CN114656785A - A kind of high weld line strength polyamide composite material and its preparation method and application - Google Patents
A kind of high weld line strength polyamide composite material and its preparation method and application Download PDFInfo
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- CN114656785A CN114656785A CN202210324077.9A CN202210324077A CN114656785A CN 114656785 A CN114656785 A CN 114656785A CN 202210324077 A CN202210324077 A CN 202210324077A CN 114656785 A CN114656785 A CN 114656785A
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- weld line
- acid
- composite material
- line strength
- polyamide composite
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- 239000004952 Polyamide Substances 0.000 title claims abstract description 34
- 229920002647 polyamide Polymers 0.000 title claims abstract description 34
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 239000003063 flame retardant Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims abstract description 11
- 239000012779 reinforcing material Substances 0.000 claims abstract description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010456 wollastonite Substances 0.000 claims description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 3
- 125000004427 diamine group Chemical group 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 claims description 2
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 claims description 2
- KSQSUDDRZLCKSW-UHFFFAOYSA-N 2,4-dimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)CCN KSQSUDDRZLCKSW-UHFFFAOYSA-N 0.000 claims description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 2
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 claims description 2
- WTKWFNIIIXNTDO-UHFFFAOYSA-N 3-isocyanato-5-methyl-2-(trifluoromethyl)furan Chemical compound CC1=CC(N=C=O)=C(C(F)(F)F)O1 WTKWFNIIIXNTDO-UHFFFAOYSA-N 0.000 claims description 2
- FJSUFIIJYXMJQO-UHFFFAOYSA-N 3-methylpentane-1,5-diamine Chemical compound NCCC(C)CCN FJSUFIIJYXMJQO-UHFFFAOYSA-N 0.000 claims description 2
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 claims description 2
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000005909 Kieselgur Substances 0.000 claims description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 2
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 claims description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010440 gypsum Substances 0.000 claims description 2
- 229910052602 gypsum Inorganic materials 0.000 claims description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 2
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N n-Dodecanedioic acid Natural products OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 claims description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 claims description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Natural products OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 claims description 2
- 238000005469 granulation Methods 0.000 claims 2
- 230000003179 granulation Effects 0.000 claims 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims 2
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 claims 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Nonanedioid acid Natural products OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract description 2
- 238000004132 cross linking Methods 0.000 abstract description 2
- 229940125904 compound 1 Drugs 0.000 abstract 1
- 239000000463 material Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005187 foaming Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 229920006119 nylon 10T Polymers 0.000 description 9
- 239000000314 lubricant Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 150000001412 amines Chemical group 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 238000012925 biological evaluation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229930003827 cannabinoid Natural products 0.000 description 2
- 239000003557 cannabinoid Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 2
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- LMOSYFZLPBHEOW-UHFFFAOYSA-N 2,5-dichloroterephthalic acid Chemical compound OC(=O)C1=CC(Cl)=C(C(O)=O)C=C1Cl LMOSYFZLPBHEOW-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XSAOTYCWGCRGCP-UHFFFAOYSA-K aluminum;diethylphosphinate Chemical compound [Al+3].CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC XSAOTYCWGCRGCP-UHFFFAOYSA-K 0.000 description 1
- 229920006020 amorphous polyamide Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
一种高熔接痕强度聚酰胺复合材料,按重量份计,包括以下组分:半芳香族聚酰胺树脂60份;阻燃剂10‑30份;增强材料0‑60份;三胺类化合物0.01‑1份。本发明通过添加一定量的三胺类化合物,与半芳香族聚酰胺树脂的端羧基反应,形成微交联体系,使聚酰胺复合材料的熔接痕处更有效的缠绕,达到提高熔接痕强度的目的,而且还改善了耐起泡性能,尤其适用于SMT组装工艺。A high weld line strength polyamide composite material, comprising the following components in parts by weight: 60 parts of semi-aromatic polyamide resin; 10-30 parts of flame retardant; 0-60 parts of reinforcing material; 0.01 part of triamine compound ‑1 serving. In the present invention, a certain amount of triamine compounds are added to react with the terminal carboxyl groups of the semi-aromatic polyamide resin to form a micro-crosslinking system, so that the welding line of the polyamide composite material can be wound more effectively, so as to improve the strength of the welding line. purpose, but also improve the blister resistance, especially suitable for SMT assembly process.
Description
技术领域technical field
本发明涉及高分子材料技术领域,特别是涉及一种高溶剂强度聚酰胺复合材料及其制备方法和应用。The invention relates to the technical field of polymer materials, in particular to a high solvent strength polyamide composite material and a preparation method and application thereof.
背景技术Background technique
近年来,随着电子产品高度密集化以及产品小型化,使无铅表面贴装技术(SMT)成为了装配的重要方式。其应用要求元器件能够承受250-280℃的高温,传统的工程塑料例如PA66、PBT根本无法满足该要求,耐高温工程塑料便应运而生。由于半芳香族聚酰胺(PPA)具有高熔点、高热变形温度、高强度等优点,而广泛应用在连接器领域。In recent years, with the high density of electronic products and the miniaturization of products, lead-free surface mount technology (SMT) has become an important way of assembly. Its application requires components that can withstand high temperatures of 250-280 °C. Traditional engineering plastics such as PA66 and PBT cannot meet this requirement at all, and high temperature engineering plastics emerge as the times require. Semi-aromatic polyamide (PPA) is widely used in the field of connectors due to its high melting point, high heat distortion temperature and high strength.
连接器产品因多PIN针结构决定材料必须具有高流动性,快速成型,高熔接痕强度特性;与传统连接器不同的是,SMT装配方式要求材料必须经过250-280℃,此过程相当于对薄壁化材料进行快速老化,材料各方面性能都会有所下降,尤其是产品的熔接痕强度,下滑尤为明显。Connector products must have high fluidity, rapid prototyping, and high weld line strength characteristics due to the multi-PIN pin structure; different from traditional connectors, SMT assembly method requires materials to pass 250-280 ℃, this process is equivalent to When the thin-walled material undergoes rapid aging, the properties of the material will decline in all aspects, especially the weld line strength of the product, which will decline significantly.
一般来说,现有技术提高材料熔接痕常见的方法有:Generally speaking, the common methods for improving material weld lines in the prior art are:
第一、改进产品结构或模具结构,改善产品熔接痕的汇合角,或者将熔接痕设计在非受力位置,如申请号为202022094118(解决产品表面熔接痕的模具结构)。但这对产品结构和模具结构设计提出很高的要求,而且通用性不强,还增加了设计和产品的成本。First, improve the product structure or mold structure, improve the convergence angle of the product weld line, or design the weld line in a non-stressed position, such as the application number 202022094118 (the mold structure for solving the product surface weld line). However, this puts forward high requirements on product structure and mold structure design, and is not versatile, and also increases the cost of design and products.
第二、从配方上设计,提高材料的熔接痕强度。例如专利申请200810218925公开了一种高熔接痕强度增强聚丙烯材料及其制备方法,通过添加偶联剂改善增强料和树脂的结合,从而提高材料的熔接痕强度;专利申请201510900503公开了一种高熔接痕强度的聚酰胺材料及其制备方法与应用,其通过添加低粘度非晶聚酰胺化合物降低材料的结晶性行为同时提高材料的流动性。上述两种方案确实可以提高材料的熔接痕强度,但并不适用在高温尼龙所注塑的SMT规格产品。原因为:目前市售的偶联剂主要为液态硅烷偶联剂,且容易挥发,难以应用在高温尼龙加工外还容易使得材料含有大量小分子残留物,过回流焊时导致起泡;而引入低粘度非晶化合物,会破坏化合物的结晶性行为,降低了材料的冷却速率,注塑薄壁化产品时往往容易存在毛边等异常。Second, from the formula design, improve the weld line strength of the material. For example, patent application 200810218925 discloses a high weld line strength reinforced polypropylene material and a preparation method thereof. The combination of reinforcing material and resin is improved by adding a coupling agent, thereby improving the weld line strength of the material; patent application 201510900503 discloses a high weld line strength. Polyamide material with weld line strength, preparation method and application thereof, which reduce the crystallinity behavior of the material and improve the fluidity of the material by adding a low-viscosity amorphous polyamide compound. The above two solutions can indeed improve the weld line strength of the material, but they are not suitable for SMT products injected with high temperature nylon. The reason is: the current commercially available coupling agents are mainly liquid silane coupling agents, which are easy to volatilize and are difficult to apply to high-temperature nylon processing. It is also easy to cause the material to contain a large amount of small molecular residues, resulting in foaming during reflow soldering. Low-viscosity amorphous compounds will destroy the crystalline behavior of the compound, reduce the cooling rate of the material, and are prone to abnormalities such as burrs when injecting thin-walled products.
与此同时,在阻燃聚酰胺体系中由于无卤阻燃剂的引入,会使材料在挤出和加工中产生更多的瓦斯气,使其所注塑的产品在SMT装配方式中更容易造成起泡,从而影响产品功能性问题和外观。At the same time, due to the introduction of halogen-free flame retardants in the flame-retardant polyamide system, the material will generate more gas during extrusion and processing, making the injection-molded products more likely to cause damage in the SMT assembly method. Foaming, which affects product functionality and appearance.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于,提供一种高熔接痕强度聚酰胺复合材料,并且改善了耐起泡性。An object of the present invention is to provide a high weld line strength polyamide composite material with improved foaming resistance.
本发明的另一目的在于,提供上述高熔接痕强度聚酰胺复合材料的制备方法。Another object of the present invention is to provide a method for preparing the above-mentioned high weld line strength polyamide composite material.
本发明是通过以下技术方案实现的:The present invention is achieved through the following technical solutions:
一种高熔接痕强度聚酰胺复合材料,按重量份计,包括以下组分:A high weld line strength polyamide composite material, in parts by weight, comprising the following components:
半芳香族聚酰胺树脂 60份;60 parts of semi-aromatic polyamide resin;
阻燃剂 10-30份;Flame retardant 10-30 copies;
增强材料 0-60份;Reinforcing material 0-60 copies;
三胺类化合物 0.01-1份。0.01-1 part of triamine compound.
所述的半芳香族聚酰胺树脂衍生自二酸单元与二胺单元;所述的二酸单元衍生自45-100mol%的芳香族二羧酸与0-55mol%的脂肪族二羧酸,所述的芳香族二羧酸为对苯二甲酸、间苯二甲酸、2-甲基对苯二甲酸、2,5-二氯对苯二甲酸、2,6-萘二甲酸、1,4- 萘二甲酸、4,4’- 联苯二甲酸、2,2’-联苯二甲酸中的至少一种,所述脂肪族二羧酸的碳原子数为4-12个;所述的二胺单元衍生自1,4-丁二胺、1,6-己二胺、1,8-辛二胺、1,9-壬二胺、1,10-癸二胺、1,11-十一碳二胺、1,12-十二碳二胺、2-甲基-1,5-戊二胺、3-甲基-1,5-戊二胺、2,4-二甲基-1,6-己二胺、2,2,4-三甲基-1,6-己二胺、2,4,4-三甲基-1,6-己二胺、2-甲基-1,8-辛二胺、5-甲基-1,9-壬二胺中的至少一种。Described semi-aromatic polyamide resin is derived from diacid unit and diamine unit; Described diacid unit is derived from 45-100mol% of aromatic dicarboxylic acid and 0-55mol% of aliphatic dicarboxylic acid, so Described aromatic dicarboxylic acid is terephthalic acid, isophthalic acid, 2-methyl terephthalic acid, 2,5-dichloroterephthalic acid, 2,6-naphthalene dicarboxylic acid, 1,4- At least one of naphthalene dicarboxylic acid, 4,4'-biphenyl dicarboxylic acid, and 2,2'-biphenyl dicarboxylic acid, the number of carbon atoms of the aliphatic dicarboxylic acid is 4-12; Amine units derived from 1,4-butanediamine, 1,6-hexanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine Carbodiamine, 1,12-dodecanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,4-dimethyl-1, 6-Hexanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2-methyl-1,8 -At least one of octanediamine and 5-methyl-1,9-nonanediamine.
所述的脂肪族二羧酸选自1,4-丁二酸、1,6-己二酸、1,8-辛二酸,1,9-壬二酸,1,10-癸二酸,1,11-十一烷二酸、1,12-十二烷二酸中的至少一种。The aliphatic dicarboxylic acid is selected from 1,4-succinic acid, 1,6-adipic acid, 1,8-suberic acid, 1,9-azelaic acid, 1,10-sebacic acid, At least one of 1,11-undecanedioic acid and 1,12-dodecanedioic acid.
本发明实施例所用的半芳香族聚酰胺树脂为自制原料,方法如下:The semi-aromatic polyamide resin used in the embodiment of the present invention is a self-made raw material, and the method is as follows:
将计量的物料加入到20 L 压力釜中,固定加入 2‰(总物质质量)的1098抗氧剂及1‰(总物质质量)的次亚磷酸钠催化剂。在制备半芳香族聚酰胺树脂时,采用苯甲酸作为封端剂,用量为芳香族二羧酸单元摩尔量的0.02倍,且胺羧比(摩尔比)为0.995,目的是使羧基过量便于挤出过程中与三胺化合物反应。加料完成后,抽真空、充氮气置换气体后,加热到预定温度230-240℃,并通过移去形成的水而保持2.9-3.1MPa恒定压力。反应完成后,卸压至常压得到预聚物。预聚物在转鼓中于240-250℃固相增粘,增粘1-3小时后可得到所述的半芳香族聚酰胺树脂。The metered materials were added to a 20 L autoclave, and 2‰ (total substance mass) of 1098 antioxidant and 1‰ (total substance mass) of sodium hypophosphite catalyst were fixedly added. In the preparation of semi-aromatic polyamide resin, benzoic acid was used as the end-capping agent, and the dosage was 0.02 times the molar amount of aromatic dicarboxylic acid units, and the amine-carboxyl ratio (molar ratio) was 0.995. It reacts with triamine compounds in the process. After the feeding is completed, after vacuuming and nitrogen filling to replace the gas, it is heated to a predetermined temperature of 230-240° C., and a constant pressure of 2.9-3.1 MPa is maintained by removing the formed water. After the reaction was completed, the pressure was released to normal pressure to obtain a prepolymer. The prepolymer is solid-phase tackified at 240-250° C. in a rotating drum, and the semi-aromatic polyamide resin can be obtained after tackifying for 1-3 hours.
所述的阻燃剂选自次膦酸盐阻燃剂或二烷基次膦酸盐阻燃剂中的至少一种。The flame retardant is selected from at least one of phosphinate flame retardants or dialkyl phosphinate flame retardants.
所述的增强材料选自玻璃纤维、碳纤维、石棉纤维、硅灰石纤维、陶瓷纤维、钛酸钾晶须、碱式硫酸镁晶须、碳化硅晶须、硼酸铝晶须、二氧化硅、硅酸铝、氧化硅、碳酸钙、二氧化钛、滑石、硅灰石、硅藻土、粘土、高岭土、球状玻璃、云母、石膏中的至少一种。The reinforcing material is selected from glass fiber, carbon fiber, asbestos fiber, wollastonite fiber, ceramic fiber, potassium titanate whisker, basic magnesium sulfate whisker, silicon carbide whisker, aluminum borate whisker, silicon dioxide, At least one of aluminum silicate, silica, calcium carbonate, titanium dioxide, talc, wollastonite, diatomaceous earth, clay, kaolin, spherical glass, mica, and gypsum.
所述的三胺化合物结构如下式,其中R1、R2、R3为氢,或为碳原子数为1-12的含有端胺基的烷基链类化合物,The structure of the triamine compound is as follows, wherein R 1 , R 2 , R 3 are hydrogen, or an alkyl chain compound with 1-12 carbon atoms containing a terminal amine group,
。 .
具体的,其中,结构式1中n1=1-12的任意整数,m1=1-12的任意整数,n1与m1可以是相同或不同的数值;结构式2中n2=1-12的任意整数,m2=1-12的任意整数,L=1-12的任意整数,n2、m2、L可以是相同或不同的数值;Specifically, in Structural Formula 1, n 1 =any integer of 1-12, m 1 =any integer of 1-12, and n 1 and m 1 may be the same or different values; in Structural Formula 2, n 2 =1-12 Any integer of , m 2 = any integer of 1-12, L = any integer of 1-12, n 2 , m 2 , L can be the same or different values;
。 .
优选的,三胺类化合物的结构为结构式1。Preferably, the structure of the triamine compound is structural formula 1.
优选的,三胺类化合物的含量为0.20-0.75重量份。Preferably, the content of the triamine compound is 0.20-0.75 parts by weight.
可以根据实际需求选自性添加0-2份助剂,所述的助剂选自润滑剂、氧化剂中的至少一种。0-2 parts of auxiliary agents can be optionally added according to actual needs, and the auxiliary agents are selected from at least one of lubricants and oxidants.
本发明的高熔接痕强度聚酰胺复合材料的制备方法,包括以下方法:按照配比,将除增强材料之外的组分混合均匀,后通过双螺杆挤出机挤出造粒,在250-350℃下熔融共混后,冷却造粒得到高熔接痕强度聚酰胺复合材料。The preparation method of the high weld line strength polyamide composite material of the present invention includes the following method: according to the proportion, the components other than the reinforcing material are mixed uniformly, and then extruded and granulated through a twin-screw extruder, and at 250- After melt blending at 350° C., cooling and pelletizing to obtain a polyamide composite material with high weld line strength.
本发明的高熔接痕强度聚酰胺复合材料的应用,用于SMT制造工艺,如灯带支架、LED反射支架;还用于高压连接器产品、低压电器产品、继电器、5G通信连接器等领域。The application of the high weld line strength polyamide composite material of the present invention is used in SMT manufacturing processes, such as lamp strip brackets, LED reflection brackets, and also in high-voltage connector products, low-voltage electrical products, relays, 5G communication connectors and other fields.
本发明具有如下有益效果:The present invention has the following beneficial effects:
本发明通过添加一定量的三胺类化合物,与半芳香族聚酰胺树脂的端羧基反应,形成微交联体系,使聚酰胺复合材料的熔接痕处更有效的缠绕,达到提高熔接痕强度的目的,而且还改善了耐起泡性能,尤其适用于SMT组装工艺。In the present invention, a certain amount of triamine compounds are added to react with the terminal carboxyl groups of the semi-aromatic polyamide resin to form a micro-crosslinking system, so that the welding line of the polyamide composite material can be wound more effectively, so as to improve the strength of the welding line. purpose, but also improve the blister resistance, especially suitable for SMT assembly process.
具体实施方式Detailed ways
下面结合具体实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明,但不以任何形式限制本发明。应当指出的是,对本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进。这些都属于本发明的保护范围。The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
实施例和对比例所用原材料来源如下:The sources of raw materials used in Examples and Comparative Examples are as follows:
PA10T,自制;PA10T, self-made;
PA5T/56,对苯二甲酸占总酸70mol%,自制;PA5T/56, terephthalic acid accounts for 70mol% of total acid, self-made;
PA6T/66,对苯二甲酸占总酸60mol%,自制;PA6T/66, terephthalic acid accounts for 60mol% of total acid, self-made;
PA10T/1010,对苯二甲酸占总酸85mol%,自制;PA10T/1010, terephthalic acid accounts for 85mol% of total acid, self-made;
PA10T/10I,对苯二甲酸占总酸90mol%,自制。PA10T/10I, terephthalic acid accounted for 90mol% of total acid, self-made.
阻燃剂A:二乙基次膦酸铝,OP1230,科莱恩公司;Flame Retardant A: Aluminum Diethylphosphinate, OP1230, Clariant;
阻燃剂B:二乙基次膦酸锌,PFR1210,常州市弘裕化工有限公司;Flame Retardant B: Zinc Diethylphosphinate, PFR1210, Changzhou Hongyu Chemical Co., Ltd.;
玻璃纤维:市售,平行试验采用同种玻璃纤维;Glass fiber: commercially available, the same kind of glass fiber was used in parallel tests;
三胺类化合物A-1:结构式1(n1=6,m1=6),双(六甲撑)三胺,上海阿拉丁生化科技股份有限公司;Triamine compound A-1: structural formula 1 (n 1 =6, m 1 =6), bis(hexamethylene)triamine, Shanghai Aladdin Biochemical Technology Co., Ltd.;
三胺类化合物A-2:结构式1(n1=9,m1=9),根据“Synthesis and BiologicalEvaluation of Bivalent Ligands for the Cannabinoid 1 Receptor”文献( J. Med.Chem. 2010, 53, 7048–7060 DOI: 10.1021/jm1006676)方法制备;Triamine compound A-2: structural formula 1 (n 1 =9, m 1 =9), according to the document "Synthesis and Biological Evaluation of Bivalent Ligands for the Cannabinoid 1 Receptor" ( J. Med.Chem. 2010, 53, 7048– 7060 DOI: 10.1021/jm1006676) method;
三胺类化合物A-3:结构式1(n2=11,m2=11),根据“Synthesis and BiologicalEvaluation of Bivalent Ligands for the Cannabinoid 1 Receptor”文献(J. Med.Chem. 2010, 53, 7048–7060 DOI: 10.1021/jm1006676)方法制备;Triamine compound A-3: structural formula 1 (n 2 =11, m 2 =11), according to "Synthesis and Biological Evaluation of Bivalent Ligands for the Cannabinoid 1 Receptor" (J. Med.Chem. 2010, 53, 7048– 7060 DOI: 10.1021/jm1006676) method;
三胺类化合物B-1:结构式2(n3=5,m3=5,L=5),根据“A method for preparingalkylated amines”国际专利,国际专利号WO 2021/174523 Al,方法制备;Triamine compound B-1: structural formula 2 (n 3 =5, m 3 =5, L=5), prepared according to the international patent of "A method for preparing alkylated amines", international patent number WO 2021/174523 Al, method;
三胺类化合物B-2:结构式2(n3=7,m3=7,L=7),根据“A method for preparingalkylated amines”国际专利,国际专利号WO 2021/174523 Al,方法制备;Triamine compound B-2: structural formula 2 (n 3 =7, m 3 =7, L=7), prepared according to the international patent "A method for preparing alkylated amines", international patent number WO 2021/174523 Al, method;
润滑剂:市售,平行试验采用同种润滑剂。Lubricant: Commercially available, the same lubricant was used in parallel experiments.
实施例和对比例聚酰胺复合材料的制备方法:按照配比,将除增强材料之外的组分混合均匀,后通过双螺杆挤出机挤出造粒,增强材料侧喂,在250-350℃下熔融共混后,冷却造粒得到高熔接痕强度聚酰胺复合材料。The preparation method of the polyamide composite material of Examples and Comparative Examples: according to the proportion, the components other than the reinforcing material are mixed uniformly, and then extruded and granulated through a twin-screw extruder, and the reinforcing material is side-fed at 250-350 After melt blending at ℃, cooling and pelletizing to obtain a polyamide composite material with high weld line strength.
各项测试方法:Various test methods:
(1)拉伸强度:将聚酰胺组合物从单边进胶,注塑成ISO拉伸测试样条;测试样条在23℃、50%RH实验室标准环境中调节24h后按照ISO-527-2:2012标准测试拉伸强度。(1) Tensile strength: The polyamide composition is glued from one side and injected into ISO tensile test strips; the test strips are adjusted in a laboratory standard environment of 23 ° C and 50% RH for 24 hours according to ISO-527- 2:2012 Standard Test Tensile Strength.
(2)回流焊前熔接痕强度:将聚酰胺组合物从双边同时进胶,注塑成ISO拉伸测试样条,熔接线汇合位置在拉伸测试样条的中间;测试样条在23℃、50%RH实验室标准环境中调节24h后按照ISO-527-2:2012标准测试熔接痕强度。(2) Weld line strength before reflow soldering: The polyamide composition was injected into the glue from both sides at the same time, and injection molded into ISO tensile test specimens. The fusion line meeting position was in the middle of the tensile test specimens; The weld line strength was tested according to the ISO-527-2:2012 standard after conditioning in a 50% RH laboratory standard environment for 24 hours.
(3)回流焊后熔接痕强度:将聚酰胺组合物从双边同时进胶,注塑成ISO拉伸测试样条,熔接线汇合位置在拉伸测试样条的中间;将样条置于紫光日东科技(深圳)有限公司的SER-710A设备中,进行了在空气中在45秒内从室温升温至150℃,在135秒内从150℃升温至200℃,以最大温升速率为3℃/s升温至260℃,其中255℃以上的时间为20-40s,再以最大温降速率为6℃/s降温至室温;最后将测试样条在23℃、50%RH实验室标准环境中调节24h后按照ISO-527-2:2012标准测试熔接痕强度。(3) Weld line strength after reflow soldering: The polyamide composition was injected into the glue from both sides at the same time, and injection molded into ISO tensile test specimens, and the fusion line meeting position was in the middle of the tensile test specimens; In the SER-710A equipment of East Technology (Shenzhen) Co., Ltd., the temperature rises from room temperature to 150°C in 45 seconds in air, and from 150°C to 200°C in 135 seconds, with a maximum temperature rise rate of 3°C The temperature rises to 260°C/s, and the time above 255°C is 20-40s, and then cools down to room temperature at a maximum temperature drop rate of 6°C/s; finally, the test specimens are placed in a laboratory standard environment of 23°C and 50% RH. After conditioning for 24 hours, the weld line strength was tested according to the ISO-527-2:2012 standard.
(4)耐起泡温度:将实施例或对比例的聚酰胺复合材料在120℃下干燥4h后注塑60*60*1mm方板,23℃水中浸泡24h后进行测试。将试片置于紫光日东科技(深圳)有限公司的SER-710A设备中,进行了在空气中在45秒内从室温升温至150℃,在135秒内从150℃升温至200℃,以最大温升速率为3℃/s升温至峰值温度℃,再以最大温降速率为6℃/s降温至室温,取出试片观测试片是否存在起泡现象; 其中峰值温度以250℃为起点,以5℃为一阶梯逐渐提高,当试片出现起泡时所对应的峰值温度-5℃即为耐起泡温度。(4) Foaming resistance temperature: The polyamide composite materials of the examples or comparative examples were dried at 120°C for 4 hours, then injected into a 60*60*1mm square plate, and tested after being soaked in water at 23°C for 24 hours. The test piece was placed in the SER-710A equipment of Ziguang Ridong Technology (Shenzhen) Co., Ltd., and the temperature was raised from room temperature to 150 °C in 45 seconds in the air, and from 150 °C to 200 °C in 135 seconds. The maximum temperature rise rate is 3 °C/s to the peak temperature °C, and then the maximum temperature drop rate is 6 °C/s to cool down to room temperature, take out the test piece and observe whether there is foaming; the peak temperature is 250 °C as the starting point , and gradually increase with 5 °C as a step. When the test piece foams, the corresponding peak temperature -5 °C is the foaming resistance temperature.
表1:实施例1-6高熔接痕聚酰胺复合材料各组分含量(重量份)及测试结果Table 1: Contents (parts by weight) and test results of each component of the high weld line polyamide composite material of Examples 1-6
由实施例1-5可知,优选结构式1的三胺类化合物,熔接痕强度更好。It can be seen from Examples 1-5 that the triamine compound of structural formula 1 is preferred, and the weld line strength is better.
由实施例1/6可知,润滑剂的添加能在一定程度上提升熔接痕强度,但是也会影响耐起泡温度。It can be seen from Example 1/6 that the addition of lubricant can improve the weld line strength to a certain extent, but also affects the foaming resistance temperature.
表2:实施例7-13高熔接痕聚酰胺复合材料各组分含量(重量份)及测试结果Table 2: Contents (parts by weight) and test results of each component of the high weld line polyamide composite material in Examples 7-13
由实施例7-13与对比例可知,在本发明的范围内都能够实现本发明的目的。It can be seen from Examples 7-13 and Comparative Examples that the objects of the present invention can be achieved within the scope of the present invention.
表3:实施例14-17高熔接痕聚酰胺复合材料各组分含量(重量份)及测试结果Table 3: Contents (parts by weight) and test results of each component of the high weld line polyamide composite material in Examples 14-17
由实施例1/14-17可知,优选三胺类化合物的含量为0.20-0.75重量份时综合性能更好。It can be seen from Examples 1/14-17 that the overall performance is better when the content of the triamine compound is preferably 0.20-0.75 parts by weight.
表4:对比例高熔接痕聚酰胺复合材料各组分含量(重量份)及测试结果Table 4: Contents (parts by weight) and test results of each component of the high weld line polyamide composite material of the comparative example
由对比例1可知,三胺类化合物添加量过高,会反而导致熔接痕强度下降。It can be seen from Comparative Example 1 that if the amount of triamine compound added is too high, the strength of the weld line will be reduced instead.
由对比例2-4可知,不添加三胺类化合物时,回流焊后熔接痕强度非常低,而且耐起泡温度也会较低。It can be seen from Comparative Examples 2-4 that when no triamine compound is added, the weld line strength after reflow soldering is very low, and the blister resistance temperature is also low.
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Denomination of invention: A high weld line strength polyamide composite material and its preparation method and application Granted publication date: 20231226 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS Co.,Ltd. Registration number: Y2024980051382 |