CN118553649B - Silicon carbide wafer chip mounter and chip mounting process thereof - Google Patents
Silicon carbide wafer chip mounter and chip mounting process thereof Download PDFInfo
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- CN118553649B CN118553649B CN202410993466.XA CN202410993466A CN118553649B CN 118553649 B CN118553649 B CN 118553649B CN 202410993466 A CN202410993466 A CN 202410993466A CN 118553649 B CN118553649 B CN 118553649B
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 59
- 239000000919 ceramic Substances 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to the technical field of crystal processing, in particular to a silicon carbide wafer chip mounter and a chip mounting process thereof; the invention provides a silicon carbide wafer chip mounter, which comprises: an equipment carrying disc, a ceramic disc rotatably arranged on the equipment carrying disc, and a wafer suitable for being fixed on the ceramic disc; the pressurizing bin is hollow, and an air bag is fixed at the lower end of the pressurizing bin and is suitable for being abutted with the wafer; the heating and heat-preserving device is arranged in the pressurizing bin in a lifting manner; the linkage piece is arranged in the pressurizing bin in a sliding manner and is suitable for being abutted with the heating and heat-preserving device; when the heating and heat preserving device moves downwards, the linkage piece is suitable for being extruded to synchronously move downwards, and the linkage piece is suitable for pushing the air bag so as to enable the lower end of the air bag to be horizontal; after the air bag is abutted with the wafer, the linkage piece continues to move downwards, so that the air bag can circumferentially squeeze the wafer from the outer wall.
Description
Technical Field
The invention relates to the technical field of crystal processing, in particular to a silicon carbide wafer chip mounter and a chip mounting process thereof.
Background
In the application of the silicon carbide wax pasting process, a silicon carbide substrate with a wax layer is turned over and placed on a ceramic disc, after a silica gel pad air bag in a room temperature state is pressed down, the temperature of the air bag is lower than the temperature of the ceramic disc and the temperature of a wafer, the temperature of the wafer and the temperature of the wax layer contacting the air bag surface are reduced, and the mobility of wax is affected by the reduction of the temperature; the wax can not cover the whole wafer to drive away the air at the edge, so that bubbles are easy to appear at the edge position, and the bubbles at the edge easily cause the polishing solution to be immersed into and eroded the surface of the chip in the subsequent polishing operation to influence the wafer yield.
Therefore, how to avoid the occurrence of bubbles when the wafer edge is adhered with the wax layer is a technical problem to be solved in the art.
Disclosure of Invention
The invention aims to provide a silicon carbide wafer chip mounter and a chip mounting process thereof.
In order to solve the above technical problems, the present invention provides a silicon carbide wafer chip mounter, comprising:
an equipment carrying disc, a ceramic disc rotatably arranged on the equipment carrying disc, and a wafer suitable for being fixed on the ceramic disc;
The pressurizing bin is hollow, and an air bag is fixed at the lower end of the pressurizing bin and is suitable for being abutted with the wafer;
the heating and heat-preserving device is arranged in the pressurizing bin in a lifting manner;
the linkage piece is arranged in the pressurizing bin in a sliding manner and is suitable for being abutted with the heating and heat-preserving device;
When the heating and heat preserving device moves downwards, the linkage piece is suitable for being extruded to synchronously move downwards, and the linkage piece is suitable for pushing the air bag so as to enable the lower end of the air bag to be horizontal;
After the air bag is abutted with the wafer, the linkage piece continues to move downwards, so that the air bag can circumferentially squeeze the wafer from the outer wall.
Preferably, the balloon is a silica gel balloon and the balloon has a diameter greater than the diameter of the wafer.
Preferably, a sealing ring is horizontally arranged in the pressurizing bin, the sealing ring is hollow, and the sealing ring is suitable for being abutted against the outer wall of the heating and heat preserving device.
Preferably, a gap is arranged between the inner wall of the pressurizing bin and the outer wall of the heating and heat-preserving device, an adjusting ring is arranged in the gap in a lifting manner, and the adjusting ring is suitable for pushing the linkage piece to move downwards.
Preferably, a sealing groove is formed in the outer wall of the heating and heat-preserving device along the circumferential direction, and the sealing ring is suitable for being inserted into the sealing groove.
Preferably, the side wall of the pressurizing bin is symmetrically provided with two through holes along the radial direction, each through hole is internally provided with a fixed column in a sliding manner, and the fixed column is suitable for limiting the sealing ring.
Preferably, the linkage piece is semicircular, and the two linkage pieces are respectively arranged at two sides of the fixed column.
Preferably, the longitudinal section of the linkage member is U-shaped, and the linkage member is an elastic member.
Preferably, the horizontal height of one end of the linkage piece, which is close to the heating and heat-preserving device, is smaller than the horizontal height of the other end.
Preferably, a driving member is arranged at the bottom of the equipment carrying disc, the ceramic disc is sleeved at the end part of a rotating shaft of the driving member, and the driving member is suitable for driving the ceramic disc to circumferentially rotate.
On the other hand, the invention also provides a surface mounting process of the silicon carbide wafer surface mounting machine, which comprises the following steps:
After the wafer is horizontally placed on the ceramic disc, the heating and heat-preserving device moves downwards and is suitable for extruding the linkage piece to synchronously move downwards, and the linkage piece is suitable for pushing the air bag so as to enable the lower end of the air bag to be horizontal;
After the air bag is abutted with the wafer, the linkage piece continues to move downwards, so that the air bag can circumferentially squeeze the wafer from the outer wall.
The silicon carbide wafer chip mounter has the beneficial effects that the cooperation of the heating and heat-preserving device and the linkage piece can ensure that the temperature of the air bag is not lower than the temperature of the wax layer when the air bag contacts with the wafer before the air bag contacts with the wafer, so that the fluidity of the wax layer is improved; after the air bag contacts with the wafer, the linkage piece can push the air bag to continue downwards so as to avoid bubbles in the wax layer; meanwhile, the air bag extrudes and wraps the outer side wall of the wafer, and wax overflowed from the bottom of the wafer can be cleaned.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a preferred embodiment of a silicon carbide wafer placement machine of the present invention;
FIG. 2 is a perspective view of the interior of the pressurized cartridge of the present invention;
FIG. 3 is a perspective view of the linkage and seal ring of the present invention;
FIG. 4 is a cutaway perspective view of the pressurized cartridge and linkage of the present invention;
FIG. 5 is a schematic view of the linkage ejector bladder of the present invention in a horizontal position;
FIG. 6 is a schematic view showing the state of the linkage pushing air bag wrapping the wafer.
In the figure:
1. an equipment carrying disc; 11. a ceramic disc;
2. a pressurized bin; 20. an air bag; 21. a seal ring; 22. an adjusting ring; 23. fixing the column;
3. Heating and heat preserving device; 31. sealing grooves;
4. And a linkage member.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 6, in at least one embodiment, there is provided a silicon carbide wafer mounter including: an equipment carrying disc (1), a ceramic disc (11) arranged on the equipment carrying disc (1) in a rotating mode, and a wafer is suitable for being fixed on the ceramic disc (11); the lower end of the equipment carrying disc is fixed with a driving piece, the ceramic disc is fixed at the end part of a rotating shaft of the driving piece, and the driving piece is suitable for driving the ceramic disc to circumferentially rotate; the device is characterized in that a heating device is arranged on the device carrying disc and is suitable for heating the ceramic disc, the ceramic disc is heated to a set temperature before the wafer is fixed on the ceramic disc, after wax dripping and throwing treatment are carried out on the wafer bottom to be polished, the wafer with the wax layer is overturned and placed on the ceramic disc, and at the moment, the temperature of the ceramic disc can ensure that the wax layer has fluidity. The wafer is made of silicon carbide material. The pressurizing bin (2) is hollow, an air bag (20) is fixed at the lower end of the pressurizing bin (2), and the air bag (20) is suitable for being abutted with a wafer; the heating and heat-preserving device (3), and the heating and heat-preserving device (3) is arranged in the pressurizing bin (2) in a lifting manner; the heating and heat-preserving device is suitable for conveying high-temperature air into the air bag so as to keep the temperature of the air bag consistent with the temperature of the ceramic disc; the linkage piece (4) is arranged in the pressurizing bin (2) in a sliding manner, and the linkage piece (4) is suitable for being abutted with the heating and heat preserving device (3); when the heating and heat preserving device (3) moves downwards, the linkage piece (4) is suitable for being extruded to synchronously move downwards, and the linkage piece (4) is suitable for pushing the air bag (20) so as to enable the lower end of the air bag (20) to be horizontal; after the air bag (20) is abutted with the wafer, the linkage piece (4) continues to move downwards, so that the air bag (20) can circumferentially squeeze the wafer from the outer wall. The heating and heat preserving device is matched with the linkage piece, so that the temperature of the air bag is not lower than the temperature of the wax layer when the air bag contacts with the wafer before the air bag contacts with the wafer, and the fluidity of the wax layer is improved; after the air bag contacts with the wafer, the linkage piece can push the air bag to continue downwards so as to avoid bubbles in the wax layer; meanwhile, the air bag extrudes and wraps the outer side wall of the wafer, and wax overflowed from the bottom of the wafer can be cleaned.
Preferably, the balloon (20) is a silica gel balloon (20), and the balloon (20) has a diameter greater than the diameter of the wafer. When the air bag is positioned in the abutting mode of the wafer, the air bag protrudes downwards, and after the wafer is positioned on the ceramic disc by the wax layer, the heating and heat preserving device conveys heated air into the air bag, and the temperature of the air bag is increased by the heated air; the hot air in the air bag is suitable for expanding the sealing ring, and when the sealing ring is expanded, the end part, close to the heating and heat preserving device, of the linkage piece can be extruded to expand outwards, so that the linkage piece can be abutted with the bottom wall of the heating and heat preserving device; when the heating and heat preserving device moves downwards, the heating and heat preserving device is suitable for extruding the linkage piece to synchronously move downwards, and the linkage piece is suitable for extruding the air bag, so that the lower end of the linkage piece is in a horizontal state in contact with the wafer, and the problem that the thickness of a wax layer at the bottom of the wafer is inconsistent due to uneven stress when the air bag is in contact with the wafer is avoided. Before the air bag contacts with the wafer, the linkage piece pushes the air bag to be in a horizontal state, and when the air bag contacts with the wafer, the extrusion force of the air bag on the wafer is consistent, so that the uniform stress of the wax layer on the bottom wall of the wafer is ensured.
Referring to fig. 2 and 3, in order to improve the airtight seal between the heating and heat-preserving device and the pressurizing bin, a sealing ring (21) is horizontally arranged in the pressurizing bin (2), the interior of the sealing ring (21) is hollow, and the sealing ring (21) is suitable for being abutted with the outer wall of the heating and heat-preserving device (3). When the heating and heat-preserving device is not installed in the extrusion bin, the sealing ring is positioned in the linkage piece; in the process that the heating and heat-preserving device moves downwards and is inserted into the pressurizing bin, the linkage piece is suitable for being abutted with the bottom wall of the heating and heat-preserving device, the heating and heat-preserving device starts to convey hot air into the air bag, the sealing ring is heated and expanded, the sealing ring is suitable for pushing the linkage piece, the end part of the sealing ring with the lower horizontal height is abutted with the heating and heat-preserving device, and the heating and heat-preserving device is suitable for pushing the linkage piece to synchronously move downwards along with the continuous downward movement of the heating and heat-preserving device until the inner ring of the sealing ring is positioned in the sealing groove. At this time, the sealing ring is separated from the linkage piece, and the outer ring of the sealing ring is abutted with the inner wall of the extrusion bin.
Referring to fig. 4, a gap is provided between the inner wall of the pressurizing bin (2) and the outer wall of the heating and heat-preserving device (3), an adjusting ring (22) is arranged in the gap in a lifting manner, and the adjusting ring (22) is suitable for pushing the linkage piece (4) to move downwards. The adjusting ring is in sliding seal with the pressurizing bin and the heating and heat preserving device, namely, when the adjusting ring moves downwards relative to the heating and heat preserving device, hot air in the air bag cannot leak upwards through a gap. A supporting frame is fixed above the equipment carrying disc, a first driving piece is vertically fixed on the supporting frame, the adjusting ring is fixed at the movable end of the first driving piece, and the first driving piece is suitable for driving the adjusting ring to vertically move up and down relative to the heating and heat preserving device; the support frame is also fixedly provided with a second driving piece, the heating and heat-preserving device is fixed at the movable end of the second driving piece, and the second driving piece is suitable for driving the heating and heat-preserving device to vertically move up and down relative to the pressurizing bin; the support frame is also fixed with a third drive, the pressurizing bin is fixed at the movable end of the third drive, the third drive is adapted to drive the pressurized chamber toward or away from the wafer.
Preferably, a sealing groove (31) is formed in the outer wall of the heating and heat-preserving device (3) along the circumferential direction, and the sealing ring (21) is suitable for being inserted into the sealing groove (31). The sealing groove is suitable for limiting the sealing ring, and when the adjusting ring moves downwards, the sealing ring is suitable for being extruded, so that the sealing ring deforms into the sealing groove.
Referring to fig. 3, in order to facilitate disassembly of the sealing ring, two through holes are symmetrically formed in the side wall of the pressurizing bin (2) along the radial direction, a fixing column (23) is slidably arranged in each through hole, and the fixing column (23) is suitable for limiting the sealing ring (21).
Referring to fig. 3 and 4, the linkage members are semicircular, and the two linkage members are respectively arranged at two sides of the fixed column (23). The two linkage pieces are oppositely arranged; the two opposite linkage pieces are in a ring shape, and the diameter of the ring is larger than that of the wafer. After the sealing ring is fixed in the sealing groove, the lower end of the linkage piece is abutted with the air bag; the longitudinal section of the linkage piece is U-shaped, and the linkage piece is an elastic piece. The horizontal height of one end of the linkage piece, which is close to the heating and heat preserving device (3), is smaller than that of the other end. When the ceramic disc heating and heat preserving device works, the pressurizing bin moves downwards to the upper part of the wafer, the heating and heat preserving device moves vertically downwards, and meanwhile, the heating and heat preserving device starts to convey hot air into the air bag so as to keep the temperature of the air bag consistent with the temperature of the ceramic disc; the heating and heat preserving device pushes the linkage piece to move downwards, and the linkage piece is suitable for pushing the air bag when moving downwards, so that the bottom wall of the air bag is a horizontal device, and the extrusion bin moves downwards until the air bag is abutted with the wafer; the extrusion force of the horizontal air bag to the wafer is uniform, so that the thickness of the liquid wax layer at the bottom of the wafer is not consistent; the air bag extrudes the wafer, so that air in the liquid wax layer can be exhausted; the adjusting ring continuously moves downwards relative to the heating and heat-preserving device, the adjusting ring extrudes the sealing ring to move into the sealing groove, meanwhile, the adjusting ring pushes the linkage piece to continuously move downwards relative to the heating and heat-preserving device, so that the part, located outside the wafer, of the air bag continuously moves downwards, the air bag is suitable for wrapping the wafer, liquid wax overflowed from the bottom wall of the wafer can be adhered to the air bag, and the air bag is suitable for cleaning the wax overflowed from the bottom wall of the wafer. The bottom of the equipment carrying disc is provided with a driving piece, the ceramic disc is sleeved at the end part of a rotating shaft of the driving piece, and the driving piece is suitable for driving the ceramic disc to circumferentially rotate.
In some embodiments, there is also provided a bonding process of a silicon carbide wafer bonding machine, including:
After the wafer is horizontally placed on the ceramic disc, the heating and heat-preserving device moves downwards and is suitable for extruding the linkage piece to synchronously move downwards, and the linkage piece is suitable for pushing the air bag so as to enable the lower end of the air bag to be horizontal;
After the air bag is abutted with the wafer, the linkage piece continues to move downwards, so that the air bag can circumferentially squeeze the wafer from the outer wall.
In the description of embodiments of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (4)
1. A silicon carbide wafer placement machine, comprising:
An equipment carrying disc (1), a ceramic disc (11) arranged on the equipment carrying disc (1) in a rotating mode, and a wafer is suitable for being fixed on the ceramic disc (11);
The pressurizing bin (2) is hollow, an air bag (20) is fixed at the lower end of the pressurizing bin (2), and the air bag (20) is suitable for being abutted with a wafer;
The heating and heat-preserving device (3), and the heating and heat-preserving device (3) is arranged in the pressurizing bin (2) in a lifting manner;
the linkage piece (4) is arranged in the pressurizing bin (2) in a sliding manner, and the linkage piece (4) is suitable for being abutted with the heating and heat preserving device (3);
When the heating and heat preserving device (3) moves downwards, the linkage piece (4) is suitable for being extruded to synchronously move downwards, and the linkage piece (4) is suitable for pushing the air bag (20) so as to enable the lower end of the air bag (20) to be horizontal;
After the air bag (20) is abutted with the wafer, the linkage piece (4) continuously moves downwards, so that the air bag (20) can circumferentially squeeze the wafer from the outer wall;
a sealing ring (21) is horizontally arranged in the pressurizing bin (2), the sealing ring (21) is hollow, and the sealing ring (21) is suitable for being abutted with the outer wall of the heating and heat preserving device (3);
A gap is arranged between the inner wall of the pressurizing bin (2) and the outer wall of the heating and heat-preserving device (3), an adjusting ring (22) is arranged in the gap in a lifting manner, and the adjusting ring (22) is suitable for pushing the linkage piece (4) to move downwards; the outer wall of the heating and heat-preserving device (3) is provided with a sealing groove (31) along the circumferential direction, and the sealing ring (21) is suitable for being inserted into the sealing groove (31);
Two through holes are symmetrically formed in the side wall of the pressurizing bin (2) along the radial direction, a fixing column (23) is slidably arranged in each through hole, and the fixing column (23) is suitable for limiting the sealing ring (21);
the linkage pieces are semicircular, and the two linkage pieces are respectively arranged at two sides of the fixed column (23);
The longitudinal section of the linkage piece is U-shaped, and the linkage piece is an elastic piece;
The horizontal height of one end of the linkage piece, which is close to the heating and heat preserving device (3), is smaller than that of the other end.
2. The silicon carbide wafer placement machine of claim 1, wherein:
the balloon (20) is a silica gel balloon (20), and the balloon (20) has a diameter greater than the diameter of the wafer.
3. A silicon carbide wafer placement machine as defined in claim 2, wherein:
The bottom of the equipment carrying disc (1) is provided with a driving piece, the ceramic disc (11) is sleeved at the end part of a rotating shaft of the driving piece, and the driving piece is suitable for driving the ceramic disc (11) to circumferentially rotate.
4. A process for attaching a silicon carbide wafer to a die bonder as claimed in claim 1, comprising:
After the wafer is horizontally placed on the ceramic disc (11), the heating and heat-preserving device (3) moves downwards and is suitable for extruding the linkage piece (4) to synchronously move downwards, and the linkage piece (4) is suitable for pushing the air bag (20) so as to enable the lower end of the air bag (20) to be horizontal;
After the air bag (20) is abutted with the wafer, the linkage piece (4) continues to move downwards, so that the air bag (20) can circumferentially squeeze the wafer from the outer wall.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410993466.XA CN118553649B (en) | 2024-07-24 | 2024-07-24 | Silicon carbide wafer chip mounter and chip mounting process thereof |
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| CN202410993466.XA CN118553649B (en) | 2024-07-24 | 2024-07-24 | Silicon carbide wafer chip mounter and chip mounting process thereof |
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| CN118752414A (en) * | 2024-09-02 | 2024-10-11 | 浙江求是半导体设备有限公司 | Polishing pad surface treatment tool, wafer polishing device and polishing pad treatment method |
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| CN104332432A (en) * | 2014-10-15 | 2015-02-04 | 易德福 | Novel wax pasting device and processing method thereof |
| CN114643651A (en) * | 2022-03-21 | 2022-06-21 | 北京晶格领域半导体有限公司 | Silicon carbide wafer wax pasting method and auxiliary wax pasting device |
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| CN118553649A (en) | 2024-08-27 |
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