CN116487348A - Fixing element of heat dissipating device and installation method thereof - Google Patents
Fixing element of heat dissipating device and installation method thereof Download PDFInfo
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- CN116487348A CN116487348A CN202310516162.XA CN202310516162A CN116487348A CN 116487348 A CN116487348 A CN 116487348A CN 202310516162 A CN202310516162 A CN 202310516162A CN 116487348 A CN116487348 A CN 116487348A
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- sleeve
- spring
- dissipating device
- heat dissipating
- heat
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000009434 installation Methods 0.000 title description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 230000001360 synchronised effect Effects 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a fixing element of a heat dissipating device and a mounting method thereof, wherein the fixing element is arranged at four corners of the heat dissipating device to be combined with a bare crystal heating source for use, the fixing element is a screw with a spring, the screw with the spring is arranged in a sleeve, and the sleeve is used for limiting the spring in the sleeve by a limiting unit; when assembling, the heat sink and the bare-die heat source are first pre-locked by the fixing element, and then the compressed springs in the sleeves of all the fixing elements are synchronously released, so that the heat sink provides a synchronous and uniform downward pressure for the bare-die heat source.
Description
Technical Field
The present invention relates to a fixing element of a heat dissipating device and a method for installing the same, and more particularly, to a fixing element of a heat dissipating device capable of providing synchronous and uniform downward force to prevent damage or thermal resistance of a bare die type heat generating source and the heat dissipating device due to uneven and asynchronous contact stress, and a method for installing the same.
Background
In order to provide the high-performance computing capability of the electronic equipment, a high-performance high-power wafer is adopted, when the wafer is operated, quite high heat is generated, the exterior of the traditional operation wafer is provided with a packaging shell, the packaging shell wraps the wafer inside the wafer to protect the wafer from damage, and along with the improvement of the operation performance of the wafer, the wafer generates higher temperature than the traditional operation, and the heat dissipation and the heat conduction efficiency of the wafer are seriously influenced by the packaging shell packaged outside the wafer; most of the chips in the market are changed into bare crystal form for arrangement, but the bare crystal surface is not flat and is in convex arc form, and the unprotected shell leads to small heat exchange contact surface and low strength, so that the heat exchange contact surface is easy to be damaged and cracked when being combined with a heat dissipating device,
in addition, when the conventional heat dissipating device is fixed above the heat source (bare die), single locking points are adopted to be locked in sequence, so that the time points of each locking are not synchronous and are easy to generate contact inclination, the bare die cannot bear uneven pressure, and the problems of chip cracking, damage and the like are easy to occur.
Referring to fig. 1 and 2, a conventional heat dissipating device and die assembly is shown, the heat source a (die form) is set on a substrate D, copper columns B with internal threads are disposed at four corners of the substrate D corresponding to the outer side of the heat source a, four holes C3 are disposed at the positions of the heat dissipating device C corresponding to the copper columns B, and screw units C1 are respectively disposed at the positions of the heat dissipating device C, a spring C2 is sleeved outside the screw units C1, when the heat dissipating device C and the heat source a are locked, a screw locking operation is directly and sequentially performed by a manual or mechanical arm, in order to accelerate assembly time on a production line and complete in limited assembly time, each fixing screw is usually fast and directly locked in place at one time, when the screw units C1 are locked to a fixed point one by one, the spring C2 sleeved on the screw units C1 are also supported in the direction of the heat source a, and further the heat source C1 is not uniformly stressed, so that the heat source C1 is immediately bumped, but the heat source C1 is not uniformly stressed, and the die C1 is not fully compressed and completely compressed by the compression force is not provided.
Moreover, the bare die is fragile, and as described above, the four corners of the bare die must be combined by simultaneously providing a bonding force with uniform downward pressure, if the downward pressing force cannot be provided by simultaneously providing an average force to the four corners of the bare die, the heat spreader or the heat dissipating device is easy to generate warpage, no complete adhesion or damage between the heat dissipating device and the heat source (bare die), and heat resistance is also easy to be formed, so that uneven heating or heat conduction failure can occur.
Therefore, how to improve the heat dissipation device, which can be completely and comprehensively synchronized, and provide even pressure to be tightly attached to the heat source, and how to provide the effects of maintaining proper binding force between the bare die and the heat dissipation device, and repeatedly installing or adjusting the bare die and the heat dissipation device, is a primary problem for industry.
Disclosure of Invention
Therefore, in order to effectively solve the above-mentioned problems, the present invention is directed to a fixing element of a heat dissipating device and an installation method thereof, which can provide a synchronous and uniform downward force for the heat dissipating device and a heat source of a bare die, so as to effectively avoid the problem that a single locking point is locked in advance, resulting in a broken corner or a burst of a bare die operation unit due to uneven stress and asynchronism.
In order to achieve the above object, the present invention provides a fixing element of a heat dissipating device, comprising:
the screw is provided with a screw head at one end and a plurality of external threads at the other end, a ring groove is arranged above the section of the external threads to clamp a retaining ring, a spring is arranged between the screw head of the screw and the external threads in a penetrating way, the spring is provided with a top end and a bottom end, and the bottom end of the spring is abutted against the retaining ring;
the sleeve is of a tubular structure with two open ends, a containing space is formed in the sleeve, a screw with a spring is arranged in the containing space, the upper end of the spring can be limited by the sleeve through a limiting unit, and the spring is compressed in the containing space of the sleeve.
The fixing element of the heat dissipating device, wherein: the sleeve is provided with an upper end and a lower end which are open, the accommodating space is arranged between the upper end and the lower end, a pair of windows are arranged at the position, close to the upper end, of the sleeve, the windows are provided with an upper edge and a lower edge, and the pair of windows penetrate through and are communicated with the accommodating space from the outer side of the sleeve to the accommodating space direction of the sleeve.
The fixing element of the heat dissipating device, wherein: the two ends of the limiting unit are connected with the upper edge and the lower edge of the window, the limiting unit is a movable or flexible convex body, the limiting unit is provided with a first surface and a second surface, the first surface and the second surface are respectively arranged on the inner surface and the outer surface of the limiting unit, at least one surface of the first surface and the second surface is in a convex shape, and the first surface protrudes towards the direction of the accommodating space.
The fixing element of the heat dissipating device, wherein: the limiting unit is an external element and correspondingly penetrates into the accommodating space from the window to support the upper end of the spring, so that the spring is compressed and limited in the accommodating space of the sleeve.
The fixing element of the heat dissipating device, wherein: the limiting unit is a sheet body or a cross rod or a ring body, and the limiting unit penetrates or is embedded into the accommodating space of the sleeve by the two windows along the radial direction, so that the spring is interfered to be limited in the accommodating space of the sleeve.
In order to achieve the above object, the present invention provides a method for installing a heat dissipating device, comprising the steps of: providing a fixing element of the heat dissipating device;
step A: preparing a heat dissipation device, and respectively installing the fixing elements at four corners of the heat dissipation device;
and (B) step (B): correspondingly placing the heat dissipating device above a bare-die heating source, and temporarily pre-locking the heat dissipating device with the bare-die heating source in a screw locking manner through the fixing element;
step C: finally, all springs limited in the sleeve on the heat dissipation device are released, so that the springs are released and then synchronously provide a synchronous and uniform pressing and attaching force of the heat dissipation device to the bare die heating source.
The installation method of the heat dissipation device comprises the following steps: the sleeve of the fixing element and the lower end of the spring are abutted against the upper side surface of the heat dissipating device, the retaining ring is abutted against the lower side surface of the heat dissipating device, and the fixing element is fixed on the heat dissipating device.
The invention provides a fixing method of a heat dissipating device suitable for a heat generating source in a bare crystal form, which mainly adopts the technical means that a uniform downward attaching force of the heat dissipating device is provided, and the heat dissipating device is attached to the heat generating source in the bare crystal form by releasing a spring at the same time, so that the heat dissipating device is stressed evenly and does not generate warpage, and further the situation of cracking of the bare crystal is prevented.
Drawings
Fig. 1 is a schematic diagram of a conventional heat dissipating device and a die assembly.
Fig. 2 is a schematic diagram of a conventional heat spreader and die combination.
Fig. 3 is an exploded perspective view of a fixing element of the heat dissipating device of the present invention.
Fig. 4 is a perspective combined view of fixing elements of the heat dissipating device of the present invention.
Fig. 5 is an exploded perspective view of a fixing element of the heat dissipating device of the present invention.
Fig. 6 is a sectional view showing a combination of fixing elements of the heat dissipating device of the present invention.
Fig. 7 is a flowchart showing steps of a method for mounting a heat sink and a bare die heat source according to the present invention.
Fig. 8 is a flow chart illustrating steps of a method for mounting a heat dissipating device and a bare die heat generating source according to the present invention.
Fig. 9 is a flow chart illustrating steps of a method for mounting a heat dissipating device and a bare die heat generating source according to the present invention.
Fig. 10 is a flow chart illustrating steps of a method for mounting a heat dissipating device and a bare die heat generating source according to the present invention.
Reference numerals illustrate: a fixing element 3; a screw 31; a screw head 311; an external thread 312; annular groove 313; clasp 314; a sleeve 32; an upper end 321; a lower end 322; a receiving space 323; a window 324; an upper edge 3241; a lower edge 3242; a limit unit 325; a first face 3251; a second face 3252; a spring 33; a top end 331; a bottom end 332; pressing in a jig 4; copper pillars 5.
Detailed Description
The above objects of the present invention, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present invention as illustrated in the accompanying drawings.
Referring to fig. 3, 4, 5 and 6, which are respectively perspective exploded and combined sectional views of a fixing element of a heat dissipating device applied to a bare die type heat generating source according to the present invention, as shown in the drawings, the fixing element 3 of the heat dissipating device applied to the bare die type heat generating source comprises: a screw 31, a sleeve 32;
the screw 31 has a screw head 311 and a plurality of external threads 312 at the upper and lower ends, an annular groove 313 is disposed above the external threads 312 of the screw 31, and a retaining ring 314 is engaged with the annular groove 313. A spring 33 is sleeved outside the screw 31 and is positioned between the screw head 311 and the retaining ring 314, the spring 33 is provided with a top end 331 and a bottom end 332, the bottom end 332 of the spring 33 is abutted against one side of the retaining ring 314, and the retaining ring 314 provides axial limit of the bottom end 332 of the spring 33 to prevent the spring from being separated from the lower end of the screw 31.
The sleeve 32 has a tubular structure, and has an upper end 321, a lower end 322 and an accommodating space 323 which are open, wherein the accommodating space 323 is arranged between the upper end 321 and the lower end 322 and is mutually communicated, the accommodating space of the sleeve 32 is provided with the screw 31 penetrating the spring 33, a pair of windows 324 are arranged near the upper end of the sleeve 32, the pair of windows 324 are correspondingly arranged on the sleeve 32 at 180 degrees, and the pair of windows 324 penetrate from the outer side of the sleeve 32 to the accommodating space 323 direction of the sleeve 32 and are communicated with the accommodating space 323.
The sleeve 32 may utilize or press one end of the spring 33 via a limiting unit 325, the limiting unit 325 may be directly formed on the sleeve 32 to be combined with the sleeve 32, or be used in combination with the sleeve 32 by an additional preset element, etc., so that the spring 33 may be directly limited in the accommodating space 323 of the sleeve 32 by clamping or interference by the application of the limiting unit 324.
In this embodiment, the limiting unit 325 is selectively disposed on the wall surface of the sleeve 32 and directly combined with the sleeve 32, the window 324 of the sleeve 32 has an upper edge 3241 and a lower edge 3242, two ends of the limiting unit 325 are connected with the upper and lower edges 3241 and 3242 of the window 324, the limiting unit 325 in this embodiment is a movable or flexible convex body, the limiting unit 325 has a first surface 3251 and a second surface 3252, the first surface 3251 and the second surface 3252 are respectively disposed on the inner and outer surfaces of the limiting unit 325, at least one of the first surface 3251 and the second surface 3252 is convex, the first surface 3251 is convex toward the accommodating space 323, and the top end 331 of the spring 33 is pressed by the surface of the first surface 3251 to be limited. When the limiting unit 325 is deformed by the external force, the first surface 3251 will deform from the convex surface to the concave surface, and reversely concave into the window 324, so that the second surface 3252, which is concave, deforms to the convex surface to protrude out of the window 3241 toward the outer side of the sleeve 32.
In addition, the limiting unit 325 may be an external element type corresponding to the sleeve 32 to achieve the purpose of limiting and pressing the spring 33, the limiting unit 325 is extended into or embedded into or inserted into or clamped into the accommodating space 323 of the sleeve 32 by the window 324 thereof, and generates interference pressing to the top end 331 of the spring 33, so that the spring 33 is limited in the accommodating space 323 of the sleeve 32, the limiting unit 325 has various structures with sheet-like or plate-like or rod-like or ring-like or other geometric configurations, the limiting unit 325 in this embodiment is illustrated by two cross bars, but not limited thereto, the limiting unit 325 has an upper surface 3251A and a lower surface 3251B, and limits and compresses the top end 331 of the spring 33 by extending the window 324 into the accommodating space 323 in a radial direction of the sleeve 32, and the upper surface 3251A of the limiting unit 324 is limited by the upper edge 3241 of the window 324, so that the lower surface 3251B of the cross bar 3251 can press the top end of the spring 33, so that the spring 32 is compressed by the sleeve 32, and the spring 33 is released by removing the limiting unit 325 from the compression of the window 33.
Referring to fig. 7, 8, 9 and 10, which are respectively a flowchart and a schematic diagram of the steps of the method for installing a heat dissipating device and a bare die heat generating source according to the present invention, the method for installing a heat dissipating device and a bare die heat generating source according to the present invention uses the fixing element of the heat dissipating device applied to a bare die heat generating source for assembly, and includes the following steps;
step A: preparing a heat dissipation device, and respectively installing the fixing elements at four corners of the heat dissipation device;
the invention aims to provide a mounting method of a heat dissipating device capable of directly combining heat sources in a bare crystal form and providing heat exchange, but the surface of the heat source in the bare crystal form is not provided with any protective structure, so that a synchronous and uniform downward attaching force is required to be provided when the heat source is combined with the heat dissipating device for heat conduction, thereby preventing the bare crystal from being damaged due to uneven stress of the downward force. In order to make the heat dissipating device 1 provide uniform downward pressure (bonding force) to the bare die heat source 2, the structure of the fixing element 3 of the present invention is different from that of a conventional fixing element, and the implementation and illustration will not be repeated herein with reference to fig. 3 and 4.
Referring to fig. 8, the heat dissipating device 1 has a thermal contact area 11, the thermal contact area 11 is directly attached to the heat source 2 of the bare die, and fixing elements 3 are respectively disposed at four outer corners of the thermal contact area 11, and when the heat dissipating device 1 is combined with the heat source 2 of the bare die, an average pressurizing force is provided at four corners by the fixing elements 3 disposed at four corners of the heat dissipating device 1, so that the fixing elements 3 disposed at four corners need to simultaneously and synchronously press down against the heat dissipating device 1 to enable the heat dissipating device 1 and the heat source 2 of the bare die to be tightly attached without generating thermal resistance and prevent the bare die from being damaged.
After the screw 31 is inserted into the heat dissipating device 1 through the end with the external thread 312, a retaining ring 314 is disposed at the annular groove 313, the retaining ring 314 is attached to the lower surface of the heat dissipating device 1, and the spring 33 abuts against the upper surface of the heat dissipating device 1 together with the lower end of the sleeve 32, so that the fixing element 3 is temporarily fixed on the heat dissipating device 1.
And (B) step (B): correspondingly placing the heat dissipating device above a bare-die heating source, and temporarily performing primary pre-locking positioning with the bare-die heating source in a primary screw locking manner through the fixing elements;
the bare-crystal-form heat source 2 is a heat source on a substrate (circuit board), and in order to facilitate the installation and fixation of the bare-crystal-form heat source 2 and the heat dissipating device 1, a plurality of copper columns 5 with internal threads are usually disposed on the substrate and adjacent to the four corners of the outer side of the bare-crystal-form heat source 2 for preliminary pre-locking of the external threads 312 of the fixing elements 3, and at this time, the heat dissipating device 1 is only slightly above the bare-crystal-form heat source 2, and the two are not tightly locked and combined, i.e. the heat dissipating device 1 does not apply any downward pressure to the bare-crystal-form heat source 2.
Step C: finally, by simultaneously releasing all springs limited in the sleeve on the heat dissipation device, the springs are released and synchronously provide a uniform pressing-down attaching force of the heat dissipation device to the bare-chip heating source.
The final step is to synchronously and consistently release all springs 33 disposed on the heat sink 1 from compression, and release the spring force by the springs 33, so that the springs 33 provide synchronous and uniform downward force to the four corners of the heat sink 1, and the heat sink 1 is tightly attached to the heat source 2 in bare die form.
First, referring to fig. 3, 4, 5 and 6, as mentioned above, the springs 33 are directly interfered by the limiting units 325 inside the sleeve 33 and are compressed and limited in the sleeve 33, so that the spring force of the springs 33 must be released by releasing the interference or limitation of the limiting units 325 to the springs 33, so that the top ends 331 of the springs 33 support the screw heads 311 upwards, and the lower ends 332 of the springs 33 support the upper surface of the heat sink 1 downwards to pressurize the heat sink 1 to the heat source 2 in the bare crystal form, so that the heat sink 1 is tightly attached to the heat source 2 in the bare crystal form downwards.
Referring to fig. 9 and 10, in order to release the interference or limitation of the limiting unit 325 of each sleeve 33 to the top end 331 of the spring 33 by synchronous operation, external force can be applied to the limiting unit 325 by a manual or automatic mechanical device (not shown) or the mechanical device can be matched with a jig to achieve the aim of synchronous operation, and the limiting of the spring 33 by the limiting unit 325 can be removed by correspondingly designing the pressing jig 4 as an illustrative embodiment, but not limited thereto, and the limiting unit 325 can also be directly operated by the mechanical device.
When the mechanical device provides downward pressure to the pressing jig 4, the pressing jig 4 also synchronously presses the first surface 3251 of the limiting unit 325, so that the limiting unit 325 is forced to be pressed into the window 324, interference limitation on the upper ends of the springs 33 is removed, and the compression release elasticity is synchronously released for each spring 33.
For another design of the structure provided by the present invention, and how to release the limitation of the spring 33, the limitation unit 325 is extended into the window 324 in an external element manner, so that the limitation unit 325 is only required to be radially and horizontally moved out of the window 3243, and the limitation of the spring 33 can be removed to achieve the purpose of releasing the spring.
Referring to fig. 5 and 10, the limiting unit 325 in the present embodiment is an external element, in which two cross bars are taken as an illustrative embodiment, the cross bars radially penetrate the sleeve 32 from the window 324, and the two cross bars are horizontally disposed with a space therebetween, the top end 331 of the spring 33 abuts against the lower sides of the two cross bars, and when the limitation of the spring 33 being compressed is to be released, the pressing limitation of the two cross bars on the spring must be removed, i.e. the space between the two cross bars is increased, and then the spring 33 is separated from the pressing of the cross bars to restore its original state.
In this embodiment, a pressing fixture 4 is used to move vertically downward relative to the two cross bars, and the gap between the two cross bars is continuously increased (i.e. the two cross bars move outwards respectively) when the pressing fixture 4 moves downward, when the gap between the two cross bars is continuously increased until the two cross bars completely remove the pressing force to the top end 331 of the spring 33, the top end 331 of the spring 33 is released from the pressing force of the cross bars and is supported under the screw head 311 of the screw 31, so as to achieve the purpose of releasing the spring 33.
The invention provides a fixing method of a heat dissipating device suitable for a heat generating source in a bare crystal form, which mainly adopts the technical means that a uniform downward attaching force of the heat dissipating device is provided, and the heat dissipating device is attached to the heat generating source in the bare crystal form by releasing a spring at the same time, so that the heat dissipating device is stressed evenly and does not generate warpage, and further the situation of cracking of the bare crystal is prevented.
The manner and structure of how each of the springs is temporarily compressed and fixed, and the spring force is released when the heat dissipating device is attached to the bare die heat source, and the manner of the various limiting units 325 matching with the springs are in various forms, and the springs can be clamped and removed by axial sliding, radial torsion, horizontal stripping or other manners.
The main technical means of the invention is to achieve the effect of uniform force lamination by simultaneously releasing the spring force of each spring arranged on the heat dissipation device, thereby improving the defect of the combination of the existing heat dissipation device and the bare die.
Claims (7)
1. A fixing element of a heat dissipating device, comprising:
the screw is provided with a screw head at one end and a plurality of external threads at the other end, a ring groove is arranged above the section of the external threads to clamp a retaining ring, a spring is arranged between the screw head of the screw and the external threads in a penetrating way, the spring is provided with a top end and a bottom end, and the bottom end of the spring is abutted against the retaining ring;
the sleeve is of a tubular structure with two open ends, a containing space is formed in the sleeve, a screw with a spring is arranged in the containing space, the upper end of the spring can be limited by the sleeve through a limiting unit, and the spring is compressed in the containing space of the sleeve.
2. The heat sink fastening element of claim 1, wherein: the sleeve is provided with an upper end and a lower end which are open, the accommodating space is arranged between the upper end and the lower end, a pair of windows are arranged at the position, close to the upper end, of the sleeve, the windows are provided with an upper edge and a lower edge, and the pair of windows penetrate through and are communicated with the accommodating space from the outer side of the sleeve to the accommodating space direction of the sleeve.
3. The heat sink fastening element of claim 1, wherein: the two ends of the limiting unit are connected with the upper edge and the lower edge of the window, the limiting unit is a movable or flexible convex body, the limiting unit is provided with a first surface and a second surface, the first surface and the second surface are respectively arranged on the inner surface and the outer surface of the limiting unit, at least one surface of the first surface and the second surface is in a convex shape, and the first surface protrudes towards the direction of the accommodating space.
4. The heat sink fastening element of claim 2, wherein: the limiting unit is an external element and correspondingly penetrates into the accommodating space from the window to support the upper end of the spring, so that the spring is compressed and limited in the accommodating space of the sleeve.
5. The heat sink fastening element of claim 4, wherein: the limiting unit is a sheet body or a cross rod or a ring body, and the limiting unit penetrates or is embedded into the accommodating space of the sleeve by the two windows along the radial direction, so that the spring is interfered to be limited in the accommodating space of the sleeve.
6. A method of installing a heat sink, comprising the steps of: providing a fixing element of a heat dissipating device according to any one of claims 1 to 4;
step A: preparing a heat dissipation device, and respectively installing the fixing elements at four corners of the heat dissipation device;
and (B) step (B): correspondingly placing the heat dissipating device above a bare-die heating source, and temporarily pre-locking the heat dissipating device with the bare-die heating source in a screw locking manner through the fixing element;
step C: finally, all springs limited in the sleeve on the heat dissipation device are released, so that the springs are released and then synchronously provide a synchronous and uniform pressing and attaching force of the heat dissipation device to the bare die heating source.
7. The method of installing a heat sink of claim 6, wherein: the sleeve of the fixing element and the lower end of the spring are abutted against the upper side surface of the heat dissipating device, the retaining ring is abutted against the lower side surface of the heat dissipating device, and the fixing element is fixed on the heat dissipating device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310516162.XA CN116487348A (en) | 2023-05-09 | 2023-05-09 | Fixing element of heat dissipating device and installation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310516162.XA CN116487348A (en) | 2023-05-09 | 2023-05-09 | Fixing element of heat dissipating device and installation method thereof |
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Publication Number | Publication Date |
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CN116487348A true CN116487348A (en) | 2023-07-25 |
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CN202310516162.XA Pending CN116487348A (en) | 2023-05-09 | 2023-05-09 | Fixing element of heat dissipating device and installation method thereof |
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- 2023-05-09 CN CN202310516162.XA patent/CN116487348A/en active Pending
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