CN114756110A - Low-voltage direct-current power supply immersion liquid cooling calculation server - Google Patents

Abstract

The invention discloses a low-voltage direct-current power supply immersion liquid cooling computing server, in particular to the technical field of servers, which comprises a lifting ring pulling aid, and comprises a single-phase immersion liquid cooling device, wherein the single-phase immersion liquid cooling device comprises a shell, an inner container arranged in the shell, a plurality of liquid cooling servers immersed in the inner container, a cold liquid distribution device communicated with the inner container, and an outdoor cooler for cooling a cooling medium, the liquid cooling servers comprise a mainboard, a built-in PCIE16x right steering card, an optical fiber network card, an input power socket, a mainboard interface, an optical fiber socket, a key indicator lamp panel, a first CPU and a second CPU, the power of the single card is 350W, the total power of the servers is 850W, the equipment adopts a DC48V power supply system of a communication standard, the system design is optimized, system accessories are reduced, the power loss of alternating current and direct current multiple conversion in the system operation process is effectively reduced, and the heating value is reduced at the same time, the system is more reliable and energy-saving.

Description

Low-voltage direct-current power supply immersion liquid cooling calculation server

Technical Field

The invention relates to the technical field of servers, in particular to a low-voltage direct-current power supply immersion liquid cooling calculation server.

Background

The server hardware mainly comprises: processor, memory, chipset, I/O (RAID card, network card, HBA card), hard disk, chassis (power supply, fan), and the like. The working principle of the server is that the server is connected through a network, and the operations of data connection, page access, authority management and the like are achieved in the four aspects of a connection process, a request process, a response process and connection closing.

In the form of heat dissipation, most of the existing servers are air-cooled servers. The heat from the CPU is transferred to the heat sink block through the heat sink and then the hot air is blown away by the fan. In the operation process of the air cooling server, a precise air conditioner of a machine room is required to be configured to cool heat generated by the server. However, the air cooling method is inefficient, the power consumption of the system is large, and the overall PUE (index for evaluating the energy efficiency of the data center) of the machine room is not less than 2, which is not beneficial to the energy conservation and environmental protection of the whole system. Meanwhile, in the running process of the system, the noise of the air cooling server is more than 75dB (A), and obvious noise influence is caused.

In a power distribution system architecture, a conventional server mostly adopts an alternating current form, and in consideration of system reliability, an UPS (uninterruptible power supply) and a storage battery are often required to be used for backup power supply. When the commercial power is interrupted (power failure in accident), the UPS supplies the direct current electric energy of the battery to the load by the method of switching and converting the inverter to continuously supply 220V alternating current to the load, so that the load keeps normal work and protects the software and hardware of the load from being damaged. However, a voltage inversion process exists in the operation process of the system, so that certain electric quantity loss is caused.

Disclosure of Invention

The invention aims to solve the technical problems of low safety, high electric quantity loss and obvious noise caused by the existence of a voltage inversion process, and provides a low-voltage direct-current power supply immersion liquid cooling calculation server with high safety, low electric loss and low noise.

In order to solve the technical problems, the invention provides the following technical scheme: low pressure direct current power supply submergence liquid cooling calculation server, including rings help and pull out ware and ATX power strip, including single-phase submergence formula liquid cooling device, single-phase submergence formula liquid cooling device is including the shell, arrange the inside container in the shell in, immerse at the inside a plurality of liquid cooling servers of inside container, with the cold liquid distributor of inside container intercommunication, to the outdoor cooler of coolant cooling, liquid cooling server includes mainboard, built-in PCIE16x right turn to card, fiber network card, input power socket, mainboard interface, fiber socket, button indication lamp plate, single card power and is 350W, the first CPU and the second CPU of server total power 850W, ATX power strip is the low pressure direct current power supply of telecommunication room system standard DC 48V.

In a preferred embodiment of the present invention, the ATX power board has output voltages of 5Vsb, 5V, 3.3V, and 12V, maximum load currents of 3A, 25A, and 55A, and maximum powers of 15W, 125W, 80W, and 650W, respectively.

In a preferred embodiment of the present invention, the single-phase immersion liquid cooling apparatus further comprises a cooling liquid having a specific heat capacity of 2.1-2.4kJ/kg ･ k and a kinematic viscosity of 5.12 at 40 ℃ under a condition that the density is 797 kg/m under high pressure condition at 20 ℃.

As a preferred technical solution of the present invention, the cold liquid distribution device includes a plate heat exchanger, a liquid supply pipe and a liquid return pipe are connected between the internal container and the plate heat exchanger, a liquid pump is disposed between the liquid supply pipe and the plate heat exchanger, and a water supply pipe and a water return pipe are connected between the plate heat exchanger and the outdoor cooler.

As a preferable aspect of the present invention, the outdoor cooler includes a dry cooler and a cooling tower.

As a preferable embodiment of the present invention, a liquid level observation tube is connected to one side of the inner container, and a temperature detector is installed inside the inner container 11.

As a preferable technical solution of the present invention, a plurality of liquid distribution pipes are provided on the liquid supply pipe, and the plurality of liquid distribution pipes are arranged at intervals along an axial direction of the liquid supply pipe; liquid distributing pipes are arranged between the two liquid cooling servers.

As a preferred technical solution of the present invention, the first CPU and the second CPU are disposed in a staggered manner, and three baffles having different lengths are disposed at edges of the first CPU and the second CPU.

Compared with the prior art, the invention can achieve the following beneficial effects:

1. the liquid cooling device can be effectively suitable for a single-phase immersed liquid cooling technology, parts in equipment are compact, meanwhile, the liquid separating pipe and the baffle are applied, liquid flowing of a liquid cooling use environment is fully considered, the baffles arranged at the upper ends of the first CPU and the second CPU are close to each other, the two baffles are positioned on two sides of the first CPU, cooling liquid is forced to flow to the first CPU, the baffle on the left side of the upper end is far away from the lower end of a server and is positioned above the second CPU, the cooling liquid forced to flow through the first CPU flows to the second CPU, the flow field in the server is improved, the heat exchange effect is enhanced, and through fluid simulation analysis, the heat dissipation efficiency of the system can be greatly improved.

2. The equipment adopts DC48V low-voltage direct current power supply, so that the safety is high when the machine room maintenance personnel perform guarantee operation, and the safety production accident is avoided.

3. The power supply efficiency of a power supply unit is designed independently by adopting a DCDC voltage reduction module in the equipment to reach 95.5 percent and exceed 92 percent of the power supply efficiency of a platinum-grade power supply.

4. The equipment adopts a DC48V power supply system with a communication standard, optimizes the system design, reduces system accessories, effectively reduces the power loss of alternating current-direct current multiple conversion in the system operation process, and simultaneously reduces the heat productivity, so that the system is more reliable and energy-saving.

5. The equipment maintainability is good, and the system all adopts the standard computer spare part that mature reliable, the convenient purchase in the market and telecommunication system spare part design production, also can be convenient when the international situation is nervous obtain spare part and carry out production and maintenance, reduces user's long-term use cost.

Drawings

FIG. 1 is a schematic view of the structure of the CPU and the baffle installation of the present invention.

FIG. 2 is a schematic diagram of a single-phase immersion liquid cooling apparatus according to the present invention.

FIG. 3 is a top view of a computing unit according to the present invention.

FIG. 4 is a cloud diagram of the internal speed profile of the initial condition server of the present invention.

FIG. 5 is a cloud of the shell optimization server internal speed profile of the present invention.

FIG. 6 is a cloud of the velocity profile of a baffle server according to the present invention.

FIG. 7 is a cloud of the internal speed profile of a three-baffle server of the present invention.

FIG. 8 is a bar graph of CPU temperature under different conditions.

Wherein:

1. an ATX power panel; 2. a first CPU; 3. a second CPU; 4. an optical network card; 5. a hoisting ring pull-out aid; 6. an input power socket; 7. a motherboard interface; 8. a fiber optic receptacle; 9. a key indicator panel; 10. a housing; 11. an inner container; 12. a liquid cooling server; 13. a cold liquid dispensing device; 14. a plate heat exchanger; 15. a liquid supply tube; 151. a liquid separating pipe; 16. a liquid return pipe; 17. an outdoor cooler; 18. a water supply pipe; 19. a water return pipe; 20. a liquid pump; 21. a liquid level observation tube; 22. a temperature detector; 23. and a baffle plate.

Detailed Description

The present invention will be further described with reference to specific embodiments for the purpose of facilitating an understanding of technical means, characteristics of creation, objectives and functions realized by the present invention, but the following embodiments are only preferred embodiments of the present invention, and are not intended to be exhaustive. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1-8, the present invention provides a low voltage DC power supply immersion liquid cooling computing server, which comprises a ring extraction aid 5 and an ATX power board 1, and includes a single-phase immersion liquid cooling device, the single-phase immersion liquid cooling device includes a housing 10, an internal container 11 disposed in the housing 10, a plurality of liquid cooling servers 12 immersed in the internal container 11, a cold liquid distribution device 13 communicated with the internal container 11, and an outdoor cooler 17 for cooling a cooling medium, the liquid cooling servers 12 include a motherboard, a built-in PCIE16x right steering card, an optical fiber network card 4, an input power socket 6, a motherboard interface 7, an optical fiber socket 8, a key indicator light panel 9, a first CPU2 and a second CPU3 having a single card power of 350W and a total server power W850, the ATX power board 1 is a standard DC48V low voltage DC power supply for a telecommunication room system, the housing 10 has a size of 360mm width, 460mm depth and 40mm height, the liquid cooling server 12 is an ultramicro X12DPI-N6 type mainboard, a built-in PCIE16X right steering card and is provided with an FDR353A type single-port IB 56G optical fiber network card 4. The ATX power panel 1 is input by adopting DC48V, standard DC48V low-voltage direct current power supply of a telecommunication room system can be used, the output voltage of the ATX power panel 1 is 5Vsb, 5V, 3.3V and 12V, the maximum load current is 3A, 25A and 55A respectively, the maximum power is 15W, 125W, 80W and 650W respectively, all holes are formed in the position, where no connector is arranged, of the front panel of the shell 10 for heat dissipation, the left side and the right side (as shown in the left side and the right side of the figure 3) are respectively provided with a lifting ring pulling aid 5 for plugging, and an M6 loose-free screw is used for fixing in a liquid cooling cabinet. The leftmost side of the front panel is provided with an XT60E1-M type direct current power supply input socket for supplying power, and the socket can bear DC48V and 30A current. The left side of the front panel is provided with a mainboard interface. The middle of the front panel is a network fiber socket 8. The fiber network card 4 is mounted on the housing 10 compactly using two screws. And a key indicator lamp plate 9 is arranged on the right side of the front panel and used for controlling the starting operation of the equipment and observing the working state of the equipment.

The first CPU2 and the second CPU3 are immersed in the single-phase immersion type liquid cooling device, the power of a single card is 350W, and the total power of a server is 850W. The single-phase immersion type liquid cooling technology is adopted, elements such as the server and the like are directly immersed into the cooling liquid, the cooling liquid and the heating element are in direct contact for heat exchange in the process and do not generate phase change, the cooling liquid absorbs heat and then flows into the plate heat exchanger 14, and the heat is taken away by external cooling circulation.

Compared with the traditional 1U standard server powered by an AC220V alternating current power supply, the liquid cooling computing server is reduced in size, the DC-DC conversion efficiency is up to 95.5%, and the size of a server case is 360mm wide, 460mm deep, 40mm high. Meanwhile, the server supports DC48V direct current power supply, can be compatible to be used in a super-high power modular communication power supply system which is mature in technology and is applied to telecommunication operator rooms in a large scale, realizes three-phase alternating current input and online energy storage of a lead-acid storage battery pack by an economical, mature, reliable and stable communication power supply system, and directly uses the DC48V direct current output of the communication power supply system to supply power to a server cabinet, so that the flow and energy loss of a traditional server system that a UPS uninterrupted power supply system converts direct current of a storage battery into alternating current to supply to the server through an inverter under the condition that commercial power is cut off are reduced. The structure of the whole system is simpler, the problem of energy loss of up to 15% in the inversion process is solved, and the reliability of the system is improved.

Preferably, the single-phase immersion type liquid cooling device further comprises a cooling liquid with specific heat capacity of 2.1-2.4kJ/kg ･ k when the liquid is subjected to a high temperature shift at 20 ℃ and with kinematic viscosity of 5.12 when the liquid is subjected to a high temperature shift at 40 ℃, and the cooling liquid is subjected to a high temperature shift at 20 ℃ and is subjected to a high temperature shift at 797 kg/m for thin film plantation, so that the density of the cooling liquid is low, the liquid input amount is small, and the cost is low; the specific heat capacity of the liquid is about 2.3kJ/kg ･ k, the heat conduction performance is good, and the efficiency is high; when the temperature of the cooling liquid is 40 ℃, the kinematic viscosity (CST) is 5.12, the viscosity is lower, and meanwhile, the cooling liquid is combined with ultrahigh heat conduction efficiency, so that the cooling medium can be rapidly cooled, the high-efficiency operation of a data center is realized, and the cost of bearing, price and the like is reduced.

Preferably, the cold liquid distribution device 13 includes a plate heat exchanger 14, a liquid supply pipe 15 is connected between a water inlet end of the inner container 11 and a water outlet end of one end of the plate heat exchanger 14, a liquid return pipe 16 is connected between the water outlet end of the inner container 11 and a water inlet end of one end of the plate heat exchanger 14, a liquid pump 20 is disposed between the liquid supply pipe 15 and the plate heat exchanger 14 and used for conveying the cooling liquid, a water return pipe 19 is connected between a water inlet end of the other end of the plate heat exchanger 14 and a water inlet end of the outdoor cooler 17, and a water supply pipe 18 is connected between a water outlet end of the other end of the plate heat exchanger 14 and the water inlet end of the outdoor cooler 17.

Preferably, the outdoor cooler 17 comprises a dry cooler or cooling tower.

Preferably, a liquid level observation tube 21 is connected to one side of the inner container 11, the liquid level observation tube 21 is a transparent tubular structure which is transparent and is communicated with the inner container 11, and further, the liquid level of the coolant in the inner container 11 can be observed through the distance of a communicating vessel, and a temperature detector 22 is installed in the inner container 11, so that the temperature of the coolant in the inner container 11 can be monitored.

Preferably, a plurality of liquid distribution pipes 151 are arranged on the liquid supply pipe 15, and the plurality of liquid distribution pipes 151 are arranged at intervals along the axial direction of the liquid supply pipe 15; a liquid distribution pipe 151 is disposed between the two liquid-cooled servers 12, as shown in fig. 2, so that the liquid supply pipe 15 can uniformly deliver the cooling liquid to between every two liquid-cooled servers 12.

Preferably, the first CPU2 and the second CPU3 are arranged in a staggered manner, and three baffles 23 with different lengths are arranged at the edges of the first CPU2 and the second CPU 3.

As shown in fig. 4 to 8, a low-voltage dc supply liquid cooling server model is established by using three-dimensional modeling software, and thermodynamic analysis is performed on the model by using CFD thermal simulation software. And (3) carrying out gridding division on the server by using a self-contained module of the CFD software, and carrying out gridding encryption processing on the position in consideration of frequent heat exchange near high-heat-flux components such as a chip. Aiming at the heat productivity of the chip, heat radiators of different materials, different structures and different types are simulated and optimally designed, and finally the type of the heat radiator is determined to be a finned heat radiator, the thickness of fins is 0.8mm, the space between the fins is 4.5mm, and the total height of the heat radiator is 23 mm. According to the chip position, combining the internal speed distribution cloud picture of the server and the flow boundary line picture, a baffle is additionally arranged at a proper position in the server, and the cooling liquid is forced to flow to the chip position. Meanwhile, the inlet and outlet positions of the server shell are optimally designed according to the simulation result, and the inlet and outlet positions are matched with the internal baffle of the server, so that the cooling effect is obviously improved. As shown in fig. 4 and 8, the initial operating conditions were not optimized, at which time the first CPU2 and the second CPU3 temperatures were 67.7 ℃ and 75.8 ℃, respectively; as shown in fig. 7 and 8, after the optimization of the server casing 10 and the addition of the three baffles 23, the temperatures of the first CPU2 and the second CPU3 are reduced to 58.4 ℃ and 56.8 ℃, and the cooling capacity is greatly improved.

As shown in fig. 1, the baffles 23 provided at the upper ends of the first CPU2 and the second CPU3 are close to each other, two baffles are provided on both sides of the first CPU2, and the cooling liquid is forced to flow toward the first CPU2, the upper left baffle 23 is spaced from the lower server end plate by 232mm and has a size of 29.5mm × 106mm × 3mm, and the right baffle 23 is arranged in parallel with the left baffle 23 and has a size of 29.5mm × 54mm × 3 mm. The baffle plate is positioned above the second CPU3 and is 24mm away from the left baffle plate, the cooling liquid which flows through the first CPU2 is forced to flow to the second CPU3, and the size of the lower baffle plate 23 is 29.5mm multiplied by 160mm multiplied by 3mm, so that the internal flow field of the server is improved, and the heat exchange effect is enhanced.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (8)

1. Low pressure direct current power supply submergence liquid cooling calculation server helps pulling out ware (5) and ATX power strip (1), its characterized in that including rings: including single-phase submergence formula liquid cooling device, single-phase submergence formula liquid cooling device is including shell (10), arrange inside container (11) in shell (10), immerse in inside a plurality of liquid cooling server (12) of inside container (11), with cold liquid distributor (13) of inside container (11) intercommunication, to coolant refrigerated outdoor cooler (17), liquid cooling server (12) are including mainboard, built-in PCIE16x right turn to card, fiber network card (4), input power socket (6), mainboard interface (7), fiber socket (8), button indicator lamp plate (9), single card power be 350W, first CPU (2) and second CPU (3) of server total power 35850W, ATX power strip (1) is the telecommunications computer lab system standard DC48V low pressure direct current power supply.

2. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: the output voltage of the ATX power panel (1) is 5Vsb, 5V, 3.3V and 12V, the maximum load current is 3A, 25A and 55A respectively, and the maximum power is 15W, 125W, 80W and 650W respectively.

3. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: the single-phase immersion type liquid cooling device further comprises cooling liquid with the density of 797 kg/m and the specific heat capacity of 2.1-2.4kJ/kg ･ k at the temperature of 20 ℃ and the kinematic viscosity of 5.12 at the temperature of 40 ℃.

4. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: the cold liquid distribution device (13) comprises a plate type heat exchanger (14), a liquid supply pipe (15) and a liquid return pipe (16) are connected between the inner container (11) and the plate type heat exchanger (14), a liquid pump (20) is arranged between the liquid supply pipe (15) and the plate type heat exchanger (14), and a water supply pipe (18) and a water return pipe (19) are connected between the plate type heat exchanger (14) and an outdoor cooler (17).

5. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: the outdoor cooler (17) comprises a dry cooler or a cooling tower.

6. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: one side of the inner container (11) is connected with a liquid level observation pipe (21), and a temperature detector (22) is arranged inside the inner container (11).

7. The low voltage dc powered immersion liquid cooled computing server of claim 4, wherein: the liquid supply pipe (15) is provided with a plurality of liquid distribution pipes (151), and the liquid distribution pipes (151) are arranged at intervals along the axial direction of the liquid supply pipe (15); liquid separating pipes (151) are arranged between the two liquid cooling servers (12).

8. The low voltage dc powered immersion liquid cooled computing server of claim 1, wherein: the first CPU (2) and the second CPU (3) are arranged in a staggered mode, and three baffles (23) with different lengths are arranged at the edges of the first CPU (2) and the second CPU (3).

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