TWI858695B - Fixing element for heat dissipation device and method of mounting the same - Google Patents
Fixing element for heat dissipation device and method of mounting the same Download PDFInfo
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- TWI858695B TWI858695B TW112117164A TW112117164A TWI858695B TW I858695 B TWI858695 B TW I858695B TW 112117164 A TW112117164 A TW 112117164A TW 112117164 A TW112117164 A TW 112117164A TW I858695 B TWI858695 B TW I858695B
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- sleeve
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- heat sink
- limiting unit
- fixing element
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000004308 accommodation Effects 0.000 claims description 8
- 230000001360 synchronised effect Effects 0.000 claims description 8
- 238000009434 installation Methods 0.000 description 12
- 239000013078 crystal Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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Description
本發明係關於一種散熱裝置的固定元件及其安裝方法,特別係關於一種可提供同步且均勻下壓力,避免裸晶型態的發熱源與散熱裝置因接觸受力不均與不同步造成破壞或熱阻的散熱裝置的固定元件及其安裝方法。 The present invention relates to a heat sink fixing element and its installation method, and in particular to a heat sink fixing element and its installation method that can provide synchronous and uniform downward pressure to avoid damage or thermal resistance caused by uneven contact force and asynchronism between a bare die type heat source and a heat sink.
現行為了提供電子設備高效能的運算能力,故採用了高效能高功率的晶片,當晶片進行運算時產生了相當高熱量的熱量,傳統運算晶片外部具有封裝外殼,並由該封裝外殼將該晶片包覆於其內部以保護該晶片避免受損,隨著晶片的運算效能提升,晶片進行運算工作時將產生較傳統更高之溫度,又因封裝於晶片之外部的封裝外殼已嚴重影響該晶片之散熱以及向外導熱效率;故市場上多數晶片已改為裸晶形態進行設置,但由於該裸晶表面非為平整其係為外凸圓弧形態,且無保護之外殼致使其熱交換接觸面小強度低,因此容易在與散熱裝置進行組合時易產生損毀崩裂,此外,傳統散熱裝置固定於該發熱源(裸晶)上方時,係採取單一鎖點依序鎖固,致造成各鎖固之時間點不同步易發生接觸傾斜,裸晶並無法承受如此不平均之壓力,易造成晶片崩裂損毀等問題的發生。 In order to provide electronic devices with high-performance computing capabilities, high-performance and high-power chips are currently used. When the chip is operating, it generates a considerable amount of heat. Traditional computing chips have a packaging shell on the outside, and the packaging shell encapsulates the chip inside to protect the chip from damage. As the computing performance of the chip increases, the chip will generate a higher temperature than the traditional one when performing computing work. In addition, the packaging shell encapsulated on the outside of the chip has seriously affected the heat dissipation of the chip and the efficiency of heat conduction to the outside; therefore, most of the chips on the market are packaged in a packaged shell. The chip has been changed to a bare chip for installation. However, since the bare chip surface is not flat but has an outward convex arc shape, and there is no protective shell, its heat exchange contact surface is small and has low strength. Therefore, it is easy to be damaged and cracked when combined with a heat sink. In addition, when the traditional heat sink is fixed on the heat source (bare chip), a single locking point is used to lock in sequence, resulting in the time points of each locking being asynchronous and prone to contact tilt. The bare chip cannot withstand such uneven pressure, which can easily cause problems such as chip cracking and damage.
參閱第1、2圖,係為習知散熱裝置與裸晶組合示意圖,該發熱源A(裸晶型態)設立於一基板D上,在基板D上對應設置該發熱源A的外側的四個角落設有具有內螺紋的銅柱B,該散熱裝置C對應該銅柱B的位置也設有四個孔洞C3並分 穿設有螺絲單元C1,該等螺絲單元C1外部套設有一彈簧C2,該散熱裝置C與發熱源A進行鎖固結合時,通常係透過人工或機械手臂操作電動起子直接單點依序進行螺鎖作業,為了加快生產線上的組裝工時及在有限的組裝工時內完成,通常該每一固定螺絲皆以快速直接一次鎖固到位,當逐一將螺絲單元C1鎖固至定點時,套接於該螺絲單元C1上的彈簧C2也一併的向發熱源A方向進行抵撐,進而單點鎖固造成的受力不均的缺失則立即產生磕碰發熱源,前述提及發熱源A(裸晶)質脆,然而單點的螺絲單元C1鎖固及彈簧C2的抵壓對於發熱源A(裸晶)並無法提供完整全面性(裸晶的四個角落)同步均勻的向下壓力外,裸晶易因受力不均造成損毀。 Refer to Figures 1 and 2, which are schematic diagrams of the heat sink and bare crystal combination. The heat source A (bare crystal type) is set on a substrate D. Copper pillars B with internal threads are set at the four corners of the substrate D corresponding to the outer side of the heat source A. The heat sink C is also provided with four holes C3 at the positions corresponding to the copper pillars B and is penetrated by screw units C1. The screw units C1 are covered with a spring C2. When the heat sink C and the heat source A are locked together, the screwing operation is usually performed by manual or mechanical arm operating an electric screwdriver to directly perform the screwing operation in sequence. In order to speed up the assembly time and Completed within the limited assembly time, usually each fixing screw is fastened directly and once in place. When the screw unit C1 is locked to the fixed point one by one, the spring C2 sleeved on the screw unit C1 also supports in the direction of the heat source A. The lack of uneven force caused by the single-point locking immediately causes the heat source to collide. As mentioned above, the heat source A (bare crystal) is brittle. However, the single-point screw unit C1 locking and the spring C2 pressure cannot provide complete and comprehensive (four corners of the bare crystal) synchronous and uniform downward pressure on the heat source A (bare crystal). The bare crystal is easily damaged due to uneven force.
再者,裸晶相當脆弱,如前述必須由裸晶的四個角落同時同步以均勻的向下壓力提供結合力進行組合,如若無法透過同時對裸晶的四個角落以平均受力的方式提供向下的壓制力,則容易令該散熱器或散熱裝置與該發熱源(裸晶)之間產生翹曲及無完整貼合或造成損毀等缺失,也容易形成熱阻抗,即會造成受熱不均或熱傳導失效的現象發生。 Furthermore, the bare die is quite fragile. As mentioned above, the four corners of the bare die must be simultaneously and synchronously provided with uniform downward pressure to provide bonding force for assembly. If the four corners of the bare die cannot be simultaneously provided with downward pressure in an evenly applied manner, it is easy to cause the heat sink or heat dissipation device to warp and not fully bond or cause damage to the heat source (bare die), and it is also easy to form thermal impedance, which will cause uneven heating or thermal conduction failure.
故如何改善該散熱裝置可完整全面性同時同步的且提供均勻的壓力緊密與該發熱源貼合以及如何提供維持裸晶與散熱裝置間的適當結合力及可重複進行安裝或調整等功效,實為業者目前首要解決的問題。 Therefore, how to improve the heat dissipation device to fully and comprehensively provide uniform pressure to fit tightly with the heat source, and how to maintain the appropriate bonding force between the bare die and the heat dissipation device and enable repeated installation or adjustment are the primary issues that the industry needs to solve.
爰此,為有效解決上述之問題,本發明之主要目的係提供一種散熱裝置的固定元件及其安裝方法,可以提供散熱裝置與裸晶型態的發熱源一同步均勻的下壓力,有效避免單一鎖點先行鎖固,導致裸晶運算單元因受力不均及不同步造成邊角破裂或崩裂的問題。 Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a fixing element of a heat sink and its installation method, which can provide a synchronous and uniform downward pressure on the heat sink and the bare die type heat source, effectively avoiding the problem of a single locking point being locked first, resulting in the bare die computing unit cracking or breaking due to uneven and asynchronous force.
為達上述目的本發明係提供一種散熱裝置的固定元件,係具有:一螺絲、一彈簧、一套筒;所述螺絲穿設有該彈簧,該螺絲之一端設有一扣環用以提供該彈簧一端抵接令該扣環提供該彈簧的限位,防止該彈簧脫離該螺絲。 To achieve the above-mentioned purpose, the present invention provides a fixing element for a heat dissipation device, which comprises: a screw, a spring, and a sleeve; the spring is passed through the screw, and a retaining ring is provided at one end of the screw to provide abutment against one end of the spring so that the retaining ring provides a limit for the spring to prevent the spring from detaching from the screw.
該套筒係為一兩端呈開放狀的管狀體結構,其內部具有一容置空間,該套筒呈開放狀的兩端分別連通該容置空間,該套筒之容置空間套設有該具彈簧之螺絲,並該套筒可透過一限位單元對該彈簧的一端以卡制或干涉等方式進行限位,令該彈簧被限制於該套筒之容置空間內呈現壓縮狀態。 The sleeve is a tubular structure with two open ends, and has a containing space inside. The two open ends of the sleeve are respectively connected to the containing space. The containing space of the sleeve is sleeved with the screw with the spring, and the sleeve can limit one end of the spring by means of clamping or interference through a limiting unit, so that the spring is restricted in the containing space of the sleeve and presents a compressed state.
為達上述目的本發明係提供一種使用上述固定元件作為提供散熱裝置與裸晶發熱源的安裝方法,藉以達到兩者貼合時具有均勻受力的效果,係包含下列步驟:步驟A:準備一散熱裝置,並在該散熱裝置的四隅分別安裝所述固定元件;步驟B:將該散熱裝置對應放置在一裸晶發熱源的上方,並先透過該等固定元件以螺鎖的方式暫與該裸晶發熱源進行先行的初步預鎖定位貼合接觸;步驟C:最後同時解除該散熱裝置上所有受限於套筒內的彈簧,令該等彈簧對該散熱裝置向該裸晶發熱源提供一同步且均勻下壓力者。 To achieve the above purpose, the present invention provides a method for installing a heat sink and a bare die heat source using the above fixing elements, so as to achieve a uniform force effect when the two are attached, which includes the following steps: Step A: prepare a heat sink, and install the fixing elements at the four corners of the heat sink; Step B: place the heat sink on top of a bare die heat source, and first use the fixing elements to temporarily pre-lock and position the bare die heat source in a screw-locked manner; Step C: Finally, release all the springs on the heat sink that are restricted in the sleeve at the same time, so that the springs provide a synchronous and uniform downward pressure on the heat sink to the bare die heat source.
3:固定元件 3:Fixed components
31:螺絲 31: Screws
311:螺絲頭 311: Screw head
312:外螺紋 312: External thread
313:環形槽 313: Annular groove
314:扣環 314: Buckle
32:套筒 32: Sleeve
321:上端 321: Top
322:下端 322: Lower end
323:容置空間 323: Storage space
324:窗口 324: Window
3241:上緣 3241: Upper Edge
3242:下緣 3242: Lower Edge
325:限位單元 325: Limiting unit
3251:第一面 3251: First page
3252:第二面 3252: Second side
33:彈簧 33: Spring
331:頂端 331: Top
332:底端 332: bottom
4:壓入治具 4: Press-in fixture
5:銅柱 5: Copper column
第1圖係為習知散熱裝置與裸晶組合示意圖。 Figure 1 is a schematic diagram of a conventional heat sink and bare die combination.
第2圖係為習知散熱裝置與裸晶組合示意圖。 Figure 2 is a schematic diagram of a conventional heat sink and bare die combination.
第3圖係為本發明散熱裝置的固定元件立體分解圖。 Figure 3 is a three-dimensional exploded view of the fixing components of the heat dissipation device of the present invention.
第4圖係為本發明散熱裝置的固定元件立體組合圖。 Figure 4 is a three-dimensional assembly diagram of the fixing components of the heat dissipation device of the present invention.
第5圖係為本發明散熱裝置的固定元件立體分解圖。 Figure 5 is a three-dimensional exploded view of the fixing components of the heat dissipation device of the present invention.
第6圖係為本發明散熱裝置的固定元件組合剖視圖。 Figure 6 is a cross-sectional view of the fixed element assembly of the heat dissipation device of the present invention.
第7圖係為本發明散熱裝置與裸晶發熱源的安裝方法步驟流程圖。 Figure 7 is a flow chart of the steps of the installation method of the heat dissipation device and the bare die heat source of the present invention.
第8圖係為本發明散熱裝置與裸晶發熱源的安裝方法步驟流程示意圖。 Figure 8 is a schematic diagram of the steps of the installation method of the heat dissipation device and the bare die heat source of the present invention.
第9圖係為本發明散熱裝置與裸晶發熱源的安裝方法步驟流程示意圖。 Figure 9 is a schematic diagram of the steps of the installation method of the heat dissipation device and the bare die heat source of the present invention.
第10圖係為本發明散熱裝置與裸晶發熱源的安裝方法步驟流程示意圖。 Figure 10 is a schematic diagram of the steps of the installation method of the heat dissipation device and the bare die heat source of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned purpose of the present invention and its structural and functional characteristics will be explained according to the preferred embodiments of the attached drawings.
請參閱第3、4、5、6圖,係為本發明應用在裸晶型態發熱源的散熱裝置固定元件之立體分解及組合剖視圖,如圖所示,所述應用在裸晶型態發熱源的散熱裝置的固定元件3,係具有:一螺絲31、一套筒32;所述螺絲31之上、下兩端分別具有一螺絲頭311及複數外螺紋312,該螺絲31設置該外螺紋312的上方設有一環形槽313,且該環形槽313卡設有一扣環314。一彈簧33係套設於該螺絲31的外部且位於該螺絲頭311與該扣環314之間,該彈簧33具有一頂端331及一底端332,該彈簧33之底端332係抵接該扣環314一側,並由該扣環314提供該彈簧33之底端332的軸向限位,防止該彈簧由該螺絲31下端脫離。
Please refer to Figures 3, 4, 5, and 6, which are three-dimensional exploded and assembled cross-sectional views of the heat sink fixing element of the present invention applied to a bare crystal type heat source. As shown in the figure, the heat
所述套筒32係為一管狀結構,其具有呈開放狀的一上、下兩端321、322及一容置空間323,該容置空間323介於該上、下端321、322之間並相互連通,該套筒32之容置空間設有所述穿設有彈簧33之螺絲31,所述套筒32近上端處開設有一
對窗口324,該等窗口324於套筒32上係呈相距180度對應設置,該等窗口324由該套筒32外側向該套筒32的容置空間323方向貫穿並連通該容置空間323。
The
所述套筒32可利用或透過一限位單元325對該彈簧33之一端進行壓扣,該限位單元325可直接成型於套筒32上與該套筒32結合一體,或以外加之預設元件等方式與該套筒32搭配使用,藉由透過該限位單元325的應用可直接以卡制或干涉等方式將該彈簧33壓縮限制於該套筒32的容置空間323內。
The
本實施例中該限位單元325係被選擇設於該套筒32的壁面與該套筒32直接結合一體,所述套筒32窗口324具有一上緣3241及一下緣3242,該限位單元325兩端連接該窗口324之上、下緣3241、3242,本實施例之該限位單元325係為一可活動或可撓性之凸體,並該限位單元325具有一第一面3251及一第二面3252,所述第一面3251及第二面3252分別設於該限位單元325的內、外表面,該第一面3251及該第二面3252至少一面係呈凸出狀,該第一面3251向該容置空間323方向凸出,使該彈簧33的頂端331被該第一面3251的表面抵壓而受到限位。若所述限位單元325受外力作用擠壓產生變形時,則第一面3251將會由凸面變形呈凹面,反向凹縮入該窗口324,使原呈凹面的該第二面3252變形呈凸面朝該套筒32外側方向凸出該窗口324。
In this embodiment, the limiting
另外限位單元325可為一外部元件型態與套筒32對應搭配以達到對該彈簧33進行限位扣壓之用,該限位單元325係由該其一窗口324伸入或嵌入或插入或卡入該套筒32之容置空間323內,並對該彈簧33的頂端331產生干涉壓制,令該彈簧33被限制於該套筒32的容置空間323內,所述限位單元325具有多種樣式係可為片狀或板狀或桿狀或環狀或其他幾何構型之結構體,本實施例之該限位單元325係由兩橫桿作為說明但並不引以為限,該限位單元325具有一上表面3251A及一下
表面3251B,並由該窗口324處朝該套筒32的徑向伸入該容置空間323內對該彈簧33頂端331進行限位壓縮,並該限位單元325的上表面3251A受該窗口324的上緣3241處限位,使該等橫桿下表面3251B可扣壓該彈簧33之頂端331,令彈簧被壓縮於該套筒32內,再透過將該限位單元325從該窗口324處移除,進而卸除對該彈簧33的限位,藉此令原備受壓縮的彈簧33獲得釋放。
In addition, the limiting
請參閱第7、8、9、10圖,係為本發明散熱裝置與裸晶型態發熱源的安裝方法步驟流程圖及示意圖,如圖所示,本發明散熱裝置與裸晶型態發熱源的安裝方法使用了前述應用在裸晶型態發熱源的散熱裝置的固定元件進行組裝,係包含下列步驟; Please refer to Figures 7, 8, 9, and 10, which are the step flow chart and schematic diagram of the installation method of the heat sink and the bare die type heat source of the present invention. As shown in the figure, the installation method of the heat sink and the bare die type heat source of the present invention uses the aforementioned fixing components of the heat sink applied to the bare die type heat source for assembly, and includes the following steps;
步驟A:準備一散熱裝置,並在該散熱裝置的四隅分別安裝所述固定元件;本發明欲提供一種可針對裸晶型態的發熱源進行直接組合並提供熱交換的散熱裝置的安裝方法,但因裸晶型態的發熱源表面並無任何保護的結構體,故當在與散熱裝置結合進行熱傳導時,必須提供一同步且均勻的向下貼合力,藉以防止因下壓力受力不均而破壞裸晶者。為了令該散熱裝置1可提供對裸晶型態的發熱源2均勻的向下壓力(貼合力),則本發明之固定元件3結構有別於一般傳統固定元件,請參閱第3、4圖及前述說明實施及圖示,在此將不再贅述。
Step A: Prepare a heat sink and install the fixing elements at the four corners of the heat sink respectively; the present invention intends to provide a method for installing a heat sink that can be directly combined with a bare die type heat source and provide heat exchange. However, since the bare die type heat source has no protective structure on its surface, when combined with the heat sink for heat conduction, a synchronous and uniform downward bonding force must be provided to prevent the bare die from being damaged due to uneven downward pressure. In order for the
參閱第8圖,所述散熱裝置1具有一熱接觸區域11,由該熱接觸區域11直接對應與該裸晶型態的發熱源2進行貼合,於該熱接觸區域11的外側四隅分別設置有一固定元件3,由於該散熱裝置1與裸晶型態的發熱源2結合時,係由透過設置於該散熱裝置1四隅的固定元件3提供四個角落的平均加壓力,故為了可提供平均的向下壓力,則設於四隅的固定元件3勢必要同時且同步向下抵壓該散熱裝置1,
,使該散熱裝置1與該裸晶型態的發熱源2得以緊密貼合不產生熱阻以及防止裸晶遭受破壞。
Referring to FIG. 8 , the
該螺絲31透過具有外螺紋312之一端穿設該散熱裝置1後,並在該環形槽313處設置一扣環314,該扣環314貼設於該散熱裝置1的下側表面,該彈簧33與該套筒32的下端322一同抵接在該散熱裝置1上側表面,令該固定元件3暫時被固定於該散熱裝置1上。
After the
步驟B:將該散熱裝置對應放置在一裸晶發熱源的上方,並先透過該等固定元件以初步的螺鎖的方式暫與該裸晶發熱源進行初步預鎖定位;該裸晶型態的發熱源2係為一基板(電路板)上的發熱源,並為了便利該裸晶型態的發熱源2與散熱裝置1可以進行安裝固定,該基板上並相鄰該裸晶型態的發熱源2的外側四個角落通常會設置有複數個具有內螺紋的銅柱5,以供該等固定元件3的外螺紋312進行初步的預鎖定位,而此時,該散熱裝置1僅輕靠於該裸晶型態的發熱源2的上方,且尚未將兩者緊密鎖固結合,即該散熱裝置1未對該裸晶型態的發熱源2施加任何的向下壓力。
Step B: The heat sink is placed on a bare die heat source and is pre-locked with the bare die heat source by the fixing elements in a preliminary screw lock manner; the bare
步驟C:最後透過同時解除該散熱裝置上所有受限於套筒內的彈簧,令該等彈簧被釋放並同步提供該散熱裝置向該裸晶發熱源抵壓的一均勻下壓貼合力。 Step C: Finally, all the springs on the heat sink that are restricted in the sleeve are released at the same time, so that the springs are released and simultaneously provide a uniform downward pressure to the heat sink against the bare die heat source.
最後步驟係必須同步且一致的將設置於該散熱裝置1上的所有彈簧33解除其受壓縮的限制,並由該彈簧33進行釋放其彈簧力,藉此由該等彈簧33對該散熱裝置1的四隅提供同步且均勻的下壓力,進而使該散熱裝置1與該裸晶型態的發熱源2得緊密貼合。
The last step is to release the compression restriction of all the
首先,複參閱第3、4、5、6圖,如前所述,該等彈簧33係直接被該套筒32內部的限位單元325所干涉,而被壓縮限制於該套筒32內,故必須透過解除該限
位單元325對該彈簧33的干涉或限位令該彈簧33的彈簧力獲得釋放,使得以令該等彈簧33的頂端331向上頂撐該螺絲頭311,而該彈簧33的底端332向下抵壓該散熱裝置1的上側表面對該散熱裝置1向該裸晶型態的發熱源2進行加壓,令該散熱裝置1向下緊密貼合該裸晶型態的發熱源2。
First, refer to Figures 3, 4, 5, and 6 again. As mentioned above, the
請參閱第9、10圖為了同步操作解除每一套筒32之限位單元325對該彈簧33之頂端331的干涉或限位,則可透過手動或自動的機械設備(圖中未示)施以外力,或該機械設備搭配治具的方式達到同步之進行之目的,本實施例係透過對應設計壓入治具4之方式來進行卸除限位單元325對彈簧33的限制作為說明實施例,但並不引以為限,也可由機械設備直接對該限位單元325作動。
Please refer to Figures 9 and 10. In order to synchronously remove the interference or limitation of the
該壓入治具4分別對應各固定元件3套筒32的限位單元325,當該機械設備對該壓入治具4提供向下的壓力時,該壓入治具4也同步施壓於該限位單元325的第一面3251上,迫使該限位單元325被壓入該窗口324內後,進而卸除了對該等彈簧33上端的干涉限位,並同步的對各彈簧33解除壓縮釋放彈力。
The press-in
針對本發明所提供的另一結構之設計,以及如何解除其對彈簧33的限制如下說明,因該限位單元325以外部元件方式伸入於該窗口324處,故只需將該限位單元325徑向水平移出該窗口324,即可卸除對該彈簧33的限位以達到釋放彈簧之目的。
The design of another structure provided by the present invention and how to remove the restriction on the
參閱第5、10圖,本實施例所揭示的限位單元325係為一外部元件,該外部元件係以兩橫桿作為說明實施例,該等橫桿由該窗口324處徑向貫穿該套筒32,並兩橫桿水平對應設置,兩者之間具有一間距,該彈簧33之頂端331抵頂兩橫桿之下側,當要解除該彈簧33被壓縮之限制,則必須卸除兩橫桿對該彈簧的抵壓限制,即增加兩橫桿之間的間距後令該彈簧33脫離橫桿之抵壓恢復其原始狀態。
Referring to Figures 5 and 10, the
本實施例透過使用一壓入治具4相對兩橫桿垂直向下移動,並隨該壓入治具4向下移動時則會持續加大兩橫桿之間的間隙(即兩橫桿分別向外移動),當兩橫桿之間的間距持續增加至兩橫桿完全卸除對該彈簧33之頂端331的抵壓時,則可使該彈簧33之頂端331脫離橫桿之抵壓而自由的向上釋放其彈簧力,並頂撐於該螺絲31之螺絲頭311的下方,達到釋放該彈簧33之目的。
This embodiment uses a press-in
本案所提出的適用於裸晶型態的發熱源的散熱裝置固定方法,主要技術手段係要提供散熱裝置一均勻的向下貼合力,利用同時釋放彈簧,使該散熱裝置與該裸晶型態發熱源貼合時受力平均不產翹曲,進而防止裸晶破裂情事發生。 The heat sink fixing method proposed in this case is applicable to a bare die type heat source. The main technical means is to provide the heat sink with a uniform downward bonding force, and to release the springs at the same time, so that the heat sink and the bare die type heat source are evenly stressed and do not warp when they are bonded, thereby preventing the bare die from cracking.
而各該等彈簧如何暫時被壓縮固定,待該散熱裝置與該裸晶型態發熱源貼合時才釋放其彈簧力的方式及結構組成,以及各種限位單元325搭配彈簧之態樣具有眾多形式,可以軸向滑動或徑向扭轉或水平向外剝除等各種方式對該等彈簧進行卡固及卸除,本發明僅列舉其中兩種態樣作為說明實施例,但並不引以為限。
There are many ways and structures for temporarily compressing and fixing the springs, and releasing the spring force when the heat sink is attached to the bare die heat source. There are also many ways for the
本發明主要技術手段即為透過同時釋放設於散熱裝置上的各彈簧的彈簧力來達到均力貼合的功效,藉以改善現行習知散熱裝置與裸晶結合之缺失者。 The main technical means of the present invention is to achieve the effect of uniform force fitting by simultaneously releasing the spring force of each spring provided on the heat sink, thereby improving the defects of the existing conventional heat sink and bare chip combination.
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