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CN116818764A - Method, system, electronic equipment and medium for detecting appearance defects of laser chip - Google Patents

Method, system, electronic equipment and medium for detecting appearance defects of laser chip Download PDF

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Publication number
CN116818764A
CN116818764A CN202310492376.8A CN202310492376A CN116818764A CN 116818764 A CN116818764 A CN 116818764A CN 202310492376 A CN202310492376 A CN 202310492376A CN 116818764 A CN116818764 A CN 116818764A
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China
Prior art keywords
appearance
laser
laser chip
detection
image acquisition
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Chinese (zh)
Inventor
彭琪
宋克江
叶政
叶杨椿
姜伟
段美全
叶劲松
闫大鹏
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Priority to CN202310492376.8A priority Critical patent/CN116818764A/en
Publication of CN116818764A publication Critical patent/CN116818764A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The embodiment of the application discloses a method, a system, electronic equipment and a medium for detecting appearance defects of a laser chip. The method comprises the following steps: presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same; the laser chips are transported to an image acquisition mechanism through a transport module; image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained; and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip. The application can realize the appearance defect of the laser chip without adopting a manual detection mode, can detect the abnormality which cannot be identified by naked eyes, can improve the detection efficiency of the laser chip, avoids the artificial damage and omission of materials, and greatly reduces the production cost.

Description

Method, system, electronic equipment and medium for detecting appearance defects of laser chip
Technical Field
The present invention relates to the field of laser chip detection technologies, and in particular, to a method, a system, an electronic device, and a medium for detecting an appearance defect of a laser chip.
Background
In recent years, the laser science and technology of China is in a rapid development stage. Lasers are the core of laser science and technology, however, damage defects are inevitably present during the production of the laser chip COS (Chip on Submount). Therefore, in order to ensure the performance and quality of the laser chip, it is generally necessary to perform appearance defect detection on the laser chip.
Currently, appearance defects of a laser chip are usually detected by a traditional manual detection mode. However, the conventional manual detection method is usually limited by the experience, expertise, subjective factors and experimental conditions of operators, and cannot meet the high-speed, high-precision and large-batch detection requirements of the laser chip, so that the efficiency of detecting the appearance defects of the laser chip is low, the accuracy of manual detection is low, and the manufacturing cost of the laser chip is greatly increased.
Disclosure of Invention
Aiming at the defects of the prior art, the embodiment of the invention provides a method, a system, electronic equipment and a medium for detecting the appearance defects of a laser chip, which aim to solve the technical problems of lower efficiency, lower accuracy and higher cost of the appearance detection of the laser chip in the prior art.
In order to solve the above problems, in a first aspect, an embodiment of the present invention provides a method for detecting an appearance defect of a laser chip, which is applied to a detection terminal, where the method includes:
presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same;
the laser chips are transported to an image acquisition mechanism through a transport module;
image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained;
and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
In a second aspect, an embodiment of the present invention provides a system for detecting an appearance defect of a laser chip, which is applied to a detection terminal, where the device includes:
the parameter setting unit is used for presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same;
the chip transportation unit is used for transporting the laser chips to the image acquisition mechanism through the transportation module;
The image acquisition unit is used for acquiring images of the laser chips according to the image acquisition mechanism to obtain a plurality of appearance images of each laser chip;
and the image processing unit is used for processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain the detection result of the appearance defect of each laser chip.
In a third aspect, an embodiment of the present application further provides an electronic device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor implements the method for detecting an appearance defect of a laser chip according to the first aspect when executing the computer program.
In a fourth aspect, an embodiment of the present application further provides a computer readable storage medium, where the computer readable storage medium stores a computer program, where the computer program when executed by a processor causes the processor to execute the method for detecting an appearance defect of a laser chip according to the first aspect.
The embodiment of the application provides a method, a system, electronic equipment and a medium for detecting appearance defects of laser chips, wherein parameters of appearance defect algorithms of a plurality of laser chips to be detected are preset, then the laser chips are transported to an image acquisition mechanism through a transport module, the image acquisition mechanism is adopted to acquire a plurality of appearance images of each laser chip, and finally the images are processed according to the appearance defect detection algorithms after parameter setting to obtain detection results of the appearance defects of the laser chips. The application can realize the appearance defect of the laser chip without adopting a manual detection mode, can detect the abnormality which cannot be identified by naked eyes, can greatly improve the detection efficiency of the laser chip, avoids the artificial damage and omission of materials, and greatly reduces the production cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flowchart of a method for detecting an appearance defect of a laser chip according to an embodiment of the present invention;
FIG. 2 is a flowchart of a method for detecting an appearance defect of a laser chip according to an embodiment of the present invention;
FIG. 3 is a flowchart of a method for detecting an appearance defect of a laser chip according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for detecting an appearance defect of a laser chip according to an embodiment of the present invention;
FIG. 5 is a schematic block diagram of a system for detecting defects in the appearance of a laser chip according to an embodiment of the present invention;
fig. 6 is a schematic block diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
The method for detecting the appearance defects of the laser chip is applied to the detection terminal, and the method for detecting the appearance defects of the laser chip is carried out through application software installed in the detection terminal. The device where the detection terminal is located can be electronic devices such as a desktop computer, a notebook computer, a tablet computer or a mobile phone.
It should be noted that, the application scenario of the foregoing embodiment is merely an example, and the services and scenarios described in the embodiments of the present application are for more clearly describing the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application, and those skilled in the art can know that, with the evolution of the system and the appearance of the new service scenario, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems. The following will describe in detail.
The following description of the embodiments is not intended to limit the preferred embodiments. The method for detecting the appearance defects of the laser chip is described in detail below.
Referring to fig. 1, fig. 1 is a flow chart illustrating a method for detecting an appearance defect of a laser chip according to an embodiment of the application.
As shown in fig. 1, the method includes the following steps S110 to S140.
S110, presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same.
Specifically, the application can detect the appearance defects of a single laser chip, can detect the appearance defects of a plurality of laser chips with the same chip type, can set parameters of an algorithm for detecting the appearance defects of the laser chips after acquiring a plurality of laser chips to be detected, namely the appearance defect algorithm, can transport the laser chips to an image acquisition mechanism for acquiring appearance images after the parameters of the appearance defect algorithm are set, and can process the acquired appearance images by adopting the appearance defect detection algorithm after the parameters are set, thereby realizing defect detection on each surface of the laser chips.
In other embodiments of the application, as shown in fig. 2, steps S210 and S220 are further included before step S110.
S210, determining an initial sequence number of the laser chip acquired by the image acquisition mechanism on the tray frame according to an image acquisition mode of the image acquisition mechanism;
s220, determining the initial position of the image acquisition mechanism for image acquisition on the tray frame according to the initial sequence number.
In this embodiment, a plurality of laser chips may be placed on a tray frame, the tray frame may be divided into 5 columns, and 4 cartridges may be inserted into each column, and then 20 cartridges may be inserted, and a serial number is provided at a position of the tray frame where one laser chip is placed. The image acquisition mode is a mode that an image acquisition mechanism performs image acquisition on a laser chip on a tray frame, the initial serial number is a serial number that the image acquisition mechanism performs image acquisition on the laser chip on the tray frame for the first time after the tray frame moves to a preset position, the serial number of the laser chip on the tray frame is the initial serial number, and the initial position is a position that the image acquisition mechanism performs image acquisition on the laser chip on the tray frame for the first time after the tray frame moves to the preset position. After the image acquisition mode of the image acquisition mechanism is acquired, the motion rule of the image acquisition mechanism near the material tray frame can be determined, and then the sequence of each laser chip on the material tray frame can be acquired, so that the starting sequence number of the appearance image of the first laser chip acquired by the image acquisition mechanism on the material tray frame can be determined according to the image acquisition mode of the image acquisition mechanism. After the tray frame with the laser chips is transported to a preset position, the image acquisition mechanism can move to the laser chips corresponding to the initial serial numbers according to the initial serial numbers of the laser chips on the tray frame to acquire images.
In other embodiments of the invention, as shown in fig. 3, steps S230 and S240 are further included after step S220.
S230, determining whether the initial sequence number is larger than the maximum number of laser chips carried on the tray frame;
and S240, if the number is larger than the maximum number, sending an alarm instruction to the alarm module.
In this embodiment, the serial number set by placing one laser chip on the tray rack is set according to the number of laser chips carried on the tray rack, that is, the numerical value of the serial number set by placing one laser chip on the tray rack must be smaller than the numerical value of the maximum number of laser chips carried on the tray rack. Therefore, before appearance defect detection is performed on the laser chips on the tray frame, whether the set initial serial number is larger than the maximum number of the laser chips borne on the tray frame is required to be detected in advance, if so, an alarm instruction can be sent to the alarm module, and the alarm module can send an alarm signal after receiving the alarm instruction.
In other embodiments of the invention, before step S210, the method further includes the steps of: initializing the image acquisition mechanism and the transportation module according to the operation mode of the detection terminal.
In this embodiment, the operation modes of the detection terminal include a User mode, an Admin mode and a factor mode, which respectively correspond to an operator mode, an engineer login mode and a Factory maintenance mode, where the User mode is mainly used for performing appearance defect detection on the laser chips on the tray frame, so that after the detection terminal is set to the User mode, the image acquisition mechanism and the transport module can be reset, so that the laser chips on the tray frame can be transported to a predetermined position smoothly, so that the image acquisition mechanism can acquire appearance images, and then the acquired appearance images are processed by adopting an appearance defect detection algorithm after parameter setting, so as to perform defect detection on each surface of the laser chips.
In other inventive embodiments, as shown in fig. 4, step S110 includes steps S111, S112, S113, and S114.
S111, setting parameters of appearance defect types of a plurality of laser chips to be detected;
s112, setting a segmentation mode and parameters of a detection mode of the appearance image of the laser chip according to the appearance defect type and the detection surface of the laser chip;
s113, setting parameters of a detection surface of the laser chip according to the chip type of the laser chip, and importing standard parameters of the detection surface;
S114, setting and positioning parameters of the detection surface of the laser chip according to the parameters of the detection surface and the parameters of the dividing mode.
In this embodiment, the parameters of the appearance defect type include defect names and defect identifiers, the defect names include dirt, white lines, different colors, and the like, the dirt includes black dirt and white dirt, the defect identifiers are symbols when the appearance defect of the laser chip at the detection position meets the set defect names, and the defect identifiers can be identified by symbols such as english letters, that is, each defect name corresponds to one defect identifier.
Specifically, when the appearance defect detection is carried out on the laser chip, the appearance defect detection is carried out on the laser chip by collecting the appearance image of the laser chip and then processing the appearance image. Meanwhile, the detection surface of the detection laser chip mainly comprises a front surface, a bottom surface, an HR surface (high reflection film) and an AR surface (anti-reflection film), so that the appearance detection types, the segmentation modes and the detection modes of appearance images corresponding to different surfaces of the laser chip are different, and after parameters of appearance defect types of the laser chip to be detected are set, the parameters of the segmentation modes and the detection modes of the appearance images of all surfaces of the laser chip can be set, and further defect detection of all surfaces of the laser chip can be realized.
Meanwhile, when the appearance defect detection algorithm is adopted to detect the appearance defect of the laser chip, parameters of a detection surface of the laser chip are required to be set in the algorithm, the detection surface of the laser chip comprises a front surface, a bottom surface, an HR surface and an AR surface, wherein the parameters of the front surface can comprise the width, the width tolerance, the height tolerance and the chip inclination angle of the front surface, the parameters of the bottom surface can comprise the width, the width tolerance, the height tolerance and the chip inclination angle of the bottom surface, parameters of the AR surface may include the width of the AR surface, width tolerance, height tolerance, chip tilt angle, etched trench width tolerance, etched trench height tolerance, etched trench spacing, critical area width, critical area height, critical area left offset and critical area up offset, parameters of the HR surface may include width, width tolerance, height tolerance, chip tilt angle, etched trench width tolerance, etched trench height tolerance, etched trench spacing, critical area width, critical area height, critical area left offset, and critical area up offset of the HR surface.
When the parameters of the detection surface of the laser chip are set in the algorithm, all the parameters of the front surface, the bottom surface, the HR surface and the AR surface may be set, or some parameters may be set, and the specific parameter setting method may be selected according to practical application.
In addition, after the detection surface of the laser chip and the segmentation mode of the appearance image of the detection surface, which need to be detected for appearance defects, are determined, parameters for positioning the detection surface in the appearance image can be set. The method for positioning the detection surface of the laser chip comprises contour positioning and surface positioning of the detection surface.
In other inventive embodiments, step S111 includes: if the appearance defect type of the laser chip does not exist in the terminal, a defect name and a defect identifier of the appearance defect type of the laser chip are newly added; and if the appearance defect type which is not matched with the laser chip exists in the terminal, deleting the defect name and the defect identifier of the appearance defect type which is not matched with the laser chip.
Specifically, parameters of different types of appearance defects are preset in the terminal, but the types of appearance defects required to be detected by the different types of laser chips are not the same, that is, the types of appearance defects of the different types of laser chips are different. When the appearance defect type of the laser chip to be detected does not exist in the terminal, the parameters of the appearance defect type of the laser chip to be detected need to be newly added, specifically, the defect name and the defect identifier of the appearance defect type are added; when there is an appearance defect type that does not match the laser chip to be detected in the terminal, parameters of the unmatched appearance defect type need to be deleted, specifically, a defect name and a defect identifier of the appearance defect type.
It should be noted that, the present application may detect a plurality of appearance defect types of the laser chip at the same time, or may detect only one appearance defect type, and may specifically be selected according to practical applications, and the embodiment is not limited specifically.
In other inventive embodiments, step S112 includes: if the segmentation mode is threshold segmentation, setting a color space of the threshold segmentation, a first segmentation threshold and the color of an abnormal region according to the detection surface; and setting a first defect standard of the threshold segmentation according to the appearance defect type.
In this embodiment, the appearance images of different detection surfaces on the laser chip have different segmentation modes, and threshold segmentation exists in the segmentation modes, which is specifically used for performing segmentation detection on defects in the appearance images corresponding to the AR surface and the HR surface of the laser chip. The threshold segmentation is used for independently converting faults into black or white through imaging definition under different color spaces so as to realize detection of defects in a detection surface.
The parameters of the threshold segmentation include parameters such as a color space, a first segmentation threshold, colors of an abnormal region, a first defect standard and the like, wherein the color space includes a brightness space, a green space and a gray space, and different color spaces correspond to different first segmentation thresholds, colors of the abnormal region and the first defect standard. After the detection surface of the laser chip is determined, a color space for threshold segmentation of the appearance image of the detection surface, a first segmentation threshold, and the color of the abnormal region may be set according to the color of the detection surface. Meanwhile, the first defect standard of the threshold segmentation can be determined according to the external defect detection type corresponding to the detection surface. Specifically, the first segmentation threshold is a threshold for performing pixel segmentation on the appearance image, the color of the abnormal region can be white or black, the first defect standard comprises maximum and minimum values of defect width and height, and the first defect standard also comprises maximum number of allowed defects and minimum size of the defects.
In other embodiments of the present invention, step S112 further includes: if the segmentation mode is color segmentation, setting a second segmentation threshold value of the color segmentation and the color of an abnormal region according to the detection surface; and setting a second defect standard of the color segmentation according to the appearance defect type.
In this embodiment, the method for dividing the appearance image of the detection surface further includes color division, which is specifically used for dividing and detecting the appearance image corresponding to the front surface and the bottom surface of the laser chip, where the color division removes a color space compared with the threshold value division, and directly uses the color of the laser chip itself to detect the defect of the laser chip. The parameters of the color segmentation include a second segmentation threshold, the color of the abnormal region and a second defect standard, and the second defect standard of the color segmentation can be determined according to the external defect detection type corresponding to the detection surface.
Specifically, the second division threshold includes a threshold of color hue, color saturation and color brightness, the front and bottom surfaces of the chip can be better positioned by setting the second division threshold of color division, the edge grabbing rate can be improved, the over-killing is reduced, the color of the abnormal area can be white or black, the second defect standard includes maximum and minimum values of defect width and height, and the first defect standard also includes maximum number of allowed defects and minimum size of the defects.
In other embodiments of the present application, step S112 further includes: setting a third defect standard of a detection mode of the appearance image of the laser chip according to the appearance defect detection type; if the detection mode is white line detection, setting a first algorithm threshold value of the white line detection; if the detection mode is abnormal color detection, setting the area expansion parameter of white line detection and a second algorithm threshold.
In this embodiment, the third defect criteria includes maximum and minimum values of defect width and height, while the first defect criteria also includes maximum number of allowed defects and minimum size of defects. After setting the parameters of the third defect criteria, specific parameters corresponding to the detection mode may be set. The detection mode comprises white line detection and abnormal color detection, and when the detection mode is white line detection, a first algorithm threshold value of white line detection is set; when the detection mode is different-color detection, setting a region expansion parameter of white line detection and a second algorithm threshold. The range of the first algorithm threshold and the second algorithm threshold is between 0 and 1, and the region expansion parameters comprise a left expansion parameter outside the region, a right expansion parameter outside the region, an up expansion parameter outside the region and a down expansion parameter outside the region, wherein the unit of the region expansion parameters is a pixel, and can be a negative pixel.
In other inventive embodiments, step S114 includes: if the outline is adopted to position the detection surface of the laser chip, setting an etching groove range and a key area range in the outline of the appearance image of the laser chip according to the detection surface; wherein the detection surface comprises an AR surface and an HR surface of the laser chip; setting a color space and an offset compensation value of upper and lower edges of the outline of the appearance image of the laser chip; if the detection surface of the laser chip is positioned by adopting the surface, setting a third segmentation threshold value of the appearance image of the laser chip and the color of an abnormal region according to the detection surface; wherein the detection surface comprises a front surface and a bottom surface of the laser chip; and setting a brightness compensation value for positioning the detection surface of the laser chip.
In this embodiment, different detection surfaces are positioned in different manners, the HR surface and the AR surface of the laser chip are positioned in a contour positioning manner, and the front surface and the bottom surface of the laser chip are positioned in a surface positioning manner. The parameters of the detection surface of the profile positioning laser chip may include an etched groove range, a key area range, a color space of upper and lower edges of the profile and an offset compensation value in the profile of the appearance image corresponding to the detection surface, the detection surface may include an AR surface and an HR surface of the laser chip, the etched groove range in the profile of the appearance image corresponding to the detection surface includes an etched groove width, an etched groove width tolerance, an etched groove height tolerance and an etched groove spacing, which may be obtained from the parameters corresponding to the detection surface, the key area range includes a key area width and a key area height, which may also be obtained from the parameters corresponding to the detection surface, and the color space of the upper and lower edges of the profile and the offset compensation value may be determined according to the color space of the threshold segmentation. The parameters of the detection surface of the surface positioning laser chip can comprise a third segmentation threshold value of the appearance image corresponding to the detection surface, the color of the abnormal region and a brightness compensation value, wherein the third segmentation threshold value comprises a threshold value of color tone, color saturation and color brightness, the color of the abnormal region can be black or white, and the brightness compensation value of the detection surface of the laser chip can be set according to the color of the detection surface.
When positioning different detection surfaces in different manners, parameters of the detection surface of the laser chip may be selected according to practical applications, and the present application is not limited specifically.
S120, conveying the laser chips to an image acquisition mechanism through a conveying module.
In this embodiment, the transporting module is used for transporting the tray rack carrying the laser chip to a predetermined position, and can be driven by the servo motor to perform up-down, left-right, front-back and overturning movements, and the image acquisition mechanism includes a forward optical module, a back optical module, an end optical module and a pre-scanning optical module, which are all provided with high-resolution industrial cameras. When the appearance image of the detection surface of the laser chip needs to be acquired, the detection surface is only required to be placed at the corresponding optical module through the transportation module so as to acquire the appearance image of the detection surface.
In other embodiments of the present application, before step S120, the method further includes the steps of: and presetting an image acquisition mode of the image acquisition mechanism.
In this embodiment, the image capturing modes include a manual mode and an automatic mode, where the manual mode is to manually control the image capturing mechanism to capture an image, and the automatic mode is to automatically control the image capturing mechanism to capture an image after the laser chip reaches a predetermined position, where the manual mode can manually confirm whether a detection surface of the current laser chip is a preset surface that needs to be subjected to defect detection after the laser chip reaches the predetermined position. The application preferentially selects the image acquisition mechanism to preferentially select the automatic mode for image acquisition, and when the image acquisition mechanism needs to be automatically controlled for image acquisition, the image acquisition mechanism is automatically emptied for image acquisition within the preset time after receiving the instruction of the automatic mode.
S130, carrying out image acquisition on the laser chips according to the image acquisition mechanism to obtain a plurality of appearance images of each laser chip.
In this embodiment, the image capturing mechanism includes a forward optical module, a backward optical module, an end-face optical module, and a pre-scanning optical module, which are all provided with a high-resolution industrial-level camera. When the appearance image of the detection surface of the laser chip needs to be acquired, the detection surface is only required to be placed at the corresponding optical module through the transportation module so as to acquire the appearance image of the detection surface. The image definition of the forward optical module and the backward optical module is not more than 1.7nm, and the image definition of the end face optical module is not more than 0.17nm.
And S140, processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
In this embodiment, in the process of processing the appearance image by using the appearance defect detection algorithm after the parameter setting, the edge of the laser chip is positioned from the appearance image in advance to obtain the laser chip in the appearance image, and then the appearance defect detection is performed in the modes of threshold segmentation, color segmentation, white line detection or abnormal color detection, so as to obtain the detection result of the appearance defect of each laser chip, and finally the detection result is displayed on the display end. The display result in the display end is green, which is indicated as OK, the display result is red, which is indicated as NG, which is indicated as abnormal, and the display result is blue, which indicates that no laser chip exists.
In other embodiments of the present application, after step S140, the method further includes the steps of: and starting off-line re-judging software, and re-judging the detection result according to the off-line re-judging software.
In this embodiment, in order to prevent misjudgment of appearance defect detection of the laser chip, the offline re-judgment software is adopted in this embodiment to re-judge the detection result. Specifically, the storage path of the detection result is determined, and the material box code needing to be subjected to the re-judgment is determined according to the chip box number of the laser chip, so that the detection result of each laser chip can be displayed again at the display end, and then whether abnormal conditions exist or not is determined in a manual mode, so that the condition of false detection of the appearance detection of the laser chip is avoided.
In the method for detecting the appearance defects of the laser chips, parameters of appearance defect algorithms of a plurality of laser chips to be detected are preset; the chip types of the laser chips are the same; the laser chips are transported to an image acquisition mechanism through a transport module; image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained; and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip. The application can realize the appearance defect of the laser chip without adopting a manual detection mode, can detect the abnormality which cannot be identified by naked eyes, can greatly improve the detection efficiency of the laser chip, avoids the artificial damage and omission of materials, and greatly reduces the production cost.
The embodiment of the invention also provides a system 100 for detecting the appearance defect of the laser chip, which is used for executing any embodiment of the method for detecting the appearance defect of the laser chip.
Specifically, referring to fig. 5, fig. 5 is a schematic block diagram of a system 100 for detecting an appearance defect of a laser chip according to an embodiment of the invention.
As shown in fig. 5, the system 100 for detecting an appearance defect of a laser chip includes: a parameter setting unit 110, a chip transporting unit 120, an image acquisition unit 130, and an image processing unit 140.
A parameter setting unit 110, configured to preset parameters of an appearance defect algorithm of a plurality of laser chips to be detected; the chip types of the laser chips are the same;
the chip transporting unit 120 is configured to transport the plurality of laser chips carried by the plurality of laser chips to the image acquisition mechanism through the transporting module;
the image acquisition unit 130 is configured to acquire images of the plurality of laser chips according to the image acquisition mechanism, so as to obtain a plurality of appearance images of each laser chip;
and the image processing unit 140 is configured to process the plurality of appearance images according to the appearance defect detection algorithm after the parameter setting, so as to obtain a detection result of the appearance defect of each laser chip.
The system 100 for detecting the appearance defects of the laser chips provided by the embodiment of the invention is used for executing the preset parameters of the appearance defect algorithm of the plurality of laser chips to be detected; the chip types of the laser chips are the same; the laser chips are transported to an image acquisition mechanism through a transport module; image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained; and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
It should be noted that, as those skilled in the art can clearly understand, the specific implementation process of the detection system 100 and the units of the appearance defect of the laser chip can refer to the corresponding descriptions in the foregoing method embodiments, and for convenience and brevity of description, the description is omitted here.
The above-described system for detecting defects in the appearance of a laser chip may be implemented in the form of a computer program that can be run on an electronic device as shown in fig. 6.
Referring to fig. 6, fig. 6 is a schematic block diagram of an electronic device according to an embodiment of the present invention.
Referring to fig. 6, the device 500 includes a processor 502, a memory, and a network interface 505, which are connected by a system bus 501, wherein the memory may include a storage medium 503 and an internal memory 504.
The storage medium 503 may store an operating system 5031 and a computer program 5032. The computer program 5032, when executed, causes the processor 502 to perform a method for detecting defects in the appearance of a laser chip.
The processor 502 is used to provide computing and control capabilities to support the operation of the overall device 500.
The internal memory 504 provides an environment for the execution of a computer program 5032 in the non-volatile storage medium 503, which computer program 5032, when executed by the processor 502, causes the processor 502 to perform a method for detecting defects in the appearance of a laser chip.
The network interface 505 is used for network communication, such as providing for transmission of data information, etc. It will be appreciated by those skilled in the art that the structure shown in fig. 6 is merely a block diagram of a portion of the structure associated with the present inventive arrangements and is not limiting of the apparatus 500 to which the present inventive arrangements are applied, and that a particular apparatus 500 may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
Wherein the processor 502 is configured to execute a computer program 5032 stored in a memory to perform the following functions: presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same; the laser chips are transported to an image acquisition mechanism through a transport module; image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained; and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
In an embodiment, before implementing the parameter setting for the appearance defect algorithm of the plurality of laser chips to be detected in advance, the processor 502 specifically implements the following steps: determining an initial sequence number of the laser chip collected by the image collection mechanism on the tray frame according to an image collection mode of the image collection mechanism; and determining the initial position of the image acquisition mechanism for image acquisition on the tray frame according to the initial sequence number.
In one embodiment, after the processor 502 determines the starting position of the image capturing mechanism for capturing an image on the tray rack according to the starting sequence number, the following steps are specifically implemented: determining whether the initial sequence number is greater than the maximum number of laser chips carried on the tray rack; and if the number is larger than the maximum number, sending an alarm instruction to an alarm module.
In an embodiment, before the processor 502 determines that the image capturing mechanism captures the starting serial number of the laser chip on the tray frame according to the image capturing manner of the image capturing mechanism, the following steps are specifically implemented: initializing the image acquisition mechanism and the transportation module according to the operation mode of the detection terminal.
In an embodiment, when the processor 502 performs parameter setting on the appearance defect algorithm of the plurality of laser chips to be detected in advance, the following steps are specifically implemented: setting parameters of appearance defect types of a plurality of laser chips to be detected; setting a segmentation mode and parameters of a detection mode of an appearance image of the laser chip according to the appearance defect type and the detection surface of the laser chip; setting parameters of a detection surface of the laser chip according to the chip type of the laser chip, and importing standard parameters of the detection surface; and setting and positioning parameters of the detection surface of the laser chip according to the parameters of the detection surface and the parameters of the segmentation mode.
In one embodiment, before the processor 502 performs the transporting the plurality of laser chips carried by the transporting module to the image capturing mechanism, the following steps are specifically implemented: and presetting an image acquisition mode of the image acquisition mechanism.
In an embodiment, after the processor 502 processes the appearance images according to the appearance defect detection algorithm after the parameter setting to obtain a detection result of each appearance defect of the laser chip, the following steps are specifically implemented: and starting off-line re-judging software, and re-judging the detection result according to the off-line re-judging software.
Those skilled in the art will appreciate that the embodiment of the apparatus 500 shown in fig. 6 is not limiting of the specific construction of the apparatus 500, and in other embodiments, the apparatus 500 may include more or less components than illustrated, or certain components may be combined, or a different arrangement of components. For example, in some embodiments, the device 500 may include only the memory and the processor 502, and in such embodiments, the structure and the function of the memory and the processor 502 are consistent with the embodiment shown in fig. 6, and will not be described herein.
It should be appreciated that in an embodiment of the invention, the processor 502 may be a central processing unit (Central Processing Unit, CPU), the processor 502 may also be other general purpose processors 502, digital signal processors 502 (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. Wherein the general purpose processor 502 may be the microprocessor 502 or the processor 502 may be any conventional processor 502 or the like.
In another embodiment of the present invention, a computer storage medium is also provided. The storage medium may be a nonvolatile computer-readable storage medium or a volatile storage medium. The storage medium stores a computer program 5032, wherein the computer program 5032 when executed by the processor 502 performs the steps of: presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same; the laser chips are transported to an image acquisition mechanism through a transport module; image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained; and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
In an embodiment, before executing the program instruction to implement parameter setting for the appearance defect algorithm of the plurality of laser chips to be detected in advance, the processor specifically implements the following steps: determining an initial sequence number of the laser chip collected by the image collection mechanism on the tray frame according to an image collection mode of the image collection mechanism; and determining the initial position of the image acquisition mechanism for image acquisition on the tray frame according to the initial sequence number.
In an embodiment, after the processor executes the program instructions to determine the starting position of the image capturing mechanism for capturing an image on the tray rack according to the starting sequence number, the following steps are specifically implemented: determining whether the initial sequence number is greater than the maximum number of laser chips carried on the tray rack; and if the number is larger than the maximum number, sending an alarm instruction to an alarm module.
In an embodiment, before the processor executes the program instructions to implement the determining, according to the image capturing manner of the image capturing mechanism, that the image capturing mechanism captures the starting serial number of the laser chip on the tray frame, the specific implementation steps include: initializing the image acquisition mechanism and the transportation module according to the operation mode of the detection terminal.
In an embodiment, when the processor executes the program instruction to implement parameter setting for the appearance defect algorithm of the plurality of laser chips to be detected in advance, the processor specifically implements the following steps: setting parameters of appearance defect types of a plurality of laser chips to be detected; setting a segmentation mode and parameters of a detection mode of an appearance image of the laser chip according to the appearance defect type and the detection surface of the laser chip; setting parameters of a detection surface of the laser chip according to the chip type of the laser chip, and importing standard parameters of the detection surface; and setting and positioning parameters of the detection surface of the laser chip according to the parameters of the detection surface and the parameters of the segmentation mode.
In one embodiment, the processor, before executing the program instructions to implement the transporting, by the transporting module, the plurality of laser chips carried with the plurality of laser chips to the image capturing mechanism, specifically implements the following steps: and presetting an image acquisition mode of the image acquisition mechanism.
In an embodiment, after the processor executes the program instruction to implement the appearance defect detection algorithm after the parameter setting to process the plurality of appearance images, the method specifically includes the following steps: and starting off-line re-judging software, and re-judging the detection result according to the off-line re-judging software.
It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the apparatus, device and unit described above may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein. Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus, device and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the units is merely a logical function division, there may be another division manner in actual implementation, or units having the same function may be integrated into one unit, for example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices, or elements, or may be an electrical, mechanical, or other form of connection.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment of the present invention.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units may be stored in a storage medium if implemented in the form of software functional units and sold or used as stand-alone products. Based on such understanding, the technical solution of the present invention may be essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing an apparatus 500 (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a magnetic disk, an optical disk, or other various media capable of storing program codes.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims (10)

1. The method for detecting the appearance defects of the laser chip is characterized by being applied to a detection terminal, and comprises the following steps:
presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same;
the laser chips are transported to an image acquisition mechanism through a transport module;
image acquisition is carried out on the laser chips according to the image acquisition mechanism, so that a plurality of appearance images of each laser chip are obtained;
and processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain detection results of the appearance defects of each laser chip.
2. The method for detecting appearance defects of laser chips according to claim 1, further comprising, before the presetting of parameters of an appearance defect algorithm of a plurality of laser chips to be detected:
Determining an initial sequence number of the laser chip collected by the image collection mechanism on the tray frame according to an image collection mode of the image collection mechanism;
and determining the initial position of the image acquisition mechanism for image acquisition on the tray frame according to the initial sequence number.
3. The method according to claim 2, further comprising, after the determining a start position of the image capturing mechanism for capturing an image on the tray rack according to the start sequence number:
determining whether the initial sequence number is greater than the maximum number of laser chips carried on the tray rack;
and if the number is larger than the maximum number, sending an alarm instruction to an alarm module.
4. The method for detecting an appearance defect of a laser chip according to claim 2, further comprising, before the determining that the image capturing mechanism captures the starting serial number of the laser chip on the tray frame according to the image capturing mode of the image capturing mechanism:
initializing the image acquisition mechanism and the transportation module according to the operation mode of the detection terminal.
5. The method for detecting appearance defects of laser chips according to claim 1, wherein the presetting parameters of an appearance defect algorithm of a plurality of laser chips to be detected comprises:
Setting parameters of appearance defect types of a plurality of laser chips to be detected;
setting a segmentation mode and parameters of a detection mode of an appearance image of the laser chip according to the appearance defect type and the detection surface of the laser chip;
setting parameters of a detection surface of the laser chip according to the chip type of the laser chip, and importing standard parameters of the detection surface;
and setting and positioning parameters of the detection surface of the laser chip according to the parameters of the detection surface and the parameters of the segmentation mode.
6. The method for detecting appearance defects of laser chips according to claim 1, further comprising, before said transporting the plurality of laser chips carried by the transporting module to an image capturing mechanism:
and presetting an image acquisition mode of the image acquisition mechanism.
7. The method for detecting an appearance defect of a laser chip according to claim 1, wherein after the appearance defect detection algorithm after the parameter setting processes the plurality of appearance images to obtain a detection result of each appearance defect of the laser chip, further comprises:
and starting off-line re-judging software, and re-judging the detection result according to the off-line re-judging software.
8. A system for detecting appearance defects of a laser chip, which is applied to a detection terminal, the device comprising:
the parameter setting unit is used for presetting parameters of appearance defect algorithms of a plurality of laser chips to be detected; the chip types of the laser chips are the same;
the chip transportation unit is used for transporting the laser chips to the image acquisition mechanism through the transportation module;
the image acquisition unit is used for acquiring images of the laser chips according to the image acquisition mechanism to obtain a plurality of appearance images of each laser chip;
and the image processing unit is used for processing the appearance images according to the appearance defect detection algorithm after parameter setting to obtain the detection result of the appearance defect of each laser chip.
9. An electronic device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the method for detecting an appearance defect of a laser chip according to any one of claims 1 to 7 when the computer program is executed.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program which, when executed by a processor, implements the method for detecting an appearance defect of a laser chip according to any one of claims 1 to 7.
CN202310492376.8A 2023-05-04 2023-05-04 Method, system, electronic equipment and medium for detecting appearance defects of laser chip Pending CN116818764A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117548360A (en) * 2024-01-12 2024-02-13 中国传媒大学 Image feature recognition method and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117548360A (en) * 2024-01-12 2024-02-13 中国传媒大学 Image feature recognition method and device
CN117548360B (en) * 2024-01-12 2024-03-26 中国传媒大学 Image feature recognition method and device

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