CN115274483A - Wafer electrical property detection equipment - Google Patents
Wafer electrical property detection equipment Download PDFInfo
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- CN115274483A CN115274483A CN202210929255.0A CN202210929255A CN115274483A CN 115274483 A CN115274483 A CN 115274483A CN 202210929255 A CN202210929255 A CN 202210929255A CN 115274483 A CN115274483 A CN 115274483A
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- 238000001514 detection method Methods 0.000 title claims abstract description 107
- 238000012546 transfer Methods 0.000 claims abstract description 21
- 238000007689 inspection Methods 0.000 claims abstract description 19
- 238000012360 testing method Methods 0.000 claims abstract description 10
- 230000032258 transport Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 69
- 238000003708 edge detection Methods 0.000 claims description 26
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000003384 imaging method Methods 0.000 claims description 10
- 239000000523 sample Substances 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 13
- 230000002950 deficient Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 122
- 230000033001 locomotion Effects 0.000 description 8
- 230000007306 turnover Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of wafer detection, and especially discloses a wafer electrical property check out test set, be in including mounting platform, setting storage station and detection station on the mounting platform, the last transfer device that still is equipped with of mounting platform, it follows to await measuring the wafer to transfer the device storage station transports extremely detection station to transport back after detecting the completion storage station. This application has realized the round trip of wafer between storage station and detection station through moving the device that carries, detects the electrical property parameter of station automated inspection wafer, has finally realized the automatic processes such as unloading, alignment, detection and mark of going up of wafer, detects high efficiency, is convenient for filter the defective products, and the testing result is accurate.
Description
Technical Field
The application relates to the technical field of wafer detection, in particular to wafer electrical performance detection equipment.
Background
With the increasing popularity of integrated circuit applications, the demand of wafers as basic materials for manufacturing semiconductor devices is rapidly increasing in the market, and the development of the wafer manufacturing industry is simultaneously promoted.
During the manufacturing and packaging processes of the wafer, the electrical performance parameters of the wafer need to be detected to ensure the quality of the wafer. In traditional detection mode, after artifical material loading, measurement personnel manually calibrate, choose the point, detect, and at last manually retrieve to wafer basket of flowers inside, carry out the circulation of next process.
The detection period is long, the labor intensity is high, and due to the fact that the wafer is thin, the wafer is easily scratched and polluted in the manual feeding and discharging process, the quality of the wafer is reduced, meanwhile, the accuracy of a detection result is affected, and finally the qualification rate of a product is affected.
Disclosure of Invention
In order to solve the technical problem, the technical scheme of the application provides a wafer electrical performance detection device. The technical scheme is as follows:
the application provides a wafer electrical property check out test set, be in including mounting platform, setting storage station and detection station on the mounting platform, still be equipped with on the mounting platform and move the device that carries, it will await measuring the wafer follow to move the device storage station transports extremely detection station to transport back after detecting the completion storage station.
Furthermore, the storage station comprises a basket, a base frame and a turnover part, a material taking port is formed in one side of the basket, the base frame is vertically slidably arranged on the mounting platform, the basket is movably arranged on the base frame, and the turnover part is connected between the basket and the base frame so as to drive the basket to turn over along the direction deviating from the material taking port.
Specifically, the detection station includes counterpoint platform, is disposed in the testing platform, circular telegram detection portion and the counterpoint imaging unit of vacuum adsorption wafer, the counterpoint platform sets up on the mounting platform and can horizontal migration, testing platform sets up liftable on the counterpoint platform and can follow the vertical rotation that carries on, circular telegram detection portion set up in the testing platform top, be equipped with the dotter on the circular telegram detection portion, circular telegram detection portion is including the probe chuck that has the syringe needle, counterpoint imaging unit including connect in the counterpoint camera of circular telegram detection portion, connect in the counterpoint camera of counterpoint platform two, counterpoint camera one with counterpoint camera two all realizes 90 through the speculum and gets for instance, counterpoint camera one gathers the positional information of examining the wafer, counterpoint camera two gathers the syringe needle and the positional information of dotter, and external industrial control equipment integrates the information of comparing the collection, establishes complete space coordinate system and generates the path planning when the wafer is examined.
Particularly, the upset portion including slip unit, linear driving spare and fixed connection in the linkage board of basket of flowers, the guide way has been seted up on the linkage board, the tip position of guide way is along deviating from get the direction of material mouth and is rised gradually, the slip unit slides and inserts and establish in the guide way, linear driving spare articulated connect in the slip unit with between the bed frame.
Furthermore, the turnover part further comprises a positioning piece which is a microswitch arranged on the base frame, and the microswitch is electrically connected with the linear driving piece.
The flower basket turning device is characterized by further comprising a turning frame fixedly connected to the linkage plate, wherein the base frame is far away from one side of the linkage plate and hinged to the turning frame, the turning frame and the base frame are oppositely arranged to form a limiting space for containing a carrying disc, the carrying disc is horizontally arranged, and the turning frame is detachably connected with the flower basket through a clamping piece.
Particularly, the transfer device comprises a rotating frame, a first material taking arm and a second material taking arm, wherein the first material taking arm and the second material taking arm are horizontally connected with the rotating frame in a sliding mode, the first material taking arm and the second material taking arm are in an extending state and a withdrawing state, the rotating frame is arranged on the mounting platform and can rotate vertically, projections of the first material taking arm and the second material taking arm in the sliding direction are collinear in the vertical direction, and the vertical distance between the second material taking arm and the first material taking arm is larger than the thickness of a wafer.
Further, move and carry device still include the control module group and all with edge detection sensor and angle adjustment mechanism that the control module group is connected, edge detection sensor sets up on the swivel mount, work as get material arm one and be in when withdrawing the state, edge detection sensor response get the breach position of material arm one last wafer, work as when edge detection sensor does not detect the breach, edge detection sensor passes through the controller starts angle adjustment mechanism, angle adjustment mechanism orders about the wafer along vertical rotation.
Specifically, the edge detection sensor comprises an upper laser transmitter and a lower laser receiver which are arranged on the rotating frame, and light-transmitting openings are formed in the detection positions, relative to the edge detection sensor, of the first material taking arm and the second material taking arm; the angle adjusting mechanism comprises an adjusting motor, a rotating sucker and a first lifting cylinder, wherein the adjusting motor and the rotating sucker are coaxially connected, the first lifting cylinder is vertically connected with the rotating frame, and a piston end of the first lifting cylinder is fixedly connected with a fixed end of the adjusting motor through a bearing plate.
Particularly, the device further comprises a case, and the storage station, the detection station and the transfer device are sealed in the case.
Compared with the prior art, the application has the beneficial effects that: on the storage station, the upset portion drives and makes a round trip to overturn through roll-over stand linkage basket of flowers, and when not getting the blowing, basket of flowers and wafer keep the slope setting, and when getting the blowing, the basket of flowers all is vertical setting. The slippage motor drives the first material taking arm and the second material taking arm to move, the first material taking arm stretches out to take the wafer to be detected down from the storage station, the rotating sucker ascends to adsorb the wafer and then drives the wafer to rotate, and when the edge detection sensor detects a notch, the rotating sucker stops rotating and descends to reset. The rotating frame rotates, and the first material taking arm transfers the wafer to the detection station and then leaves the wafer.
When the wafer is at the detection station, the detection platform adsorbs the wafer in vacuum, the alignment platform moves to the position below the first alignment camera through the X-direction linear slide rail and the Y-direction linear slide rail, the first alignment camera captures the mark position information of the wafer to be detected, and the MAP of the wafer is generated. And the alignment platform is linked with the alignment camera II, moves to the positions below the probe chuck and the dotter respectively, captures the needle head position and the dotter position, and compares the needle head position and the dotter position by combining the position coordinates of the wafer to generate a complete position coordinate system. And the alignment platform moves to a detection position according to the generated wafer MAP. The linear motor drives the detection platform to ascend, so that chip Pins (PAD) on the wafer are contacted with the needle head, the tester connected with the chuck measures electrical parameters and the like of each chip, and the industrial personal computer generates a detection result graph of all chips on the wafer according to the detection results. Then, the detection platform moves to the position below the dotting device, and the dotting device performs dotting marking on the bad chips on the wafer.
After the detection is finished, the second material taking arm extends out to take the detected wafer down from the detection station, then the rotating frame rotates, and the second material taking arm transports the wafer to the detection station and leaves the wafer. The process is cyclic and reciprocating, automatic feeding, detection and material receiving of the wafers are achieved, the automatic feeding and detection device is suitable for wafers of different specifications, and the universality is high. Meanwhile, automatic calibration, point selection and parameter testing are performed in the detection process, the detection speed is high, the detection efficiency is high, and the surface quality of the wafer is effectively guaranteed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application, in which:
FIG. 1 is a schematic structural view of a mounting platform and a plurality of stations of the present application;
FIG. 2 is a schematic diagram of the overall structure of the present application;
FIG. 3 is a schematic structural view of a storage station of the present application;
FIG. 4 is a schematic view of the turning part according to the present application;
fig. 5 is a schematic structural view of a transfer apparatus according to the present application;
fig. 6 is a schematic structural view of a rotary drive portion embodying the present application;
FIG. 7 is a schematic structural view of an angle adjustment mechanism embodying the present application;
FIG. 8 is a schematic structural view of an inspection station of the present application;
FIG. 9 is a schematic structural diagram of an inspection platform embodying the present application;
fig. 10 is a schematic structural view of a lifting mechanism embodying the present application.
Reference numerals: 1. mounting a platform; 2. storing the station; 201. a flower basket; 202. a base frame; 2021. a track; 203. a roll-over stand; 204. a sliding unit; 2041. a slider; 2042. a pulley; 205. a linear drive; 2051. an adapter plate; 206. a linkage plate; 2061. a guide groove; 207. a microswitch; 209. a carrying tray; 2091. a connecting plate; 3. detecting a station; 301. aligning the platform; 3011. a movable seat; 3012. an X-direction linear slide rail; 3013. a Y-direction linear slide rail; 3014. a linear motor; 3015. a rotary motor; 3016. an origin limit sensor; 302. a detection platform; 3021. a pillar; 303. an energization detecting section; 3031. a chuck fixing plate; 3032. a probe chuck; 3033. a needle head; 304. a lifting mechanism; 3041. a second lifting cylinder; 3042. a cylinder block; 305. a dotting device; 3051. a mounting seat; 306. a guide strip; 307. aligning a first camera; 308. aligning a second camera; 309. a support; 4. a transfer device; 401. a rotating frame; 402. a first material taking arm; 403. a second material taking arm; 404. a base; 405. a rotation driving section; 4051. a driven coil; 4052. a driving wheel; 4053. a transmission belt; 4054. a rotating electric machine; 406. a slipping component; 4061. a synchronous belt; 4062. a rotating wheel 4063 and a sliding motor; 4064. a synchronizing member; 407. an edge detection sensor; 4071. an upper laser transmitter; 4072. a lower laser receiver; 408. an angle adjusting mechanism; 4081. adjusting the motor; 4082. rotating the sucker; 4083. a first lifting cylinder; 4084. carrying a plate; 4085. a linkage shaft; 4086. a fixed block; 4087. a guide bar; 4088. a top plate; 4089. a spline; 409. detecting a disc; 4091. connecting sleeves; 4092. a sensing member; 5. a chassis; 51. an alarm; 52. a display screen; 6. and (5) a wafer.
Detailed Description
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
With the increasing popularity of integrated circuit applications, the demand of wafers as basic materials for manufacturing semiconductor devices is rapidly increasing in the market, and the development of the wafer manufacturing industry is simultaneously promoted.
During the manufacturing and packaging processes of the wafer, the electrical performance parameters of the wafer need to be detected to ensure the quality of the wafer. In traditional detection mode, after artifical material loading, the measurement personnel are manual to be calibrated, select a little, detect, and at last manual recovery is inside the wafer basket of flowers, carries out the circulation of next process.
The detection period is long, the labor intensity is high, and due to the fact that the wafer is thin, the wafer is easily scratched and polluted in the manual feeding and discharging process, the quality of the wafer is reduced, meanwhile, the accuracy of a detection result is affected, and finally the qualification rate of a product is affected.
In order to solve the technical problem, the technical scheme of the application provides a wafer electrical property detection device. The technical scheme is as follows:
the present application is described in further detail below with reference to fig. 1-10.
As shown in fig. 1, the present application provides a wafer electrical performance detection apparatus, which includes a horizontally arranged installation platform 1, wherein the installation platform 1 is provided with a storage station 2, a detection station 3 and a transfer device 4, and the transfer device 4 is located between the storage station 2 and the detection station 3. During operation, the transfer device 4 transfers the wafer 6 to be detected from the storage station 2 to the detection station 3, and returns the wafer to the storage station 2 after detection is completed.
As shown in fig. 1 and 2, in order to reduce the possibility of contamination of the wafer 6 during the inspection process, the wafer electrical property inspection apparatus further includes a case 5, wherein the storage station 2, the inspection station 3, and the transfer device 4 are hermetically accommodated in the case 5. In addition, the case 5 is also provided with an alarm 51 and a display screen 52, the display screen 52 visually displays the detection information of the wafer 6 detected by the detection station 3, and when the detection equipment is abnormal, the alarm 51 gives an alarm.
As shown in fig. 1 and fig. 3, the storage station 2 includes a basket 201, a base frame 202, a turning frame 203, and a turning portion, a material taking opening is provided on one side of the basket 201, a plurality of horizontally arranged wafers 6 are placed in the basket 201, and the plurality of wafers 6 are vertically stacked at equal intervals. The base frame 202 is vertically slidably disposed on the mounting platform 1 by the cooperation of the linear guide and the cylinder.
Referring to fig. 3, the turning frame 203 and the base frame 202 are sequentially arranged below the flower basket 201 from top to bottom, the turning frame 203 is connected with the flower basket 201, the bottom of the turning frame 203 is hinged to the base frame 202, and the hinged point of the base frame 202 and the turning frame 203 is located on one side of the base frame 202 away from the material taking port. The turning part is connected between the turning frame 203 and the base frame 202 to drive the flower basket 201 to turn in the direction away from the material taking port.
During the in-service use, the upset portion orders about the upset of roll-over stand 203 level, and roll-over stand 203 linkage basket of flowers 201 upset, and the upset in-process is got the material mouth upward movement, and basket of flowers 201 and 6 slopes to be set up, have avoided the possibility that wafer 6 dropped from basket of flowers 201, have guaranteed wafer 6's stability. When the material needs to be taken and placed, the turning frame 203 is linked with the flower basket 201 to reset, and at the moment, the flower basket 201 is vertically arranged.
As shown in fig. 3 and 4, the turning part comprises a sliding unit 204, a linear driving member 205 and a linkage plate 206, and the linkage plate 206 is vertically arranged and fixedly connected to the bottom of the turning frame 203. When the flower basket 201 is vertically arranged, the lower surface of the linkage plate 206 and the base frame 202 are kept in abutment. A guide groove 2061 is formed in the linkage plate 206, the guide groove 2061 is a waist-shaped groove, and the position of the end of the guide groove 2061 is gradually raised along the direction deviating from the material taking port.
As shown in fig. 4, the sliding unit 204 includes a sliding block 2041 and a pulley 2042, a horizontally disposed rail 2021 is fixedly connected to the inner wall of the base frame 202, and the sliding block 2041 is slidably sleeved on the rail 2021. The pulley 2042 is rotatably connected to the side wall of the sliding block 2041, and the sliding block 2041 is located in the guide groove 2061. In this embodiment, the linear driving member 205 is a driving cylinder, one end of the driving cylinder is hinged to the sliding block 2041, the other end of the driving cylinder is hinged to an adapter plate 2051, and the adapter plate 2051 is fixedly connected to the side wall of the base frame 202.
When the driving cylinder performs telescopic motion, the sliding block 2041 slides, the sliding block 2041 is linked with the pulley 2042, and the pulley 2042 changes in the position of the guide groove 2061, at the moment, the linkage plate 206 and the pulley 2042 generate relative motion, the linkage plate 206 drives the turnover frame 203 to perform turnover motion, and the turnover of the flower basket 201 is realized.
As shown in fig. 4, the turning part further includes a positioning element, and the positioning element monitors the position of the linkage plate 206, so as to avoid the situation that the linkage plate 206 is turned excessively and the linkage plate 206 is not in place after being turned. The positioning member includes a micro switch 207 disposed on the base frame 202, and the micro switch 207 is electrically connected to the linear driving member 205.
As shown in fig. 3, in order to facilitate loading of a specific single wafer 6, the storage station 2 further includes a tray 209 and a connection plate 2091, and the tray 209 is opened with a receiving groove for receiving the single wafer 6. The overturning frame 203 and the base frame 202 are oppositely arranged to form a limited space, the carrying tray 209 and the connecting plate 2091 are horizontally arranged in the limited space, and the connecting plate 2091 is positioned right below the carrying tray 209. Wherein, carry thing dish 209 to slide through linear guide and connect in connecting plate 2091, carry the horizontal setting of the slip direction of thing dish 209 and point to and get the material mouth, through above-mentioned structure, the horizontal position of nimble adjustment year thing dish 209 has improved the commonality.
As shown in fig. 5 and 6, the transfer device 4 includes a rotating frame 401, a first pick arm 402 and a second pick arm 403 horizontally slidably connected to the rotating frame 401. The mounting platform 1 is provided with a base 404 in a horizontal frame mode, the rotating frame 401 is vertically rotated and arranged on the base 404, and the base 404 is further provided with a rotary driving portion 405 in transmission connection with the rotating frame 401.
The first material taking arm 402 takes the wafer 6 to be detected from the storage station 2 and transfers the wafer to the detection station 3, the second material taking arm 403 stretches out to take the detected wafer 6 from the detection station 3 and transfers the wafer 6 to the storage station 2, the wafer 6 is automatically fed, transferred and received, and the wafer feeding device is suitable for wafers 6 of different specifications and is high in universality.
As shown in fig. 6, the rotation driving unit 405 includes a driven ring 4051, a driving wheel 4052, and a transmission belt 4053, the base 404 is inserted through the bottom of the rotating frame 401, and the driven ring 4051 is fixedly attached to the bottom of the rotating frame 401. The driving wheel 4052 is rotatably connected to the lower surface of the base 404, and the driving belt 4053 is wound around the driven ring 4051 and the driving wheel 4052. The base 404 is further connected with a rotating motor 4054, and an output shaft of the rotating motor 4054 penetrates through the base 404 and is in transmission connection with the driving wheel 4052.
As shown in fig. 4, the first pick-up arm 402 and the second pick-up arm 403 are horizontally connected to the rotating frame 401 by a sliding assembly 406 in a sliding manner, the second pick-up arm 403 is located above the first pick-up arm 402, and the vertical distance between the first pick-up arm 402 and the second pick-up arm is greater than the thickness of one wafer 6. In the vertical direction, the projection of the sliding direction of the first material taking arm 402 and the second material taking arm 403 is collinear, and the first material taking arm 402 and the second material taking arm 403 both have an extending state and a retracting state.
Referring to fig. 4, the following description will be made by taking the sliding assembly 406 connected to the first material taking arm 402 as an example, the sliding assembly 406 includes a timing belt 4061, a rotating wheel 4062 and a sliding motor 4063, and the rotating wheel 4062 is rotatably connected to the rotating frame 401 and is provided with two in the sliding direction of the first material taking arm 402. A sliding motor 4063 is provided on the rotating frame 401, and an output end of the sliding motor 4063 is coaxially connected to one of the rotating wheels 4062. The synchronous belt 4061 is wound around the rotating wheel 4062, and the synchronous belt 4061 is connected with a synchronous piece 4064 connected with the first material taking arm 402.
As shown in fig. 5, the sliding motor 4063 is linked with the first material taking arm 402 through the rotating wheel 4062 and the synchronous belt 4061, and the first material taking arm 402 slides, so as to improve the stability of the first material taking arm 402 in the motion process, the first material taking arm 402 is connected with the rotating frame 401 in a sliding manner through a linear guide rail.
As shown in fig. 5 and 7, in order to ensure that the relative position of each wafer 6 transferred to the detection station 3 is the same, the transfer device 4 positions the wafer 6, the transfer device 4 further includes a control module, and an edge detection sensor 407 and an angle adjustment mechanism 408 both connected to the control module, and the edge detection sensor 407 and the angle adjustment mechanism 408 are both located on the movement path of the first material taking arm 402. In the retracted state, the first and second pick-up arms 402 and 403 are provided with light-transmitting openings at imaging positions with respect to the edge detection sensor 407.
As shown in fig. 5 and 7, when the first material taking arm 402 takes down the wafer 6 to be detected and is in a retracting state, the edge detection sensor 407 scans the edge of the wafer 6 for imaging, and if the edge detection sensor 407 detects a notch in the edge of the wafer 6, the control module starts the rotation transmission portion, so that the wafer 6 can be transferred. If the edge detection sensor 407 does not detect the notch of the wafer 6, the control module starts the angle adjustment mechanism 408, and the angle adjustment mechanism 408 drives the wafer 6 to rotate vertically until the edge detection sensor 407 scans the notch of the wafer 6.
Referring to fig. 5, the edge detection sensor 407 includes an upper laser transmitter 4071 and a lower laser receiver 4072, and the upper laser transmitter 4071 and the lower laser receiver 4072 are sequentially disposed on the rotating frame 401 from top to bottom. Both the first pick arm 402 and the second pick arm 403 are positioned between the upper laser transmitter 4071 and the lower laser receiver 4072.
As shown in fig. 7, the angle adjusting mechanism 408 includes an adjusting motor 4081, a rotary sucker 4082 and a first lifting cylinder 4083, a fixed end of the first lifting cylinder 4083 is fixedly connected to the rotary frame 401 through a fixed block 4086, and a piston end of the first lifting cylinder 4083 is connected to a horizontally disposed supporting plate 4084. Adjusting motor 4081 is vertical setting and is located the below of loading board 4084, and adjusting motor 4081's stiff end and loading board 4084 fixed connection. The power output end of the adjusting motor 4081 is coaxially connected with a linkage shaft 4085 which penetrates through the bearing plate 4084, and the top end of the linkage shaft 4085 is coaxially connected with the rotary sucker 4082.
The piston end of the first lifting cylinder 4083 moves, the synchronous lifting of the adjusting motor 4081 and the rotating sucker 4082 is achieved through the bearing plate 4084, the power output end of the adjusting motor 4081 rotates, the rotating sucker 4082 is driven to rotate through the linkage shaft 4085, the vertical lifting and rotating of the rotating sucker 4082 are achieved, and the rotating sucker 4082 drives the wafer 6 to rotate.
As shown in fig. 7, a vertically arranged guide bar 4087 is connected to the fixed block 4086, a top plate 4088 is connected to the top end of the guide bar 4087, and the top plate 4088 is fixedly connected to the rotating frame 401. Sliding sleeve is equipped with spline 4089 on the guide arm 4087, and spline 4089 is fixed to be inlayed and is established in loading board 4084, provides the direction for the vertical motion of loading board 4084 and adjustment motor 4081 to the stability of rotating suction cup 4082 in the lift in-process has been improved.
As shown in fig. 7, the linkage shaft 4085 is provided with an induction member 4092 via a connection sleeve 4091, and the connection sleeve 4091 is fixedly connected to the upper surface of the bearing plate 4084. The universal driving shaft 4085 is fixedly sleeved with a detection disc 409, the detection disc 409 is provided with a detection through groove, and the detection disc 409 is located in the sensing range of the sensing piece 4092.
During actual use, the detection disc 409 rotates along with the rotary sucker 4082 through the linkage shaft 4085, the sensing piece 4092 senses the detection disc 409 in real time, and when the sensing piece 4092 senses the detection through groove again, the wafer 6 has completed at least 360-degree rotation. If the edge detection sensor 407 does not detect the notch of the wafer 6, it indicates that the wafer 6 has a problem, and the industrial personal computer alarms.
As shown in fig. 8, the detection station 3 includes an alignment platform 301, a detection platform 302, an energization detection portion 303, and an alignment imaging unit, and the alignment platform 301 is horizontally disposed and moves on a horizontal plane. The inspection stage 302 is provided on the alignment stage 301 so as to be capable of lifting and lowering, and is capable of rotating in the vertical direction, and the inspection stage 302 is disposed on the vacuum chuck wafer 6.
As shown in fig. 8, a horizontal moving seat 3011 is provided below the alignment stage 301, and the alignment stage 301 is connected to the moving seat 3011 by two X-direction linear slide rails 3012 arranged side by side. The moving seat 3011 is located above the installation platform 1, and the moving seat 3011 is connected to the installation platform 1 in a sliding manner through two Y-direction linear sliding rails 3013 arranged side by side. The X-direction linear slide 3012 and the Y-direction linear slide 3013 are both arranged horizontally and perpendicular to each other.
As shown in fig. 9, since the wafer 6 is placed on the inspection platform 302 by an external robot, in order to facilitate taking and placing the wafer 6, the inspection platform 302 is a vacuum chuck, and three posts 3021 are symmetrically arranged on the center of the inspection platform 302.
The robot places the wafer 6 on the post 3021, and the inspection stage 302 applies an attraction force to the wafer 6 so that the wafer 6 is stably attracted to the post 3021, and the wafer 6 can be removed by releasing the attraction force. The pillar 3021 provides additional space between the bottom of the wafer 6 and the inspection platform 302, which facilitates the robot to pick and place the wafer 6, and avoids the possibility of damage to the wafer 6 during the picking and placing process.
As shown in fig. 9, in order to realize the lifting and rotating functions of the detection platform 302, a vertically arranged linear motor 3014 is connected to the lower surface of the alignment platform 301, a power output end of the linear motor 3014 penetrates through the alignment platform 301 and is connected to a rotary motor 3015, and a power shaft of the rotary motor 3015 is vertically arranged and coaxially connected to the bottom of the detection platform 302. Preferably, the rotary motor 3015 is a DD motor, and an origin limit sensor 3016 is connected to the alignment platform 301 and is disposed corresponding to the DD motor to monitor the rotation of the alignment platform 301.
As shown in fig. 8 and 9, the energization detecting portion 303 is disposed above the detection platform 302, the energization detecting portion 303 includes a chuck fixing plate 3031 and a probe chuck 3032, and the chuck fixing plate 3031 is horizontally disposed and disposed on the housing 5. The side wall of the chuck fixing plate 3031 is connected with a dotting device 305 through a lifting mechanism 304, the dotting direction of the dotting device 305 is downward, and the dotting device 305 is electrically connected with external industrial control equipment. The probe chuck 3032 is horizontally embedded in the chuck fixing plate 3031 and is connected with an external testing machine. The probe chuck 3032 has a needle 3033 at the center, and the bottom end of the needle 3033 is electrically contacted with the chip pin on the wafer 6 during detection.
As shown in fig. 10, the lifting mechanism 304 includes a second lifting cylinder 3041 and a cylinder base 3042, the cylinder base 3042 is fixedly connected to the chuck fixing plate 3031, and the second lifting cylinder 3041 is vertically disposed on the cylinder base 3042. The piston end of the second lifting cylinder 3041 is fixedly connected with the dotter 305 through a mounting base 3051, in order to improve the stability of the dotter 305 in the movement process, the fixed end of the second lifting cylinder 3041 is vertically connected with a guide bar 306, and the mounting base 3051 is slidably sleeved on the guide bar 306.
As shown in fig. 8, the alignment imaging unit is configured to be connected to an external industrial control device, and the alignment imaging unit includes a first alignment camera 307 and a second alignment camera 308, and both the first alignment camera 307 and the second alignment camera 308 realize image capture through a reflector.
The first alignment camera 307 acquires the position information of the wafer 6, the second alignment camera 308 acquires the position information of the needle 3033 and the dotter 305, and external industrial control equipment integrates, compares and acquires the acquired information, establishes a complete space coordinate system and generates a path plan when the wafer 6 is detected. The alignment platform 301 moves the detection position according to the path plan, the detection platform 302 rises until the chip pins on the wafer 6 contact the needle 3033, and the tester measures the electrical property and other parameters of each chip. Finally, the detection platform 302 moves to the position below the dotting device 305, and the dotting device 305 performs dotting and marking on the bad chips on the wafer 6 according to the detection result diagram of the wafer 6, so that the automatic alignment, detection and marking of the wafer 6 to be detected are realized, the detection is fast and efficient, the screening of the bad products is facilitated, and the detection result is accurate.
As shown in fig. 8 and 9, in order to reduce the space required for mounting the imaging unit while satisfying the usage requirements, the alignment camera 307 is fixedly connected to the chuck fixing plate 3031 and horizontally disposed, and the lens of the alignment camera 307 is disposed toward the right lower side. The second alignment camera 308 is horizontally erected on the alignment platform 301 through a support 309, and a lens of the second alignment camera 308 is arranged towards the right upper side.
The implementation principle of the application is as follows: on storage station 2, the upset portion drives and makes a round trip to overturn through roll-over stand 203 linkage basket of flowers 201, and when not getting the blowing, basket of flowers 201 and wafer 6 keep the slope setting, when getting the blowing, the vertical setting of basket of flowers 201.
The sliding motor 4063 drives the first 402 of the material taking arm and the second 403 of the material taking arm, the first 402 of the material taking arm extends out to take the wafer 6 to be detected down from the storage station 2, the rotating sucker 4082 rises to adsorb the wafer 6, then the wafer 6 is driven to rotate, and when the edge detection sensor 407 detects a notch, the rotating sucker 4082 stops rotating and descends to reset. The rotating frame 401 rotates, and the first material taking arm 402 transfers the wafer 6 to the detection station 3 and then leaves.
When the wafer 6 is at the inspection station 3, the inspection platform 302 vacuum-adsorbs the wafer 6, the alignment platform 301 moves to the lower side of the first alignment camera 307 through the X-direction linear slide 3012 and the Y-direction linear slide 3013, and the first alignment camera 307 captures the position information of the inspected wafer 6mark and generates the wafer 6MAP. The alignment platform 301 is linked with the alignment camera II 308, and moves to the positions below the probe chuck 3032 and the dotter 305 respectively, so as to capture the position of the needle 3033 and the position of the dotter 305, and the position coordinates of the wafer 6 are combined for comparison, so that a complete position coordinate system is generated. The alignment stage 301 moves to the inspection position according to the generated wafer 6MAP. The linear motor 3014 drives the detection platform 302 to ascend, so that chip Pins (PAD) on the wafer 6 are in contact with the needle 3033, the tester connected with the chuck measures parameters such as electrical property of each chip, and the industrial personal computer generates a detection result graph of all chips on the wafer 6 according to the detection results. Then, the inspection stage 302 moves to a position below the dotter 305, and the dotter 305 performs dotting marking on the defective chips on the wafer 6.
After the detection is completed, the second pick arm 403 extends out to take the detected wafer 6 off the detection station 3, and then the rotating frame 401 rotates, and the second pick arm 403 transports the wafer 6 to the detection station 3 and leaves. The process is circularly reciprocated, the wafers 6 are automatically fed, detected and received, and the automatic feeding device is suitable for the wafers 6 with different specifications and has high universality. Meanwhile, automatic calibration, point selection and parameter testing are performed in the detection process, the detection speed is high, the detection efficiency is high, and the surface quality of the wafer 6 is effectively guaranteed.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. The utility model provides a wafer electrical property check out test set which characterized in that, is in including mounting platform, setting storage station and detection station on the mounting platform, still be equipped with on the mounting platform and move the device, it will await measuring the wafer follow to move by the device storage station transports to detection station, and transport back after the detection is accomplished storage station.
2. The wafer electrical property detection device of claim 1, wherein the storage station comprises a flower basket, a base frame and an overturning portion, a material taking opening is formed in one side of the flower basket, the base frame is vertically slidably arranged on the mounting platform, the flower basket is movably arranged on the base frame, and the overturning portion is connected between the flower basket and the base frame so as to drive the flower basket to overturn along a direction away from the material taking opening.
3. The wafer electrical performance detection equipment according to claim 1, wherein the detection station comprises an alignment platform, a detection platform configured on a vacuum adsorption wafer, an electrifying detection part and an alignment imaging unit, the alignment platform is arranged on the mounting platform and can move horizontally, the detection platform is arranged on the alignment platform in a liftable manner and can rotate in a vertical direction, the electrifying detection part is arranged above the detection platform, a dotter is arranged on the electrifying detection part, the electrifying detection part comprises a probe chuck with a needle head, the alignment imaging unit comprises a first alignment camera connected to the electrifying detection part and a second alignment camera connected to the alignment platform, the first alignment camera and the second alignment camera realize 90-degree image capture through a reflector, the first alignment camera collects position information of the wafer, the second alignment camera collects the position information of the needle head and the dotter, the external industrial control equipment integrates the collected information, establishes a complete space coordinate system and generates a path plan when the wafer is detected.
4. The wafer electrical performance detection device of claim 2, wherein the overturning portion comprises a sliding unit, a linear driving member and a linkage plate fixedly connected to the basket, a guide groove is formed in the linkage plate, the end position of the guide groove is gradually raised along a direction departing from the material taking port, the sliding unit is slidably inserted into the guide groove, and the linear driving member is hinged between the sliding unit and the base frame.
5. The wafer electrical property detection apparatus of claim 4, wherein the flipping portion further comprises a positioning element, the positioning element is a micro switch disposed on the base frame, and the micro switch is electrically connected to the linear driving element.
6. The wafer electrical property detection equipment of claim 5, further comprising a roll-over stand fixedly connected to the linkage plate, wherein one side, away from the linkage plate, of the base frame is hinged to the roll-over stand, the roll-over stand and the base frame are oppositely arranged to form a limited space for accommodating a carrying disc, the carrying disc is horizontally arranged, and the roll-over stand is detachably connected with the basket through a clamping piece.
7. The wafer electrical performance detection equipment as recited in claim 1, wherein the transfer device comprises a rotating frame, a first material taking arm and a second material taking arm, the first material taking arm and the second material taking arm are horizontally connected to the rotating frame in a sliding manner, the first material taking arm and the second material taking arm are both in an extending state and a withdrawing state, the rotating frame is arranged on the mounting platform and can rotate vertically, projections of sliding directions of the first material taking arm and the second material taking arm are collinear in a vertical direction, and a vertical distance between the second material taking arm and the first material taking arm is larger than the thickness of one wafer.
8. The wafer electrical performance detection apparatus as recited in claim 7, wherein the transfer device further comprises a control module, and an edge detection sensor and an angle adjustment mechanism both connected to the control module, the edge detection sensor is disposed on the rotating frame, when the first pick-up arm is in a retracted state, the edge detection sensor senses a position of a notch of a wafer on the first pick-up arm, when the edge detection sensor does not detect the notch, the edge detection sensor activates the angle adjustment mechanism through the controller, and the angle adjustment mechanism drives the wafer to rotate vertically.
9. The wafer electrical property detection apparatus as recited in claim 8, wherein the edge detection sensor comprises an upper laser transmitter and a lower laser receiver disposed on the rotating frame, and the first and second pick-up arms are provided with light-transmitting openings at detection positions corresponding to the edge detection sensor; the angle adjusting mechanism comprises an adjusting motor, a rotating sucker and a first lifting cylinder, wherein the adjusting motor and the rotating sucker are coaxially connected, the first lifting cylinder is vertically connected with the rotating frame, and the piston end of the first lifting cylinder is fixedly connected with the fixed end of the adjusting motor through a bearing plate.
10. The wafer electrical performance inspection apparatus of claim 1, further comprising a cabinet, wherein the storage station, the inspection station, and the transfer device are sealed within the cabinet.
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| CN115274483B (en) | 2024-01-23 |
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