CN219121590U - Auxiliary testing tool for electronic device and server testing system - Google Patents

Abstract

The embodiment of the application discloses an auxiliary testing tool for an electronic device and a server testing system, wherein the auxiliary testing tool is used for testing the electronic device in a server, and the electronic device can be a device which is sensitive to temperature, such as a memory bank. The auxiliary testing tool comprises a shell and a heating assembly, wherein the shell is provided with an inner cavity, the heating assembly comprises a heating device, a connecting cable and a connecting joint, the heating device is located in the inner cavity, and the heating device is connected with the connecting joint through the connecting cable. During specific testing, the shell can be configured in the server, and the electronic device can be covered in the inner cavity so as to provide a testing environment for the electronic device; the server is internally provided with a connecting interface, and the connecting joint is used for being connected with the connecting interface. The auxiliary testing tool is provided with the heating device, so that the problem of insufficient self-heating of the electronic device can be solved, the auxiliary testing tool can work under the power support and control of the inside of the server, and the structure can be simplified.

Description

Auxiliary testing tool for electronic device and server testing system

Technical Field

The embodiment of the application relates to the technical field of testing, in particular to an auxiliary testing tool for an electronic device and a server testing system.

Background

In the current server test system, temperature test is required to be performed on electronic devices in the form of memory banks and the like, so as to detect the performance of the memory banks under different temperature conditions. In the related art, temperature testing of electronic devices mainly relies on self-heating of the electronic devices, but the self-heating of the electronic devices is very limited, and it is often difficult to achieve the required testing conditions.

Therefore, how to provide a solution to overcome or alleviate the above-mentioned drawbacks is still a technical problem to be solved by those skilled in the art.

Disclosure of Invention

The embodiment of the application provides an auxiliary testing tool for an electronic device and a server testing system, wherein the auxiliary testing tool is provided with a heating device, can overcome the problem of insufficient self-heating of the electronic device, can work under the power support and control of the inside of a server, and can simplify the structure.

In a first aspect, an embodiment of the present application provides an auxiliary testing tool for an electronic device, where the auxiliary testing tool is used for testing an electronic device in a server, and the electronic device may specifically be a device that is relatively sensitive to temperature, such as a memory bank. The auxiliary testing tool comprises a shell and a heating assembly, wherein the shell is provided with an inner cavity, the heating assembly comprises a heating device, a connecting cable and a connecting joint, the heating device is located in the inner cavity, and the heating device is connected with the connecting joint through the connecting cable. During specific testing, the shell can be configured in the server, and the electronic device can be covered in the inner cavity so as to provide a testing environment for the electronic device; the server is internally provided with a connecting interface, and the connecting joint is used for being connected with the connecting interface.

In this application embodiment, heating device can heat the inside of inner chamber, can provide required ambient temperature for the test of memory strip, can overcome the problem that the heat is not enough when memory strip spontaneous heating better to accomplish the temperature test of memory strip better.

In particular, the auxiliary testing tool does not need an external power supply, but is connected with the existing connection interface of the server through the connection joint so as to directly acquire power support from the power supply inside the server, so that the integrity of the server is not damaged after the auxiliary testing tool is assembled, the accuracy of a measuring result is ensured, and the structure of the auxiliary testing tool is simplified. Meanwhile, the start-stop control, the power control and the like of the heating device can be completed by the server, so that additional temperature control components such as a singlechip and the like can be omitted.

The structural form of the connection joint is matched with a connection interface in the server, and the connection interface can be a SYSFAN interface and the like.

Based on the first aspect, the present application embodiment further provides a first implementation manner of the first aspect: the auxiliary test tool further comprises a mounting column which can be fixedly mounted on the shell, and the connecting joint is configured on the mounting column. Therefore, the connecting joint and the mounting column can be integrally arranged, and the mounting column is of a rigid structure, so that the mounting column can play a role of fixing an auxiliary test tool when being assembled on the connecting interface through the connecting joint in a plugging manner; that is, the connection of the connection joint and the connection interface not only can realize the electric connection of the heating device and the server, but also can realize the physical assembly between the auxiliary test tool and the main board, and the auxiliary test tool can not be provided with other mounting structures, so that the structural complexity of the auxiliary test tool provided by the embodiment of the application can be further reduced, and the cost is further reduced.

Based on the first implementation manner of the first aspect, the present application further provides a second implementation manner of the first aspect: the mounting column has internal passageway, and internal passageway is used for setting up the connecting cable to reduce the exposing of connecting cable, and then can form the protection to the connecting cable.

Based on the first aspect, or based on the first implementation manner or the second implementation manner of the first aspect, the present application example further provides a third implementation manner of the first aspect: the server is provided with a plurality of installation seats which are spaced apart, and each installation seat is provided with an electronic device; the shell comprises a plurality of sub-shells, the number of the sub-shells is consistent with that of the mounting seats, the sub-shells are respectively provided with an inner cavity, and in an assembled state, the electronic devices of the mounting seats are arranged in the inner cavities of the sub-shells in a one-to-one correspondence manner.

By means of the arrangement, the auxiliary testing tool provided by the embodiment of the application can perform temperature testing on all electronic devices to be tested in the server at one time, and the testing efficiency is high; and because of the arrangement of each sub-shell, each electronic device in the server is heated for the partition, the temperature of the electronic devices at different positions can be ensured to be consistent to the greatest extent, meanwhile, the electronic device to be tested and other electronic devices in the server can be isolated, and the influence of the heating device on the normal operation of other electronic devices in the server can be avoided to a great extent.

Based on the third implementation manner of the first aspect, the present embodiment further provides a fourth implementation manner of the first aspect: each mount pad sets up along first direction interval, and each minute shell sets up along first direction interval, forms the first wind channel that extends along the second direction between the adjacent two minute shells, and the cooling air can flow in first wind channel, can reduce the radiating influence to other electronic components in the server.

Based on the fourth implementation manner of the first aspect, the present embodiment further provides a fifth implementation manner of the first aspect: the casing includes the base plate, divides the shell to include cavity portion and connecting portion, and cavity portion is formed with the inner chamber, and cavity portion passes through connecting portion and base plate and links to each other, is formed with the second wind channel that extends along the second direction between cavity portion and the base plate, and the cooling wind can flow in the second wind channel, can reduce the radiating influence to other electronic device in the server.

Based on the fifth implementation manner of the first aspect, the present embodiment further provides a sixth implementation manner of the first aspect: the auxiliary testing tool also comprises a first air guide component, wherein the first air guide component is arranged on the shell and used for guiding air flow into the second air channel so as to ensure that cooling air can relatively smoothly enter the second air channel; and/or, the auxiliary testing tool may further include a second air guiding component, where the second air guiding component is installed on the housing, and is configured to guide the air flow out of the second air duct along the set direction, so as to guide the cooling air flowing out of the second air duct, thereby better implementing effective heat dissipation at the designated area.

Based on the fifth implementation manner of the first aspect, the present embodiment further provides a seventh implementation manner of the first aspect: the cavity forming part is provided with a first ventilation and heat dissipation opening, and the first ventilation and heat dissipation opening is communicated with the inner cavity and the outer space of the cavity forming part. In this way, when the temperature in the inner cavity is too high, heat can be timely dissipated through the first ventilation and heat dissipation port.

In a second aspect, embodiments of the present application further provide a server test system, including a server and the auxiliary test tool of the electronic device according to the first aspect or any of the embodiments of the first aspect. The server is configured with an electronic device to be tested, and the electronic device is internally provided with a temperature sensing component for detecting the temperature of the electronic device. The housing of the auxiliary test tool may be assembled to the server and is capable of housing the electronics within the interior cavity.

The server test system directly detects the electronic device to be tested on the server, can better restore the actual use condition of the electronic device to be tested, and has more accurate and referential test results. In addition, in the above scheme, a temperature sensing component can be integrated in the electronic device, and the temperature sensing component can detect the temperature of the electronic device in real time; therefore, when the temperature test is carried out on the electronic device, the auxiliary test tool does not need to be additionally provided with a temperature sensor, and the structural form of the auxiliary test tool can be relatively simple.

Based on the second aspect, the present embodiments also provide a first implementation manner of the second aspect: the electronic device is a memory bank, a hard disk, a processor and the like.

Drawings

FIG. 1 is a schematic diagram of a server;

FIG. 2 is a schematic diagram of an embodiment of an auxiliary testing tool for electronic devices according to the embodiments of the present application;

FIG. 3 is a cross-sectional view taken along the direction A-A of FIG. 2;

FIG. 4 is an enlarged view of a portion of FIG. 3;

FIG. 5 is a cross-sectional view of FIG. 2 in the direction B-B;

fig. 6 is a schematic structural diagram of fig. 2 at another view angle.

The reference numerals are explained as follows:

100 servers, 101 installation seats, 102 memory strips, 103 connection interfaces, 104 fans, 105 intermediate devices, 106 rear devices, 107 mainboards and 108 shells;

200 auxiliary test tools, 210 shells, 211 split shells, 211a cavity forming parts, 211a-1 first side plates, 211a-2 second side plates, 211a-2a first ventilation and heat dissipation openings, 211a-3 partition plates, 211a-4 inner cavities, 211a-4a openings, 211b connecting parts, 211b-1 first connecting plates, 211c second air channels, 212 first air channels, 213 substrates, 216 second connecting plates, 220 heating components, 221 heating devices, 222 connecting cables, 223 connecting joints, 230 mounting columns, 231 inner channels, 240 first air guide parts, 241 second air guide heat dissipation openings, 250 second air guide parts, 251 upper air guide plates and 252 lower air guide plates.

Detailed Description

In order to make the technical solution of the present application better understood by those skilled in the art, the present application will be further described in detail with reference to the accompanying drawings and specific embodiments.

In the present embodiments, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium.

In the description of the embodiments of the present application, the term "plurality" refers to a plurality of indefinite numbers, typically two or more; also, where the use of "a number" refers to the number of a certain number of elements, it does not necessarily mean that there is an equal relationship between the numbers of elements, unless specifically indicated.

In the description of embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

The embodiment of the application provides a server test system, which is used for detecting the temperature of an electronic device in a server, and particularly, a specific temperature condition is built for detecting the electronic device so as to realize early screening and the like of the electronic device. Therefore, the failure rate of the electronic device in the server in the subsequent use process can be effectively reduced, and the yield of the server can be further improved, so that the satisfaction degree of users is improved.

The electronic device may be a device that is relatively sensitive to temperature, such as a memory bank, a hard disk, a processor, etc. For convenience of description, the following embodiments of the present application use an electronic device as a memory bank as an example.

The server test system comprises a server to be tested (hereinafter referred to as a server), an auxiliary test tool and related detection components. The server is internally provided with a memory bar to be tested (hereinafter referred to as a memory bar), and the auxiliary testing tool can be assembled inside the server and can be covered on the memory bar. The auxiliary test tool can generate heat to provide a set ambient temperature for the memory bank. The detecting component may be coupled to the memory bank for detecting performance of the memory bank. The test scheme is to directly detect in the server, so that the actual use condition of the memory bank can be better restored, and the obtained test result is more accurate and has more references.

Here, the embodiment of the present application is not limited to a specific kind of the detection component, and in practical application, a person skilled in the art may determine the detection component in combination with a specific test requirement, so long as the detection component can meet the requirement of use. The detection means may be, for example, a processor of a server or the like.

In order to better understand the technical solutions of the embodiments of the present application, the following embodiments of the present application will respectively describe structures of the server and the auxiliary test tool.

Referring to fig. 1, fig. 1 is a schematic diagram of a server.

As shown in fig. 1, the server 100 may include a housing 108, and a mounting cavity may be formed in the housing 108, and a main board 107 may be disposed in the mounting cavity. The motherboard 107 may specifically be a printed circuit board (Printed Circuit Board, PCB) or the like, on which the mount 101, the memory bank 102, the connection interface 103, the fan 104, the intermediate device 105, the rear device 106, or the like may be disposed.

The mounting base 101 may be provided with a slot (not shown in the figure), and the memory bank 102 may be inserted and fixed in the slot, so as to be used for implementing the mounting of the memory bank 102 on the motherboard 107. A temperature sensing component may be integrated within the memory bank 102, which may detect the temperature of the memory bank 102 in real time. In this way, when the temperature test is performed on the memory bank 102, the auxiliary test tool does not need to be additionally provided with a temperature sensor, and the structure of the auxiliary test tool can be relatively simple.

The number and the mounting positions of the mounting seats 101 are not limited, and in practical applications, those skilled in the art may adjust the number and the mounting positions according to actual needs, so long as the number and the mounting positions can meet the use requirements. In addition, the number of slots provided by one mounting seat 101 is not limited, and in practical application, only one slot may be provided by one mounting seat 101, or a plurality of slots may be provided, which specifically needs to be determined in combination with practical use requirements.

In the solution of the drawings, the number of the mounting seats 101 may be three, and the three mounting seats 101 may be arranged at intervals in the first direction. In this way, in the second direction, each mounting seat 101 may be in the same row, and an air duct extending along the second direction may be formed between two adjacent mounting seats 101, so that the mounting arrangement of devices such as the fan 104 on the main board 107 can be facilitated.

The fan 104 may be located on one side of the mount 101. In the azimuth and positional relationship shown in fig. 1, the second direction is the left-right direction, and the fan 104 may be located on the right side of the mount 101. The fan 104 may generate cooling air, and the flow path of the cooling air may be from right to left, and the cooling air may flow in the aforementioned air duct and on a side of the mounting base 101 away from the main board 107, so as to perform heat dissipation treatment on the memory bank 102 mounted on the mounting base 101. The fan 104 may be specifically connected to the connection interface 103 to obtain power support, and by adjusting the current, the start and stop of the fan 104, the power, and the like may be controlled.

The intermediate member 105 may be positioned between two adjacent mounts 101. The embodiment of the present application is not limited to the type of the intermediate member 105, and in practical applications, those skilled in the art may configure the intermediate member according to actual needs, so long as the intermediate member can meet the requirements of use. Illustratively, the intermediate component 105 may be a processor, the core in which may be, for example, a central processing unit (Central Processing unit, CPU), and may be other specific integrated circuits (Application Specific Integrated Circuit, ASIC); the processor may also be other general purpose processors, digital signal processors (digital signal processing, DSP), application specific integrated circuits (application specific integrated circuit, ASIC), field programmable gate arrays (field programmable gate array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like.

The rear member 106 is located on a side of the mount 101 facing away from the fan 104, that is, on a downstream side of the mount 101 in the flow path of the cooling air. Here, the embodiment of the present application is not limited to the type of the rear member 106, and in practical applications, those skilled in the art may perform configuration according to actual needs, as long as the requirements of use can be satisfied. By way of example, the rear component 106 may be a power source, connector, chiplet, or the like.

Referring to fig. 2-6, fig. 2 is a schematic structural diagram of an auxiliary testing tool for an electronic device according to an embodiment of the present application, fig. 3 is a cross-sectional view of fig. 2 in a direction A-A, fig. 4 is a partial enlarged view of fig. 3, fig. 5 is a cross-sectional view of fig. 2 in a direction B-B, and fig. 6 is a schematic structural diagram of fig. 2 in another view.

As shown in fig. 2, 3, 5 and 6, the embodiment of the present application further provides an auxiliary testing tool 200 for electronic devices, including a housing 210 and a heating assembly 220. Wherein the housing 210 has an inner cavity 211a-4, the inner cavity 211a-4 is an open cavity, which may be provided with an opening 211a-4a, and in the embodiment of fig. 3, the opening 211a-4a may be provided at a lower end of the inner cavity 211a-4; heating assembly 220 includes heating device 221, connection cable 222, and connection joint 223, heating device 221 is located in internal cavity 211a-4, and heating device 221 may be connected by connection cable 222 and connection joint 223.

When the temperature of the memory bank 102 is tested, the housing 210 may be assembled in the server 100, and the memory bank 102 may be covered in the inner cavity 211a-4, and the opening 211a-4a of the inner cavity 211a-4 may be plugged by the main board 107, so as to create a relatively closed heating space for the memory bank 102. The connection connector 223 may be used to connect with the connection interface 103, and may specifically be plugged into the connection interface 103.

By adopting the above scheme, the heating device 221 can heat the interior of the inner cavity 211a-4, can provide the required ambient temperature for the test of the memory bank 102, and can better overcome the problem of insufficient heat when the memory bank 102 generates self heat so as to better complete the temperature test of the memory bank 102. In particular, the auxiliary testing tool 200 does not need an external power supply, but is connected to the existing connection interface 103 of the motherboard 107 through the connection connector 223 to directly obtain power support from the power supply inside the server 100, so that the integrity of the server 100 is not damaged by the auxiliary testing tool 200 after the assembly is completed, which is more beneficial to ensuring the accuracy of the measurement result, and is also beneficial to simplifying the structure of the auxiliary testing tool 200. Meanwhile, the start-stop control, the power control and the like of the heating device 221 can be completed by the server 100, so that additional temperature control components such as a singlechip can be omitted, the structure of the auxiliary test tool 200 provided by the embodiment of the application can be simpler, and the cost can be lower.

Here, the embodiment of the present application is not limited to the specific type of the heating device 221, and in practical application, a person skilled in the art may set the heating device according to specific needs, so long as the heating device can meet the requirements of use. By way of example, the heating device 221 may be a resistive wire, a silicone heating pad, or the like.

In addition, the embodiment of the present application is not limited to a specific mounting structure between the housing 210 and the server 100, and in practical applications, those skilled in the art may set the mounting structure as required, so long as the mounting structure can meet the use requirements. For example, the housing 210 may be connected to the server 100 using a relatively detachable connection such as a screw connection, a socket connection, a snap connection, etc., so that the auxiliary test tool 200 can be removed relatively easily after the test on the memory bank 102 is completed.

In some embodiments, as shown in fig. 5, the auxiliary test tool 200 may further include a mounting post 230, where the mounting post 230 may be fastened to the housing 210, and the specific fastening manner includes, but is not limited to, screw connection, welding, fusion, clamping, riveting, and so on; the mounting post 230 is a rigid structure, and the connection joint 223 may be disposed on the mounting post 230. So set up, the erection column 230 can peg graft and assemble in the connection interface 103 of mainboard 107 through the attach fitting 223, based on the rigidity setting of erection column 230, this kind of connected mode itself can play the effect of fixed auxiliary test instrument 200, that is to say, the connection of attach fitting 223 and connection interface 103, not only can realize the electricity of heating device 221 and mainboard 107 and connect, can also realize the physics assembly between auxiliary test instrument 200 and the mainboard 107, auxiliary test instrument 200 can no longer set up other mounting structure, can further reduce the structural complexity of auxiliary test instrument 200 that this application embodiment provided, and then reduce cost.

The mounting position of the connection joint 223 on the mounting post 230 is not limited herein, and in practical applications, those skilled in the art may adjust the connection joint according to specific needs, so long as the connection joint can meet the use requirements. In the arrangement of fig. 5, the connection joint 223 may be disposed coaxially with the mounting post 230 and may be located at the lower end of the mounting post 230. In addition, the connection joint 223 may be disposed non-coaxially with the mounting post 230, and in this case, the connection joint 223 may be disposed on the outer peripheral wall surface of the mounting post 230 and may be located at the lower end of the mounting post 230.

The mounting post 230 may also have an internal passage 231 inside, the internal passage 231 for providing the connection cable 222. Thus, the connection cable 222 is less exposed, which is beneficial to protecting the connection cable 222, and the structural cleanliness of the auxiliary testing tool 200 provided by the embodiment of the application can be improved, so that the auxiliary testing tool 200 can be transported and used conveniently.

It should be understood that the integrated arrangement of the mounting post 230, the connection connector 223, and the connection cable 222 is only an exemplary illustration of the embodiments of the present application, and is not intended to limit the scope of the implementation of the auxiliary test tool 200 provided by the embodiments of the present application. In other implementations of the embodiments of the present application, the mounting post 230, the connection joint 223 and the cable may be independent of each other, at this time, based on the flexible deformation characteristic of the connection cable 222, the mounting position of the connection joint 223 may be conveniently adjusted, and the mounting post 230 and the motherboard 107 (or other components in the server 100, such as the housing 108) may be connected by using a screw connection or the like; alternatively, the mounting post 230 may not be provided, and the housing 210 may be connected to the server 100 by other means.

As described above, the number of the mounting seats 101 may be several, and each mounting seat 101 may be disposed at intervals on the main board 107. Suitably, the housing 210 of the auxiliary testing tool 200 provided in the embodiment of the present application may also include a plurality of sub-housings 211, where the number of sub-housings 211 and the number of mounting seats 101 may be identical, and each sub-housing 211 may be formed with an inner cavity 211a-4; in the assembled state, the memory banks 102 assembled on the respective mounting bases 101 may be placed in the inner cavities 211a-4 of the respective sub-housings 211 in a one-to-one correspondence.

By the arrangement, the partition heating of each memory bank 102 can be realized, and the temperature consistency of the memory banks 102 at different positions can be ensured to the greatest extent; moreover, the memory bank 102 and other electronic devices in the server 100 can be isolated, so that the influence of the heating device 221 on the normal operation of other electronic devices in the server 100 can be avoided to a large extent; meanwhile, the one-to-one corresponding assembly relationship between each sub-shell 211 and each mounting seat 101 can also realize the one-time temperature test of all the memory strips 102 in the server 100, and is also beneficial to improving the test efficiency.

It should be understood that the number of sub-cases 211 may be smaller than that of the mounting base 101, and in this case, the synchronous test for each memory bank 102 may be implemented by configuring a plurality of auxiliary test tools 200; of course, the temperature test may be performed on each memory bank 102 in batches.

In a specific server 100, the mounting bases 101 are disposed at intervals in the first direction, so that the sub-cases 211 may be disposed at intervals in the first direction to cover the memory banks 102 on the mounting bases 101 at different positions. At this time, a first air duct 212 extending along the second direction may be formed between the adjacent two sub-cases 211, the first air duct 212 is used for avoiding the middle part 105, and the cooling air generated by the fan 104 may blow through the first air duct 212 to radiate heat from the middle part 105 and radiate heat from the rear part 106.

As shown in fig. 3 and 5, the case 210 may include a base plate 213, the sub-case 211 may include a cavity-forming portion 211a and a connection portion 211b, the cavity-forming portion 211a may be formed with the aforementioned inner cavity 211a-4, the cavity-forming portion 211a may be connected to the base plate 213 through the connection portion 211b, and a second air duct 211c extending in a second direction may be formed between the cavity-forming portion 211a and the base plate 213, and cooling air generated by the fan 104 may be blown from the second air duct 211c toward the rear member 106 to further enhance cooling and heat dissipation effects of the rear member 106.

Referring to fig. 3 to 5, in the solution of the drawings, the cavity-forming portion 211a may include two first side plates 211a-1, two second side plates 211a-2, and a partition 211a-3, the two first side plates 211a-1 may be spaced apart in a first direction, the two second side plates 211a-2 may be spaced apart in a second direction, the partition 211a-3 may be positioned at top ends of the first side plates 211a-1 and the second side plates 211a-2, such that the two first side plates 211a-1, the two second side plates 211a-2, and the partition 211a-3 may enclose the aforementioned cavity 211a-4, and the heating device 221 may be fixed to the partition 211a-3 in a specific fixing manner including, but not limited to, screw connection, clamping, bonding, welding, etc.; the connection portion 211b may include two first connection plates 211b-1, the two first connection plates 211b-1 may be disposed at intervals in the first direction, and in the same sub-housing 211, the two first connection plates 211b-1 may be respectively located above the two first side plates 211a-1 and may be connected to the base plate 213, so that the two first connection plates 211b-1, the base plate 213 and the partition plate 211a-3 may enclose to form the aforementioned second air duct 211c.

In practical application, the first side plate 211a-1 and the first connecting plate 211b-1 of the same sub-shell 211 can be in an integrated structure, so as to facilitate the processing and preparation of the sub-shell 211, and the partition plate 211a-3 and the integrated structure can be connected in a welding, fusing, integrated forming and other modes; in addition, the two first connection plates 211b-1 of the two adjacent sub-shells 211 can be connected through the second connection plate 216, so that structural connection between the sub-shells 211 can exist, the structural strength of the shell 210 can be improved, the second connection plate 216 can also be connected with the substrate 213, and specific connection modes can be welding, fusing, screw connection, riveting, clamping and the like.

It should be understood that the specific structural forms of the cavity forming portion 211a and the connecting portion 211b are not limited to the above description, and in practical application, the cavity forming portion 211a and the connecting portion 211b may take other structural forms as long as they can meet the requirements of use. For example, the connection portion 211b may further include only one first connection plate 211b-1, and the first connection plate 211b-1 may directly connect the spacer 211a-3 and the substrate 213.

In some alternative embodiments, the cavity-forming portion 211a may also be provided with a first ventilation and heat dissipation port 211a-2a to timely dissipate heat when the internal temperature of the cavity 211a-4 is too high. Referring to fig. 2-4 and fig. 6, the first ventilation and heat dissipation port 211a-2a may be disposed on the second side plate 211a-2, because the second side plate 211a-2 is located on the flow path of the cooling air, and the first ventilation and heat dissipation port 211a-2a is disposed therein, which is more beneficial to timely dissipation of the excessive heat in the inner cavity 211 a-4. Of course, the first ventilation and heat dissipation openings 211a-2a may also be disposed on the first side plate 211a-1, which may also achieve the technical purpose of dissipating the excessive heat.

Here, the number and shape of the first ventilation and heat dissipation ports 211a-2a are not limited in the embodiment of the present application, and in practical application, those skilled in the art may set the number and shape according to specific needs, so long as the number and shape can meet the requirements of use. For example, the first ventilation cooling holes 211a-2a may be rectangular holes or the like, and each of the second side plates 211a-2 may be provided with two first ventilation cooling holes 211a-2a.

In some alternative embodiments, the auxiliary test tool 200 may further include a first air guiding member 240, and the first air guiding member 240 may be mounted to the housing 210, specifically, may be mounted to a side of the partition 211a-3 facing the fan 104, for guiding the air flow into the second air duct 211c.

Referring to fig. 5, in the embodiment of the drawings, the first air guide member 240 may have a flat plate-like structure, and an upper surface thereof is a guide plane for guiding the cooling air into the second air duct 211c. In addition, the first air guide member 240 may have an arc-shaped plate structure.

The first air guiding member 240 is actually located on the windward side of the cavity 211a, referring to fig. 5, that is, the first air guiding member 240 is located on the windward side of the second side plate 211a-2 on the right side, in order to avoid shielding of the first air guiding member 240 from the first ventilation and heat dissipation port 211a-2a, as shown in fig. 6, the first air guiding member 240 may be further provided with a second ventilation and heat dissipation port 241, and the location and shape of the second ventilation and heat dissipation port 241 may correspond to those of the first ventilation and heat dissipation port 211a-2a, so that cooling air can smoothly flow to the first ventilation and heat dissipation port 211a-2a. It should be understood that the second ventilation cooling hole 241 may not be provided when the first ventilation cooling hole 211a-2a is not blocked by the first air guide part 240.

In some alternative embodiments, the auxiliary testing tool 200 may further include a second air guiding component 250, where the second air guiding component 250 may also be mounted to the housing 210, for guiding the airflow out of the second air duct 211c along the set direction. The setting direction here refers specifically to a direction toward the rear device 106 so that the cooling air can flow better to the rear device 106 to achieve ventilation cooling for the rear device 106; in some arrangements, the height of the rear device 106 is generally low, and thus, the set direction may be inclined downward (see fig. 5).

Referring to fig. 5, in the embodiment of the drawings, the second air guiding member 250 may include an upper air guiding plate 251 and a lower air guiding plate 252, the upper air guiding plate 251 may be mounted on the base plate 213, the lower air guiding plate 252 may be mounted on the partition 211a-3, and the upper air guiding plate 251 and the lower air guiding plate 252 may each extend along a set direction to form a guiding channel extending along the set direction, so that the cooling air may flow along the set direction. The upper air guide plate 251 and the lower air guide plate 252 may have a flat plate structure, an arc plate structure, or the like.

In practical use, the second air guiding member 250 may include only the upper air guiding plate 251, which may serve the technical purpose of guiding air.

Here, the material of the auxiliary test tool 200 is not limited in this embodiment, and in practical application, those skilled in the art may adjust the auxiliary test tool according to specific needs, so long as the auxiliary test tool can meet the requirements of use. Illustratively, at least the cavity-forming portion 211a of the auxiliary test tool 200 may be formed of a low thermal conductivity material to reduce heat dissipation. The low heat conduction material can be, for example, an acrylic plate, a micro-nano heat insulation plate, a glass fiber cotton plate and the like.

The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.

Claims (10)

1. An auxiliary testing tool for electronic devices in a server, comprising:

a housing having an inner cavity, the housing being capable of being disposed within the server and capable of housing the electronic device within the inner cavity;

the heating assembly comprises a heating device, a connecting cable and a connecting joint, wherein the heating device is positioned in the inner cavity, the heating device is connected with the connecting joint through the connecting cable, a connecting interface is arranged inside the server, and the connecting joint is used for being connected with the connecting interface.

2. The auxiliary test tool for electronic devices according to claim 1, further comprising a mounting post fixedly mounted to the housing, the connection joint being disposed on the mounting post.

3. The auxiliary test tool for electronic devices according to claim 2, wherein the mounting post has an internal channel for disposing the connection cable.

4. A secondary testing tool for electronic devices according to any one of claims 1-3, wherein the server is configured with a plurality of spaced apart mounts, each mount having the electronic device mounted thereon;

the shell comprises a plurality of sub-shells, the number of the sub-shells is consistent with that of the mounting seats, the inner cavities are formed in the sub-shells, and in an assembled state, the electronic devices of the mounting seats are arranged in the inner cavities of the sub-shells in a one-to-one correspondence mode.

5. The auxiliary testing tool for electronic devices according to claim 4, wherein each of the mounting seats is arranged at intervals along a first direction, each of the sub-housings is arranged at intervals along the first direction, and a first air channel extending along a second direction is formed between two adjacent sub-housings.

6. The auxiliary testing tool for electronic devices according to claim 5, wherein the housing comprises a base plate, the sub-housing comprises a cavity forming portion and a connecting portion, the cavity forming portion is formed with the inner cavity, the cavity forming portion is connected with the base plate through the connecting portion, and a second air duct extending in the second direction is formed between the cavity forming portion and the base plate.

7. The auxiliary test tool for electronic devices according to claim 6, further comprising a first air guiding member mounted to the housing for guiding an air flow into the second air duct; and/or the number of the groups of groups,

the air conditioner further comprises a second air guide component, wherein the second air guide component is installed on the shell and used for guiding air flow out of the second air duct along a set direction.

8. The auxiliary testing tool for electronic devices according to claim 6, wherein the cavity forming portion is provided with a first ventilation and heat dissipation port communicating the inner cavity and an outer space of the cavity forming portion.

9. A server test system comprising a server and the auxiliary test tool for electronic devices according to any one of claims 1-8, said server being provided with said electronic devices to be tested, said electronic devices having temperature sensing means built therein for sensing the temperature of said electronic devices.

10. The server test system of claim 9, wherein the electronic device is a memory bank.

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