CN114521044B - Circuit board and electrical apparatus thereof - Google Patents
Circuit board and electrical apparatus thereof Download PDFInfo
- Publication number
- CN114521044B CN114521044B CN202011312009.8A CN202011312009A CN114521044B CN 114521044 B CN114521044 B CN 114521044B CN 202011312009 A CN202011312009 A CN 202011312009A CN 114521044 B CN114521044 B CN 114521044B
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- layer
- substrate layer
- circuit board
- substrate
- circuit
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- 239000000758 substrate Substances 0.000 claims abstract description 323
- 239000000463 material Substances 0.000 claims abstract description 104
- 239000002184 metal Substances 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000010410 layer Substances 0.000 claims description 657
- 229910000679 solder Inorganic materials 0.000 claims description 58
- 239000011241 protective layer Substances 0.000 claims description 47
- 239000004593 Epoxy Substances 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000005452 bending Methods 0.000 abstract description 65
- 238000000034 method Methods 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 22
- 238000003475 lamination Methods 0.000 abstract description 21
- 239000000969 carrier Substances 0.000 abstract description 9
- 239000004642 Polyimide Substances 0.000 description 15
- 229920001721 polyimide Polymers 0.000 description 15
- 239000002861 polymer material Substances 0.000 description 13
- 230000032798 delamination Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000008602 contraction Effects 0.000 description 7
- 238000003801 milling Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a circuit board which comprises a first substrate layer, a circuit layer and a second substrate layer which are connected with each other, wherein the material of the first substrate layer and the material of the second substrate layer are consistent in thermal expansion coefficient, surface energy and expansion coefficient. According to the circuit board, the first substrate layer and the second substrate layer are used as carriers for supporting the circuit layer, and the semi-flexible circuit board is subjected to manufacturing processes, such as bending and high-temperature lamination, and deformation phase difference is small in the bending and stretching process due to the fact that the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the problems of layering, dislocation and the like caused by different deformation among different layers, namely the first substrate layer, the circuit layer, the metal layer and the second substrate layer, caused by bending are avoided.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a circuit board and an electrical device thereof.
Background
With the development of the electronic and electric industry, a semi-flexible circuit board with bending flexibility between that of a flexible circuit board and that of a PCB rigid board has appeared. However, existing semi-flexible circuit board structures include a polyimide layer, a wiring layer, and an FR4 epoxy board layer, with the wiring layer being located between the polyimide layer and the FR4 epoxy board layer. Polyimide layers and FR4 epoxy board layers are materials of two different physical properties, due to the physical properties of the two materials such as: the difference in thermal expansion system, surface energy and expansion and contraction coefficients creates the problem of inconsistent material matching. Thus, during the production process, the polyimide layer and the FR4 epoxy board layer are expanded or contracted to different degrees due to temperature changes such as heating, cooling, etc., thereby causing problems of delamination, dislocation, etc.
Disclosure of Invention
The application provides a circuit board, which solves the problem of inconsistent material matching caused by two materials with different physical properties, such as thermal expansion coefficient, surface energy and expansion coefficient, of polyimide and FR4 epoxy boards in the existing rigid-flexible circuit board structure, and quality defects such as layering, alignment and the like are easy to occur in the process.
In order to solve the technical problems, the application adopts a technical scheme that: the circuit board comprises a first substrate layer, a circuit layer and a second substrate layer which are connected with each other, wherein the second substrate layer comprises a first fixing part and a second fixing part, and a concave area is formed between the first fixing part and the second fixing part; the first substrate layer and the circuit layer are connected to the first fixing part and the second fixing part layer by layer and are positioned at one side of the second substrate layer far away from the concave area; the material of the first substrate layer and the material of the second substrate layer have the same thermal expansion coefficient, surface energy and expansion coefficient.
The circuit board further comprises a first protection layer, and the first protection layer is covered on the circuit layer.
The first protective layer is arranged as a solder mask layer covering the circuit layer, and the first substrate layer is arranged between the circuit layer and the second substrate layer.
The circuit board further comprises a metal layer, and the first substrate layer is located between the metal layer and the circuit layer.
The circuit board further comprises a solder mask layer, the solder mask layer extends to form a first protection layer, the first protection layer is far away from the second substrate layer, and the metal layer is located between the second substrate layer and the first substrate layer.
The circuit board further comprises a second protection layer, and the second protection layer covers the metal layer.
The circuit board further comprises a solder mask layer, the solder mask layer is far away from the second substrate layer, and the solder mask layer is arranged corresponding to the first fixing portion and the second fixing portion.
The circuit board further comprises a solder mask layer, wherein the solder mask layer is far away from the second substrate layer and extends to form a second protection layer; the first protective layer is positioned between the second substrate layer and the circuit layer.
The circuit board further comprises a solder mask layer, the solder mask layer extends to form a first protection layer, the first protection layer is far away from the second substrate layer, and the second protection layer is located between the circuit layer and the second substrate layer.
The second protective layer and the second substrate layer are integrally formed and formed by extending the first fixing part and the second fixing part to the inner side of the concave area.
The metal layer and the circuit layer are selectively positioned on the upper side or the lower side of the first substrate layer.
The materials of the first protective layer and the second protective layer are polymer material layers or FR4 epoxy plates.
Wherein, the material of first substrate layer and second substrate layer is FR4 epoxy board.
The first substrate layer is made of semi-cured bonding materials, and the second substrate layer is made of FR4 epoxy boards.
Wherein, the upper and lower surfaces of the first and second fixing parts are provided with a first solder mask.
In order to solve the technical problems, a second technical scheme adopted by the invention is as follows: there is provided an electrical device comprising a circuit board of any one of the above.
The beneficial effects of the application are as follows: in contrast to the prior art, the present application provides a circuit board, which includes a first substrate layer, a circuit layer and a second substrate layer that are connected to each other, wherein the material of the first substrate layer and the material of the second substrate layer have the same thermal expansion coefficient, surface energy and expansion coefficient characteristics. According to the circuit board, the material of the first substrate layer and the second substrate layer are used as carriers for supporting the circuit layer, and the thermal expansion coefficient, the surface energy and the expansion coefficient of the material are consistent. In the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient is consistent with the thermal expansion coefficient, so that the deformation phase difference is not large in the bending and stretching process, and the problems of layering, dislocation and the like caused by different deformation among different layers of the first substrate layer, the circuit layer and the second substrate layer due to bending are avoided.
Drawings
For a clearer description of the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
Fig. 1 is a schematic structural view of a first embodiment of a circuit board of the present application;
fig. 2 is a schematic structural view of a second embodiment of the circuit board of the present application;
FIG. 3 is a schematic diagram of a third embodiment of a circuit board of the present application;
Fig. 4 is a schematic structural view of a fourth embodiment of the circuit board of the present application;
fig. 5 is a schematic structural view of a fifth embodiment of the circuit board of the present application;
Fig. 6 is a schematic structural view of a sixth embodiment of the circuit board of the present application;
fig. 7 is a schematic structural view of a seventh embodiment of the circuit board of the present application;
Fig. 8 is a schematic structural view of an eighth embodiment of the circuit board of the present application.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the application more clear, the technical scheme of the embodiment of the application will be further described in detail with reference to the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a circuit board according to the present application. The circuit board 100 includes a first substrate layer 101, a wiring layer 102, and a second substrate layer 103 connected to each other.
In this embodiment, the second substrate layer 103 of the circuit board 100 includes a first fixing portion 1031 and a second fixing portion 1032, and a recess region 106 is formed between the first fixing portion 1031 and the second fixing portion 1032, the first substrate layer 101 and the circuit layer 102 are connected to one side of the second substrate layer 103 away from the recess region 106 in a stacked manner, and the material of the first substrate layer 101 and the physical characteristics of the material of the second substrate layer 103 are consistent. The recess region 106 may be formed by removing the FR4 epoxy board corresponding to the recess region 106 of the second substrate layer 103 by a milling cutter during the manufacturing process, and the first fixing portion 1031 and the second fixing portion 1032 may be provided with wiring and/or soldering components. Specifically, the material of the first substrate layer 101 and the material of the second substrate layer 103 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 101 and the second substrate layer 103 provide the carrier and support of the circuit layer 102, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 101 and the second substrate layer 103 are consistent, so that the deformation of the first substrate layer 101 and the second substrate layer 103 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 101, the circuit layer 102 and the second substrate layer 103 due to bending are avoided. The circuit board 100 is bent along the direction indicated by the arrow in fig. 1 by a preset angle, where the preset angle may be 15 °,30 °, 90 ° or the like, and the two ends of the circuit board 100 corresponding to the first fixing portion 1031 and the second fixing portion 1032 are bent toward the recess region 106, and specifically set according to actual requirements.
Specifically, the first substrate layer 101 may be a semi-cured adhesive material or an FR4 epoxy board that has a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction that are consistent with those of the second substrate layer 103. Wherein, in some specific embodiments, the first substrate layer 101 and the second substrate layer 103 are made of FR4 epoxy board material for cost saving. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 101 and the second substrate layer 103 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 101 is harder than polyimide materials commonly used in the prior art, and the length of the first substrate layer 101 is not less than 10mm in order to avoid easy breakage during bending. But in order to secure the use strength, the thickness of the first substrate layer 101 is set within a preset range of 0.05-0.2 mm.
In this embodiment, the circuit board 100 further includes a first protection layer 104 to protect the circuit layer 102. The first protective layer 104 is a solder resist layer covering the wiring layer 102, and the first substrate layer 101 is located between the wiring layer 102 and the second substrate layer 103. Specifically, the first substrate layer 101, the wiring layer 102, and the first protective layer 104 are sequentially laminated in a direction away from the second substrate layer 103, and are disposed on a side of the second substrate layer 103 away from the recess 106. It can be appreciated that in other embodiments, the first protection layer 104 may also be a solder mask disposed on the outer surfaces of the first fixing portion 1031 and the second fixing portion 1032, and a portion of the solder mask located on the top surfaces of the first fixing portion 1031 and the second fixing portion 1032 extends to cover the surface of the circuit layer 102 so as to protect the circuit layer 102. It is also understood that: the first protection layer 104 may also be a cover layer separately disposed on the surface of the circuit layer 102, where the cover layer may be an extension of the solder mask layer, and may be the same material or process as the solder mask layer; of course, the cover layer may also be some insulating material layer, protective layer, etc., as desired. For example, in one embodiment, the material of the first protective layer 104 is solder resist ink.
In the present embodiment, the circuit board 100 further includes a solder resist layer 105 covering the first and second fixing portions 1031 and 1031, thereby protecting the second substrate layer 103 of the circuit board 100.
Unlike the prior art, the circuit board 100 of the first embodiment of the present application includes the first substrate layer 101, the circuit layer 102 and the second substrate layer 103 connected to each other, where the material of the first substrate layer 101 and the material of the second substrate layer 103 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board 100 of the present application, the first substrate layer 101 and the second substrate layer 103 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of delamination, dislocation, etc. caused by different deformations among different layers of the first substrate layer 101, the circuit layer 102 and the second substrate layer 103 are avoided.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a second embodiment of a circuit board according to the present application. The circuit board 200 includes a first substrate layer 201, a wiring layer 202, and a second substrate layer 203 that are connected to each other.
In this embodiment, the second substrate layer 203 of the circuit board 200 includes a first fixing portion 2031 and a second fixing portion 2032, and a recess region 206 is formed between the first fixing portion 2031 and the second fixing portion 2032, the first substrate layer 201 and the circuit layer 202 are connected to one side of the second substrate layer 203 away from the recess region 206 in a stacked manner, and the material of the first substrate layer 201 and the physical characteristics of the material of the second substrate layer 203 are consistent. The recess region 106 may be formed by removing the FR4 epoxy board corresponding to the recess region 206 of the second substrate layer 203 by a milling cutter during the manufacturing process, and the first and second fixing portions 2031 and 2032 may be wired and/or soldered with components. Specifically, the material of the first substrate layer 201 and the material of the second substrate layer 203 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 201 and the second substrate layer 203 provide the carrier and support for the circuit layer 202, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 201 and the second substrate layer 203 are consistent, so that the deformation of the first substrate layer 201 and the second substrate layer 203 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 201, the circuit layer 202 and the second substrate layer 203 due to bending are avoided. The circuit board 200 is bent along the direction indicated by the arrow in fig. 2 by a preset angle, where the preset angle may be 15 °,30 °, 90 ° or the like, and the two ends of the circuit board 200 corresponding to the first fixing portion 2031 and the second fixing portion 2032 are bent toward the recess area 206, and specifically set according to actual requirements.
Specifically, the first substrate layer 201 may be a semi-cured adhesive material or an FR4 epoxy board that has a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction consistent with those of the second substrate layer 203. Wherein, in some specific embodiments, the first substrate layer 201 and the second substrate layer 203 are made of FR4 epoxy board material for cost saving. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 201 and the second substrate layer 203 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 201 has a preset length not less than 10 mm in order to avoid easy breakage during bending, compared with polyimide materials commonly used in the prior art. But in order to secure the use strength, the thickness of the first substrate layer 201 is set within a preset range of 0.05-0.2 mm.
In the present embodiment, the circuit board 200 further includes a metal layer 207, and the first substrate layer 201 is disposed between the metal layer 207 and the wiring layer 202. The metal layer 207 is formed by laminating a metal on the other side of the first substrate layer 201. Preferably, the metal layer 207 is provided as a copper layer. The metal layer 207 is located between the second substrate layer 201 and the second substrate layer 203, and two ends of the metal layer 207 extend into the first fixing portion 2031 and the second fixing portion 2032 according to a predetermined length. Optionally, the preset length is set to 0.5-1.0 mm, and the metal layer 207 is used as a carrier when the circuit board 200 is bent along the bending direction, so as to prevent the circuit board 200 from breaking during the bending process. In addition, the metal layer 207 extends into the first and second fixing parts 2031 and 2032 according to a predetermined length, so that a problem of stress concentration at a connection point of the metal layer 207 and the second substrate layer 203 when the circuit board 200 is bent in the bending direction is avoided.
In this embodiment, the circuit board 200 further includes a first protection layer 204 to protect the circuit layer 202. The first protective layer 204 is a solder mask layer covering the circuit layer 202, and the first substrate layer 201 is located between the circuit layer 202 and the metal layer 207. Specifically, the metal layer 207, the first substrate layer 201, the wiring layer 202, and the first protective layer 204 are sequentially stacked in a direction away from the second substrate layer 203, and are disposed on a side of the second substrate layer 203 away from the recess 206. It can be appreciated that in other embodiments, the first protection layer 204 may also be a solder mask disposed on the outer surfaces of the first fixing portion 2031 and the second fixing portion 2032, and the portion of the solder mask located on the top surfaces of the first fixing portion 2031 and the second fixing portion 2032 extends to cover the surface of the circuit layer 202 to protect the circuit layer 202. It is also understood that: the first protective layer 204 may also be a cover layer separately disposed on the surface of the circuit layer 202, and the cover layer may be an extension of the solder mask layer, and may be made of the same material or process as the solder mask layer; of course, the cover layer may also be some insulating material layer, protective layer, etc., as desired. For example, in one embodiment, the material of the first protective layer 204 is solder resist ink.
In the present embodiment, the circuit board 200 further includes a solder resist layer 205 covering the first and second fixing portions 2031 and 2032, thereby protecting the second substrate layer 203 of the circuit board 200.
Unlike the prior art, the circuit board 200 of the second embodiment of the present application includes a first substrate layer 201, a circuit layer 202 and a second substrate layer 203 that are connected to each other, where the material of the first substrate layer 201 and the material of the second substrate layer 203 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board 200 of the present application, the first substrate layer 201 and the second substrate layer 203 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of delamination, dislocation, etc. caused by different deformations among different layers of the first substrate layer 201, the circuit layer 202, the metal layer 207 and the second substrate layer 203 due to bending are avoided.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a third embodiment of a circuit board according to the present application. The circuit board 300 includes a first substrate layer 301, a wiring layer 302, and a second substrate layer 303 that are connected to each other.
In this embodiment, the second substrate layer 303 of the circuit board 300 includes a first fixing portion 3031 and a second fixing portion 3032, and a recess region 306 is formed between the first fixing portion 3031 and the second fixing portion 3032, the first substrate layer 301 and the circuit layer 302 are connected to one side of the second substrate layer 303 away from the recess region 306 in a stacked manner, and the material of the first substrate layer 301 and the physical characteristics of the material of the second substrate layer 303 are consistent. The recess region 306 may be formed by removing the FR4 epoxy board of the portion of the second substrate layer 303 corresponding to the recess region 306 by a milling cutter during the manufacturing process, and the first and second fixing portions 3031 and 3032 may be provided with wiring and/or soldering components. Specifically, the material of the first substrate layer 301 and the material of the second substrate layer 303 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 301 and the second substrate layer 303 provide the carrier and support for the circuit layer 302, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 301 and the second substrate layer 303 are consistent, so that the deformation of the first substrate layer 301 and the second substrate layer 303 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 301, the circuit layer 302 and the second substrate layer 303 due to bending are avoided. The circuit board 300 is bent along the direction indicated by the arrow in fig. 3 by a preset angle, and the two ends of the circuit board 300 corresponding to the first fixing portion 3031 and the second fixing portion 3032 are bent toward the recess area 306, where the preset angle may be 15 °,30 °, 90 ° or the like, and specifically set according to actual requirements.
Specifically, the first substrate layer 301 may be a semi-cured adhesive material (i.e., PP material) or an FR4 epoxy board that has a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction consistent with those of the second substrate layer 303. Wherein, in some specific embodiments, the first substrate layer 301 and the second substrate layer 303 are made of FR4 epoxy board material for cost saving. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 301 and the second substrate layer 303 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 301 has a preset length not less than 10 mm in order to avoid easy breakage during bending, compared to polyimide materials commonly used in the prior art. But in order to secure the use strength, the thickness of the first substrate layer 301 is set within a preset range of 0.05-0.2 mm.
In this embodiment, the circuit board 300 further includes a metal layer 307, the first substrate layer 301 is disposed between the metal layer 307 and the circuit layer 302, and the metal layer 307 is pressed onto the first substrate layer 301 by metal. Preferably, the metal layer 307 is provided as a copper layer.
In this embodiment, the circuit board 300 further includes a first protection layer 309 covering the circuit layer 302, which performs insulation and protection functions on the circuit layer 302. The first protective layer 309 is located between the wiring layer 302 and the second substrate layer 303. Alternatively, the first protective layer 309 may be a polymer material layer, specifically, the polymer material layer is blocked by polyimide and a glue layer. The first substrate layer 301 and the first protection layer 309 are respectively located on two sides of the circuit layer 302.
In this embodiment, the circuit board 300 further includes a second protection layer 308, and the second protection layer 308 covers the metal layer 307. Alternatively, the second protection layer 308 may be a polymer material layer, preferably, the polymer material layer is formed by polyimide and an adhesive layer, and the second protection layer 308 may protect the metal layer 307 from oxidation damage to the metal layer 307.
In this embodiment, the circuit board 300 further includes a solder mask layer 304, the solder mask layer 304 is far away from the second substrate layer 303, and the solder mask layer 304 is disposed corresponding to the first fixing portion 3031 and the second fixing portion 3032. Further, the solder mask 304 covers a predetermined length of the second protective layer 308, which is set to 0.5-1.0 mm. When the preset lengths of the metal layer 307 and the second protection layer 308 extend into the first fixing portion 3031 and the second fixing portion 3032 or the solder mask layer 304, the metal layer 307 serves as a carrier when the circuit board 300 is bent along the bending direction, so that the circuit board 300 is prevented from being broken in the bending process, and meanwhile, the preset lengths of the metal layer 307 extend into the first fixing portion 3031 and the second fixing portion 3032 or the solder mask layer 304, so that the problem of stress concentration at the connection position of the metal layer 307 and the second substrate layer 303 when the circuit board 300 is bent along the bending direction is avoided.
In the present embodiment, the circuit board 300 further includes a solder resist layer 304 covering the first and second fixed portions 3031 and 3031, thereby protecting the second substrate layer 303 of the circuit board 300.
Unlike the prior art, the circuit board 300 according to the third embodiment of the present application includes a first substrate layer 301, a circuit layer 302 and a second substrate layer 303 that are connected to each other, where the material of the first substrate layer 301 and the material of the second substrate layer 303 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board of the application, the first substrate layer 301 and the second substrate layer 303 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of layering, dislocation and the like caused by different deformation among different layers of the first substrate layer 301, the circuit layer 302, the metal layer 307 and the second substrate layer 303 caused by bending are avoided.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a circuit board according to a fourth embodiment of the application. The circuit board 300' of the fourth embodiment shown in fig. 4 is different from the circuit board 300 according to the third embodiment of the present application only in that: the positions of the wiring layer 302 'and the metal layer 307' in the fourth embodiment are interchanged with the positions of the wiring layer 302 and the metal layer 307 in the third embodiment. Specifically, the position of the wiring layer 302' in the fourth embodiment is located at the position of the metal layer 307 in the third embodiment; while in the fourth embodiment the position of the metal layer 307' is located at the position of the wiring layer 302 in the third embodiment.
Other structures of the circuit board 300' in the fourth embodiment of the present application are identical to those of the circuit board 300 described in the above third embodiment, and will not be described herein.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a fifth embodiment of a circuit board according to the present application. The circuit board 400 includes a first substrate layer 401, a wiring layer 402, and a second substrate layer 403 connected to each other.
In this embodiment, the second substrate layer 403 of the circuit board 400 includes a first fixing portion 4031 and a second fixing portion 4032, and a recess region 406 is formed between the first fixing portion 4031 and the second fixing portion 4032, the first substrate layer 401 and the circuit layer 402 are connected to one side of the second substrate layer 403 away from the recess region 406 in a stacked manner, and the material of the first substrate layer 401 and the physical characteristics of the material of the second substrate layer 403 are consistent. The recess 406 may be formed by removing the FR4 epoxy board corresponding to the recess 406 of the second substrate layer 403 by a milling cutter during the manufacturing process, and the first fixing portion 4031 and the second fixing portion 4032 may be provided with wiring and/or soldering components. Specifically, the material of the first substrate layer 401 and the material of the second substrate layer 403 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 401 and the second substrate layer 403 provide the carrier and support of the circuit layer 402, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 401 and the second substrate layer 403 are consistent, so that the deformation of the first substrate layer 401 and the second substrate layer 403 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 401, the circuit layer 402 and the second substrate layer 403 due to bending are avoided. The circuit board 400 is bent along the direction indicated by the arrow in fig. 4 by a preset angle, and the two ends of the circuit board 400 corresponding to the first fixing portion 4031 and the second fixing portion 4032 are bent towards the concave area 406, where the preset angle may be 15 °,30 °, 90 ° or the like, and specifically set according to actual requirements.
Specifically, the first substrate layer 401 may be a semi-cured adhesive material or an FR4 epoxy board having a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction consistent with those of the second substrate layer 403. Wherein, in some specific embodiments, the first substrate layer 401 and the second substrate layer 403 are made of FR4 epoxy board material for cost saving. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 401 and the second substrate layer 403 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 401 is harder than polyimide materials commonly used in the prior art, and the preset length of the first substrate layer 401 is not less than 10 mm in order to avoid easy breakage during bending. But in order to secure the use strength, the thickness of the first substrate layer 401 is set within a preset range of 0.05-0.2 mm.
In this embodiment, the circuit board 400 further includes a metal layer 407, the first substrate layer 401 is disposed between the metal layer 407 and the circuit layer 402, and the metal layer 407 is pressed on the first substrate layer 401 by metal. Preferably, the metal layer 407 is provided as a copper layer.
In this embodiment, the circuit board 400 further includes a first protection layer 408 covering the wiring layer 402, which serves to insulate and protect the wiring layer 402. The first protective layer 408 is located between the wiring layer 402 and the second substrate layer 403. Alternatively, the first protective layer 408 may be a polymer material layer, specifically, the polymer material layer is blocked by polyimide and a glue layer. Wherein the first substrate layer 401 and the first protection layer 408 are respectively located at two sides of the circuit layer 402. More specifically, the preset length of the first protection layer 408 extends into the first fixing portion 4031 and the second fixing portion 4032, and the preset length is set to 0.5-1.0 mm, so that the circuit board 400 is prevented from breaking during the bending process, and meanwhile, the preset length of the first protection layer 408 extends into the first fixing portion 4031 and the second fixing portion 4032, so that the problem of stress concentration at the connection position of the first protection layer 408 and the second substrate layer 403 when the circuit board 400 is bent along the bending direction is avoided. Optionally, wiring and/or soldering components may be performed on the first and second fixing portions 4031 and 4032.
In this embodiment, the circuit board 400 further includes a second protection layer 404, where the second protection layer 404 is far away from the second substrate layer 403 and covers the metal layer 407, so as to insulate and protect the metal layer 407. Specifically, the second protective layer 404 is a solder mask layer disposed on the top surface of the circuit board 400 away from the recess 406. Specifically, the structure of the circuit board 400 of the present embodiment is that the first protective layer 408, the circuit layer 402, the first substrate layer 401, the metal layer 407, and the solder resist layer 405 are sequentially stacked in a direction away from the second substrate layer 403, and disposed on a side of the second substrate layer 403 away from the recess 406.
In this embodiment, the circuit board 400 further includes a solder resist layer 405 covering the first fixing portion 4031 and the second fixing portion 4031, thereby protecting the second substrate layer 403 of the circuit board 400.
Unlike the prior art, the circuit board 400 according to the fourth embodiment of the present application includes a first substrate layer 401, a circuit layer 402 and a second substrate layer 403 that are connected to each other, where the material of the first substrate layer 401 and the material of the second substrate layer 403 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board 400 of the present application, the first substrate layer 401 and the second substrate layer 403 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of layering, dislocation and the like caused by different deformation among different layers of the first substrate layer 401, the circuit layer 402, the metal layer 407 and the second substrate layer 403 due to bending are avoided.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a sixth embodiment of a circuit board according to the present application.
The circuit board 400' of the sixth embodiment shown in fig. 6 differs from the circuit board 400 of the fifth embodiment of the present application only in that: except for the difference of the structure of the first protection layer 408 'in the sixth embodiment, other structures of the circuit board 400' in the sixth embodiment are identical to those of the circuit board 400 described in the fifth embodiment, and are not described herein.
Specifically, the first protective layer 408 'of the sixth embodiment of the present application is integrally formed with the second substrate layer 403'. That is, the first protection layer 408' is formed by extending the first fixing portion 4031' and the second fixing portion 4032' toward the inner side of the recess region 406', and covers the circuit layer 402'. The thickness of the first protective layer 408' is set to 0.05-0.1 mm. To match the structure of the first protective layer 408', it can be appreciated that in this embodiment, the thickness of the first substrate layer 401' is set to 0.05-0.1 mm.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a seventh embodiment of a circuit board according to the present application. The circuit board 500 includes a first substrate layer 501, a wiring layer 502, and a second substrate layer 503 that are connected to each other.
In this embodiment, the second substrate layer 503 of the circuit board 500 includes a first fixing portion 5031 and a second fixing portion 5032, and a recess region 506 is formed between the first fixing portion 5031 and the second fixing portion 5032, the first substrate layer 501 and the circuit layer 502 are connected to one side of the second substrate layer 503 away from the recess region 506 in a stacked manner, and the material of the first substrate layer 501 and the physical characteristics of the material of the second substrate layer 503 are consistent. The recess 506 may be formed by removing the FR4 epoxy board corresponding to the recess 506 of the second substrate layer 503 by a milling cutter during the manufacturing process, and the first fixing portion 5031 and the second fixing portion 5032 may be provided with wiring and/or soldering components. Specifically, the material of the first substrate layer 501 and the material of the second substrate layer 503 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 501 and the second substrate layer 503 provide the carrier and support for the circuit layer 502, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 501 and the second substrate layer 503 are consistent, so that the deformation of the first substrate layer 501 and the second substrate layer 503 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 501, the circuit layer 502 and the second substrate layer 503 are not caused by bending. The circuit board 500 is bent along the direction indicated by the arrow in fig. 5 by a preset angle, and the two ends of the circuit board 500 corresponding to the first fixing portion 5031 and the second fixing portion 5032 are bent toward the concave region 506, where the preset angle may be 15 °,30 °, 90 ° or the like, and specifically set according to actual requirements.
Specifically, the first substrate layer 501 may be a semi-cured adhesive material or an FR4 epoxy board that has a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction consistent with those of the second substrate layer 503. Wherein, in some specific embodiments, the first substrate layer 501 and the second substrate layer 503 are made of FR4 epoxy board material for cost saving. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 501 and the second substrate layer 503 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 501 has a preset length not less than 10 mm in order to avoid easy breakage during bending, compared to polyimide materials commonly used in the prior art. But in order to secure the use strength, the thickness of the first substrate layer 501 is set within a preset range of 0.05-0.2 mm.
In this embodiment, the circuit board 500 further includes a metal layer 507, and the first substrate layer 501 is disposed between the metal layer 507 and the circuit layer 502, where the metal layer 507 is formed by laminating metal on the first substrate layer 501. Preferably, the metal layer 507 is provided as a copper layer.
In this embodiment, the circuit board 500 further includes a first protection layer 504 covering the circuit layer 502, which performs insulation and protection functions on the circuit layer 502. Specifically, the first protective layer 504 is a solder mask layer disposed on the top surface of the circuit board 500 away from the recess 506. It can be appreciated that, in other embodiments, the solder mask layer may be disposed on the outer surfaces of the first fixing portion 5031 and the second fixing portion 5032, and the portions of the solder mask layer on the top surfaces of the first fixing portion 5031 and the second fixing portion 5032 extend to cover the surface of the circuit layer 502; the first protection layer 504 may be a polymer material layer, and two ends of the polymer material layer are connected to the build-up layer, and the build-up layer and the solder mask layer together protect the circuit layer 502. It is also understood that: the first protection layer 504 may also be a cover layer separately disposed on the surface of the circuit layer 502, and the cover layer may be an extension of the solder mask layer, and may be made of the same material or process as the solder mask layer; of course, the cover layer may also be some insulating material layer, protective layer, etc., as desired. For example, in one embodiment, the first protective layer 504 is made of solder resist ink.
In this embodiment, the circuit board 500 further includes a second protection layer 508, where the second protection layer 508 covers the metal layer 507, and the second protection layer 508, the metal layer 504, the first substrate layer 501, the circuit layer 502, and the solder mask layer 505 are sequentially stacked in a direction away from the second substrate layer 503, and are disposed on a side of the second substrate layer 503 away from the recess 506. The second protective layer 508 may be a polymer material layer, preferably, the polymer material layer is formed by polyimide and a glue layer. More specifically, the preset lengths of the metal layer 507 and the second protection layer 508 extend into the first fixing portion 5031 and the second fixing portion 5032, the metal layer 507 is used as a carrier when the circuit board 500 is bent along the bending direction, the preset length is set to be 0.5-1.0 mm, the circuit board 500 is prevented from being broken in the bending process, and the like, and meanwhile, the preset length of the second protection layer 508 extends into the first fixing portion 5031 and the second fixing portion 5032, so that the problem of stress concentration at the joint of the second protection layer 508 and the second substrate layer 503 when the circuit board 500 is bent along the bending direction is avoided.
In this embodiment, the circuit board 500 further includes a solder resist layer 505 covering the first fixing portion 5031 and the second fixing portion 5031, thereby protecting the second substrate layer 503 of the circuit board 500.
Unlike the prior art, the circuit board of the seventh embodiment of the present application includes a first substrate layer 501, a circuit layer 502 and a second substrate layer 503 that are connected to each other, where the material of the first substrate layer 501 and the material of the second substrate layer 503 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board 500 of the present application, the first substrate layer 501 and the second substrate layer 503 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of delamination, dislocation, etc. caused by different deformations among different layers of the first substrate layer 501, the circuit layer 502, the metal layer 507 and the second substrate layer 503 are avoided.
Referring to fig. 8, fig. 8 is a schematic structural diagram of an eighth embodiment of a circuit board according to the present application. The circuit board 600 includes a first substrate layer 601, a wiring layer 602, and a second substrate layer 603 connected to each other.
In this embodiment, the circuit board 600 has bending performance, the circuit board 600 includes a first fixing portion 6031 and a second fixing portion 6032, a recess region 606 is formed between the first fixing portion 6031 and the second fixing portion 6032, the first substrate layer 601 and the circuit layer 602 are connected to one side of the second substrate layer 603 away from the recess region 606 in a stacked manner, and the material of the first substrate layer 601 is consistent with the physical characteristics of the material of the second substrate layer 603. The recess 606 may be formed by removing the FR4 epoxy board corresponding to the recess 606 of the second substrate layer 603 by a milling cutter during the manufacturing process, and the first fixing portion 6031 and the second fixing portion 6032 may be provided with wiring and/or soldering components. Specifically, the material of the first substrate layer 601 and the material of the second substrate layer 603 have the same thermal expansion coefficient, surface energy, and expansion coefficient. Since the first substrate layer 601 and the second substrate layer 603 provide the carrier and support for the circuit layer 602, during the manufacturing process, for example, high temperature lamination and bending, the thermal expansion system and the expansion coefficient of the first substrate layer 601 and the second substrate layer 603 are consistent, so that the deformation of the first substrate layer 601 and the second substrate layer 603 is not greatly different during the high temperature lamination and bending stretching process, and the problems of delamination, dislocation and the like caused by different deformation among different layers of the first substrate layer 601, the circuit layer 602 and the second substrate layer 603 due to bending are avoided. The circuit board 600 is bent along the direction indicated by the arrow in fig. 6 by a preset angle, where the two ends of the circuit board 600 corresponding to the first fixing portion 6031 and the second fixing portion 6032 are bent toward the concave area 606, and the preset angle may be 15 °, 30 °, 90 ° or the like, and specifically set according to actual requirements.
Specifically, the first substrate layer 601 may be a semi-cured adhesive material or an FR4 epoxy board having a thermal expansion coefficient, a surface energy, and a coefficient of expansion and contraction consistent with those of the second substrate layer 603. Wherein, to save costs, in some specific embodiments, the first substrate layer 601 and the second substrate layer 603 are both made of FR4 epoxy board material. As the FR4 epoxy board material has wider application, the material cost is lower.
In this embodiment, since the first substrate layer 601 and the second substrate layer 603 are made of a semi-cured adhesive material or an FR4 epoxy board, the first substrate layer 601 is harder than polyimide materials commonly used in the prior art, and the preset length of the first substrate layer 601 is not less than 10 mm in order to avoid easy breakage during bending. But in order to secure the use strength, the thickness of the first substrate layer 601 is set within a preset range of 0.05-0.2 mm.
In this embodiment, the circuit board 600 further includes a metal layer 607, the first substrate layer 601 is disposed between the metal layer 607 and the circuit layer 602, and the metal layer 607 is pressed onto the first substrate layer 601 by metal. Preferably, the metal layer 607 is provided as a copper layer. Wherein, the preset length of the metal layer 607 extends into the first fixing portion 6031 and the second fixing portion 6032, the preset length is set to 0.5-1.0 mm, the metal layer 607 is used as a carrier when the circuit board 600 is bent along the bending direction, so as to prevent the circuit board 600 from breaking during the bending process, and meanwhile, the preset length of the metal layer 607 extends into the first fixing portion 6031 and the second fixing portion 6032, so that the problem of stress concentration at the joint of the metal layer 607 and the second substrate layer 603 when the circuit board 600 is bent along the bending direction is avoided.
In this embodiment, the circuit board 600 further includes a first protection layer 604 covering the circuit layer 602, which performs insulation and protection functions on the circuit layer 602. Specifically, the first protective layer 604 is a solder mask layer disposed on the top surface of the circuit board 600 away from the recess 606. It will be appreciated that, in other embodiments, the solder mask layer may be disposed on the outer surfaces of the first fixing portion 6031 and the second fixing portion 6032, and the portions of the solder mask layer on the top surfaces of the first fixing portion 6031 and the second fixing portion 6032 extend to cover the surface of the circuit layer 602; the first protection layer 604 may be a polymer material layer, and two ends of the polymer material layer are connected to the build-up layer, and the build-up layer and the solder mask layer together protect the circuit layer 602. It is also understood that: the first protective layer 604 may also be a cover layer separately disposed on the surface of the circuit layer 602, and the cover layer may be an extension of the solder mask layer, and may be made of the same material or process as the solder mask layer; of course, the cover layer may also be some insulating material layer, protective layer, etc., as desired. For example, in one embodiment, the first protective layer is made of solder resist ink.
In this embodiment, the circuit board 600 further includes a second protection layer 608, where the second protection layer 608 covers the metal layer 607. The second protective layer 608 has a predetermined thickness of 0.05-0.1 mm. The structure of the circuit board 600 of this embodiment is that the second protective layer 608, the metal layer 607, the first substrate layer 601, the wiring layer 602 and the solder resist layer 605 are sequentially laminated in a direction away from the second substrate layer 603, and are disposed on a side of the second substrate layer 603 away from the recess 606. Specifically, in the present embodiment, the second protection layer 608 is integrally formed with the second substrate layer 603. That is, the second protection layer 608 is formed by extending the first fixing portion 6031 and the second fixing portion 6032 inward of the recess region 606, and covers the wiring layer 602.
In this embodiment, the circuit board 600 further includes a solder resist layer 605 covering the first and second fixing portions 6031 and 6032, thereby protecting the second substrate layer 603 of the circuit board 600.
Unlike the prior art, the circuit board 600 according to the eighth embodiment of the present application includes a first substrate layer 601, a circuit layer 602 and a second substrate layer 603 that are connected to each other, where the material of the first substrate layer 601 and the material of the second substrate layer 603 have the same thermal expansion coefficient, surface energy and expansion coefficient. In the circuit board 600 of the present application, the first substrate layer 601 and the second substrate layer 603 are used as carriers for supporting the circuit layers, and in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of layering, dislocation and the like caused by different deformation among different layers of the first substrate layer 601, the circuit layer 602, the metal layer 607 and the second substrate layer 603 due to bending are avoided.
Furthermore, the present application also provides an electrical apparatus, where the electrical apparatus may include a circuit board as described above, and details thereof are omitted herein.
In summary, the present application provides a circuit board and an electrical apparatus. When the first substrate layer and the second substrate layer are used as carriers for supporting the circuit layer, in the manufacturing process of the semi-flexible circuit board, such as bending and high-temperature lamination, the expansion coefficient, the surface energy and the thermal expansion coefficient are consistent, so that the deformation phase difference is not large in the bending and stretching process, and the problems of layering, dislocation and the like caused by different deformation among different layers of the first substrate layer, the circuit layer, the metal layer and the second substrate layer due to bending are avoided. In addition, the FR4 epoxy board material has wider application and lower material cost.
The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present application.
Claims (16)
1. The circuit board comprises a first substrate layer, a circuit layer and a second substrate layer, wherein the second substrate layer comprises a first fixing part and a second fixing part, and a concave area is formed between the first fixing part and the second fixing part; the first substrate layer and the circuit layer are connected to the first fixing part and the second fixing part in a layer-by-layer manner and are positioned at one side of the second substrate layer far away from the concave area;
the thermal expansion coefficient, the surface energy and the expansion coefficient of the material of the first substrate layer are consistent with those of the material of the second substrate layer.
2. The circuit board of claim 1, further comprising a first protective layer overlying the wiring layer.
3. The circuit board of claim 2, wherein the first protective layer is a solder mask layer overlying the wiring layer, the first substrate layer being located between the wiring layer and the second substrate layer.
4. The circuit board of claim 2, further comprising a metal layer, wherein the first substrate layer is located between the metal layer and the wiring layer.
5. The circuit board of claim 4, further comprising a solder mask layer extending to form the first protective layer, the first protective layer being remote from the second substrate layer, the metal layer being located between the second substrate layer and the first substrate layer.
6. The circuit board of claim 4, further comprising a second protective layer overlying the metal layer.
7. The circuit board of claim 6, further comprising a solder mask layer extending away from the second substrate layer and forming the second protective layer; the first protective layer is located between the second substrate layer and the circuit layer.
8. The circuit board of claim 6, further comprising a solder mask layer extending to form the first protective layer, the first protective layer being remote from the second substrate layer, the second protective layer being located between the circuit layer and the second substrate layer.
9. The circuit board of claim 8, wherein the second protective layer is integrally formed with the second substrate layer and is formed by extending the first and second fixing portions inward of the recessed region.
10. The circuit board of any of claims 4-9, wherein the metal layer and the wiring layer are both located on an upper side or a lower side of the first substrate layer.
11. The circuit board of any one of claims 4-9, wherein the material of the first protective layer is a polymeric material layer or an FR4 epoxy board.
12. The circuit board of any one of claims 6-9, wherein the material of the second protective layer is a polymeric material layer or an FR4 epoxy board.
13. The circuit board of any of claims 1-9, wherein the first substrate layer and the second substrate layer are both FR4 epoxy boards.
14. The circuit board of any one of claims 1-9, wherein the first substrate layer is a semi-cured adhesive material and the second substrate layer is an FR4 epoxy board.
15. The circuit board of any one of claims 1-9, wherein the first fixing portion and the second fixing portion are provided with a first solder resist layer on upper and lower surfaces thereof.
16. An electrical device comprising the circuit board of any one of claims 1-15.
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| CN202011312009.8A CN114521044B (en) | 2020-11-20 | 2020-11-20 | Circuit board and electrical apparatus thereof |
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| CN202011312009.8A CN114521044B (en) | 2020-11-20 | 2020-11-20 | Circuit board and electrical apparatus thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958293A (en) * | 2011-08-29 | 2013-03-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with offset structure |
| CN104349570A (en) * | 2013-08-07 | 2015-02-11 | 富葵精密组件(深圳)有限公司 | Rigid-flexible-combined circuit board and manufacturing method thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3492025B2 (en) * | 1995-06-02 | 2004-02-03 | 株式会社トクヤマ | Circuit board structure |
| JP5059486B2 (en) * | 2007-05-28 | 2012-10-24 | パナソニック株式会社 | Manufacturing method of module with built-in components |
| JPWO2011118544A1 (en) * | 2010-03-24 | 2013-07-04 | 日本電気株式会社 | Wireless module and manufacturing method thereof |
| JP2011222701A (en) * | 2010-04-08 | 2011-11-04 | Denso Corp | Electronic device |
| DE102013219992A1 (en) * | 2013-10-02 | 2015-04-02 | Conti Temic Microelectronic Gmbh | Circuit device and method for its production |
| TWI603505B (en) * | 2015-04-07 | 2017-10-21 | 矽品精密工業股份有限公司 | Package substrate |
| CN107534113B (en) * | 2015-04-28 | 2021-09-07 | 三洋电机株式会社 | Power supply device and vehicle with same |
| CN105357864A (en) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | Multilayer circuit board and manufacturing method |
| JP6446507B2 (en) * | 2017-06-16 | 2018-12-26 | 株式会社ジャパンディスプレイ | Manufacturing method of display device |
| WO2020100625A1 (en) * | 2018-11-16 | 2020-05-22 | 大日本印刷株式会社 | Wiring substrate, and method for manufacturing wiring substrate |
| CN211509412U (en) * | 2019-12-31 | 2020-09-15 | 福建泉州市铭源通电子有限公司 | Circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958293A (en) * | 2011-08-29 | 2013-03-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with offset structure |
| CN104349570A (en) * | 2013-08-07 | 2015-02-11 | 富葵精密组件(深圳)有限公司 | Rigid-flexible-combined circuit board and manufacturing method thereof |
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