CN115413126A - Large-size single-sided circuit board preparation method based on hybrid process - Google Patents

Abstract

The invention is suitable for the technical field of circuit board processing, and provides a method for preparing a large-size single-sided circuit board based on a hybrid process, wherein a photoetching process is adopted for preparing a circuit layer to realize circuit transfer printing, meanwhile, a traditional exposure process is still adopted for preparing a solder mask, and in order to realize the exposure of a large-size substrate, a glass film is adopted to ensure that a graph cannot deform; in addition, in order to meet the production requirement of the large-size circuit board, a plurality of links of the existing production line are improved, and finally, the full-automatic large-size high-precision circuit board production line is realized. By adopting the technical scheme of the invention, the performance and the production efficiency of the single-sided circuit board can be further improved, and the production cost of the single-sided circuit board is further reduced.

Description

Large-size single-sided circuit board preparation method based on hybrid process

Technical Field

The invention belongs to the technical field of circuit board processing, and particularly relates to a preparation method of a large-size single-sided circuit board based on a hybrid process.

Background

A Circuit Board, also called a Printed Circuit Board or a Printed Circuit Board, abbreviated as PCB (Printed Circuit Board), is a carrier for electrical connection between electronic components, and is one of important components in the electronic industry. The single-sided circuit board has the advantage of low cost and is widely applied to many technical fields. With the continuous progress of the application technology of electronic products, the demand for high-precision and large-size single-sided circuit boards is continuously increased.

In the prior art, the automation degree of the single-sided circuit board preparation process is not high, and at present, no full-automatic single-sided circuit board production line exists, so that the production efficiency is low, the production cost is relatively high, and the precision and the size of the circuit board are both bottleneck; in the existing single-panel process, only small-size circuit boards can be usually prepared, and the main reason is that the existing circuit layer preparation adopts an exposure process, a large-size film is easy to deform, and the line width of a circuit pattern is reduced due to the refraction of light in the exposure process, so that the circuit has risks of insufficient line width, open circuit and the like, and the large-size precise circuit board cannot be prepared. Therefore, in the existing process, a standard substrate needs to be cut into small plates with corresponding sizes, which not only increases the complexity of the process, but also causes the waste of the plates to a certain extent. If a large-size circuit board can be adopted, the board space can be utilized to the maximum extent through pattern splicing, and the production cost is further reduced.

In addition, although the precision of the photoetching process is high, the photoetching efficiency is relatively low, and therefore, the circuit photoetching in the actual production by the applicant adopts a plurality of photoetching machines to carry out the circuit photoetching simultaneously; meanwhile, the applicant also finds that the actual effect of using the photoetching process in the preparation of the solder mask layer is poor in production line research and test, the photoetching effect is poor because white oil is coated on the solder mask photoetching, meanwhile, the photoetching process needs a long time, the requirements of the preparation process cannot be met, the speed of the production process is not matched with that of other processes, and the integral production efficiency is further greatly reduced.

Therefore, there is a need in the art for an automated technology for manufacturing large-sized circuit boards, so as to solve the technical problems in the prior art.

Disclosure of Invention

Aiming at the problems in the prior art, the large-size single-sided circuit board production process based on the hybrid process provided by the invention adopts the photoetching process to realize circuit transfer printing, so that the limitation of the size of a film is not required, and the preparation of a high-precision large-size circuit layer can be very conveniently realized; meanwhile, in order to meet the production requirements of large-size circuit boards, a plurality of links of the existing production line are improved, and finally, a full-automatic large-size high-precision circuit board production line is realized.

The technical scheme adopted by the invention for solving the technical problem is as follows: a preparation method of a large-size single-sided circuit board based on a hybrid process comprises the following steps:

(1) Pre-treating a substrate: directly transferring a substrate plate to be processed to a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate;

(2) Line coating and photoetching: uniformly coating a layer of circuit ink on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine;

(3) Line development: placing the substrate in a developing machine for developing treatment, and removing the ink which is not photoetched;

(4) Etching copper: carrying out chemical reaction on the copper surface without ink protection by using strong acid or strong alkali to remove the copper surface without ink protection, and only keeping the pattern with ink protection;

(5) And (3) removing the film: removing the circuit printing ink for protecting the copper wires on the substrate, and exposing all the copper wires;

(6) Solder resist coating: coating solder resist ink on the whole surface of the copper wire surface of the substrate by using a coating machine,

(7) Solder resist exposure: exposing the substrate by an exposure machine, wherein a glass film is adopted in the process;

(8) Solder resist development: placing the exposed substrate in a developing machine for developing treatment;

(9) High-temperature curing: conveying the substrate to a high-temperature curing furnace, and curing the solder resist ink completely after high-temperature curing to increase the adhesive force between the substrate and the solder resist ink;

(10) Cutting: the large-sized substrate plate is cut into respective small plates or finished products using a laser cutter.

Preferably, the conveying device between the adjacent processes adopts a telescopic conveying device.

Preferably, the step 2 and the step 7 are performed by using double-layer transmission.

Preferably, a temporary storage device is arranged between the adjacent working procedures.

Preferably, in the steps 1 to 10, the substrate is subjected to a centering treatment before entering the next process.

Preferably, after the step 2, the step 7 and the step 9 are completed, the cooling treatment is respectively carried out on the basic materials.

Preferably, in the step 5, after the film removal is completed, the substrate is brushed, washed and air-dried to remove stains on the surface of the substrate.

Preferably, the substrate is cleaned and then subjected to a dust-binding treatment.

Preferably, in the step 4, the substrate is turned over by 180 degrees before the substrate is corroded by copper, the corrosive liquid is sprayed from the lower part of the substrate, the corrosion effect is improved, and the substrate is turned over by 180 degrees after the copper corrosion is finished, so that the copper-clad surface is upward, and the requirement of scrubbing and removing the film is met.

Preferably, a photoetching machine is adopted in the step 2 for circuit photoetching, a glass film exposure machine is used for exposure in the step 7, the exposure machine utilizes an LED lamp to emit ultraviolet strong light, and ultraviolet light penetrating through the transparent part of the glass film is utilized to carry out appropriate UV curing on the solder resist ink on the surface of the circuit board in time.

The beneficial effects of the invention are: the technical scheme of the application provides a full-automatic production line of a large-size single-sided circuit board, so that the performance and the production efficiency of the single-sided circuit board can be further improved, and the production cost of the single-sided circuit board is further reduced; in the process, the line transfer printing is realized by adopting a photoetching process, so that the limitation of the size of a film is not required; in addition, considering that the precision requirement of the solder mask lithography is not high, the traditional exposure process is still adopted for preparing the solder mask layer, the traditional film is replaced by the glass film, and the glass film is not easy to deform, so that the exposure of a large-size circuit can be realized, and the production efficiency of the circuit board can be further improved compared with the solder mask lithography process; meanwhile, in order to meet the production requirements of large-size circuit boards, a plurality of links of the existing production line are improved, wherein the telescopic conveying device is arranged to realize full-automatic steering, so that the arrangement and planning of the production line and the movement of the transmission device are facilitated, and the utilization rate of equipment is improved; the double-layer transmission device is arranged and matched with the manipulator, so that the production efficiency is improved, and meanwhile, the feeding and discharging are convenient to manage; a certain amount of substrates can be temporarily stored through the temporary storage device; when equipment in the next process has problems, a signal can be sent to the temporary storage device through the controller, and the temporary storage device starts to store the substrate after receiving the signal, so that the processing of the circuit board is facilitated; before the substrate is corroded by copper, the substrate is turned over by 180 degrees through a plate turnover machine, and corrosive liquid is sprayed from the lower part of the substrate, so that the corrosion effect is improved; the solder mask adopts an exposure process, so that the speed of the production process of the solder mask can be matched with that of other processes, and the production efficiency of enterprises is greatly improved.

Drawings

FIG. 1 is a schematic view of a telescopic drive of the present invention;

FIG. 2 is a schematic view of the fixing frame shown in FIG. 1;

FIG. 3 is a schematic view of the moving assembly of FIG. 2;

FIG. 4 is a schematic structural diagram of a double-layer transmission device according to the present invention;

FIG. 5 is a top view of FIG. 4;

FIG. 6 is a schematic structural diagram of a temporary storage apparatus according to the present invention;

FIG. 7 is a process flow diagram of the present invention;

FIG. 8 is a schematic structural diagram of an etching apparatus.

Detailed Description

The present invention is described in further detail below with reference to examples, but the scope of the present invention is not limited thereto.

Referring to fig. 7, a flow chart of a method for manufacturing a large-size single-sided circuit board based on a hybrid process according to the present invention is shown, which includes the following steps:

(1) Pre-treating a substrate: directly transferring a substrate plate to be processed to a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate; the prior art processes typically cut standard substrates into small plates of corresponding size before processing, and the present application processes standard substrates (typically 1.2m x 1.2m) directly. Because the process is directly prepared on the basis of the standard substrate, the step of cutting the plate can be omitted, the preparation process is simplified to a certain extent, meanwhile, the large-size circuit board is beneficial to splicing a circuit layer, and the size of the substrate can be fully utilized.

(2) Line coating and photoetching: uniformly coating a layer of circuit printing ink with the thickness of 0.01mm on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine; according to the method, the circuit layer is prepared by adopting the photoetching process, so that the circuit precision can be further improved, meanwhile, the circuit splicing plate can be very conveniently realized, the preparation of a film is omitted, the size of the circuit layer is not limited by the bottleneck of the film, and the preparation of a large-size circuit board can be very conveniently realized.

In a preferred embodiment, the line lithography adopts a plurality of lithography machines to carry out the lithography simultaneously, and the line lithography speed is increased so as to meet the requirements of the whole automatic production line.

(3) Line development: placing the substrate in a developing machine for developing treatment, and removing the ink which is not photoetched;

(4) Etching copper: carrying out chemical reaction on the copper surface without ink protection by using strong acid or strong alkali to remove the copper surface without ink protection, and only keeping the pattern with ink protection;

(5) And (3) removing the film: removing the circuit ink for protecting the copper wires on the substrate, and exposing all the copper wires;

(6) Solder resist coating: coating solder resist ink on the whole surface of the copper wire surface of the substrate by using a coating machine,

(7) Solder resist exposure: exposing the substrate through an exposure machine; in the past assumption of the applicant, the photoetching process is directly adopted for preparing the solder mask, however, the actual effect of the photoetching process used in the preparation of the solder mask is also found to be poor in production line research and test, because white oil is coated on the solder mask, the photoetching effect is poor, meanwhile, the photoetching process needs a long time, the requirements of the preparation process cannot be met, the speed of the production process is not matched with that of other processes, and the overall production efficiency is greatly reduced. Therefore, considering that the requirement of solder mask lithography on precision is not high, in the actual preparation process flow, the traditional exposure process is still adopted for preparing the solder mask layer, and the production efficiency of the circuit board can be further improved. Furthermore, the glass film is adopted to replace the traditional film, and the glass film is not easy to deform, so that the exposure of a large-size circuit can be realized.

(8) Solder resist development: placing the exposed substrate in a developing machine for developing treatment;

(9) High-temperature curing: conveying the substrate to a high-temperature curing furnace, and curing the solder resist ink completely after high-temperature curing to increase the adhesive force between the substrate and the solder resist ink;

(10) Cutting: the large-sized substrate is cut into corresponding small plates or finished products using a laser cutter.

In this embodiment, a large-sized substrate is used, a plurality of small circuit boards are processed at a time, and after the processing is completed, the substrate is cut, and then a plurality of circuit boards are processed at a time. This application can further make full use of base plate space through the circuit makeup, has further reduced the manufacturing cost of circuit board, has also promoted production efficiency simultaneously.

The existing single-sided circuit board process is based on the preparation of a small-size circuit board, in order to meet the production requirement of a large-size circuit board, a full-automatic large-size high-precision circuit board production line is realized, and the method makes corresponding improvements on various links of the existing production line, and specifically refers to the following description.

The existing etching machine is based on a small-size circuit board, and in the preparation of a large-size circuit board, the uneven etching can be caused, and the performance of the circuit board is reduced. To this end, the present application provides a corresponding improvement over existing etching processes. Firstly, the invention adopts a plurality of etching machines to work in a cascade mode, the circuit board passes through the plurality of etching machines in the etching process, thereby ensuring the full etching of the large-size circuit board, and simultaneously, the plurality of etching machines provide etching solution through the same container, thereby ensuring the consistency of the concentration of the solution in different etching machines and the consistency of the feeding quantity, and further greatly improving the performance of the circuit board.

As shown in fig. 8, 4 etching machines are connected together to etch a PCB, one side of each of the four etching machines is connected with a container 1201, etching solution is contained in the container, and a stirring device 1202 is connected in the container to stir the etching solution through the stirring device, so as to prevent the etching solution from precipitating and affecting the quality of the PCB; the container is connected with a pump 1203, the pump is connected with four connecting pipes 1204, the four connecting pipes are respectively connected to the etching machines 1205, so that the concentration of the etching solution in each etching machine 1205 is kept consistent, and the quality of the PCB is improved.

Because the photoetching process is adopted in the preparation of the circuit layer, the photoetching efficiency of a single photoetching machine cannot meet the requirements of the process of a full-automatic production line, therefore, in the actual photoetching process, a plurality of photoetching machines are adopted to cooperate with a mechanical arm to carry out photoetching, and in order to ensure that the photoetching process is carried out orderly, the production line is improved by the application, and the double-layer transmission device is provided, and feeding and discharging are respectively arranged at the upper layer and the lower layer, so that the orderly production process is ensured, and the management of the automatic production line is facilitated.

Furthermore, a telescopic conveying device is adopted as the conveying device between the adjacent processes.

As shown in fig. 1, 2 and 3, fig. 1 is a telescopic transmission conveying device, and adjacent processes are connected through the telescopic conveying device, so that a space can be reserved for subsequent production line modification, and the processes can be removed conveniently, so that a new process can be added in a space; when equipment of the next production procedure breaks down, the transmission line can be quickly disconnected, and manual operation is convenient to carry out.

In the embodiment, the telescopic conveying device adopts independent electric rollers to rotate, and a plurality of electric rollers form a conveying belt together; meanwhile, the telescopic conveying device realizes full-automatic steering, so that the arrangement and planning of a production line and the movement of a transmission device are facilitated, and the utilization rate of equipment is improved.

In the embodiment, movable frames 4 are connected between fixed frames 1 at adjacent positions, a first connecting rod 3 is connected to any fixed frame 1, a second connecting rod 5 is connected to the movable frame 4, a supporting component 6 is connected between the first connecting rod 4 and the second connecting rod 5, the fixed frame 1 and the movable frame 4 can be conveniently moved through the supporting component 6, and further the transmission device can be conveniently stretched and contracted, a moving component 2 is connected to the bottom end of any fixed frame 1, the transmission device can be conveniently controlled to be adjusted through a controller through the moving component 2, the adjusting precision of the transmission device is greatly improved, errors in manual operation are reduced, transmission components 7 are respectively connected to the top ends of the fixed frame 1 and the movable frame 4, and the PCB can be conveniently moved through the transmission components 7; the bottom of the fixing frame 4 is connected with the moving assembly 2, so that the fixing frame 1 can move and can stretch, and the conveying device can realize steering conveying, so that the arrangement and planning of a production line and the movement of the transmission device are facilitated, and the utilization rate of equipment is improved; the telescopic conveying device can be conveniently removed, so that a new process is added in a space; meanwhile, when the rear-stage equipment fails, the transmission line can be quickly disconnected, and manual operation is convenient to perform.

In this embodiment, a first driving motor 21 is connected to an inner side of a lower portion of the fixing frame 1, an output end of the first driving motor 21 is connected to a rotating rod 22, a housing 23 is connected to a bottom end of the rotating rod 22, a roller 24 is rotatably connected to the housing 23, the first driving motor 21 drives the roller 24 to rotate, so that a transmission device is conveniently adjusted, a second driving motor 25 is connected to an inner side wall of the housing 23, an output end of the second driving motor 25 is connected to a gear 26, a rack bar at one side of the roller 24 is provided with a slot tooth 27, the slot tooth 27 is meshed with the gear 26, the second driving motor 25 can drive the roller to rotate, and the fixing frame 1 is convenient to move; a supporting block 28 is connected to the outer side wall of the rotating rod 22, and the supporting block 28 is connected with the fixing frame 1 in a sliding manner, so that a supporting effect is provided when the rotating rod 22 rotates; be connected with angle sensor 29 on the upper portion lateral wall of dwang 22, detect dwang 22 pivoted angle through angle sensor 29, and then can accurate adjustment roller 24's turned angle.

In this embodiment, any transmission assembly 7 includes a roller 71, one end of the roller 71 is rotatably connected to the fixed frame 1 or the movable frame 4, the other end of the roller 71 is connected to a third driving motor 72, the third driving motor 72 is fixed to the fixed frame 1 or the movable frame 4, and the third driving motor 72 is connected to the controller.

Further, double-layer transmission is adopted in the processes of step 2 and step 7.

As shown in fig. 4 and 5, fig. 4 is a schematic structural diagram of a double-layer transmission device, in step 2 and step 3, in order to improve the production efficiency of an enterprise, a plurality of photoetching machines work simultaneously, in order to feed and discharge the circuit board orderly when the robot arm interacts with the plurality of photoetching machines, the robot arm takes the circuit board from the lower layer, and after the photoetching machines finish machining, the robot arm is put on the upper layer to enter the next procedure, so that the feeding and the discharge can be conveniently managed, and the production efficiency of the enterprise is greatly improved.

In the embodiment, when the substrate in the previous process enters the first layer of double-layer transmission, the first layer of double-layer transmission is started, the roller rotates, and the substrate enters the material taking area through corner transmission and sends a material taking signal to the mechanical arm; the photoetching machine starts processing to enter a material waiting signal, the photoetching machine sends a material waiting signal to the mechanical arm, the mechanical arm confirms that the material taking area has materials and can grab the materials, the mechanical arm takes the materials from the material taking area, then the base plate is placed on a processing table board of the photoetching machine, the photoetching machine starts vacuum suction to suck the plates, then the mechanical arm leaves to finish the material placing action, the photoetching machine starts processing, after the photoetching machine finishes processing, the material taking signal is sent to the mechanical arm, the mechanical arm takes the processed base plate on the table board of the photoetching machine away, the mechanical arm sends a signal to the double-layer transmission to confirm whether the plates can be placed in a second-layer discharging and plate placing area of the double-layer transmission, and under the condition that the second-layer discharging and plate placing area has no plates, the mechanical arm confirms that the plates can be placed in the second-layer discharging and plate placing area; after the mechanical arm finishes discharging, a plate placing completion signal is transmitted to one double-layer conveying roller, and the double-layer conveying discharging roller rotates to convey the plate to the next station.

In this embodiment, the PCB is on the first conveying device, when the PCB on the first conveying frame moves to one side of the corresponding material placing frame, when the first sensor and the second sensor detect the PCB and the signal of the controller simultaneously, the driving device on the corresponding conveying frame stops working, the steering device starts working, and then the PCB is conveyed to the material placing frame, when the third sensor on the material placing frame detects the PCB, the driving device on the corresponding material placing frame starts working, and the PCB is conveyed to the corresponding position, the manipulator transfers the PCB to the corresponding production line, and after the PCB is processed, the manipulator moves the PCB to the second conveying device 3, and then the next production process is conveyed.

Furthermore, a temporary storage device is arranged between the adjacent working procedures.

As shown in fig. 6, fig. 6 is a schematic structural diagram of a temporary storage device, two sides of the top end of the fixed support 101 are respectively connected with a servo motor 102, the output end of any servo motor 102, which is located at the bottom, is connected with a screw rod 103, two screw rods 103 are sleeved with a shelf 104, the servo motor 102 drives the screw rod 102 to rotate, thereby driving the shelf 104 to move up and down, thereby moving the PCB plate on the conveying device 106 up or moving the PCB plate temporarily stored on the shelf 104 to the transmission device 106, when the subsequent production line is busy and green, the PCB plate can be temporarily stored through the temporary storage machine, the front production line stop work is avoided, when the production line is idle, the PCB plate stored on the temporary storage machine can be moved to the transmission device 106 again, thereby greatly improving the production efficiency of enterprises. Temporary storage devices are connected between the adjacent working procedures, and a certain amount of substrates can be temporarily stored through the temporary storage devices; when next process equipment goes wrong, can send the signal for temporary storage device through the controller, the temporary storage device begins storage base plate on receiving the signal, and then makes things convenient for the processing of circuit board.

In the embodiment, in the steps 1 to 10, the substrate is subjected to centering treatment before entering the next process, the centering device corrects the position of the substrate in the middle of the conveying device, so that the condition of the substrate is conveniently checked by manual visual inspection, the plate material is reasonably treated in time, and meanwhile, the substrate is conveniently processed,

in this embodiment, step 2, step 7 and step 9 are accomplished the back and are respectively to basically carrying out cooling treatment, cool off the base plate through the cooling work or material rest during the cooling, can hold a plurality of base plates on the cooling work or material rest, the cooling work or material rest is located sealed space, the space is inside to export air conditioning in the space through the air conditioner, through installing radiator fan on the cooling work or material rest, the radiating efficiency of base plate is accelerated, through dispelling the heat to the base plate, the processing of one process next of convenience is accomplished the heat dissipation of base plate fast, the precision of improvement base plate processing, and then the yields of improvement base plate processing.

In this embodiment, in step 5, after the film removal, the substrate is subjected to polishing, washing with water, and air-drying to remove stains on the surface of the substrate.

In the present embodiment, after the substrate is cleaned, the surface of the substrate is subjected to a dust-adhering treatment using a dust-adhering machine to prevent residual dust on the surface, and the surface is subjected to a surface cleaning protection treatment for coating solder resist ink.

In the embodiment, in step 4, before the substrate is etched with copper, the substrate is turned over by 180 degrees by a plate turnover machine, the corrosive liquid is sprayed from the lower part, so that the corrosion effect is improved, and after the copper etching is finished, the substrate is turned over by 180 degrees, so that the copper-clad surface faces upwards, and the requirement of brushing and removing the film on the substrate is met.

In the embodiment, a photoetching machine is adopted in the step 2 for circuit photoetching, a glass film exposure machine is used for exposure in the step 7, the exposure machine utilizes an LED lamp to emit ultraviolet strong light, and ultraviolet light penetrating through the transparent part of the film is utilized to carry out appropriate UV curing on the solder resist ink on the surface of the circuit board in time.

In the embodiment, the solder mask layer is prepared by adopting a traditional exposure process to meet the requirement, and the glass film is adopted to realize exposure.

The exposure machine utilizes the LED lamp to emit ultraviolet strong light, and utilizes ultraviolet light penetrating through the transparent part of the film to carry out appropriate UV curing on the solder resist ink on the surface of the circuit board in time so as to achieve the purpose that the solder resist ink of the part to be reserved can be reserved in the subsequent development; the working sequence is as follows: conveying a first layer of corner material to an exposure machine in a double-layer mode, positioning the corner material by the aid of a side, primarily positioning Mark points, floating a plate material to be pushed to an exposure area by a push rod through air blowing of a vacuum platform, sucking the plate in vacuum, descending a film above a circuit board, finding the Mark points on the circuit board through the film, visually aligning a camera, pressing the film on the circuit board after the film is rotated and aligned, completely attaching the vacuum suction to the circuit board, opening an led ultraviolet lamp for 3-6 seconds, closing vacuum adsorption, lifting the film, pushing the plate material to a discharging conveying area by the aid of the air blowing push rod of the vacuum platform, rotating a discharging conveying roller, conveying and centering the discharged material, and taking the plate material to a discharging station of a second layer of double-layer conveying by a truss mechanical handle; the glass film exposure machine used by the invention adopts the automatic feeding and discharging in the whole process, the automatic lifting and sticking of the film to the circuit board, the visual alignment of the camera, the integral large-width LED lamp tube, no motion scanning is needed, the exposure time is saved, the air blowing and the air suction of the vacuum platform are realized, the transmission and the positioning of the plate material in the exposure machine are realized by the action of the push rod, and the production efficiency of the circuit board is greatly improved; meanwhile, the efficiency of the exposure machine is higher than that of photoetching of the photoetching machine, the solder resist link has not very high precision requirements, the traditional exposure process is adopted, the requirements can be met, the efficiency of the solder resist link is greatly improved, and the production efficiency of the solder resist link is matched with the whole production line.

The above-mentioned embodiments are merely preferred embodiments of the present invention, which are based on a hybrid process for producing a large-sized single-sided circuit board, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the scope of the present invention as set forth in the claims.

Claims (10)

1. A preparation method of a large-size single-sided circuit board based on a hybrid process is characterized by comprising the following steps: the method comprises the following steps:

(1) Substrate pretreatment: directly transferring a substrate plate to be processed to a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate;

(2) Line coating and photoetching: uniformly coating a layer of circuit ink on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine;

(3) Line development: placing the substrate in a developing machine for developing treatment, and removing the ink which is not photoetched;

(4) Etching copper: carrying out chemical reaction on the copper surface without the ink protection by using strong acid or strong alkali to remove the copper surface without the ink protection, and only keeping a pattern with the ink protection;

(5) And (3) removing the film: removing the circuit ink for protecting the copper wires on the substrate, and exposing all the copper wires;

(6) Solder resist coating and prebaking: coating solder resist ink on the whole surface of the copper wire surface on the substrate by using a coating machine, and baking;

(7) Solder resist exposure: exposing the substrate by an exposure machine, wherein a glass film is used in the exposure process;

(8) Solder resist development: placing the exposed substrate in a developing machine for developing treatment;

(9) High-temperature curing: conveying the substrate to a high-temperature curing furnace, and curing the solder resist ink completely after high-temperature curing to increase the adhesive force between the substrate and the solder resist ink;

(10) Cutting: the large-sized substrate is cut into respective small plates or finished products using a laser cutter.

2. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: the conveying device between the adjacent processes adopts a telescopic conveying device.

3. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: and the procedures of the step 2 and the step 7 adopt double-layer transmission.

4. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: a temporary storage device is arranged between the adjacent working procedures.

5. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: in step 1 to step 10, the substrate is subjected to a centering process before entering the next process.

6. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: and (5) after the step 2, the step 7 and the step 9 are finished, respectively carrying out cooling treatment on the basic materials.

7. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: in the step 5, after the film is removed, the substrate is polished, washed and air-dried to remove stains on the surface of the substrate.

8. A method for manufacturing a large-size single-sided circuit board based on a hybrid process as claimed in claim 7, wherein: and carrying out dust adhesion treatment after cleaning the substrate.

9. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: in the step 4, the substrate is turned over by 180 degrees before the substrate is corroded by copper, the corrosive liquid is sprayed from the lower part of the substrate, the overlook effect is improved, and the substrate is turned over by 180 degrees after the copper corrosion is finished, so that the copper-clad surface is upward, and the requirement of brushing and removing the film on the substrate is met.

10. The method for preparing a large-size single-sided circuit board based on the hybrid process as claimed in claim 1, wherein: and in the step (7), the exposure machine utilizes an LED lamp to emit ultraviolet strong light, and utilizes ultraviolet light penetrating through the transparent part of the glass film to carry out appropriate UV curing on the solder resist ink on the surface of the circuit board at proper time.

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