CN115515787B - Mold release film and method for producing molded article - Google Patents
Mold release film and method for producing molded article Download PDFInfo
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- CN115515787B CN115515787B CN202180034332.XA CN202180034332A CN115515787B CN 115515787 B CN115515787 B CN 115515787B CN 202180034332 A CN202180034332 A CN 202180034332A CN 115515787 B CN115515787 B CN 115515787B
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- release film
- release
- layer
- film
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 44
- 239000011342 resin composition Substances 0.000 claims abstract description 43
- 238000003860 storage Methods 0.000 claims abstract description 33
- 239000010408 film Substances 0.000 claims description 239
- 239000010410 layer Substances 0.000 claims description 180
- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 44
- 238000003825 pressing Methods 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229920000306 polymethylpentene Polymers 0.000 claims description 11
- 239000011116 polymethylpentene Substances 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 230000000740 bleeding effect Effects 0.000 claims description 7
- 229920005672 polyolefin resin Polymers 0.000 claims description 6
- 239000013039 cover film Substances 0.000 claims description 4
- 230000037303 wrinkles Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 18
- 239000012787 coverlay film Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 13
- 239000004744 fabric Substances 0.000 description 12
- 239000010954 inorganic particle Substances 0.000 description 8
- 239000011146 organic particle Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000012748 slip agent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920003314 Elvaloy® Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadecene Natural products CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The release film (10) of the present invention has a first release layer (1) and a buffer layer (3) formed from a first thermoplastic resin composition, the first release layer (1) having an average thickness of 12 [ mu ] m or more and 38 [ mu ] m or less, and the release film (10) having a storage modulus E' of 30MPa or more at 180 ℃. The average thickness of the release film (10) is preferably 80-180 [ mu ] m, and the average thickness of the buffer layer (3) is preferably 40-110 [ mu ] m. In the first release layer (1), the ten-point average roughness Rz on the surface on the opposite side of the buffer layer (3) is preferably 3 μm or more and 20 μm or less.
Description
Technical Field
The present invention relates to a release film and a method for producing a molded article.
Background
In recent years, a release film has been generally used when a coverlay film is bonded to a flexible circuit board on which a circuit is exposed, through an adhesive layer provided in the coverlay film, by heating and pressing, to form a laminate, which is a flexible printed circuit board.
When forming such a flexible printed circuit board using a release film, in other words, a laminate of a flexible circuit board and a coverlay film, 2 characteristics, that is, excellent landfill property and releasability are required for the release film.
Specifically, first, a cover film is laminated on a flexible circuit board to form a recess in the flexible printed circuit board, but a release film is required to exhibit excellent filling properties into the recess.
More specifically, the coverlay film is laminated on the flexible circuit board via an adhesive layer provided on the coverlay film. In this lamination, the release film is required to have excellent filling properties into the concave portion and to suppress the bleeding of the adhesive in the concave portion.
After the cover film is laminated on the flexible printed circuit board as described above, the release film is required to be peeled from the flexible printed circuit board to be formed with excellent releasability.
More specifically, when the release film is peeled from the formed flexible printed circuit board, the release film is required to have excellent releasability from the flexible printed circuit board, and to suppress the occurrence of creases and breaks in the flexible printed circuit board.
In order to provide a release film having 2 excellent properties (landfill property and releasability) as described above, for example, patent document 1 proposes a release film having a polyester elastomer layer and a polyester layer. However, in the release film having such a structure, it cannot be said that excellent landfill property and excellent releasability are both achieved, and it is actually required to develop a release film having 2 characteristics which are balanced and more excellent.
In addition, such a problem also occurs in the following cases: the mold release film is attached to an object formed of a material containing a thermosetting resin in a semi-cured state, and the thermosetting resin is cured in this state, whereby a molded article is produced using the object.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2011-88351.
Disclosure of Invention
Technical problem to be solved by the invention
The purpose of the present invention is to provide a release film that can exhibit both excellent landfill properties and excellent release properties in a balanced manner, and a method for producing a molded article using the release film.
Means for solving the problems
The object is achieved by the present invention described in the following (1) to (13).
(1) A release film comprising a first release layer and a buffer layer formed from a first thermoplastic resin composition, wherein the first release layer has an average thickness of 12 [ mu ] m or more and 38 [ mu ] m or less, and the release film has a storage modulus E' of 30MPa or more at 180 ℃.
(2) The release film according to the above (1), wherein the average thickness of the release film is 80 μm or more and 180 μm or less.
(3) The release film according to the above (1) or (2), wherein the average thickness of the buffer layer is 40 μm or more and 110 μm or less.
(4) The release film according to any one of the above (1) to (3), wherein the ten-point average roughness (Rz) on the surface of the first release layer on the opposite side from the buffer layer is 3 μm or more and 20 μm or less.
(5) The release film according to any one of the above (1) to (4), wherein the storage modulus E' of the first release layer under 180℃condition is 60MPa or more.
(6) The release film according to any one of the above (1) to (5), wherein E '1/T1[ MPa/μm ] satisfies a relationship of 2.1 < E'1/T1 < 6.0, when T1[ μm ] is the average thickness of the first release layer and E '1[ MPa ] is the storage modulus E' of the first release layer at 180 ℃.
(7) The release film according to any one of the above (1) to (6), wherein the first thermoplastic resin composition contains a poly 4-methyl 1-pentene resin.
(8) The release film according to any one of the above (1) to (7), wherein the buffer layer is formed of a third thermoplastic resin composition containing a poly 4-methyl 1-pentene resin and a polyolefin-based resin different from the poly 4-methyl 1-pentene resin.
(9) The release film according to any one of the above (1) to (8), wherein the release film has a second release layer formed of a second thermoplastic resin composition laminated on the opposite side of the buffer layer from the first release layer.
(10) The release film according to any one of the above (1) to (9), wherein the release film having a width of 270mm is pressure-bonded to a flexible circuit board having irregularities having a pitch of 50 μm, a width of 50 μm and a height of 18 μm by a roll-to-roll press under conditions of 180 ℃,11 MPa and 120sec, and when the release film and the flexible circuit board are peeled off while being conveyed immediately after the pressure is applied, the ultimate peeling speed at which wrinkles are not observed in the release film is 100 mm/sec or more.
(11) The release film according to any one of the above (1) to (10), wherein the release film having a width of 270mm is pressed into a laminate formed by attaching a coverlay film (manufactured by japan glossy manufacturing company (Arisawa Manufacturing co., ltd.), "CMA 0525") to a flexible circuit board having a pitch of 50 μm, a width of 50 μm, and a height of 18 μm under conditions of 180 ℃,11 MPa, and 120s, and wherein the adhesive layer provided in the coverlay film is set to the flexible circuit board side, and then, when one end of the release film is gripped, the maximum amount of adhesive oozed out in a planar view in a concave portion of the laminate is 100 μm or less.
(12) The release film according to any one of the above (1) to (11), which is used by being superimposed on the surface of an object formed of a material containing a thermosetting resin in a semi-cured state so that the surface on the first release layer side is brought into contact with the surface of the object.
(13) A method for producing a molded article, comprising the steps of disposing the release film on the object such that the first release layer of the release film of any one of (1) to (12) is on the object side, and heating and pressing the object on which the release film is disposed, wherein in the step of disposing the release film, the surface of the object on the side on which the release film is disposed is formed of a material containing a thermosetting resin in a semi-cured state.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a release film that exhibits both excellent landfill property and excellent release property can be provided in a balanced manner.
Therefore, in the case where the release film is used for forming, for example, a flexible printed circuit board using a flexible circuit board and a coverlay film, bleeding of the adhesive into a recess formed on the flexible printed circuit board can be reliably suppressed or prevented.
Further, when the release film is peeled off from the flexible printed circuit board after the flexible printed circuit board is formed, occurrence of creases and breakage in the flexible printed circuit board can be reliably suppressed or prevented.
Drawings
Fig. 1 is a side view showing a main part of a roll-to-roll press for manufacturing a flexible printed circuit board.
Fig. 2 is a longitudinal sectional view showing each step in a method for manufacturing a flexible printed circuit board using the roll-to-roll press shown in fig. 1.
Fig. 3 is a longitudinal sectional view showing a heating and pressing process in a method for manufacturing a flexible printed circuit board using the roll-to-roll press shown in fig. 1.
Fig. 4 is a longitudinal sectional view showing an embodiment of the release film of the present invention.
Fig. 5 is a partially enlarged longitudinal sectional view of the portion a of the release film shown in fig. 4.
Detailed Description
Hereinafter, a method for producing a release film and a molded article according to the present invention will be described in detail with reference to preferred embodiments shown in the drawings.
In the following, a case of manufacturing a flexible printed circuit board using the release film of the present invention will be described as an example. Before describing the method for producing a release film and a molded article according to the present invention, a roll-to-roll press for producing a flexible printed circuit board will be described.
Roller pair roller press
Fig. 1 is a side view showing a main part of a roll-to-roll press for manufacturing a flexible printed circuit board, fig. 2 is a longitudinal sectional view showing each step in a manufacturing method of a flexible printed circuit board using the roll-to-roll press shown in fig. 1, and fig. 3 is a longitudinal sectional view showing a heating and pressing step in a manufacturing method of a flexible printed circuit board using the roll-to-roll press shown in fig. 1. In the following description, for convenience of explanation, the upper side in fig. 1 to 3 is referred to as "upper" or "upper", the lower side is referred to as "lower" or "lower", the left side is referred to as "left", and the right side is referred to as "right".
The roll-to-roll press 100 (RtoR press) includes: a conveying mechanism (not shown) for conveying the release film 10, the flexible printed circuit board 200 (hereinafter, sometimes referred to as "FPC") and the glass cloths 300A, 300B; a heating and pressing mechanism 50 for bonding a flexible circuit board 210 and a coverlay film 220 (hereinafter, also referred to as "CL film") provided on the FPC200 by heating and pressing the CL film 220 to the flexible circuit board 210 using the release film 10; and a release mechanism 60 for releasing (peeling) the release film 10 from the FPC200 having the CL film 220 bonded to the flexible circuit board 210.
In the conveying mechanism, the FPC200, the release films 10A and 10B, and the glass cloths 300A and 300B, which are wound around different feed rollers, are conveyed along these longitudinal directions by rotation of a tensioner (tension roller), are processed by the heating and pressing mechanism 50 and the release mechanism 60, and are wound around winding rollers.
The rollers are each made of a metal material such as stainless steel. The rollers are arranged so that the rotation axes (central axes) are oriented in the same direction and are separated from each other.
As shown in fig. 1, the heat pressing mechanism 50 has a heat pressing portion 52.
The thermocompression bonding portion 52 has a pair of thermocompression bonding plates 521. The heated pressing plate 521 is conveyed by a conveying mechanism, and is opposed to the glass cloth 300A, the release film 10A, FPC200, the release film 10B, and the glass cloth 300B in a superposed state, and 1 is disposed above and below each. When the glass cloth 300A, the release film 10A, FPC200, the release film 10B, and the glass cloth 300B are overlapped with each other by the heating press plate 521, the FPC200 is heated and pressurized by the heating press plate 521 via the glass cloths 300A and 300B and the release films 10A and 10B. Accordingly, in the FPC200, the stacked flexible circuit board 210 and CL film 220 are bonded via the adhesive layer 222 provided in the CL film 220. In other words, the cover layer 221 and the flexible circuit board 210 are bonded via the adhesive layer 222. When the FPC200 is heated and pressurized, that is, when the cover layer 221 and the flexible circuit board 210 are bonded via the adhesive layer 222, the release film 10 is embedded in the recess 223 formed in the cover layer 221. Therefore, the bleeding of the adhesive from the adhesive layer 222 in the concave portion 223 can be suppressed (refer to fig. 2 (b)).
Before the heat press bonding by the heat press bonding plate 521, the FPC200 is stacked in a state where the flexible circuit board 210 and the CL film 220 are superposed, but the flexible circuit board 210 and the CL film 220 are not bonded via the adhesive layer 222 provided in the CL film 220.
As shown in fig. 1, the demolding mechanism 60 is disposed on the downstream side in the conveying direction with respect to the heating and pressing mechanism 50. The release mechanism 60 is configured to separate the FPC200 from the release film 10A, B. As described above, in the thermocompression bonding portion 52 provided in the thermal compression mechanism 50, the release film 10 is buried in the concave portion 223 formed in the cover layer 221, and thereby the release film 10 is bonded to the CL film 220 (FPC 200). Thereafter, the roll-to-roll press 100 is configured such that the release film 10 is peeled (released) from the CL film 220 (FPC 200) by the action of the release mechanism 60 (see fig. 2 (c)).
The flexible printed circuit board 200 (FPC 200) can be manufactured using the roll-to-roll press 100 as described above. Hereinafter, a method for manufacturing FPC200 using the roll-to-roll press will be described. The method for manufacturing the molded product of the present invention is applied to the method for manufacturing the FPC 200.
In the present embodiment, the method for manufacturing FPC200 includes: a first step of forming a laminate in which a sheet-shaped glass cloth 300A, a release film 10A, FPC, a release film 10B, and a glass cloth 300B are stacked in this order; a second step of bonding the cover layer 221 (CL film 220) to the flexible circuit board 210 via the adhesive layer 222 in the FPC200 by heating and pressing the laminate; and a third step of releasing the release film 10 (10A, 10B) from the FPC200 to obtain the FPC200 having the CL film 220 bonded to the flexible circuit board 210.
These steps are described in order below.
(First step)
First, the glass cloth 300A, the release film 10A, FPC200, the release film 10B, and the glass cloth 300B, each of which is in a sheet form, are wound around a feed roller, and when conveyed by a conveying mechanism, are stacked in this order (see fig. 1, 2 (a), and 3).
The method of laminating the members (films) into a laminate is not particularly limited, and may be, for example, lamination while pressing by a roller, or lamination while pressing by pressing. The order of stacking the members may be arbitrarily determined. For example, all the members may be stacked at the same time, or the coverlay film 220 and the flexible circuit board 210 may be stacked in advance, and then the other members may be stacked at the same time.
In the first step, the laminate is formed, and thus the release film 10 is disposed on the object (FPC 200) in the method for producing a molded article according to the present invention.
(Second step)
Next, the laminate formed by stacking the glass cloth 300A, the release film 10A, FPC200, the release film 10B, and the glass cloth 300B in this order is heated and pressed by the heating and pressing mechanism 50 (the heated and pressing portion 52), whereby the coverlay 221 (CL film 220) and the flexible circuit board 210 are bonded to each other through the adhesive layer 222 in the FPC200 (heating and pressing step, see fig. 1, 2 (B), and 3).
In the heat pressing step, the temperature at which the FPC200 is heated is not particularly limited, but is preferably, for example, 100 ℃ to 250 ℃, more preferably 150 ℃ to 200 ℃.
In the heat pressing step, the pressure for pressing the FPC200 is not particularly limited, but is preferably 1MPa to 14MPa, more preferably 5MPa to 14 MPa.
Further, the conveyance speed for conveying the laminate is not particularly limited, but is preferably 40mm/sec or more and 400mm/sec or less, and more preferably 200mm/sec or more and 350mm/sec or less.
In the method for producing a molded article of the present invention, the object (FPC 200) provided with the release film 10 is heated and pressed by the heating and pressing step. In addition, when the cover layer 221 (insulating layer) is made of a material containing a thermosetting resin in a semi-cured state, the cover layer 221 forms the surface of the object (FPC 200) on the side where the release film 10 is disposed. Further, since the release film 10 is used to overlap the surface of the cover layer 221 so that the surface of the first release layer 1 is in contact with the surface of the cover layer 221, the thermosetting resin can be cured by maintaining the shape of the cover layer 221 in which the concave portion 223 is formed by the release film 10. Thus, the cover layer 221 (molded article) can be molded on the flexible circuit board 210 with excellent accuracy. Although the method of heating by heating and pressing is described in the present embodiment, the method is not limited to this method, and heating may be performed by infrared rays, for example, or may be performed by a heating roller.
(Third step)
Next, in the release mechanism 60, the release films 10 (10A, 10B) are released from the FPC 200. Namely, the release film 10A and the release film 10B are peeled from the joined body of the coverlay film 220 and the flexible circuit board 210. Thus, an FPC200 (see fig. 1, 2 (c), and 3) in which the CL film 220 is bonded to the flexible circuit board 210 is obtained.
The release mechanism 60 is not particularly limited, and may be, for example, a structure that is peeled off by vacuum suction by providing a vacuum device on the outside, a structure that is peeled off by feeding air between the joined body and the release films 10A, 10B, or a structure that is peeled off by sandwiching a rod between the joined body and the release films 10A, 10B.
Thereafter, the assembly of the coverlay film 220 and the flexible circuit board 210, the glass cloth 300A, the release film 10B, and the glass cloth 300B are wound by the respective winding rolls.
By such winding, the FPC200 in which the flexible circuit board 210 and the CL film 220 are bonded to each other via the adhesive layer 222 provided in the CL film 220 can be continuously obtained while being wound around the roll.
As described above, by applying the manufacturing method of the flexible printed circuit board 200 based on the roll-to-roll press 100 using the release film 10, the flexible printed circuit board 200 can be continuously manufactured.
The release film 10 used in the roll-to-roll press 100 may be a release film of the present invention. That is, as the release film 10, a release film is used which is characterized by comprising a first release layer formed from a first thermoplastic resin composition and a buffer layer, wherein the first release layer has an average thickness of 12 μm or more and 38 μm or less, and the storage modulus E' of the entire release film at 180 ℃ is 30MPa or more.
The release film 10 has such a structure, and thus can be a release film that exhibits both excellent landfill property and releasability in a balanced manner.
Therefore, as described above, in the case where the release film is used to form the FPC200 using the flexible circuit board 210 and the CL film 220, in the second step, the adhesive from the adhesive layer 222 can be reliably inhibited or prevented from oozing into the recess 223 formed in the FPC 200.
Further, after forming the FPC200 in which the flexible circuit board 210 and the CL film 220 are bonded to each other via the adhesive layer 222 provided in the CL film 220, when the release film 10 is peeled off from the FPC200 in the third step, the occurrence of creases and breakage in the FPC200 can be reliably suppressed or prevented.
Hereinafter, a release film 10 to which the release film of the present invention is applied will be described. In the following, a case will be described in which the release film 10 is composed of a laminate in which the first release layer 1, the buffer layer 3, and the second release layer 2 are laminated in this order.
< Release film 10 >)
Fig. 4 is a longitudinal sectional view showing an embodiment of the release film of the present invention, and fig. 5 is a partially enlarged longitudinal sectional view of a portion a of the release film shown in fig. 4. In the following description, for convenience of description, the upper side in fig. 4 and 5 will be referred to as "upper" and the lower side will be referred to as "lower".
As shown in fig. 4, in the present embodiment, the release film 10 is used by stacking the first release layer 1, the buffer layer 3, and the second release layer 2 in this order, and overlapping the first release layer 1 side surface with the CL film 220 provided in the FPC200 so as to contact the CL film 220.
Hereinafter, the respective layers constituting the release film 10 will be described.
< First Release layer 1 >)
First, the first release layer 1 will be described. The first release layer 1 is laminated on one surface side of the buffer layer 3.
In the above-described method for manufacturing the flexible printed circuit board 200 using the roll-to-roll press 100 using the release film 10, the release film 10 is overlapped with the CL film 220 provided in the FPC200 so that the first release layer 1 is in contact with the CL film 220. The first release layer 1 is the following layer: in the second step of the manufacturing method, when the laminated flexible circuit board 210 and CL film 220 are bonded via the adhesive layer 222, a layer is pressed in following the shape of the concave portion 223 formed by the flexible circuit board 210 and CL film 220. Thus, the first release layer 1 functions as a protective (cushioning) material for preventing the release film 10 from breaking. Further, the first release layer 1 functions as a contact layer for exerting excellent releasability of the release film 10 from the CL film 220 (FPC 200) in the third step.
The first release layer 1 is composed of a first thermoplastic resin composition, which is not particularly limited as long as it is a composition capable of setting the storage modulus E' of the release film 10 at 180 ℃ to 30MPa or more, but preferably contains poly 4-methyl 1-pentene resin (polymethylpentene; TPX (registered trademark)) as a main component. This makes it possible to set the storage modulus E' to 30MPa or more relatively easily, and to reliably impart the aforementioned functions to the first release layer 1.
Therefore, as described above, in the case where the release film 10 is used to form the FPC200 using the flexible circuit board 210 and the CL film 220, in the second step, the adhesive from the adhesive layer 222 can be reliably inhibited or prevented from oozing into the recess 223 formed in the FPC 200.
Further, after forming the FPC200 in which the flexible circuit board 210 and the CL film 220 are bonded to each other via the adhesive layer 222 provided in the CL film 220, when the release film 10 is peeled off from the FPC200 in the third step, the occurrence of creases and breakage in the FPC200 can be reliably suppressed or prevented.
Further, the Melt Flow Rate (MFR) of the poly-4-methyl-1-pentene resin measured at 260℃under a load of 5.0kg is preferably 5g/10min or more and 250g/10min or less, more preferably 30g/10min or more and 200g/10min or less, still more preferably 40g/10min or more and 160g/10min or less. This can more remarkably exert the effect obtained by using the poly-4-methyl-1-pentene resin.
The first thermoplastic resin composition may contain a resin material other than the poly (4-methyl-1-pentene) resin, and examples of the resin material include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefin resins other than poly (4-methyl-1-pentene), such as polyethylene and polypropylene; polystyrene resin such as syndiotactic polystyrene, etc., can be used in combination of 1 or 2 or more of these.
The first thermoplastic resin composition may contain at least 1 of inorganic particles and organic particles in addition to the poly 4-methyl 1-pentene resin. By including the particles as described above in the first thermoplastic resin composition, particularly when the air knife film forming method is used, as shown in fig. 5, the first release layer 1 having the concave-convex shape on the surface of the first release layer 1 on the opposite side from the buffer layer 3 can be formed.
The inorganic particles are not particularly limited, but examples thereof include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, amorphous silica, antimony oxide, E glass, D glass, S glass, and the like, and 1 or 2 or more of these may be used in combination.
The organic particles are not particularly limited, but examples thereof include polystyrene particles, acrylic particles, polyimide particles, polyester particles, silicone particles, polypropylene particles, polyethylene particles, fluororesin particles, core-shell particles, and the like, and 1 or 2 or more of these can be used in combination.
Further, the average particle diameter of the inorganic particles and the organic particles is preferably 3 μm or more and 20 μm or less, more preferably 5 μm or more and 20 μm or less. This enables the surface of the first release layer 1 opposite to the buffer layer 3 to be reliably formed into the concave-convex shape.
In the first release layer 1 having the above-described uneven shape on the surface, the ten-point average roughness (Rz) on the surface is preferably 3 μm or more and 20 μm or less, more preferably 5 μm or more and 17 μm or less, and still more preferably 7 μm or more and 17 μm or less. This can more reliably impart the aforementioned functions to the first release layer 1. In the second step, when the first mold release layer 1 is pressed into the concave portion 223 formed in the FPC200, the transfer of the concave-convex shape to the surfaces of the flexible circuit board 210 and the CL film 220 can be reliably suppressed or prevented. In addition, the ten-point average roughness (Rz) can be measured in accordance with JIS B0601-1994.
The storage modulus E'1 of the first release layer 1 having such a structure at 180 ℃ is preferably 60MPa or more, more preferably 65MPa or more and 150MPa or less, still more preferably 68MPa or more and 150MPa or less, and particularly preferably 70MPa or more and 100MPa or less. Thus, the storage modulus E '1 of the first release layer 1 at 180 ℃ is set as described above, whereby the storage modulus E't of the release film 10 at 180 ℃ can be set to 30MPa or more relatively easily.
In addition, the storage modulus E'1 of the first release layer 1 at 180 ℃ can be obtained by: a first release layer 1 having a width of 4mm and a length of 20mm was prepared in accordance with JIS K7244-4, and the measurement was carried out using a dynamic viscoelasticity measuring apparatus (manufactured by SII nanotechnology Co., ltd. (SII NanoTechnology Inc.) "DMS 6100") under the conditions of a stretching mode, a frequency of 1Hz, and a heating rate of 5 ℃/min.
In the present invention, the average thickness T1 of the first release layer 1 is set to 12 μm or more and 38 μm or less, preferably 14 μm or more and 36 μm or less, and more preferably 25 μm or more and 36 μm or less. This can more reliably impart the aforementioned functions to the first release layer 1, and can reliably set the storage modulus E' of the release film 10 at 180 ℃ to 30MPa or more.
When the average thickness of the first release layer 1 is T1[ mu ] m, and the storage modulus E 'of the first release layer 1 at 180 ℃ is E'1[ MPa ], E '1/T1[ MPa/mu ] m preferably satisfies a relation of 2.1 < E'1/T1 < 6.0, more preferably satisfies a relation of 2.2 < E '1/T1 < 5.0, and even more preferably satisfies a relation of 2.2 < E'1/T1 < 2.9. This can more remarkably exert the effect obtained by setting the storage modulus E' and the average thickness of the first release layer 1 as described above.
In addition, as described above, regarding the thickness of the first release layer 1, in the case where the surface of the first release layer 1 on the opposite side from the buffer layer 3 has the concave-convex shape, the thickness is measured at the position including the convex portion in the convex portion and at the position including the concave portion in the concave portion, respectively.
The first thermoplastic resin composition constituting the first release layer 1 may contain additives such as a nucleating agent, an antioxidant, a slip agent (SLIP AGENT), an anti-adhesive agent, an antistatic agent, a colorant, and a stabilizer, in addition to the resin material, the inorganic particles, and the organic particles.
In addition, when the crystal nucleus agent is contained in the first thermoplastic resin composition, the crystallinity of polymethylpentene can be improved, and as a result, the storage modulus E' can be set to 30MPa or more relatively easily.
In this case, the content of the crystal nucleus agent in the first thermoplastic resin composition is preferably 0.1% by weight or more and 2.0% by weight or less, more preferably 0.3% by weight or more and 0.8% by weight or less.
< Buffer layer 3 >)
Next, the buffer layer 3 will be described. The buffer layer 3 is arranged as an intermediate layer between the first release layer 1 and the second release layer 2.
The buffer layer 3 has excellent followability. As described above, in the method for manufacturing the flexible printed circuit board 200 by the roll-to-roll press 100 using the release film 10, the release film 10 is overlapped with the CL film 220 provided in the FPC200 so that the first release layer 1 is in contact with the CL film 220. The buffer layer 3 is the following layer: in the second step of the manufacturing method, when the laminated flexible circuit board 210 and CL film 220 are bonded via the adhesive layer 222, the first mold release layer 1 is pressed into the layer of the first mold release layer 1 so as to follow the shape of the concave portion 223 formed by the flexible circuit board 210 and CL film 220, and has a function as a buffer. Further, by providing the buffer layer 3 in the release film 10, the CL film 220 can be pressed against the flexible circuit board 210 by the release film 10 with a uniform pressure.
The buffer layer 3 is composed of a third thermoplastic resin composition, which is not particularly limited as long as it can impart excellent followability to the buffer layer 3, but preferably contains, for example, a poly 4-methyl-1-pentene resin (polymethylpentene; TPX (registered trademark)) and a polyolefin resin different from the poly 4-methyl-1-pentene resin. This can provide excellent follow-up properties to the buffer layer 3, and can provide excellent adhesion of the buffer layer 3 to the first release layer 1 and the second release layer 2.
The content of the poly-4-methyl-1-pentene resin in the third thermoplastic resin composition is preferably 20% by weight or more, more preferably 20% by weight or more and 50% by weight or less. This can more remarkably exhibit the effect obtained by the configuration including the poly 4-methyl-1-pentene resin and the polyolefin resin.
Further, the Melt Flow Rate (MFR) of the poly-4-methyl-1-pentene resin measured at 260℃under a load of 5.0kg is preferably 5g/10min or more and 250g/10min or less, more preferably 15g/10min or more and 200g/10min or less, still more preferably 20g/10min or more and 150g/10min or less. In this way, in the second step, the buffer layer 3 can be more reliably provided with a function as a press-fit layer for pressing the first release layer 1 so that the first release layer 1 follows the shape of the recess 223 formed by the flexible circuit board 210 and the CL film 220.
The polyolefin resin other than the poly 4-methyl-1-pentene resin contained in the third thermoplastic resin composition is not particularly limited, and examples thereof include α -olefin polymers such as polyethylene and polypropylene; an α -olefin copolymer having ethylene, propylene, butene, pentene, hexene, methylpentene, etc. as a polymer component, etc., may be used in combination of 1 or 2 or more of these.
The average thickness Tk of the buffer layer 3 is preferably 40 μm or more and 110 μm or less, more preferably 50 μm or more and 100 μm or less, and still more preferably 60 μm or more and 85 μm or less. This can more reliably impart the aforementioned functions to the buffer layer 3, and can reliably set the storage modulus E' of the release film 10 at 180 ℃ to 30MPa or more.
The third thermoplastic resin composition constituting the buffer layer 3 may contain the same additives as those listed for the first thermoplastic resin composition, in addition to the resin materials described above.
< Second Release layer 2 >)
Next, the second release layer 2 will be described. The second release layer 2 is laminated on the other surface side of the buffer layer 3, that is, on the opposite surface side of the buffer layer 3 from the first release layer 1.
The second release layer 2 has flexibility. As described above, in the method for manufacturing the flexible printed circuit board 200 by the roll-to-roll press 100 using the release film 10, the release film 10 is overlapped with the CL film 220 provided in the FPC200 so that the first release layer 1 is in contact with the CL film 220. The second release layer 2 functions as the following layer: in the second step of the manufacturing method, when the laminated flexible circuit board 210 and CL film 220 are bonded via the adhesive layer 222, the force from the heating press plate 521 is transmitted to the layer of the buffer layer 3. Further, the second release layer 2 functions as a contact layer for exerting excellent releasability between the glass cloths 300A and 300B and the release film 10 in the third step.
The second release layer 2 is formed of a second thermoplastic resin composition, which is not particularly limited as long as it is a composition capable of setting the storage modulus E' of the release film 10 at 180 ℃ to 30MPa or more, but preferably contains poly 4-methyl 1-pentene resin (polymethylpentene; TPX (registered trademark)) as a main component in the same manner as the first thermoplastic resin composition. This makes it possible to set the storage modulus E' to 30MPa or more relatively easily, and to reliably impart the aforementioned functions to the second release layer 2.
Further, the Melt Flow Rate (MFR) of the poly-4-methyl-1-pentene resin measured at 260℃under a load of 5.0kg is preferably 5g/10min or more and 250g/10min or less, more preferably 30g/10min or more and 200g/10min or less, still more preferably 40g/10min or more and 160g/10min or less. This can more remarkably exert the effect obtained by using the poly-4-methyl-1-pentene resin.
The second thermoplastic resin composition may contain a resin material other than the poly 4-methyl-1-pentene resin, and as the resin material, the same resin material as the resin material mentioned for the first thermoplastic resin composition can be used.
The second thermoplastic resin composition may contain at least 1 of inorganic particles and organic particles in addition to the poly 4-methyl 1-pentene resin. By including the particles as described above in the second thermoplastic resin composition, particularly when the air knife film forming method is used, as shown in fig. 5, the second release layer 2 having the concave-convex shape on the surface of the second release layer 2 on the opposite side from the buffer layer 3 can be formed.
The inorganic particles and the organic particles are not particularly limited, but the same materials as those listed in the first thermoplastic resin composition can be used.
Further, the average particle diameter of the inorganic particles and the organic particles is preferably 3 μm or more and 20 μm or less, more preferably 5 μm or more and 20 μm or less. This enables the surface of the second release layer 2 opposite to the buffer layer 3 to be reliably formed into the concave-convex shape.
In the second release layer 2 having the surface with the uneven shape, the ten-point average roughness (Rz) on the surface is preferably 3 μm or more and 20 μm or less, more preferably 5 μm or more and 17 μm or less, and still more preferably 7 μm or more and 17 μm or less. This can more reliably impart the aforementioned functions to the second release layer 2. In addition, the ten-point average roughness (Rz) can be measured in accordance with JIS B0601-1994.
The storage modulus E'2 of the second release layer 2 having such a structure at 180 ℃ is preferably 60MPa or more, more preferably 65MPa or more and 150MPa or less, still more preferably 68MPa or more and 150MPa or less, and particularly preferably 70MPa or more and 100MPa or less. Thus, the storage modulus E 'of the second release layer 2 at 180 ℃ is set as described above, whereby the storage modulus E' of the release film 10 at 180 ℃ can be set to 30MPa or more relatively easily.
The average thickness T2 of the second release layer 2 is preferably 12 μm or more and 38 μm or less, more preferably 14 μm or more and 36 μm or less, and still more preferably 25 μm or more and 36 μm or less. This can more reliably impart the aforementioned functions to the second release layer 2, and can reliably set the storage modulus E' of the release film 10 at 180 ℃ to 30MPa or more.
The second thermoplastic resin composition constituting the second release layer 2 may contain the same additives as those listed for the first thermoplastic resin composition, except for the resin material, inorganic particles, and organic particles.
In the first release layer 1 and the second release layer 2, the first thermoplastic resin composition and the second thermoplastic resin composition may be the same or different, but are preferably the same or have the same properties from the viewpoint of substitution. Further, the average thickness of the first release layer 1 and the second release layer 2 may be the same or different.
In the present invention, the average thickness T1 of the first release layer 1 provided in the release film 10 is set to 12 μm or more and 38 μm or less, and the storage modulus E' T of the release film 10 at 180 ℃ is set to 30MPa or more.
As described above, when the release film 10 is used to form the FPC200 using the flexible circuit board 210 and the CL film 220, the average thickness of the first release layer 1 pressed into the concave portion 223 formed in the FPC200 in the second step is set within the above-described range, and the storage modulus E' of the release film 10 as a whole under 180 ℃ condition is set to the above-described lower limit value or more, whereby the release film 10 exhibiting both excellent landfill property and releasability in a balanced manner can be obtained.
Therefore, as described above, in the case where the release film 10 is used to form the FPC200 using the flexible circuit board 210 and the CL film 220, in the second step, the adhesive from the adhesive layer 222 can be reliably inhibited or prevented from oozing into the recess 223 formed in the FPC 200.
Specifically, the release film 10 having a width of 270mm is pressed by the roll-to-roll press 100 at 180 ℃, 11MPa, and 120sec to a laminate formed by attaching a coverlay film 220 (manufactured by japan glossy manufacturing company (Arisawa Manufacturing co., ltd.), "CMA 0525") to a flexible circuit board 210 having irregularities (circuits) having a pitch of 50 μm, a width of 50 μm, and a height of 18 μm, and the adhesive layer 222 provided in the coverlay film 220 is set to be on the side of the flexible circuit board 210, and then when one end of the release film 10 is gripped and peeled off, the maximum amount of adhesive in a planar view in the concave portion of the laminate is preferably set to be 100 μm or less, more preferably 85 μm or less.
Further, after forming the FPC200 in which the flexible circuit board 210 and the CL film 220 are bonded to each other via the adhesive layer 222 provided in the CL film 220, when the release film 10 is peeled off from the FPC200 in the third step, the occurrence of creases and breakage in the FPC200 can be reliably suppressed or prevented.
Specifically, when the release film 10 having a width of 270mm is pressed against the flexible circuit board 210 having irregularities (circuits) having a pitch of 50 μm, a width of 50 μm, and a height of 18 μm by the roll-to-roll press 100 at 180 ℃, 11MPa, and 120sec, and the flexible circuit board 210 and the release film 10 are peeled off while being conveyed immediately after the pressing, the limiting peeling speed at which wrinkles are not observed in the release film 10 can be preferably set to 100 mm/sec or more, more preferably set to 150 mm/sec or more, still more preferably set to 190 mm/sec or more, and particularly preferably set to 250 mm/sec or more.
As described above, the maximum bleeding amount is set to the upper limit value or less and the limit peeling speed is set to the lower limit value or more, so that the release film 10 can be said to be a release film that exhibits both excellent filling property and release property in a balanced manner.
The storage modulus E't of the release film 10 at 180℃is not less than 30MPa, but preferably not less than 30MPa and not more than 150 MPa. Thus, the release film 10 exhibiting both excellent landfill property and excellent release property can be obtained more uniformly.
In addition, the storage modulus E't of the release film 10 at 180 ℃ can be obtained by: a release film 10 having a width of 4mm and a length of 20mm was prepared in accordance with JIS K7244-4, and the film was measured in a stretching mode at a frequency of 1Hz and a heating rate of 5 ℃/min by using a dynamic viscoelasticity measuring apparatus (manufactured by SII nanotechnology Co., ltd. (SII NanoTechnology Inc.) "DMS 6100").
Further, the average thickness Tt of the release film 10 is preferably 80 μm or more and 180 μm or less, more preferably 90 μm or more and 160 μm or less. Further, T1/Tk, which is a relational expression between the average thickness Tk of the buffer layer 3 and the average thickness T1 of the first release layer 1, is preferably 0.5 or less, more preferably 0.3 or more and 0.4 or less. By satisfying these thickness relationships, the release film 10 that exhibits both excellent landfill property and excellent release property in a more balanced manner can be obtained.
In the present embodiment, the release film 10 is formed of a laminate in which the first release layer 1, the buffer layer 3, and the second release layer 2 are laminated in this order, but the present invention is not limited to this configuration, and may be formed of a laminate having an intermediate layer such as an adhesive layer disposed between at least one of the first release layer 1 and the buffer layer 3 and between the second release layer 2 and the buffer layer 3.
In the third step, if the release film 10 can maintain excellent releasability between the glass cloths 300A and 300B and the release film 10, the second release layer 2 contacting the glass cloths 300A and 300B may be omitted.
The method for producing the release film and the molded article of the present invention has been described above, but the present invention is not limited to these.
For example, in the above-described embodiment, the case where the release film of the present invention is used as a release film for roll-to-roll press suitable for manufacturing a flexible printed circuit board by a roll-to-roll press, that is, the case where a cover layer (functional layer) having a recess formed therethrough is bonded to a flexible circuit board (substrate) via an adhesive layer by press by a roll-to-roll method has been described, but the present invention is not limited thereto. Specifically, the release film of the present invention can be used even when a functional layer having a through recess is bonded to a substrate via an adhesive layer by using a press molding method, a vacuum pressure forming method, or the like different from the roll-to-roll method.
Examples (example)
Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited thereto.
1. Preparation of raw materials
As raw materials for manufacturing the release film, the following materials were prepared, respectively.
(Thermoplastic resin Material)
Poly (4-methyl-1-pentene) resin I (4-methyl-1-pentene/hexadecene/octadecene copolymer), MFR=100 g/10min
Poly (4-methyl-1-pentene) resin II (4-methyl-1-pentene/decene-1 copolymer), MFR=180 g/10min
Poly (4-methyl-1-pentene) resin III (4-methyl-1-pentene-decene-1 copolymer), MFR=9 g/10min
Poly 4-methyl-1-pentene resin IV (4-methyl-1-pentene/decene-1 copolymer, MFR=21 g/10 min)
Low Density polyethylene (LDPE, yu Kong Bolus polyethylene Co., ltd. (tube-Maruzen Polyethlene Co, ltd.) "R500"
Polypropylene (PP, manufactured by Sumitomo chemical Co. (Sumitomo Chemical Co., ltd.) "FH 1016")
Ethylene-methyl methacrylate copolymer (EMMA, manufactured by sumitomo chemical company (Sumitomo Chemical co., ltd.) "WD 106")
Ethylene-methyl acrylate copolymer (EMA, sanjingchen Poly chemical Co., ltd. (DOW-MITSUI POLYCHEMICALS CO., LTD.) "ELVALOY AC 1125")
(Particulate Material)
Amorphous silica (manufactured by Si, nippon STEEL CHEMICAL & Material Co., ltd.,. Phi.12 μm, "SC 10-32F.)
Acrylic beads (manufactured by Soken Chemical & Engineering Co., ltd.,. Phi.10μm, "MZ-10 HN")
(Nucleating agent)
GEL ALL DXR (manufactured by new japan physicochemical company (New Japan Chemical co., ltd.))
2. Production of release film
Example 1 >
First, a poly 4-methyl-1-pentene resin I was prepared as a first thermoplastic resin composition and a second thermoplastic resin composition, respectively. As the third thermoplastic resin composition, a composition comprising 50 parts by weight of low-density polyethylene (R500), 30 parts by weight of polypropylene (FH 1016) and 20 parts by weight of poly 4-methyl-1-pentene resin I was prepared.
Next, a first thermoplastic resin composition, a third thermoplastic resin composition, and a second thermoplastic resin composition were laminated in a T-die to form 1 molten resin laminate, and then cooled and solidified to form a laminate in which the buffer layer 3 and the second release layer 2 were laminated in this order on the first release layer 1, thereby obtaining the release film 10 of example 1. In addition, during cooling, the molten resin was sandwiched between a metal roll having an embossed shape at 100℃and a rubber roll having an embossed shape at 30℃and transferred with irregularities while cooling.
In addition, in the obtained release film 10, the average thickness T1 of the first release layer 1 was 25 μm, the average thickness Tk of the buffer layer 3 was 70 μm, and the average thickness T2 of the second release layer 2 was 25 μm.
The storage modulus E't and the storage modulus E'1 at 180 ℃ were measured using a dynamic viscoelasticity measuring device (manufactured by SII nanotechnology corporation (SII NanoTechnology inc., "DMS 6100"), respectively, for the release film 10 and the first release layer 1, and the results were 34MPa and 72MPa.
Further, ten-point average roughness (Rz) was measured on the surface exposed on the opposite side to the buffer layer 3 by using a surface roughness measuring device (manufactured by Mitutoyo corporation, "SURFTEST SJ-210") for each of the first release layer 1 and the second release layer 2, and as a result, 15.8 μm and 10.3 μm were obtained.
Example 2 to example 10, comparative example 1 to comparative example 4 >
The release films 10 of examples 2 to 10 and comparative examples 1 to 4 were obtained in the same manner as in example 1 except that the materials shown in table 1 were used as the first thermoplastic resin composition, the second thermoplastic resin composition, and the third thermoplastic resin composition to form the first release layer 1, the buffer layer 3, and the second release layer 2 each having a surface ten-point average roughness (Rz) and an average thickness shown in table 1. In examples 3,4 and 9 in which particles were contained in the first and second release layers, when the molten resin laminate was cooled, the molten resin was pressed against a metal roll having an embossed shape at 100 ℃ by the air pressure of an air knife, and the filler was exposed and cooled to form irregularities.
3. Evaluation
The release films 10 of each example and each comparative example were evaluated as follows using a roll-to-roll press 100.
3-1 Mold release Property of mold release film
The release films 10 of each example and each comparative example were each formed to have a width of 270mm. When the release film 10 was pressed and attached to a flexible circuit board 210 having irregularities with a pitch of 50 μm, a width of 50 μm, and a height of 18 μm by a roll-to-roll press 100 at 180 ℃ under conditions of 11MPa and 120sec, the release film 10 was immediately conveyed after the pressing, and the release film 10 and the flexible circuit board 210 were peeled off by a release rod provided in the release mechanism 60, and the limiting peeling rate at which wrinkles were not observed in the release film 10 was measured.
3-2 Landfill Property of Release film
The release films 10 of each example and each comparative example were each formed to have a width of 270mm. Then, the release film 10 was pressed by a roll-to-roll press 100 at 180 ℃ and under 11MPa and 120s to a laminate having projections and depressions with a pitch of 50 μm, a width of 50 μm, and a height of 18 μm, which was formed by adhering a coverlay film 220 (manufactured by japan glossy manufacturing company (Arisawa Manufacturing co., ltd.) "CMA 0525") to the flexible circuit board 210, and the adhesive layer 222 provided in the coverlay film 220 was set on the side of the flexible circuit board 210, and then, the maximum adhesive bleeding amount in a plan view in the concave portion of the laminate was measured when one end of the release film 10 was peeled off.
3-3. Summary
The evaluation results obtained in the releasability of the 3-1 release film and the landfill ability of the 3-2 release film are shown in Table 1.
As shown in table 1, in each example, both the average thickness of the first release layer 1 was 12 μm or more and 38 μm or less and the storage modulus E't of the release film 10 at 180 ℃ was 30MPa or more were satisfied. As a result, it was found that the maximum release rate was 100 mm/sec or more and the maximum release amount of the adhesive was 100 μm or less, and that both excellent landfill property and excellent releasability were exhibited in a balanced manner.
In contrast, in each comparative example, the first release layer 1 had an average thickness of 12 μm or more and 38 μm or less, and the release film 10 had a storage modulus E't at 180 ℃ of 30MPa or more. This shows that the maximum release rate of the adhesive is 100 mm/sec or more and the maximum release rate of the adhesive is 100 μm or less, and that both excellent landfill property and excellent releasability cannot be uniformly exhibited.
Industrial applicability
According to the present invention, a release film that exhibits both excellent landfill property and excellent releasability can be provided in a balanced manner. Therefore, in the case where the release film is used for forming, for example, a flexible printed circuit board using a flexible circuit board and a coverlay film, bleeding of the adhesive into a recess formed in the flexible printed circuit board can be reliably suppressed or prevented. Further, when the release film is peeled off from the flexible printed circuit board after the flexible printed circuit board is formed, occurrence of creases and breakage in the flexible printed circuit board can be reliably suppressed or prevented. Therefore, the present invention has industrial applicability.
Claims (7)
1. A release film having a first release layer formed of a first thermoplastic resin composition and a buffer layer formed of a third thermoplastic resin composition, characterized in that,
The first thermoplastic resin composition comprises a poly 4-methyl 1-pentene resin,
The third thermoplastic resin composition comprises a poly (4-methyl-1-pentene) resin and a polyolefin resin which is different from the poly (4-methyl-1-pentene) resin,
The average thickness of the first release layer is 12 [ mu ] m or more and 38 [ mu ] m or less, the average thickness of the buffer layer is 60 [ mu ] m or more and 110 [ mu ] m or less, T1/Tk satisfies the relationship of 0.21 < T1/Tk < 0.50 when T1[ mu ] m is the average thickness of the first release layer and Tk [ mu ] m is the average thickness of the buffer layer,
The first release layer has a storage modulus E '1 at 180 ℃ of 70MPa or more and less than 95MPa, the release film has a storage modulus E't at 180 ℃ of 30MPa or more,
Applying the release film having a width of 270mm to a flexible circuit board having irregularities having a pitch of 50 μm, a width of 50 μm and a height of 18 μm by a roll-to-roll press at 180 ℃ under 11MPa for 120sec, and peeling the flexible circuit board and the release film while conveying immediately after the application of the pressure, wherein a limit peeling speed at which wrinkles are not observed in the release film is 180 mm/sec or more, and
The release film having a width of 270mm was pressed under conditions of 180 ℃ and 11MPa and 120sec to a laminate formed by attaching a cover film of "CMA0525" manufactured by Japan glossy manufacturing company to a flexible circuit board having irregularities having a pitch of 50 μm, a width of 50 μm and a height of 18 μm, and the adhesive layer provided on the cover film was used as the side of the flexible circuit board, and then, when one end of the release film was gripped and peeled off, the maximum adhesive bleeding amount in a planar view in the concave portion of the laminate was 85 μm or less.
2. The release film according to claim 1, wherein,
The release film has an average thickness of 80 μm or more and 180 μm or less.
3. The release film according to claim 1, wherein,
In the first release layer, the ten-point average roughness Rz on the surface on the opposite side of the buffer layer is 3 μm or more and 20 μm or less.
4. The release film according to claim 1, wherein,
When the average thickness of the first release layer is T1 μm and the storage modulus E 'of the first release layer at 180 ℃ is E'1MPa, E '1/T1 MPa/μm satisfies the relationship of 2.1 < E'1/T1 < 6.0.
5. The release film according to claim 1, wherein,
The release film has a second release layer formed of a second thermoplastic resin composition laminated on the opposite side of the buffer layer from the first release layer.
6. The release film according to claim 1, wherein,
The release film is used by overlapping the release film on the surface of the object so that the surface of the first release layer side is in contact with the surface of the object formed of a material containing a thermosetting resin in a semi-cured state.
7. A method for producing a molded article, characterized by,
The method for producing a molded article comprises a step of disposing a release film on an object such that the first release layer of the release film according to any one of claims 1 to 6 is on the object side, and a step of heating and pressing the object on which the release film is disposed, and in the step of disposing the release film, the surface of the object on the side on which the release film is disposed is formed of a material containing a thermosetting resin in a semi-cured state.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-136422 | 2020-08-12 | ||
| JP2020136422 | 2020-08-12 | ||
| PCT/JP2021/028849 WO2022034834A1 (en) | 2020-08-12 | 2021-08-03 | Mold release film and method for manufacturing molded product |
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| Publication Number | Publication Date |
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| CN115515787A CN115515787A (en) | 2022-12-23 |
| CN115515787B true CN115515787B (en) | 2024-11-05 |
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| JP (1) | JP7283639B2 (en) |
| CN (1) | CN115515787B (en) |
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|---|---|---|---|---|
| JP2015013465A (en) * | 2013-06-06 | 2015-01-22 | 住友ベークライト株式会社 | Release film and usage of release film |
| JP2016203475A (en) * | 2015-04-22 | 2016-12-08 | 住友ベークライト株式会社 | Release film and method for manufacturing molded product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005187526A (en) * | 2003-12-24 | 2005-07-14 | Sumitomo Bakelite Co Ltd | Mold release film and method for producing flexible film with the same |
| JP4786657B2 (en) * | 2005-05-13 | 2011-10-05 | 三井化学株式会社 | Laminated body containing 4-methyl-1-pentene polymer and release film comprising the same |
| WO2008001682A1 (en) * | 2006-06-27 | 2008-01-03 | Mitsui Chemicals, Inc. | Film and mold release film |
| CN102869687B (en) * | 2010-04-28 | 2015-03-18 | 三井化学株式会社 | Resin fine powder consisting of 4-methyl-1-pentene polymer, composition containing same, and process for production thereof |
| JP5895755B2 (en) * | 2012-07-17 | 2016-03-30 | 住友ベークライト株式会社 | Release film |
| CN106062947B (en) * | 2014-03-07 | 2019-03-05 | Ａｇｃ株式会社 | The manufacturing method and mold release film of semiconductor element mounting packaging body |
| JP6352034B2 (en) * | 2014-04-21 | 2018-07-04 | 三井化学東セロ株式会社 | Multi-layer release film |
| WO2017169654A1 (en) * | 2016-03-30 | 2017-10-05 | 住友ベークライト株式会社 | Mold release film and method for producing molded article |
| US10703070B2 (en) * | 2016-03-30 | 2020-07-07 | Asahi Kasei Kabushiki Kaisha | Resin composite film including cellulose microfiber layer |
| WO2018025932A1 (en) * | 2016-08-03 | 2018-02-08 | 積水化学工業株式会社 | Interlayer film for colored laminated glass, and colored laminated glass |
| WO2018110361A1 (en) * | 2016-12-16 | 2018-06-21 | 東レフィルム加工株式会社 | Release film and protective film |
| TWI784191B (en) * | 2018-08-24 | 2022-11-21 | 日商住友電木股份有限公司 | Release film and method for manufacturing molded article |
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- 2021-08-03 JP JP2022542816A patent/JP7283639B2/en active Active
- 2021-08-03 WO PCT/JP2021/028849 patent/WO2022034834A1/en active Application Filing
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| JP2015013465A (en) * | 2013-06-06 | 2015-01-22 | 住友ベークライト株式会社 | Release film and usage of release film |
| JP2016203475A (en) * | 2015-04-22 | 2016-12-08 | 住友ベークライト株式会社 | Release film and method for manufacturing molded product |
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| JPWO2022034834A1 (en) | 2022-02-17 |
| TW202214442A (en) | 2022-04-16 |
| WO2022034834A1 (en) | 2022-02-17 |
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| CN115515787A (en) | 2022-12-23 |
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