CN116736089A - High-low temperature reliability test equipment and method for chip - Google Patents
High-low temperature reliability test equipment and method for chip Download PDFInfo
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- CN116736089A CN116736089A CN202311026936.7A CN202311026936A CN116736089A CN 116736089 A CN116736089 A CN 116736089A CN 202311026936 A CN202311026936 A CN 202311026936A CN 116736089 A CN116736089 A CN 116736089A
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- 238000012360 testing method Methods 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims abstract description 22
- 210000001503 joint Anatomy 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013079 data visualisation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application relates to the technical field of chip testing, in particular to a device and a method for testing high-low temperature reliability of a chip. The equipment comprises a temperature control device, a top plate, a circuit board, a lifting rod and a telescopic return pipe, wherein the lifting rod and the telescopic return pipe are connected between the top plate and the temperature control device; the top surface of the temperature control device is provided with a plurality of first air flow ports; the bottom surface of the top plate is provided with a plurality of second air flow ports, and an air flow channel is arranged in the top plate; a panel on one side of the circuit board is provided with a plurality of mounting grooves for placing chips to be tested, and the mounting grooves are matched with the second air flow openings; the bottom wall of the mounting groove is provided with an air hole; a butt joint port matched with the first air flow port is arranged on the other surface of the circuit board at a position corresponding to the position of the mounting groove; the circuit board is welded with connecting lines and test boards required by test in advance. The device can prolong the service life of the test board card and realize the high-low temperature reliability test of batch accuracy.
Description
Technical Field
The application relates to the technical field of chip testing, in particular to a chip high-low temperature reliability testing device and a chip high-low temperature reliability testing method.
Background
In the prior art, the high-low temperature reliability test of the high-speed signal storage chip is mainly divided into two types of test modes, wherein one type is based on a heat flow cover to test a single chip, and the number of chips measured once is greatly limited by the mode, so that the time consumption is overlong and the efficiency is low; the other type is to test chips in batches based on an environmental temperature test box, and in order to ensure the reliability of signal transmission, a test board card and a tested chip are usually required to be put into the environmental temperature test box together for testing in the test process. The test board card can experience the same severe temperature environment as the tested chip, so that the aging failure process of the test system on the test board card can be accelerated, and resources are wasted. In addition, the accuracy of the test results can also be affected by the burn-in test board.
Disclosure of Invention
The embodiment of the application aims to provide high-low temperature reliability test equipment and method for chips, so as to prolong the service life of test boards and realize accurate high-low temperature reliability test in batches.
In order to achieve the above object, a first aspect of the present application provides a device for testing high and low temperature reliability of a chip, the device including a temperature control device, a top plate, and a lifting rod and a telescopic return pipe connected between the top plate and the temperature control device, wherein the lifting rod can drive the top plate to approach or separate from the temperature control device; a plurality of first air flow ports are formed in one surface of the temperature control device facing the top plate; a plurality of second airflow ports are formed in one surface of the top plate facing the temperature control device, and an airflow channel used for communicating the second airflow ports with the telescopic return pipe is formed in the top plate; the device further comprises a circuit board, wherein a panel on one side of the circuit board is provided with a plurality of mounting grooves for placing chips to be tested, and the mounting grooves are matched with the second airflow port; an air hole is formed in the bottom wall of the mounting groove; a butt joint port matched with the first air flow port is arranged on the other surface of the circuit board at a position corresponding to the position of the mounting groove; the circuit board is welded with connecting lines and test boards required by testing in advance, or is welded with connecting lines and grooves for accommodating the test boards in advance; the temperature control device is used for providing air flow meeting the test temperature of the chip to be tested, and the air flow provided by the temperature control device can be sent into the mounting groove through the first air flow port and the air hole in sequence.
Based on the first aspect, in some embodiments of the present application, the device includes a plurality of circuit boards stacked in layers, and the interface of the upper circuit board in the adjacent layer circuit board is adapted to be clamped with the mounting slot of the lower circuit board.
Based on the first aspect, in some embodiments of the present application, the mounting groove is adapted to the chip to be tested, and is circular or rectangular.
Based on the first aspect, in some embodiments of the application, the interface and the slot bottom wall and side walls of the mounting slot are each made of an insulating material.
Based on the first aspect, in some embodiments of the application, the interface and the slot bottom and side walls of the mounting slot are each made of a transparent material.
Based on the first aspect, in some embodiments of the present application, the temperature control device is configured to simultaneously provide air flows of at least three temperature segments, and air flows of different temperature segments are respectively discharged from different first air flow ports; at least three airflow channels which are not communicated with each other are formed in the top plate, and each airflow channel is respectively communicated with the telescopic reflux pipe and used for respectively conveying airflows with different temperature sections into the telescopic reflux pipe.
Based on the first aspect, in some embodiments of the application, the temperature control device includes: a first temperature sensor for monitoring the temperature of the airflow output by the first airflow port; a second temperature sensor for monitoring the temperature of the gas flow flowing into the second gas flow port; the actuating mechanism is used for providing air flow meeting the test temperature of the chip to be tested; and the controller is used for acquiring the temperature values fed back by the first temperature sensor and the second temperature sensor and controlling the actuating mechanism to provide air flow meeting the test temperature of the chip to be tested based on the fed back temperature values.
Based on the first aspect, in some embodiments of the application, the temperature control device further includes: the touch control display screen is connected with the controller and used for acquiring user instructions and displaying temperature values acquired by the controller.
In a second aspect, the present application provides a method for testing high and low temperature reliability of a chip, which is applicable to the above-mentioned device for testing high and low temperature reliability of a chip, and the method includes: embedding chips to be tested into the mounting grooves of the circuit board in a one-to-one correspondence manner; stacking and installing the circuit boards embedded with the chips to be tested between the temperature control device and the top plate, and adjusting the height of the lifting rod to enable the butt joint opening of the circuit board at the bottommost layer to be clamped with the first air flow port of the temperature control device (1) and the mounting groove of the circuit board at the topmost layer to be clamped with the second air flow port of the top plate (2); and starting the temperature control device to provide air flow meeting the test temperature of the chip to be tested, enabling the air flow provided by the temperature control device (1) to pass through the first air flow port and the air holes of each layer of circuit board from bottom to top, enabling the air flow to enter an air flow channel in the top plate from the second air flow port of the top plate (2), and enabling the air flow to return into the temperature control device from the telescopic return pipe through the air flow channel.
Based on the second aspect, in some embodiments of the present application, at least three airflow channels which are not communicated with each other are arranged inside the top plate, and each airflow channel is respectively communicated with the telescopic reflux tube; the test method further comprises the following steps: dividing the second air flow ports leading to the same air flow channel into the same group, and dividing the mounting grooves connected with the same group of second air flow ports into the same group; and the temperature control device respectively provides air flows with different temperature sections for the mounting grooves of different groups.
The application has at least the following beneficial effects:
1) According to the application, the mounting groove of the chip to be tested is arranged on the circuit board, so that an independent temperature test environment is created for the chip to be tested, and the connecting circuit and the test board card required by test are welded on the mounting board in advance, thereby smartly isolating the test board card and the chip to be tested. Therefore, the test board card can be ensured to work in a room temperature environment, the same severe temperature environment as the tested chip is avoided, the aging process of the test board card is slowed down, and the service life is prolonged;
2) In the application, the single circuit board can support a plurality of test stations, and can finish a large quantity of temperature reliability tests in a mode of stacking the circuit boards up and down, and compared with the prior art, the application has the advantages of high efficiency, energy saving and easy operation.
Additional features and advantages of embodiments of the application will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain, without limitation, the embodiments of the application. In the drawings:
fig. 1 schematically shows a schematic structural diagram of a chip high-low temperature reliability test apparatus according to an embodiment of the present application;
FIG. 2 schematically illustrates a top view of a circuit board according to an embodiment of the application;
FIG. 3 schematically illustrates a side view of a circuit board according to an embodiment of the present application;
fig. 4 schematically shows a schematic diagram of an airflow circuit in an apparatus for performing high-low temperature reliability test by using the apparatus provided by the embodiment of the present application.
Description of the reference numerals
1-a temperature control device; 2-top plate; 3-lifting rods; 4-telescoping return pipe; 5-a circuit board; 51-mounting slots; 511-air holes; 52-interfacing; 53-test the board card; and 6-a touch display screen.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it should be understood that the detailed description described herein is merely for illustrating and explaining the embodiments of the present application, and is not intended to limit the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that, if directional indications (such as up, down, left, right, front, rear, etc.) are involved in the embodiment of the present application, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.
Example 1
The embodiment provides a chip high-low temperature reliability test device, as shown in fig. 1, the device comprises a temperature control device 1, a top plate 2, a lifting rod 3 and a telescopic return pipe 4, wherein the lifting rod 3 and the telescopic return pipe 4 are connected between the top plate 2 and the temperature control device 1, and the lifting rod 3 can drive the top plate 2 to be close to or far away from the temperature control device 1; a plurality of first air flow ports are formed in one surface of the temperature control device 1 facing the top plate 2; a plurality of second airflow ports are formed in one surface of the top plate 2 facing the temperature control device 1, and an airflow channel for communicating the second airflow ports with the telescopic return pipe 4 is formed in the top plate 2; the device further comprises a circuit board 5, wherein a panel on one side of the circuit board 5 is provided with a plurality of mounting grooves 51 for placing chips to be tested, and the mounting grooves 51 are matched with the second air flow openings; an air hole 511 is formed in the bottom wall of the mounting groove 51; a butt joint 52 matched with the first air flow port is arranged on the other surface of the circuit board 5 corresponding to the position of the mounting groove 51; the circuit board 5 is welded with connecting lines and a test board card 53 in advance for completing the test, or the circuit board 5 is welded with connecting lines and a groove for accommodating the test board card 53 in advance for completing the test; the temperature control device 1 is configured to provide an air flow that meets the testing temperature of the chip to be tested, and the air flow is sent to the mounting groove 51 through the first air flow port and the air hole 511 in sequence, so as to create a temperature environment required for testing the chip to be tested.
Illustratively, the first and second vents may be configured as vents similar to the bottom of the mounting slot 51.
Wherein, a single circuit board 5 can be placed between the top plate 2 and the temperature control device 1, and a plurality of circuit boards 5 can be stacked (in order to ensure the temperature control effect, the number needs to be controlled within a certain range, the number can not be infinitely increased, the maximum number of the circuit boards 5 is limited by the length of the lifting rod 3), and the specific number can be determined according to the number of chips to be tested.
For example, for the monolithic circuit board 5, the structure thereof can be shown with reference to fig. 2 and 3. Since the chip is generally square or circular (wafer), the mounting groove 51 should be adapted to the shape of the chip to be tested, so as to ensure that the chip to be tested can be reliably connected to the test board 53 through the connection circuit. Correspondingly, if the test board 53 is not directly soldered on the circuit board 5, the groove can be arranged on the circuit board 5 to accommodate the board, and the same groove should be adapted to the test board 53, so as to ensure the reliability of connection.
In addition, the chips to be tested are required to be in one-to-one correspondence with the mounting grooves 51. If the number of chips to be tested is small, the requirement can be met only by the single-chip circuit board. The specific installation process is as follows: firstly, chips to be tested are embedded into the mounting grooves 51 of the circuit board 5 in a one-to-one correspondence manner, then the circuit board 5 is mounted between the temperature control device 1 and the top plate 2, the height of the lifting rod 3 is adjusted, the (bottom) butt joint opening 52 of the circuit board 5 is clamped with the first air flow opening, the (top) mounting groove 51 of the circuit board 5 is clamped with the second air flow opening, and a relatively closed area is formed between the mounting groove 51 and the second air flow opening. Through mounting groove 51 and second air flow mouth joint, can guarantee that the air current of settlement temperature value upwards circulates all the time can not produce the excessive, so can guarantee to provide suitable test environment for the chip that awaits measuring also can separate the chip that awaits measuring and test integrated circuit board 53, avoid test integrated circuit board 53 to experience abominable temperature test environment, prolonged test integrated circuit board 53's life, can satisfy simultaneously that the test is required in batches.
For the situation that the number of chips to be tested is large, multiple circuit boards 5 are needed, as shown in fig. 1, the circuit boards 5 embedded with the chips to be tested are stacked and installed between the temperature control device 1 and the top plate 2, and the height of the lifting rod 3 is adjusted, so that the butt joint opening 52 of the circuit board 5 at the bottommost layer is clamped with the first air flow port, and the mounting groove 51 of the circuit board 5 at the topmost layer is clamped with the second air flow port. Wherein, the butt joint 52 of the upper circuit board in the adjacent layer circuit board is in fit and clamping connection with the mounting groove 51 of the lower circuit board. That is, the mounting grooves 51 on the other layers of circuit boards except the top layer of circuit board are all in fit and clamping connection with the butt joint openings 52 of the upper layer of circuit board. Similarly, a relatively closed area is formed between the mounting slot 51 and the interface 52 of the upper circuit board, so that a suitable testing environment is provided for the chip to be tested, and the chip to be tested can be separated from the test board 53.
After the circuit board 5 is installed, the temperature control device 1 is started, and the temperature control device 1 provides air flow meeting the test temperature of the chip to be tested; the air flow enters the mounting groove 51 from bottom to top through the air holes 511 of each layer of circuit board 5 through the first air flow port, and creates a temperature environment required by test for the chip to be tested; and then continues to enter the air flow channel in the top plate 2 from the second air flow port upwards, and returns into the temperature control device 1 from the telescopic return pipe 4 through the air flow channel, as shown in fig. 4, wherein the arrow in the figure indicates the flow direction of the air flow.
Example 2
On the basis of embodiment 1, the temperature control device 1 in this embodiment may also be used to simultaneously provide at least three temperature sections of air flows, where the air flows in different temperature sections are respectively discharged from different first air flow ports; at least three airflow channels which are not communicated with each other are arranged in the top plate 2, and each airflow channel is respectively communicated with the telescopic return pipe 4 and used for respectively conveying airflows with different temperature sections into the telescopic return pipe 4.
Thus, the first airflow port, the second airflow port or the mounting groove 51 respectively communicated with different airflow channels can be divided into three groups to respectively form three independent airflow loops, so that hardware support is provided for simultaneously performing three-temperature tests.
Example 3
Further, in order to avoid potential safety hazards such as leakage and short circuit, the interface 52, the bottom wall and the side wall of the mounting groove 51 are all made of insulating materials. Wherein the counter interface 52 is integrally connectable with the mounting slot 51 for mounting and securing.
Further, the butt joint 52, the bottom wall and the side wall of the mounting groove 51 are made of transparent materials. So that it is convenient to observe whether the chip to be tested is placed in each mounting groove 51 and whether the chip to be tested is placed in each mounting groove.
Materials satisfying both conditions include glass, crystal, transparent plastic, etc. It should be noted that the selected materials also need to have high and low temperature resistance, and will not deform or melt during the test.
Example 4
Specifically, in this embodiment, the temperature control device 1 specifically includes:
a first temperature sensor for monitoring the temperature of the airflow output by the first airflow port;
a second temperature sensor for monitoring the temperature of the gas flow flowing into the second gas flow port;
in this embodiment, it can be understood that a first temperature sensor is installed near any one of the first airflow ports; a second temperature sensor is arranged near any second airflow port.
The actuating mechanism is used for providing air flow meeting the test temperature of the chip to be tested; for heating or cooling air.
And the controller is used for acquiring the temperature values fed back by the first temperature sensor and the second temperature sensor, and controlling the actuating mechanism to provide air flow meeting the test temperature of the chip to be tested for the corresponding mounting groove 51 based on the fed back temperature values.
The first temperature sensor and the second temperature sensor here detect the air flow flowing out from the same first air flow port. The controller acquires a first temperature value fed back by the first temperature sensor and a second temperature value fed back by the second temperature sensor; the temperature value control actuating mechanism based on feedback provides the air current that satisfies the chip test temperature that awaits measuring, specifically can be: calculating an average value of the first temperature value and the second temperature value; and controlling the execution mechanism to execute corresponding actions based on the difference value between the average value and the set temperature range value (the set temperature value), so that the execution mechanism can provide air flow meeting the test temperature (closer to the set temperature value) of the chip to be tested. The actuator can be realized by changing the flow speed of the air flow or heating and refrigerating (air) the air flow in the process of adjusting the temperature.
Further, for more convenience of man-machine interaction, the temperature control device 1 further includes a touch display screen 6, where the touch display screen 6 is connected to the controller, and is configured to obtain a user instruction (which may be input by a user through the touch display screen 6) and display data obtained by the controller (for example, data detected by the first temperature sensor and the second temperature sensor). The existence of the touch display screen 6 can realize data visualization, and the man-machine interaction is simpler and more convenient.
Example 5
In this embodiment, a method for testing high and low temperature reliability of a chip is provided, which is applicable to the device for testing high and low temperature reliability of a chip described in embodiment 1, and the method includes:
a1, the chips are embedded in the mounting grooves 51 of the circuit board 5 in a one-to-one correspondence manner;
a2, stacking and installing the circuit boards 5 embedded with the chips to be tested between the temperature control device 1 and the top plate 2, and adjusting the height of the lifting rod 3 to enable the butt joint opening 52 of the circuit board 5 at the bottommost layer to be clamped with the first air flow port and the installation groove 51 of the circuit board 5 at the topmost layer to be clamped with the second air flow port;
if the circuit board 5 is monolithic, the bottommost circuit board 5 is also the topmost circuit board 5.
A3, starting the temperature control device 1 to provide air flow meeting the test temperature of the chip to be tested, wherein the air flow passes through the first air flow port and passes through the air holes 511 of each layer of circuit board 5 from bottom to top, then enters the air flow channel in the top plate 2 from the second air flow port, and returns into the temperature control device 1 from the telescopic return pipe 4 through the air flow channel.
Example 6
In this embodiment, a method for testing high and low temperature reliability of a chip is provided, which is applicable to the device for testing high and low temperature reliability of a chip described in embodiment 2, and the method includes:
the test environment of a plurality of temperature sections is built by using the high-low temperature reliability test equipment of the chip, and the specific steps are as follows:
b1, dividing the second air flow ports leading to the same air flow channel into the same group, dividing the mounting grooves 51 connected with the same group of second air flow ports into the same group, and equally, dividing the first air flow ports connected with the same group of second air flow ports into the same group, wherein if the air flow channels are three in total, the air flow channels can be divided into three groups in total.
B2, the temperature control device 1 provides air flows with different temperature sections for the mounting grooves 51 of different groups respectively.
For example, if a three temperature test (high, medium, and low) is performed, three groups are provided with three temperature values of (air) flow, respectively.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises an element.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (10)
1. A chip high and low temperature reliability test apparatus, the apparatus comprising: the temperature control device (1), the top plate (2) and the lifting rod (3) and the telescopic return pipe (4) which are connected between the top plate (2) and the temperature control device (1), wherein the lifting rod (3) can drive the top plate (2) to be close to or far away from the temperature control device (1);
one surface of the temperature control device (1) facing the top plate (2) is provided with a plurality of first air flow ports;
a plurality of second air flow ports are formed in one surface of the top plate (2) facing the temperature control device (1), and an air flow channel used for communicating the second air flow ports with the telescopic return pipe (4) is formed in the top plate (2);
the device further comprises a circuit board (5), wherein a panel on one side of the circuit board (5) is provided with a plurality of mounting grooves (51) for placing chips to be tested, and the mounting grooves (51) are matched with the second air flow port; an air hole (511) is formed in the bottom wall of the mounting groove (51); a butt joint (52) matched with the first air flow port is arranged on the other surface of the circuit board (5) at a position corresponding to the position of the mounting groove (51);
the circuit board (5) is welded with connecting lines required by testing and a test board card (53) in advance, or is welded with connecting lines required by testing and grooves for accommodating the test board card (53) in advance;
the temperature control device (1) is used for providing air flow meeting the test temperature of the chip to be tested, and the air flow provided by the temperature control device (1) can be sequentially sent into the mounting groove (51) through the first air flow port and the air hole (511).
2. The chip high and low temperature reliability test apparatus according to claim 1, wherein the apparatus comprises a plurality of circuit boards (5), the plurality of circuit boards (5) being stacked one on top of the other;
in the adjacent layer circuit board (5), the butt joint (52) of the upper layer circuit board (5) is in fit and clamping connection with the mounting groove (51) of the lower layer circuit board (5).
3. The chip high and low temperature reliability test apparatus according to claim 1, wherein the mounting groove (51) is adapted to the chip to be tested, and is circular or rectangular.
4. The chip high and low temperature reliability test apparatus according to claim 1, wherein the butt joint (52) and the bottom wall and side wall of the mounting groove (51) are made of insulating materials.
5. The chip high and low temperature reliability test apparatus according to claim 1, wherein the butt joint (52) and the bottom wall and side wall of the mounting groove (51) are made of transparent materials.
6. The chip high-low temperature reliability test device according to claim 1, wherein the temperature control device (1) is used for simultaneously providing air flows of at least three temperature sections, and the air flows of different temperature sections are respectively discharged by different first air flow ports;
at least three non-communicated air flow channels are formed in the top plate (2), and each air flow channel is respectively communicated with the telescopic return pipe (4) and used for respectively conveying air flows of different temperature sections into the telescopic return pipe (4).
7. Chip high and low temperature reliability test equipment according to claim 1, characterized in that the temperature control device (1) comprises:
a first temperature sensor for monitoring the temperature of the airflow output by the first airflow port;
a second temperature sensor for monitoring the temperature of the gas flow flowing into the second gas flow port;
the actuating mechanism is used for providing air flow meeting the test temperature of the chip to be tested;
and the controller is used for acquiring the temperature values fed back by the first temperature sensor and the second temperature sensor and controlling the actuating mechanism to provide air flow meeting the test temperature of the chip to be tested based on the fed back temperature values.
8. The chip high and low temperature reliability test apparatus according to claim 7, wherein the temperature control device (1) further comprises:
and the touch control display screen (6) is connected with the controller and used for acquiring a user instruction and displaying the temperature value acquired by the controller.
9. A method for testing high and low temperature reliability of a chip, which is applicable to the device for testing high and low temperature reliability of a chip according to claim 2, the method comprising:
embedding chips to be tested into the mounting grooves (51) of the circuit board (5) in a one-to-one correspondence manner;
stacking and installing the circuit boards (5) embedded with the chips to be tested between the temperature control device (1) and the top plate (2), and adjusting the height of the lifting rod (3) to enable the butt joint opening (52) of the bottommost circuit board (5) to be clamped with the first air flow port of the temperature control device (1) and the mounting groove (51) of the topmost circuit board (5) to be clamped with the second air flow port of the top plate (2);
and starting the temperature control device (1) to provide air flow meeting the test temperature of the chip to be tested, enabling the air flow provided by the temperature control device (1) to pass through air holes (511) of each layer of circuit board (5) from bottom to top, enabling the air flow to enter an air flow channel in the top plate (2) from a second air flow port of the top plate (2), and returning the air flow to the temperature control device (1) from the telescopic return pipe (4) through the air flow channel.
10. The method for testing the high-low temperature reliability of the chip according to claim 9, wherein at least three non-communicated air flow channels are formed in the top plate (2), and each air flow channel is respectively communicated with the telescopic return pipe (4); the test method further comprises the following steps:
dividing the second air flow openings leading to the same air flow channel into the same group, and dividing the mounting grooves (51) connected with the same group of second air flow openings into the same group;
the temperature control device (1) respectively provides air flows with different temperature sections for different groups of mounting grooves (51).
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