CN117840902A - Rotary-cut type jet abrasive-free flattening processing device and method based on vortex cavitation - Google Patents
Rotary-cut type jet abrasive-free flattening processing device and method based on vortex cavitation Download PDFInfo
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- CN117840902A CN117840902A CN202410208551.0A CN202410208551A CN117840902A CN 117840902 A CN117840902 A CN 117840902A CN 202410208551 A CN202410208551 A CN 202410208551A CN 117840902 A CN117840902 A CN 117840902A
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- 238000003672 processing method Methods 0.000 claims description 3
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- 239000004100 Oxytetracycline Substances 0.000 description 2
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- IWVCMVBTMGNXQD-PXOLEDIWSA-N oxytetracycline Chemical compound C1=CC=C2[C@](O)(C)[C@H]3[C@H](O)[C@H]4[C@H](N(C)C)C(O)=C(C(N)=O)C(=O)[C@@]4(O)C(O)=C3C(=O)C2=C1O IWVCMVBTMGNXQD-PXOLEDIWSA-N 0.000 description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention discloses a rotary-cut type jet abrasive-free flattening processing device based on vortex cavitation, which comprises a multi-shaft mobile control platform, wherein a station is arranged on the multi-shaft mobile control platform, a rotary-cut type vortex cavitation polishing device is arranged above the station, the rotary-cut type vortex cavitation polishing device is connected with a liquid supply device, and the liquid supply device supplies polishing liquid for the rotary-cut type vortex cavitation polishing device. Step one, preparing polishing solution; step two, installing the workpiece on a station; and step three, moving the rotary-cut type vortex cavitation device and the workpiece to enable the lower end of the rotary-cut type nozzle to move to a preset processing position. The rotational-cut jet abrasive-free planarization processing device and method based on vortex cavitation provided by the invention combine the chemical effect of cavitation and the micro-jet erosion effect to polish a workpiece in an abrasive-free manner, so that a better polishing effect can be achieved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a rotary-cut jet abrasive-free planarization processing device and method based on vortex cavitation.
Background
With the rapid development of the electronic information industry, the third generation semiconductor substrates such as silicon carbide and gallium nitride are developed towards the large-size and ultra-thin, and the requirements on the processing quality of the semiconductor substrates are also higher and higher, and the requirements on the sub-nanometer surface roughness and the lower flatness are generally met, and less sub-surface damage is also required. For this reason, the quality, efficiency, cost, and environmental friendliness of the overall process of semiconductor substrate polishing are significant challenges facing the field of chip manufacturing.
Cavitation is a complex hydrodynamic phenomenon which is variable in gas-liquid phase, nonlinear and unsteady, occurs in a region where the fluid pressure is lower than the saturated vapor pressure, and the growth, expansion, contraction and collapse evolution of cavitation bubbles generate extreme physical environments such as instantaneous high temperature, high pressure, strong shock waves, high-speed microjet, chemical effect and the like, so that the cavitation device is widely applied to the fields of sewage treatment and the like. Gogate et al combine hydrodynamic cavitation with Fenton, photoFenton, photolysis and photocatalysis to degrade harmful substances, and found that hydrodynamic cavitation and Fenton reactions have the best synergistic effect.
Wang Baoe and the like propose a novel spiral-flow type vortex cavitation device for removing oxytetracycline in wastewater, and the cavitation device is formed by combining a vortex cavity and a spiral line runner, so that the result shows that the structure can generate obvious vortex cavitation effect and improve the degradation rate of oxytetracycline. The research results show that the extreme physical environment generated by cavitation bubbles during collapse can improve the yield and concentration of OH in Fenton reaction, and the sewage treatment efficiency is enhanced.
Yeo et al propose a hydrodynamic cavitation abrasive polishing technique for polishing an inner surface of electric spark machining with 47.5% reduction in surface roughness, and the material removal mechanism is represented by hydrodynamic cavitation and abrasive grain micro-cutting and micro-plow removal modes, wherein: cavitation removes large scale irregular textures on the surface, and micro-cutting and micro-tillage plows further remove surface materials. The liquid rotates in the cyclone cavity at high speed to form a space vortex during vortex cavitation, and cavitation is generated when the pressure of the center of the vortex is lower than the saturated vapor pressure of the polishing liquid, so that the method is a typical hydrodynamic cavitation technology. The cavitation intensity can be regulated by regulating the inlet speed, pressure, medium rheological property and the like.
In order to achieve better processing effect, chinese patent No. CN202210577451.6 proposes a chemical magneto-rheological polishing device and method based on vortex cavitation. According to the method, cavitation bubbles are generated by using an eddy cavitation device, a constraint space is formed on the end face of a nozzle by combining magnetorheological fluid in the processing process, and the cavitation bubbles are regulated and controlled. The method generates a direct injection cavitation jet flow, directly erodes the surface along the normal direction of the surface to be polished, generates obvious erosion pits and further generates larger subsurface damage; the subsequent cleaning process is also complicated due to the use of magnetorheological fluid and other chemical reagents during the polishing process.
Disclosure of Invention
The invention provides a rotary-cut type jet abrasive-free planarization processing device and method based on vortex cavitation aiming at the problems in the prior art.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
the rotary-cut type jet abrasive-free flattening processing device based on vortex cavitation comprises a multi-shaft mobile control platform, wherein a station is arranged on the multi-shaft mobile control platform, a rotary-cut type vortex cavitation polishing device is arranged above the station, the rotary-cut type vortex cavitation polishing device is connected with a liquid supply device, and the liquid supply device supplies polishing liquid for the rotary-cut type vortex cavitation polishing device.
Further, the rotary-cut type vortex cavitation polishing device comprises a converging cavity and a cyclone cavity arranged below the converging cavity, a spiral flow divider is arranged in the converging cavity, the spiral flow divider divides and cyclones polishing liquid in the converging cavity, and polishing liquid after the division and cyclone flow enters the cyclone cavity and then is sprayed out from the cyclone cavity.
Further, the converging cavity comprises a cylindrical cavity, a liquid inlet channel is arranged at the upper end of the cylindrical cavity, and the lower end of the cylindrical cavity is in butt joint with the cyclone cavity.
Further, the cyclone cavity comprises a cyclone cavity body, the upper part of the cyclone cavity body is a cylindrical cavity, the lower part of the cyclone cavity body is a conical cavity, and the lower end of the conical cavity is connected with a flow outlet pipe.
Further, a switching disc is arranged between the converging cavity and the swirling cavity, and a plurality of fan-shaped windows are formed in the middle of the switching disc.
Further, the spiral shunt comprises a shunt column, an inverted cone shunt head is arranged at the upper end of the shunt column, a plurality of spiral blades are arranged on the periphery of the shunt column in a ring mode, and the heights of the spiral blades are identical to those of the shunt column.
Further, a speed increasing cavity is arranged in the rotational flow cavity, a toothed plate is arranged on the outer wall of the speed increasing cavity, the toothed plate penetrates through the rotational flow cavity body to be meshed with a first gear arranged on the outer wall of the rotational flow cavity in a surrounding mode, the first gear is connected with the driving mechanism and rotates under the driving of the driving mechanism, and the rotational flow cavity body rotates under the driving of the first gear.
Further, the speed increasing cavity is a cylindrical hollow cavity, and the side wall of the cylindrical hollow cavity is in contact with the inner wall of the rotational flow cavity.
A rotary-cut jet abrasive-free flattening processing method based on vortex cavitation comprises the steps of firstly, preparing polishing solution; step two, installing the workpiece on a station; step three, moving the rotary-cut type vortex cavitation device and the workpiece to enable the lower end of the rotary-cut type nozzle to move to a preset processing position; pumping the polishing liquid into a vortex cavitation device by a high-pressure pump, generating cavitation liquid flow and emitting the cavitation liquid flow by a rotary-cut cavitation nozzle; and fifthly, continuously modifying and washing the semiconductor substrate by the ejected cavitation liquid flow, and realizing abrasive-free planarization processing of the whole surface of the substrate under the track control of the multi-axis mobile control platform.
The invention has the beneficial effects that:
the rotational-cut jet abrasive-free planarization processing device and method based on vortex cavitation provided by the invention combine the chemical effect of cavitation and the micro-jet erosion effect to polish a workpiece in an abrasive-free manner, so that a better polishing effect can be achieved. The polishing solution is subjected to cavitation chemical effect to enable water and hydrogen peroxide to react chemically, hydroxyl free radicals with strong oxidability are generated, and the hydroxyl free radicals are sprayed to the polishing surface along with cavitation jet flow. The hydroxyl radical reacts with GaN material to generate soft gallium oxide (Ga 2 O 3 ) React with SiC material to generate soft silicon dioxide (SiO 2 ) The method comprises the steps of carrying out a first treatment on the surface of the The micro jet generated when the cavitation bubbles collapse impacts the surface material to be polished, so that the micro plasticity of the material is removed. The polishing method has the advantages that no abrasive material participates, no subsurface damage layer is generated, no metal ion pollution is caused, and the cleaning workload after processing is greatly reduced, so that a novel green and environment-friendly polishing method is formed.
2. The rotary-cut type jet nozzle is adopted to split and swirl the polishing liquid, the polishing liquid is in a tangential jet flow shape when being sprayed out, compared with a direct-jet type outflow, the rotary-cut type outflow has a corresponding tangential velocity component, and can drive microjet generated by cavitation bubbles to generate shearing force equivalent to normal force on microcosmic rough peaks on the surface to be polished, and the shearing force is not the normal extrusion acting force, so that the micro-nano texture material is more favorable for removing and cutting. In addition, the polishing solution after the flow separation and rotational flow is accelerated by adopting the speed-increasing cavity, so that the cavitation effect is enhanced, the flow speed is increased, and the rotary cutting efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment 1 of a rotational-cut type jet abrasive-free planarization processing device based on vortex cavitation;
FIG. 2 is a schematic view showing the structure of an embodiment 1 of a rotary-cut type vortex cavitation polishing apparatus according to the present invention;
FIG. 3 is a cross-sectional view showing the structure of an embodiment 1 of a rotary-cut type vortex cavitation polishing apparatus according to the present invention;
FIG. 4 is a schematic diagram of a tray in embodiment 1 of the present invention;
FIG. 5 is a schematic view showing the structure of a spiral shunt according to embodiment 1 of the present invention;
FIG. 6 is a schematic structural diagram of example 2 of a rotational-cut type jet abrasive-free planarization processing device based on vortex cavitation;
FIG. 7 is a graph showing the effect of cavitation bubbles in a direct and rotary-cut cavitation jet on the surface of a workpiece.
In the figure: the device comprises a 1-working table top, a 2-rotating base, a 3-station, a 4-mounting side frame, a 5-Z axis module, a 6-rotary-cut type vortex cavitation polishing device, a 61-converging cavity, a 611-converging cavity, a 612-liquid inlet channel, a 613-annular fixed table I, a 62-swirling cavity, a 621-swirling cavity, a 622-outflow pipe, a 63-spiral diverter, a 631-diversion column, a 632-inverted cone diversion head, a 633-spiral blade, a 64-rotating disc, a 65-fan-shaped window, a 66-rotary-cut type nozzle, a 67-nozzle chuck, a 68-accelerating cavity, a 681-toothed plate, a 682-gear I, a 683-driving mechanism, a 69-annular limiting channel, a 7-filter, an 8-storage container, a 9-high pressure pump, a 10-throttle valve, an 11-temperature sensor, a 12-pressure sensor, a 13-flow sensor, a 14-recovery container and a 15-temperature adjusting device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
Example 1
Referring to fig. 1, the rotary-cut type jet abrasive-free planarization processing device and method based on vortex cavitation provided by the invention comprise a multi-axis mobile control platform, wherein a station 3 is arranged on the multi-axis mobile control platform, a rotary-cut type vortex cavitation polishing device 6 is arranged above the station 3, the rotary-cut type vortex cavitation polishing device 6 is connected with a liquid supply device, and the liquid supply device supplies polishing liquid for the rotary-cut type vortex cavitation polishing device 6.
Wherein, multiaxis mobile control platform includes table surface 1, is equipped with the XY axle module in the table surface 1, and station 3 passes through rotating base 2 to be set up on the XY axle module, and station 3 and rotating base 2 follow XY axial direction and remove under the drive of XY axle module. One side of the working table surface 1 is provided with a side mounting frame 4, the lower part of the side mounting frame 4 is fixedly connected with one side of the working table surface 1, the upper part of the inner side of the side mounting frame 4 is provided with a Z-axis module 5, and a rotary-cut type vortex cavitation polishing device 6 is arranged on the Z-axis module 5 in a sliding mode and moves back and forth along the Z-axis direction under the driving of the Z-axis module 5. The rotary-cut type vortex cavitation polishing device 6 is driven by the Z-axis module 5 to lift along the Z-axis, approaches or departs from the station 3, polishes and polishes the semiconductor product placed on the station 3, and the station 3 and the rotating base 2 are driven by the XY-axis module to move to the position right below the rotary-cut type vortex cavitation polishing device 6, and the rotating base 2 drives the station 3 to rotate. The station 3 is a disc-shaped station and has the function of collecting polishing liquid.
Referring to fig. 2-4, the rotary-cut type vortex cavitation polishing device 6 includes a converging cavity 61 and a cyclone cavity 62 disposed below the converging cavity 61, the converging cavity 61 includes a converging cavity 611, the converging cavity 611 is a cylindrical cavity, the lower end of the cylindrical cavity is an open port, the upper end of the cylindrical cavity is provided with a liquid inlet channel 612, the liquid inlet channel 612 and the converging cavity 611 are integrally formed, an annular fixing table one 613 is further disposed on the outer wall of the lower end of the converging cavity 611, and the annular fixing table one 613 and the converging cavity 611 are integrally formed.
The cyclone chamber 62 is arranged below the converging chamber 61 and comprises a cyclone chamber 621, wherein the upper part of the cyclone chamber 621 is a cylindrical chamber, the lower part of the cyclone chamber is a conical chamber, the lower end of the conical chamber is connected with a flow outlet pipe 622, and the flow outlet pipe 622 and the cyclone chamber 621 are integrally formed. The upper part of the cyclone cavity 621 is provided with a second annular fixing table 623, and the second annular fixing table 623 and the cyclone cavity are integrally formed. The lower end of the cyclone chamber 62 is provided with a rotary-cut nozzle 66, and the rotary-cut nozzle 66 is fixed at the lower end of the cyclone chamber 62 through a nozzle chuck 67.
A switching disc 64 is arranged between the converging cavity 61 and the swirling cavity 62, the switching disc 64 is a circular disc with a certain thickness, a plurality of fan-shaped windows 65 are formed in the middle of the circular disc, a plurality of screw holes are formed in the edges of the fan-shaped windows 65, and screws sequentially penetrate through the annular fixing table one 613, the switching disc 64 and the annular fixing table two 623 to fixedly connect the converging cavity 61, the switching disc 64 and the swirling cavity 62. The converging chamber 61 and the swirling chamber 62 are coaxially arranged.
Referring to fig. 3 and 5, the spiral splitter 63 includes a splitter post 631, the splitter post 631 is a cylinder, an inverted cone splitter head 632 is disposed at an upper end of the cylinder, the inverted cone splitter head 632 and the splitter post 631 are integrally formed, a plurality of spiral blades 633 are disposed around an outer periphery of the splitter post 631, a height of the spiral blades 633 is the same as that of the splitter post 631, and the spiral blades 633 are integrally formed with the splitter post 631. The spiral splitter 63 is disposed in the manifold chamber 61, and the lower end of the split post 631 is disposed on the adapter plate 64 with the inverted cone split head 632 facing the inlet channel 612.
Referring to fig. 1, a high-pressure pump 9, a throttle valve 10, a temperature sensor 11, a pressure sensor 12, a flow sensor 13 are sequentially connected to a storage container 8, and the flow sensor 13 is connected to a liquid inlet channel 612. A temperature sensor 11 is provided in the magazine 8. The material storage container 8 is also provided with a temperature adjusting device 15, and the temperature adjusting device 15 is used for adjusting the temperature of the polishing solution in the material storage container 8.
The recovery device comprises a filter 7, the filter 7 is connected with the station 3, the polishing solution in the station 3 is filtered, the filter 7 is connected with a recovery container 14, and the filtered polishing solution is recovered to the recovery container 14.
Working principle:
during operation, polishing liquid in the storage container 8 sequentially passes through the throttle valve 10, the temperature sensor 11, the pressure sensor 12 and the flow sensor 13 under the action of the high-pressure pump 9 to enter the liquid inlet channel 612, the polishing liquid enters the confluence cavity 61 from the liquid inlet channel 612, the polishing liquid is split and swirled under the action of the spiral splitter 63, the polishing liquid after split and swirled enters the swirling cavity 62, swirled to the rotary-cut spray group 66 along the side wall of the swirling cavity, and is sprayed out from the rotary-cut spray nozzle 66 to polish a workpiece, and waste liquid generated after polishing is filtered by the filter 7 and then enters the recovery container 14.
Example 2
Referring to fig. 6 and 7, the difference between the present embodiment and embodiment 1 is that: the cyclone chamber 62 is provided with a speed increasing chamber 68, the speed increasing chamber 68 is a cylindrical cavity, the upper and lower ends of the speed increasing chamber 68 are both open ends, and the upper and lower ends of the speed increasing chamber 68 respectively lean against the upper and lower ends of the cylindrical chamber part of the cyclone chamber 62 and are in contact with the inner wall of the cyclone chamber 62.
The outer wall of the speed increasing cavity 68 is provided with a toothed plate 681, the toothed plate 681 and the outer wall of the speed increasing cavity 68 are integrally formed, and the toothed plate 681 is meshed and connected with a first gear 682 which is annularly arranged on the rotational flow cavity 621 through an annular limiting channel 69 which is formed on the outer wall of the rotational flow cavity 621, and the first gear 682 drives the toothed plate 681 to rotate when rotating, so that the speed increasing cavity 68 rotates. Because the annular limiting channel 69 divides the cyclone chamber 62 into an upper part and a lower part, the upper part and the lower part of the cyclone chamber 62 are fixedly connected through the fixing member 684.
The outside of gear one 682 is equipped with actuating mechanism 683, and actuating mechanism 683 includes driving motor, and driving motor's drive end is connected with gear two, and gear two and gear one 682 meshing are connected, and driving motor drives gear two and rotates, and gear two drives gear one 682 and rotate.
Working principle:
during operation, the polishing solution in the station 3 sequentially passes through the filter 7, the material storage container 8, the throttle valve 10, the temperature sensor 11, the pressure sensor 12 and the flow sensor 13 under the action of the high-pressure pump 9, enters the liquid inlet channel 612, enters the flow dividing column 61 from the liquid inlet channel 612, is divided and swirled under the action of the spiral flow divider 63, enters the speed increasing cavity 68, the speed increasing cavity 68 rotates under the drive of the driving mechanism 683, accelerates the polishing solution entering the speed increasing cavity 68, swirls to the rotary-cut type spray set 66 along the side wall of the swirling cavity, sprays out from the rotary-cut type spray set 66, polishes a workpiece, and waste liquid generated after polishing is filtered by the filter 7 and enters the recovery container 14.
A rotational-cut type jet abrasive-free flattening processing method based on vortex cavitation comprises the following steps of
Step one, preparing polishing solution, namely preparing the polishing solution by adopting H2O and H2O 2;
step two, installing a workpiece on a station, and pouring polishing solution into the station;
step three, a multi-axis mobile control platform moves the rotary-cut type vortex cavitation device and the station, so that the lower end of the rotary-cut type nozzle is aligned to the semiconductor substrate placed on the station;
pumping the polishing liquid into a vortex cavitation device by a high-pressure pump, generating cavitation liquid flow and emitting the cavitation liquid flow by a rotary-cut cavitation nozzle; and fifthly, continuously modifying and washing the semiconductor substrate by the ejected cavitation liquid flow, and realizing abrasive-free planarization processing of the whole surface of the substrate under the track control of the multi-axis mobile control platform.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (9)
1. The utility model provides a rotary-cut type efflux abrasive-free planarization processingequipment based on vortex cavitation which characterized in that: the rotary-cut type vortex cavitation polishing device comprises a multi-shaft mobile control platform, wherein a station (3) is arranged on the multi-shaft mobile control platform, a rotary-cut type vortex cavitation polishing device (6) is arranged above the station (3), the rotary-cut type vortex cavitation polishing device (6) is connected with a liquid supply device, and the liquid supply device provides polishing liquid for the rotary-cut type vortex cavitation polishing device (6).
2. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 1, wherein: the rotary-cut type vortex cavitation polishing device (6) comprises a converging cavity (61) and a vortex cavity (62) arranged below the converging cavity (61), a spiral flow divider (63) is arranged in the converging cavity (61), the spiral flow divider (63) divides and vortices polishing liquid in the converging cavity (61), and polishing liquid after the division and the vortex flow enters the vortex cavity (62) and then is sprayed out of the vortex cavity (62).
3. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 2, wherein: the converging cavity (61) comprises a cavity body (611), the cavity body (611) is a cylindrical cavity, the upper end of the cavity body is provided with a liquid inlet channel (612), and the lower end of the cavity body (611) is in butt joint with the cyclone cavity (62).
4. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 3, wherein: the cyclone cavity (62) comprises a cyclone cavity (621), the upper part of the cyclone cavity (621) is a cylindrical cavity, the lower part of the cyclone cavity is a conical cavity, and the lower end of the conical cavity is connected with a flow outlet pipe (622).
5. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 2, wherein: a switching disc (64) is arranged between the converging cavity (61) and the swirling cavity (62), and a plurality of fan-shaped windows (65) are formed in the middle of the switching disc (64).
6. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 2, wherein: the spiral shunt (63) comprises a shunt column (631), an inverted conical shunt head (632) is arranged at the upper end of the shunt column (631), a plurality of spiral blades (633) are arranged on the periphery in a ring mode, and the heights of the spiral blades (633) are identical to those of the shunt column (631).
7. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 1, wherein: the rotational flow cavity (62) is internally provided with a speed increasing cavity (68), the outer wall of the speed increasing cavity (68) is provided with a toothed plate (681), the toothed plate (681) penetrates through an annular limiting channel (69) arranged on the rotational flow cavity (621) and is connected with a first gear (682) arranged on the outer wall of the rotational flow cavity (621) in a meshed mode, the first gear (682) is connected with a driving mechanism (683), and the rotational flow cavity (621) rotates under the driving of the first gear (682) under the driving of the driving mechanism (683).
8. The vortex cavitation based rotary-cut type jet abrasive-free planarization processing device according to claim 7, wherein: the speed increasing cavity (68) is a cylindrical hollow cavity, and the side wall of the cylindrical hollow cavity is in contact with the inner wall of the rotational flow cavity (62).
9. A rotary-cut jet abrasive-free flattening processing method based on vortex cavitation is characterized by comprising the following steps of: comprises the steps of preparing polishing solution; step two, installing the workpiece on a station; step three, moving the rotary-cut type vortex cavitation device and the workpiece to enable the lower end of the rotary-cut type nozzle to move to a preset processing position; pumping the polishing liquid into a vortex cavitation device by a high-pressure pump, generating cavitation liquid flow and emitting the cavitation liquid flow by a rotary-cut cavitation nozzle; and fifthly, continuously modifying and washing the semiconductor substrate by the ejected cavitation liquid flow, and realizing abrasive-free planarization processing of the whole surface of the substrate under the track control of the multi-axis mobile control platform.
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| CN202410208551.0A CN117840902A (en) | 2024-02-26 | 2024-02-26 | Rotary-cut type jet abrasive-free flattening processing device and method based on vortex cavitation |
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