate at a high speed, thereby accelerating the air flow rate in the shell, and the heat dissipated by the heat dissipation end of the semiconductor refrigerator can be quickly discharged, and the heat dissipation end of the semiconductor refrigerator is cooled, thereby ensuring its normal performance.

Furthermore, the through cavity is formed on the shell, and the dustproof net is connected to the through cavity by screws.

By adopting the above technical solution, the cavity provides an installation space for the dustproof net, and the dustproof net prevents dust from entering the shell, thereby preventing dust from accumulating on the fan blades and the surface of the semiconductor refrigerator, thereby providing effective dust protection for the fan blades and the semiconductor refrigerator.

(III) Beneficial effects

Compared with the prior art, the utility model has the following beneficial effects:

In order to solve the problem that the existing laminated ceramic inductor mostly uses a heat-conducting layer to extract the heat generated by its internal coil during use, so as to achieve the heat dissipation of the inductor. The above method is passive heat dissipation, and when the ambient temperature of the inductor is high, it will affect its heat dissipation effect, resulting in the inability to quickly discharge its internal heat, which is easy to cause the inductor to burn, on the one hand resulting in poor heat dissipation performance, and on the other hand resulting in a short service life. The utility model is provided with a heat-conducting plate, a semiconductor refrigerator, a motor and a fan blade. During the use of the inductor, the semiconductor refrigerator can reduce the temperature of one end of the heat-conducting plate, increase the temperature difference between the two ends of the heat-conducting plate, and thus enable it to quickly extract the heat, and the motor drives the fan blade to rotate at a high speed, thereby accelerating the air flow rate in the shell, dissipating the heat at the heat dissipation end of the semiconductor refrigerator, thereby ensuring its cooling effect on the heat-conducting plate, so that the heat-conducting plate can continuously and efficiently dissipate heat in the dielectric layer, on the one hand effectively improving the heat dissipation performance of the inductor, and on the other hand improving the service life of the inductor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a multilayer ceramic inductor according to the utility model;

FIG2 is a back view of a housing in a multilayer ceramic inductor according to the present invention;

FIG. 3 is a schematic diagram of the internal structure of a shell in a multilayer ceramic inductor according to the present invention.

The following are the descriptions of the reference numerals:

1. Dielectric layer; 2. End electrode; 3. Shell; 4. Heat conduction plate; 5. Dust screen; 6. Through cavity; 7. Fan blades; 8. Outer shell; 9. Motor; 10. Semiconductor refrigerator.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

As shown in FIGS. 1 to 3 , a laminated ceramic inductor in this embodiment includes a dielectric layer 1. Two groups of terminal electrodes 2 are symmetrically arranged at both ends of the dielectric layer 1. The dielectric layer 1 and the terminal electrodes 2 can be combined to form a laminated ceramic inductor. The terminal electrodes 2 are convenient for connecting to external connection lines, so that the dielectric layer 1 can be put into operation as an inductor. A plurality of groups of heat conducting plates 4 are arranged in an array on one side wall of the dielectric layer 1. During the use of the inductor, the heat conducting plates 4 can extract the heat generated inside the dielectric layer 1, thereby dissipating the heat inside the dielectric layer 1 to avoid excessive internal temperature and ensure the normal use performance of the inductor. A shell 3 is arranged at one end of the heat conducting plate 4, and a semiconductor refrigerator 10 is installed in the shell 3. The semiconductor refrigerator 10 can reduce the temperature at one end of the heat conducting plate 4 and increase the temperature difference between the two ends of the heat conducting plate 4, thereby enabling the heat to be quickly extracted. At the same time, it also ensures that the dielectric layer 1 is continuously and efficiently dissipated. On the one hand, the heat dissipation performance of the inductor is effectively improved, and on the other hand, the service life of the inductor is improved. Two groups of shells 8 are symmetrically installed on the side of the conductor cooler 10 opposite to the heat conducting plate 4. The shell 8 provides installation space for the motor 9 and the fan blades 7. The motor 9 and the fan blades 7 can be combined to form a heat dissipation fan, which can dissipate heat from the heat dissipation end of the semiconductor cooler 10, thereby ensuring its cooling capacity for the heat conducting plate 4. The motor 9 is installed in the middle of the shell 8, and four groups of fan blades 7 are distributed in a circle on the output shaft of the motor 9. During the use of the inductor, the motor 9 drives the fan blades 7 to rotate at a high speed, thereby accelerating the air flow rate in the shell 3, and the heat dissipated from the heat dissipation end of the semiconductor cooler 10 can be quickly discharged, and the heat dissipation end of the semiconductor cooler 10 can be dissipated, thereby ensuring its normal use performance. A through cavity 6 is opened on the side wall of the shell 3 opposite to the heat conducting plate 4, and a dustproof net 5 is installed in the through cavity 6. The cavity provides an installation space for the dustproof net 5, and the dustproof net 5 prevents dust from the inside of the shell 3, thereby preventing dust from accumulating on the fan blades 7 and the surface of the semiconductor cooler 10, and can effectively protect it from dust.

As shown in Figures 1 to 3, in this embodiment, the material of the dielectric layer 1 is ceramic, the material of the end electrode 2 is nickel, the end electrode 2 is bonded to both ends of the dielectric layer 1, one group of end electrodes 2 is the positive electrode, and the other group of end electrodes 2 is the negative electrode. One end of the heat conducting plate 4 is placed inside the dielectric layer 1, and the other end of the heat conducting plate 4 is inside the shell 3. The heat conducting plate 4 is made of a material with a high thermal conductivity coefficient. The joints between the heat conducting plate 4 and the shell 3 and the dielectric layer 1 are all sealed. The semiconductor refrigerator 10 is fixed inside the shell 3 by screws, and one end of the heat conducting plate 4 is fixed to the cooling end of the semiconductor refrigerator 10.

As shown in Figures 1 to 3, in this embodiment, the outer shell 8 is fixed in the shell 3 by bolts, the outer shell 8 is located at the heat dissipation end of the semiconductor refrigerator 10, the motor 9 is fixed inside the outer shell 8, the fan blades 7 are fixed to the output shaft of the motor 9 by screws, the fan blades 7 have four groups, the through cavity 6 is formed on the shell 3, and the dustproof net 5 is connected to the through cavity 6 by screws.

The specific implementation process of this embodiment is as follows: when in use, firstly, two groups of terminal electrodes 2 are respectively connected to external connection lines, so that the laminated ceramic inductor composed of the dielectric layer 1 and the terminal electrodes 2 is put into operation. During the use of the inductor, the heat conducting plate 4 can extract the heat generated inside the dielectric layer 1, and then dissipate the heat inside the dielectric layer 1 to avoid excessive internal temperature and ensure the normal use performance of the inductor. At the same time, the semiconductor refrigerator 10 can reduce the temperature of one end of the heat conducting plate 4 and increase the temperature difference between the two ends of the heat conducting plate 4, so that it can quickly extract the heat. The motor 9 drives the fan blade 7 to rotate at a high speed, thereby accelerating the air flow rate in the shell 3, dissipating the heat at the heat dissipation end of the semiconductor refrigerator 10, and thereby ensuring its cooling effect on the heat conducting plate 4, so that the heat conducting plate 4 can continuously and efficiently dissipate the heat in the dielectric layer 1, which effectively improves the heat dissipation performance of the inductor on the one hand, and improves the service life of the inductor on the other hand. Finally, the dustproof net 5 prevents dust from the inside of the shell 3, thereby preventing dust from accumulating on the fan blade 7 and the surface of the semiconductor refrigerator 10, and effectively protecting it from dust.

The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. A multilayer ceramic inductor, characterized in that it comprises a dielectric layer (1), two groups of terminal electrodes (2) are symmetrically arranged at both ends of the dielectric layer (1), a plurality of groups of heat conducting plates (4) are arranged in an array on one side wall of the dielectric layer (1), a shell (3) is arranged at one end of the heat conducting plate (4), a semiconductor refrigerator (10) is installed in the shell (3), two groups of shells (8) are symmetrically installed on the side of the semiconductor refrigerator (10) opposite to the heat conducting plate (4), a motor (9) is installed in the middle of the shell (8), four groups of fan blades (7) are circumferentially distributed on the output shaft of the motor (9), a through cavity (6) is opened on the side wall of the shell (3) opposite to the heat conducting plate (4), and a dustproof net (5) is installed in the through cavity (6). 2. A multilayer ceramic inductor according to claim 1, characterized in that the material of the dielectric layer (1) is ceramic, and the material of the terminal electrode (2) is nickel. 3. A multilayer ceramic inductor according to claim 1, characterized in that: the terminal electrodes (2) are bonded to both ends of the dielectric layer (1), one group of the terminal electrodes (2) is a positive electrode, and the other group of the terminal electrodes (2) is a negative electrode. 4. A multilayer ceramic inductor according to claim 1, characterized in that: one end of the heat conducting plate (4) is placed inside the dielectric layer (1), and the other end of the heat conducting plate (4) is inside the shell (3), the heat conducting plate (4) is made of a material with a high thermal conductivity coefficient, and the connection between the heat conducting plate (4) and the shell (3) and the dielectric layer (1) is sealed. 5. A multilayer ceramic inductor according to claim 4, characterized in that: the semiconductor refrigerator (10) is fixed inside the housing (3) by screws, and one end of the heat conducting plate (4) is fixed to the cooling end of the semiconductor refrigerator (10). 6. A multilayer ceramic inductor according to claim 5, characterized in that: the outer shell (8) is fixed in the housing (3) by bolts, and the outer shell (8) is located at the heat dissipation end of the semiconductor refrigerator (10). 7. A multilayer ceramic inductor according to claim 6, characterized in that: the motor (9) is fixed inside the housing (8), the fan blades (7) are fixed to the output shaft of the motor (9) by screws, and the fan blades (7) are in four groups. 8. A multilayer ceramic inductor according to claim 7, characterized in that: the through cavity (6) is formed on the shell (3), and the dustproof net (5) is connected to the through cavity (6) by screws.