CN115389820A - MLCC insulation resistance detection device and use method - Google Patents

Abstract

The present invention relates to a kind of MLCC insulation resistance detection device and using method, MLCC insulation resistance detection device comprises: placing platform, infrared scanning instrument, mechanical arm, control unit and PCB board; On the placement platform, there is a heat gun on the mechanical arm, and the control panel is set on the side of the placement platform. The control panel is connected to the infrared scanning instrument, the mechanical arm and the heat gun respectively; the placement platform is provided with a placement slot, which is used to place the PCB. plate; the infrared scanning instrument is used to photograph the infrared state map of the MLCC on the PCB; the mechanical arm is used to move the heat gun to a designated position; the control unit is used to control the infrared scanning instrument, the mechanical arm, and the use of the heat gun, By using this device, a large number of MLCCs can be measured at one time, and suspected failure capacitors can be screened out for insulation resistance detection, which significantly improves the failure detection efficiency of MLCCs.

Description

A kind of MLCC insulation resistance detecting device and using method

technical field

The invention relates to the detection field of MLCC, in particular to an MLCC insulation resistance detection device and a use method.

Background technique

In recent years, with the rapid development of electronic devices and integrated circuits, the demand for miniaturization and multi-function of electronic equipment has become increasingly urgent. Basic electronic components, especially chip multilayer ceramic capacitors (referred to as: MLCC), have the advantages of small size, multi-layer, suitable for mass production, low price and high stability. , aviation, automotive electronics and other industries are widely used.

The reliability of MLCC directly affects the reliability of its application equipment, so it is necessary to test the reliability of MLCC. The reliability test of MLCC is usually to detect the failure of several MLCCs connected to the PCB board. During the test, several MLCCs need to be installed on a PCB board to form a parallel circuit, and then the PCB board is powered on. , to perform failure detection for each MLCC. When a parallel circuit is detected to indicate a fault, it is necessary to remove the MLCCs on the PCB board one by one and test them individually. However, the number of MLCCs on the PCB board is large, and even As many as hundreds or thousands, which seriously affects the detection efficiency.

Contents of the invention

Based on this, the object of the present invention is to provide a method for using an MLCC insulation resistance detection device and a method for using it, which has the advantage of high detection efficiency.

On the one hand, the present invention provides a kind of MLCC insulation resistance detecting device, it comprises:

Place the platform, infrared scanning instrument, robotic arm, control unit and PCB board;

The infrared scanning instrument and the mechanical arm are arranged on the placement platform, the mechanical arm is provided with a heat gun, and the control unit is connected with the infrared scanning instrument, the mechanical arm and the heat gun respectively ;

The placement platform is provided with a placement slot, and the placement slot is used to place the PCB board, wherein, the PCB board is provided with a power input end, a power output end, and a power input end and the power output end. A plurality of test circuits connected in parallel, for each test circuit, two pads connected in series to the test circuit are formed on the surface of the PCB board, and MLCCs are welded on every two pads ;

The infrared scanning instrument is used to scan the PCB board from the top to obtain an infrared state map after the power input terminal and the power output terminal are connected to an external power supply for testing;

The control unit is used to analyze the abnormal heating point of the infrared state map by infrared spectral image analysis, and determine the location of the abnormal heating point;

The control unit is also used to drive the mechanical arm to move the heat gun to the position of the abnormal heating point, and control the heat gun to purge the abnormal heating point to blow off the abnormal heating point The soldered MLCC.

Further, the heat gun includes an air inlet chamber, and two air outlet needles located on both sides of the bottom of the air inlet chamber communicated with the air inlet chamber, and the bottom of the air outlet needles forms an air outlet mouth.

Further, the air inlet chamber includes an air inlet chamber and an air guide chamber communicating with both sides of the air inlet chamber, the air outlet needle tube communicates with the corresponding air guide chamber, and the air guide chamber passes through a connecting channel It communicates with the air inlet chamber, and the cross-sectional area of the connecting channel is smaller than that of the air inlet chamber and the air guiding chamber. It acts as a buffer against hot air.

Further, it also includes adsorption tubes;

The bottom of the air inlet chamber is provided with an adsorption chamber, and the adsorption chamber is located between the two air outlet needles; the inner wall of the bottom of the adsorption chamber is provided with a fixed part, and the inside of the fixed part is provided with a device that communicates with the adsorption chamber and the outside. A through hole, the through hole includes communication parts at both ends and a movable part in the middle, the inner diameter of the movable part is larger than the inner diameter of the communication part;

The side wall of the adsorption chamber is provided with a through hole, one end of the adsorption tube passes through the through hole and is connected with a vacuum adsorption device, and the other end of the adsorption tube passes through the through hole and extends to the adsorption Below the cavity, and between the two air outlet needles;

The adsorption tube includes a limiting part, the limiting part is located in the movable part, and the size of the limiting part is smaller than the movable part and larger than the communicating part, so that the limiting part can Move up and down within the activity department.

Further, the structure of the movable part and the limiting part of the adsorption tube is a cylindrical cavity.

Further, the temperature of the heat gun can be adjusted, and the air outlet needle and the adsorption tube form an outwardly inclined angle. The device can be adapted to different sizes of MLCCs by adjusting the air outlet temperature of the heat gun, the heat blowing time, and the distance between the heat gun and the MLCC.

In another aspect, the present invention provides a method for using an MLCC insulation resistance detection device, comprising the steps of:

S1: Provide DC power supply, PCB board and MLCC insulation resistance detection device, the PCB board is provided with a test circuit, the test circuit includes a power input terminal, a power output terminal, and a power supply input terminal connected to the power supply A plurality of test positions between the output terminals, a plurality of the test positions are connected in parallel between the power supply input terminal and the power supply output terminal, and the PCB board is arranged on the placement platform;

S2: Connect a plurality of MLCCs to each of the test positions on the PCB, connect the positive pole of the DC power supply to the power input terminal of the test circuit, and connect the negative pole of the DC power supply to the power input terminal of the test circuit. The power supply output terminal connection of the test circuit;

S3: energizing the plurality of MLCCs on the PCB through the DC power supply;

S4: After the first time of power-on, scan the PCB board with an infrared scanning instrument to obtain a first target image, perform edge detection based on the first target image, and obtain a second target image that only contains image information within the scope of the PCB board, Perform color space identification based on the second target image to obtain a plurality of color regions, establish an X-Y coordinate system based on the second target image, and divide the second target image into regions based on the color regions to obtain different regions. Coordinate information, obtaining characteristic information of each color region, comparing with a set threshold, and determining the area exceeding the set threshold as a suspected failed capacitor area;

S5: The control unit obtains the coordinate information of the suspected failed capacitor area, controls the mechanical arm to move to the suspected failed capacitor area, and then starts the heat gun to heat the soldering point for a period of time after approaching the capacitor;

S6: Remove the suspected failed capacitor.

Further, the test bit includes two pads respectively connected to the power supply input terminal and the power supply output terminal, and step S5 specifically includes:

After the mechanical arm moves to the center of the suspected failed capacitor area, it approaches the capacitor downward, the adsorption tube touches the MLCC, the two air outlet nozzles of the air outlet needle are respectively aligned with the two pads, and the hot air gun is started to The two pads are thermally blown for a period of time.

Further, the suspected failed capacitor is removed by a mechanical arm, step S6 specifically includes:

After the hot air gun blows for a set time, the vacuum adsorption device starts, the adsorption tube absorbs the MLCC, the mechanical arm rises, the suspected failed capacitor is taken away from the PCB board by the adsorption tube, and the mechanical arm moves When reaching the failed capacitor placement area, the vacuum adsorption device is turned off, and the suspected failed capacitor falls into the failed capacitor placement area.

Further, in step S3, the time for energizing the PCB board is 1-5 minutes, and the energizing voltage is 1v-6v.

Further, in step S4, the time for scanning the PCB board by an infrared scanning device is 1-3 minutes.

For better understanding and implementation, the present invention will be described in detail below in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is the structural representation of MLCC insulation resistance detecting device of the present invention;

Fig. 2 is the structural representation of heat gun and electric capacity when MLCC insulation resistance measuring device of the present invention works;

Fig. 3 is a schematic cross-sectional view of an adsorption chamber and an adsorption tube in an exemplary embodiment;

Fig. 4 is another kind of structural representation of the heat gun of MLCC insulation resistance measuring device of the present invention;

FIG. 5 is an exemplary equivalent circuit diagram of an existing measurement method;

Fig. 6 is a flow chart of the method of using the MLCC insulation resistance detection device.

Reference signs:

1. Placement platform; 11. Placement slot; 2. Infrared scanning instrument; 21. Fixing frame; 22. Detection mechanism; 3. Mechanical arm; 31. Heat gun; 311. Air inlet chamber; 311.a. ; 311.b, air guiding cavity; 312, air outlet needle tube; 32, adsorption cavity; 321, fixed part; 321.a, connecting part; 321.b, movable part; 322, adsorption tube; 4. Control panel; 5. PCB board; 51. MLCC.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.

It should be clear that the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the embodiments of the present application.

The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms "a", "said" and "the" used in the embodiments of this application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, nor can they be Read as indicating or implying relative importance. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In addition, in the description of the present application, unless otherwise specified, "plurality" means two or more. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B may indicate: A exists alone, A and B exist simultaneously, and B exists independently. The character "/" generally indicates that the contextual objects are an "or" relationship.

It should be understood that the embodiments of the present application are not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the embodiments of the present application is limited only by the appended claims.

MLCC51 is widely used as a capacitive device, and its reliability directly affects the reliability of its application equipment. Therefore, it is necessary to test the reliability of MLCC51 in the production process. At present, the reliability testing of MLCC51 is mainly to measure the insulation resistance. Referring to FIG. 5 , FIG. 5 is an exemplary equivalent circuit diagram of an existing measurement method. Usually, the failure of several MLCC51s connected on the PCB board 5 is detected. During the detection, several MLCC51s need to be installed on a PCB board 5 to form a parallel circuit, and then the PCB board 5 is energized to target each Each MLCC51 performs failure detection. When a parallel circuit is detected to indicate a fault, it is necessary to remove the MLCC51s on the PCB board 5 one by one and test them individually, or test each MLCC51 individually and screen them one by one, or, Each branch of the MLCC51 in the parallel circuit performs current detection. However, the number of MLCC51 on the PCB 5 is relatively large, even as many as hundreds or even thousands, which seriously affects the detection efficiency.

Based on this, with reference to Figure 1 and Figure 2, the present embodiment provides a MLCC insulation resistance detection device for solving the above problems, which includes:

Place the platform 1, the infrared scanning instrument 2, the mechanical arm 3, the control unit (not shown in the figure) and the PCB board 5.

The placement platform 1 is provided with a placement slot 11, and the placement slot 11 is used to place the PCB board 5; the A side of the PCB board 5 is welded with a plurality of MLCC51, and the B side of the PCB board 5 is etched with circuits, so that each of them is welded on the PCB board 5 The MLCC51s on the surface A of the PCB are connected in parallel with each other, and the PCB board 5 is provided with a power input terminal and a power output terminal, which are used for connecting external circuits. Figure 1 shows the distribution of MLCC51 on the partially enlarged PCB board 5. In fact, there are thousands of MLCC51 soldered on the PCB board 5. In order to facilitate the understanding of the scheme, the distribution is only given as an example. picture. The external electrodes at both ends of the MLCC51 are welded on the pads of the PCB 5 , the MLCC51s are arranged at equal intervals, and the MLCC51s are connected in parallel with each other.

The infrared scanning instrument 2 includes: a fixed frame 21 and a detection mechanism 22. One end of the fixed frame 21 is fixed on the placement platform 1, and the other end extends horizontally. A detection mechanism 22 is fixed at the end of the horizontal extension. The detection mechanism 22 faces the PCB board 5. During the test process, the MLCC51 on the PCB board 5 is photographed and detected.

The mechanical arm 3 is set on the placement platform 1, and the mechanical arm 3 is provided with multiple rotating shafts. The movement in the XYZ three-dimensional direction can be realized by controlling the mechanical arm 3 to move the mechanical arm 3 around the rotating shaft. One end of the mechanical arm 3 is fixed on the placing platform 1. On the other end, a heat gun 31 is provided, and the heat gun 31 includes an air inlet cavity 311.a and an air outlet. The heat gun 31 is used to heat-blow the welding place between the MLCC51 and the PCB board 5 , so that the MLCC51 is detached from the PCB board 5 .

Control unit is connected with control panel 4, and control panel 4 is arranged on the side of placing platform 1, and control panel 4 can control infrared scanning instrument 2, mechanical arm 3, the use status of heat gun 31 by setting parameters.

In conjunction with FIG. 2 , in another preferred embodiment, the heat gun 31 further includes an air inlet chamber 311 , and two outlet needles 312 located on both sides of the bottom of the air inlet chamber 311 communicated with the air inlet chamber 311 , the bottom of the air outlet needle tube 312 forms an air outlet. After the hot air enters the chamber, it enters the two air outlet needles 312 respectively, and finally blows the hot air to two places through the two air outlet nozzles. Through this structure, it is possible to achieve precise heat blowing on the welding point of the MLCC51 and the PCB board 5 , and avoid damage to the MLCC51 caused by the high temperature of the heat gun 31 .

In another preferred embodiment, the air inlet chamber 311 includes an air inlet chamber 311.a and an air guide chamber 311.b communicating with both sides of the air inlet chamber 311.a, and the air outlet needle tube 312 is connected to the corresponding air guide chamber 311. .b is connected, the air guide chamber 311.b communicates with the air inlet chamber 311.a through a connecting channel, and the cross-sectional area of the connecting channel is smaller than that of the air inlet chamber 311.a and the air guide chamber 311.b. This structure can buffer the hot air blown out.

With reference to FIG. 3 , FIG. 3 is a schematic cross-sectional view of the adsorption chamber 32 and the adsorption tube 322 in an exemplary embodiment. FIG. 3 is only an exemplary schematic diagram. In order to better illustrate the design concept, the spacing dimensions are enlarged. In another preferred embodiment, an adsorption tube 322 is also included;

The bottom of the air inlet chamber 311.a is provided with an adsorption chamber 32, and the adsorption chamber 32 is located between the two air outlet needles 312; the inner wall of the bottom of the adsorption chamber 32 is provided with a fixed part 321, and the inside of the fixed part 321 is provided with a connecting adsorption chamber. The through hole between the chamber 32 and the outside, the through hole includes communicating parts 321.a at both ends and a movable part 321.b in the middle, the inner diameter of the movable part 321.b is larger than the inner diameter of the communicating part 321.a;

The side wall of the adsorption chamber 32 is provided with a through hole, one end of the adsorption tube 322 passes through the through hole and is connected with a vacuum adsorption device, and the other end of the adsorption tube 322 passes through the through hole and extends to Below the adsorption cavity 32 and between the two air outlet needles 312;

The adsorption tube 322 includes a limiting part 322.a, the limiting part 322.a is located in the movable part 321.b, and the size of the limiting part 322.a is smaller than that of the movable part 321.b , which is larger than the communicating portion 321.a, so that the limiting portion 322.a can move up and down in the movable portion 321.b.

The bottom of the air inlet chamber 311.a is provided with an adsorption chamber 32. The adsorption chamber 32 is located between the two outlet needles 312. The adsorption chamber 32 is fixedly connected to the air inlet chamber 311.a. The fixed part 321 is provided with a communication adsorption chamber inside. The cavity 32 and the external through hole, the through hole includes connecting parts 321.a at both ends and a movable part 321.b in the middle, and the structure of the movable part 321.b is a cylindrical cavity. The inner diameter of the movable part 321.b is larger than the inner diameter of the communication part 321.a.

The side wall of the adsorption chamber 32 is provided with a through hole, one end of the adsorption tube 322 passes through the through hole, and is connected with a vacuum adsorption device (not shown in the figure), and the other end of the adsorption tube 322 passes through the through hole and extends to the adsorption chamber 32 below, and between the two air outlet needles 312. The adsorption tube 322 is directly connected to the vacuum adsorption device through the through hole, which prevents the vacuum adsorption device from drawing the air in the entire adsorption chamber 32 through the through hole to form a vacuum and saves resources.

The adsorption tube 322 includes a stopper 322.a, the structure of the stopper 322.a is also a cylindrical cavity, the stopper 322.a is located in the movable part 321.b, and the size of the stopper 322.a is smaller than The movable part 321.b is larger than the communicating part 321.a, so that the limiting part 322.a can move up and down in the movable part 321.b.

By designing this structure, the adsorption tube 322 can be fixed in the fixed part 321, and can move up and down in the movable part 321.b. On the one hand, this structure can automatically remove the suspected failed capacitor from the PCB board 5, and on the other hand On the one hand, to avoid capacitors of different sizes, we need to use adsorption tubes 322 of different lengths to avoid that when the mechanical arm 3 is close to the capacitors, the adsorption tubes 322 will squeeze the capacitors and damage the capacitors. While reducing the risk of damaging the capacitor, it is possible to omit the replacement of adsorption tubes 322 of different lengths, thereby solving costs and reducing procedures.

Referring to FIG. 4 , FIG. 4 is only an exemplary schematic diagram. In order to better illustrate the design concept, the inclination angle and the distance between devices are enlarged. In another preferred embodiment, the air outlet needle tube 312 and the adsorption tube 322 form an outwardly inclined angle. When the MLCC51 is of different sizes, the descending distance of the mechanical arm 3, the temperature parameters of the heat gun 31, the hot blowing speed and the hot blowing time of the heat gun 31 can be set through the control panel 4, so as to realize the application of matching different sizes of MLCC51 function of the scene.

With reference to Fig. 1, Fig. 2, Fig. 4, the working process of a kind of MLCC51 insulation resistance detecting device of the present embodiment is:

Solder a plurality of MLCC51s on the PCB board 5, place the PCB board 5 in the placement slot 11 after the welding is completed, and connect the PCB board 5 to the circuit, preset the infrared scanning instrument 2, the mechanical arm 3, and the heat gun through the control panel 4 After using the parameters of 31, start the device. After the device is started, the PCB board 5 is energized, and after a period of continuous power-on, the infrared scanning instrument 2 performs thermal imaging and photographing of the PCB board 5 area in the placement groove 11, and the computer equipment connected to the control panel 4 performs the thermal imaging according to the photos taken by the infrared scanning instrument 2. Divide the area, and mark the area where the temperature exceeds the threshold, and control the movement of the mechanical arm 3 according to the coordinate information. After the mechanical arm 3 moves to the designated position, control the heat gun 31 to approach the MLCC51. During the process of approaching the MLCC51, the adsorption tube 322 contacts MLCC51, as the mechanical arm 3 continues downward, the adsorption tube 322 is pushed, the stopper 322.a moves upward, the adsorption tube 322 shrinks, and the MLCC51 is not damaged. When the mechanical arm 3 stops, the adsorption tube 322 is close to the MLCC51 . Start the hot air gun 31, and the hot air gun 31 carries out heat blowing to the solder joints of the MLCC51 and the PCB board 5 welding. The position part 322.a falls back, and the adsorption tube 322 stretches out. The control unit controls the mechanical arm 3 to move to the unloading area, the vacuum adsorption device stops, and the MLCC51 falls into the unloading area. The above operations are repeated until all MLCCs 51 in regions where the temperature exceeds the threshold are taken out.

Referring to Fig. 6, the present embodiment provides a method for using an MLCC insulation resistance detection device, which includes the following steps:

S1: Provide a DC power supply, a PCB board 5 and the MLCC insulation resistance detection device described in this embodiment, a test circuit is provided on the PCB board 5, and the test circuit includes a power input terminal, a power output terminal, and connections between the power input terminal and the power supply A plurality of test positions between the output ends, the plurality of test positions are connected in parallel between the power input end and the power output end, and the PCB board 5 is set on the placement platform 1;

S2: Connect multiple MLCC51s to each test position on the PCB board 5, connect the positive pole of the DC power supply to the power input terminal of the test circuit, and connect the negative pole of the DC power supply to the power output terminal of the test circuit. 4 set the operating parameters of the infrared scanning instrument 2, the mechanical arm 3 and the heat gun 31;

S3: energize multiple MLCCs 51 on the PCB 5 through a DC power supply; specifically, in this embodiment, the time for energizing the PCB 5 is 1-5 minutes, and the energizing voltage is 1v-6v.

S4: After powering on for the first time, scan the PCB board 5 by the infrared scanning device 2 to obtain the first target image, perform edge detection based on the first target image, and obtain the second target image containing only the image information within the scope of the PCB board 5 , perform color space identification based on the second target image, obtain multiple color areas, establish an X-Y coordinate system based on the second target image, divide the second target image based on the color areas, obtain coordinate information of different areas, and obtain each color The characteristic information of the area is compared with the set threshold, and the area exceeding the set threshold is determined as a suspected failed capacitor area;

Specifically in this embodiment, the time for scanning the PCB board 5 by the infrared scanning instrument 2 is 1-3 minutes, and the infrared scanning instrument 2 is a handheld thermal imager, and step S2 includes: S21: Utilize the infrared scanning instrument 2 to scan the PCB After the plate 5, a thermal imaging image is generated on a display device; S22: Determine a region with a higher temperature from the thermal imaging image.

When the heat of MLCC51 is higher than or equal to the heat threshold corresponding to the temperature threshold, the thermal imaging image is displayed as the first color (such as red); when the heat of MLCC51 is lower than the heat threshold corresponding to the temperature threshold, the thermal imaging image is displayed as the second color color (such as blue), and the first color is different from the second color. Moreover, since when MLCC51 fails, its insulation resistance will increase. When multiple MLCC51s are connected in parallel, the current passing through each MLCC51 is the same. At this time, the heat of the failed MLCC51 will be higher than that of the non-failed MLCC51. The MLCC51 whose color is the first color in the image is determined to be a suspected failed capacitor.

S5: The control unit obtains the coordinate information of the suspected failed capacitor area, controls the mechanical arm 3 to move to the suspected failed capacitor area, and then approaches the capacitor downward. During the process of approaching the capacitor, the adsorption tube 322 touches the capacitor. Continue downward, the adsorption tube 322 is pushed, the stopper 322.a moves upward, the adsorption tube 322 shrinks, and the capacitor is not damaged. When the mechanical arm 3 stops, the heat gun 31 is started to heat the soldering point.

S6: Remove the suspected failed capacitor. Use the hot air gun 31 to purge the suspected failed capacitor, so that the two solder joints connected to the bottom of the PCB board 5 fall off, control the vacuum adsorption device to start, the adsorption tube 322 will absorb the MLCC51, and move the MLCC51 to the failed capacitor. Zone, control the vacuum adsorption device to stop, the suspected failed capacitors fall into the failed capacitor placement area, and the time for blowing the suspected failed capacitors through the heat gun 31 is 80-100 seconds.

In the present invention, the material of the pad is tin, and the temperature of the hot air is 300±20°C.

The above examples only express the preferred implementation of the present invention, and the descriptions thereof are more specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that, for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present invention, and the present invention is also intended to include these changes and modifications.

Claims (10)

1. A MLCC insulation resistance detection device is characterized in that, comprising: Place the platform, infrared scanning instrument, robotic arm, control unit and PCB board; The infrared scanning instrument and the mechanical arm are arranged on the placement platform, the mechanical arm is provided with a heat gun, and the control unit is connected with the infrared scanning instrument, the mechanical arm and the heat gun respectively ; The placement platform is provided with a placement slot, and the placement slot is used to place the PCB board, wherein, the PCB board is provided with a power input end, a power output end, and a power input end and the power output end. A plurality of test circuits connected in parallel, for each test circuit, two pads connected in series to the test circuit are formed on the surface of the PCB board, and MLCCs are welded on every two pads ; The infrared scanning instrument is used to scan the PCB board from the top to obtain an infrared state map after the power input terminal and the power output terminal are connected to an external power supply for testing; The control unit is used to analyze the abnormal heating point of the infrared state map by infrared spectral image analysis, and determine the location of the abnormal heating point; The control unit is also used to drive the mechanical arm to move the heat gun to the position of the abnormal heating point, and control the heat gun to purge the abnormal heating point to blow off the abnormal heating point The soldered MLCC. 2. MLCC insulation resistance detection device according to claim 1, is characterized in that: The heat gun includes an air inlet chamber, and two air outlet needles located on both sides of the bottom of the air inlet chamber communicated with the air inlet chamber, and the bottom of the air outlet needles forms an air outlet. 3. MLCC insulation resistance detection device according to claim 2, is characterized in that: The air inlet chamber includes an air inlet chamber and an air guide chamber communicating with both sides of the air inlet chamber, the air outlet needle tube communicates with the corresponding air guide chamber, and the air guide chamber is connected to the air guide chamber through a connecting channel. The air inlet chamber is connected, and the cross-sectional area of the connecting channel is smaller than the air inlet chamber and the air guide chamber. 4. MLCC insulation resistance detection device according to claim 3, is characterized in that: Also includes sorbent tubes; The bottom of the air inlet chamber is provided with an adsorption chamber, and the adsorption chamber is located between the two air outlet needles; the inner wall of the bottom of the adsorption chamber is provided with a fixed part, and the inside of the fixed part is provided with a device that communicates with the adsorption chamber and the outside. A through hole, the through hole includes communication parts at both ends and a movable part in the middle, the inner diameter of the movable part is larger than the inner diameter of the communication part; The side wall of the adsorption chamber is provided with a through hole, one end of the adsorption tube passes through the through hole and is connected with a vacuum adsorption device, and the other end of the adsorption tube passes through the through hole and extends to the adsorption Below the cavity, and between the two air outlet needles; The adsorption tube includes a limiting part, the limiting part is located in the movable part, and the size of the limiting part is smaller than the movable part and larger than the communicating part, so that the limiting part can Move up and down within the activity department. 5. MLCC insulation resistance detecting device according to claim 4, is characterized in that: The structures of the movable part and the limiting part of the adsorption tube are cylindrical cavities. 6. MLCC insulation resistance detecting device according to claim 5, is characterized in that: The temperature of the heat gun can be adjusted, and the air outlet needle tube and the adsorption tube form an outwardly inclined inclination angle. 7. a method for using an MLCC insulation resistance detection device, is characterized in that, comprises the steps: S1: Provide DC power supply, PCB board and MLCC insulation resistance detection device, the PCB board is provided with a test circuit, the test circuit includes a power input terminal, a power output terminal, and a power supply input terminal connected to the power supply A plurality of test positions between the output terminals, a plurality of the test positions are connected in parallel between the power supply input terminal and the power supply output terminal, and the PCB board is arranged on the placement platform; S2: Connect multiple MLCCs to each of the test positions on the PCB, connect the positive pole of the DC power supply to the power input terminal of the test circuit, and connect the negative pole of the DC power supply to the The power supply output terminal connection of the test circuit; S3: energizing the plurality of MLCCs on the PCB through the DC power supply; S4: After the first time of power-on, scan the PCB board with an infrared scanning instrument to obtain a first target image, perform edge detection based on the first target image, and obtain a second target image that only contains image information within the scope of the PCB board, Perform color space identification based on the second target image to obtain a plurality of color regions, establish an X-Y coordinate system based on the second target image, and divide the second target image into regions based on the color regions to obtain different regions. Coordinate information, obtaining characteristic information of each color region, comparing with a set threshold, and determining the area exceeding the set threshold as a suspected failed capacitor area; S5: The control unit obtains the coordinate information of the suspected failed capacitor area, controls the mechanical arm to move to the suspected failed capacitor area, and after approaching the capacitor downwards, starts the heat gun to heat the welding point for a period of time; S6: Remove the suspected failed capacitor. 8. the using method of MLCC insulation resistance detection device according to claim 7, is characterized in that, described test position comprises two pads that are respectively connected with described power input end and described power output end, and step S5 specifically include: After the mechanical arm moves to the center of the suspected failed capacitor area, it approaches the capacitor downward, the adsorption tube touches the MLCC, the two air outlet nozzles of the air outlet needle are respectively aligned with the two pads, and the hot air gun is started to The two pads are thermally blown for a period of time. 9. The method for using the MLCC insulation resistance detection device according to claim 8, wherein the suspected failure capacitor is removed by a mechanical arm, and step S6 specifically includes: After the hot air gun blows for a set time, the vacuum adsorption device starts, the adsorption tube absorbs the MLCC, the mechanical arm rises, the suspected failed capacitor is taken away from the PCB board by the adsorption tube, and the mechanical arm moves When reaching the failed capacitor placement area, the vacuum adsorption device is turned off, and the suspected failed capacitor falls into the failed capacitor placement area. 10. The method for using the MLCC insulation resistance detection device according to claim 7, characterized in that, in step S3, the time for energizing the PCB board is 1-5 minutes, and the energizing voltage is 1v-6v.

Images