CN114454363A - Silicon rod cutting method, device and system - Google Patents

Abstract

Embodiments of the present application provide a method, device and system for cutting a silicon rod, wherein the method includes: confining the silicon rod on the cutting device; For cutting, the number of the first section is two, and the two first sections are parallel; the number of the second section is at least three, and at least three second sections are parallel to each other; the second section is perpendicular to the first section, In order to obtain at least two small silicon rods and an edge leather with a flat surface and an arc surface. The silicon rod cutting method, device, and system provided by the embodiments of the present application can solve the defects of cutting a small piece structure from a large piece structure in the traditional solution.

Description

Silicon rod cutting method, equipment and system

technical field

The present application relates to the cutting technology of hard and brittle materials, and in particular, to a method, equipment and system for cutting a silicon rod.

Background technique

With the development of heterojunction cells, the market demand for small silicon wafers is increasing, and the demand for thin wafers is also increasing. The thickness is from 180 microns to 150 microns. , 80 micron thickness silicon wafer, and the thinner the silicon wafer, the smaller the silicon wafer specification is to ensure the cutting quality and process.

In the traditional solution, small pieces of monocrystalline silicon cells are usually first cut from monocrystalline silicon rods into large pieces of silicon wafers, and then diced and cut into small pieces of silicon wafers using laser technology, but in the process of laser scribing. , which will cause damage and defect states to the cross-section of the small silicon wafer, which will seriously affect the conversion efficiency of the final processed heterojunction cell.

The size of silicon rods is getting bigger and bigger, from 166mm to 182mm, and then to 210mm, and may reach 230mm or even 250mm in the future. high, easily broken.

SUMMARY OF THE INVENTION

In order to solve one of the above technical defects, a method, device and system for cutting a silicon rod are provided in the embodiments of the present application.

According to a first aspect of the embodiments of the present application, a method for cutting a silicon rod is provided, comprising:

Limit the silicon rod to the cutting equipment;

The silicon rod is cut synchronously with the first section and the second section parallel to the length direction of the silicon rod, the number of the first section is two, and the two first sections are parallel; the number of the second section is at least three , at least three second cut planes are parallel to each other; the second cut planes are perpendicular to the first cut planes, so as to obtain at least two small silicon rods and an edge leather with a flat surface and an arc surface.

According to a second aspect of the embodiments of the present application, there is provided a cutting device applying the above silicon rod cutting method, including:

pedestal;

a bearing platform, arranged on the base, for bearing the silicon rod;

a wire cutting device, which is arranged on the base, and can move relative to the bearing platform along the length direction of the silicon rod; a cutting wire wheel group is arranged on the wire cutting device;

The cutting wire wound on the cutting wire wheel set is used to cut the silicon rod.

According to a third aspect of the embodiments of the present application, there is provided a silicon rod cutting system, comprising: the cutting device as described above, used for cutting a silicon rod with a first section and a second section to obtain small silicon rod; and,

Grinding equipment for grinding small silicon rods.

In this embodiment, small silicon rods with smaller cross-sectional areas are directly obtained by cutting the silicon rods through the first section and the second section at the same time, which has high production efficiency. Small silicon wafers that meet the size requirements of silicon wafers are used to prepare small-piece heterojunction cells without the need for laser scribing, which improves the product quality of small silicon wafers, thereby ensuring the conversion efficiency of heterojunction cells.

Description of drawings

1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present application;

2 is a schematic diagram of the method for cutting a silicon rod provided by an embodiment of the present application for cutting a silicon rod;

Fig. 3 is the structural representation of cutting edge leather in the silicon rod cutting method provided by the embodiment of the application;

4 is a schematic structural diagram of a silicon rod cutting device provided by an embodiment of the present application;

Fig. 5 is the structural representation of the wire cutting device in the cutting equipment shown in Fig. 4;

Fig. 6 is the structural representation that the wire cutting device in the cutting equipment shown in Fig. 4 cuts the silicon rod;

7 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

8 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

10 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the application;

11 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the application;

12 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the application;

13 is a first structural schematic diagram of a wire cutting device in a silicon rod cutting device provided by an embodiment of the application;

14 is a second structural schematic diagram of a wire cutting device in a silicon rod cutting device provided by an embodiment of the application;

15 is a schematic structural diagram of a carrying table in a cutting device provided by an embodiment of the application;

16 is a cross-sectional view of a clamping mechanism in a cutting device provided by an embodiment of the application;

17 is a schematic structural diagram of another bearing platform in the cutting device provided by the embodiment of the application;

18 is a cross-sectional view of a cutting wire wheel in a cutting device provided by an embodiment of the application;

Fig. 19 is a schematic structural diagram 1 of the gripping device gripping the edge leather in the cutting device provided by the embodiment of the application;

Fig. 20 is a schematic structural diagram 2 of the gripping device gripping the edge leather in the cutting device provided by the embodiment of the application;

21 is a schematic structural diagram of a silicon rod grinding device provided by an embodiment of the application;

Figure 22 is a schematic structural diagram of a small silicon rod clamped to a sliding table device in the grinding equipment shown in Figure 21;

Figure 23 is a schematic structural diagram of the sliding table device in the grinding equipment shown in Figure 21;

FIG. 24 is a schematic structural diagram of a grinding assembly in the grinding apparatus shown in FIG. 21 .

Reference number:

a1-silicon rod; a4-small silicon rod; a5-small raw material sheet; a6-side leather; a61-arc top; a62-corner; a63-side leather rod;

b1-the first section; b2-the second section; b3-the third section; b4-the fourth section;

1 - base;

2-bearing table; 211-1-main bearing part; 211-2-auxiliary bearing part; 221-limiting mechanism; 23-clamping mechanism; 321-clamping drive mechanism; 232-telescopic rod; 233-clamping Head; 251-flat plate abutting plate; 252-L-type abutting plate; 261-first preset opening;

301-main support; 302-line wheel support; 31-cutting line wheel; 311-line groove; 32-cutting line; 34-line pay-off mechanism; 35-line arrangement mechanism; 36-line take-up mechanism; 38-laser alignment device; 39-spray lubrication device;

401-feeding area; 402-grinding area; 41-base assembly; 42-feeding assembly; 421-feeding slide; 422-headstock; 423-tailstock; 44-headstock chuck; 425-tail rack chuck;

51-fixture; 52-claw; 521-installation plate; 522-claw body.

Detailed ways

In order to make the technical solutions and advantages of the embodiments of the present application clearer, the exemplary embodiments of the present application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and Not all embodiments are exhaustive. It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other under the condition of no conflict.

This embodiment provides a method for cutting a silicon rod, which is used to cut a silicon rod to obtain a small-piece silicon wafer. The silicon rod may be a polycrystalline silicon material, a single crystal silicon material, or the like. This embodiment only takes the single crystal silicon material as an example to describe the cutting method in detail. Those skilled in the art can directly apply the technical solutions provided in this embodiment to cutting other materials, or can be applied to cutting other materials after adaptability improvement.

Fig. 1 is a flowchart of a method for cutting a silicon rod provided by an embodiment of the present application, and Fig. 2 is a schematic diagram of a method for cutting a silicon rod provided by an embodiment of the present application for cutting a silicon rod. As shown in Figure 1 and Figure 2, the cutting method provided by this embodiment includes:

Step 101 , confine the silicon rod to the cutting device.

Step 102: Cut the silicon rod simultaneously with the first section and the second section parallel to the length direction of the silicon rod, the number of the first section is two, and the two first sections are parallel; the number of the second section is At least three, at least three second cut surfaces are parallel to each other; the second cut surface is perpendicular to the first cut surface, so as to obtain at least two small silicon rods and an edge leather with a flat surface and an arc surface.

In this embodiment, the silicon rod is a single crystal silicon rod, and its shape is a cylinder, and the length direction of the silicon rod is the direction of the center line of the cylinder, which can also be referred to as the axis direction.

The two first cut planes b1 are parallel and can be symmetrically arranged on both sides of the center line of the silicon rod a1, and the edge skin material at the top and the edge skin material at the bottom of the silicon rod are cut off. At least three second cutting planes b2 are parallel and spaced apart, the second cutting planes b2 are perpendicular to the first cutting plane b1, and the second cutting planes b2 located on both sides are cut off the left edge leather and the right edge leather. Simultaneously cut the silicon rod a1 through the two first cut planes b1 and at least three second cut planes b2, to obtain at least two small silicon rods a4 and the left and right edge skins, the top edge skin and the bottom edge skin.

The left and right side leathers have a flat surface and an arc surface, and the arc surface is connected with the flat surface. The top and bottom edges The leather has two vertical planes and an arc surface connecting between the two vertical planes.

In the traditional scheme, the cylindrical silicon rod is first cut into a rectangular square rod, and then the square rod is sliced to obtain a large silicon wafer with a larger size, and then the large silicon wafer is cut into small silicon wafers by laser scribing technology. , will damage the small silicon wafer.

In this embodiment, in step 102, two first sections and at least three second sections are used to cut the silicon rod, and at least two small silicon rods a4 with smaller cross-sectional areas are directly obtained. There are fewer steps and higher efficiency, and the subsequent slicing of the small silicon rod a4 can directly obtain a small silicon wafer that meets the size requirements of the silicon wafer for the preparation of small-piece heterojunction cells, without the need for laser scribing. The product quality of the sheet is improved, thereby ensuring the conversion efficiency of the heterojunction cell.

The step of cutting the small silicon rod a4 is as follows: slicing the small silicon rod a4 along the length direction of the small silicon rod a4 with a section perpendicular to the length direction of the small silicon rod a4 to obtain a plurality of small raw material sheets a5. The step of slicing may be performed by a prior art slicer.

On the basis of the above technical solutions, before slicing the small silicon rods a4, the small silicon rods a4 also need to be ground. Referring to the above steps, a small silicon rod a4 is obtained, its cross section is rectangular, and the four surfaces parallel to its longitudinal direction are side surfaces. After the small silicon rod a4 is obtained, the four sides of the small silicon rod a4 are ground, and then the edges and corners between the two adjacent sides in the small silicon rod a4 are ground to form a chamfered surface between the two sides. , to obtain a small silicon rod a4' after grinding.

The side of the small silicon rod is ground to make the surface smoother, and the edge of the small silicon wafer formed in the subsequent slicing is relatively smooth, and there is no need to trim the edge by laser scribing, and the quality of the small silicon wafer is improved. Grinding the edges and corners of the small silicon rods to form a chamfered surface can prevent the cutting lines from contacting the edges and corners of the small silicon rods during the slicing process, thereby causing damage to the edges and corners of the silicon wafers.

In the above scheme, when the number of the second tangent planes b2 is three, the two second tangent planes located on the outside are symmetrically arranged on both sides of the center line of the silicon rod, and the ratio of the cross-sectional areas of the two small silicon rods a4 obtained is: 1:1-1:6. The number of the third cut plane b3 and the specific cutting position can be determined according to the size of the small silicon rod a4 and the size of the small silicon wafer to be produced, so as to meet the preparation requirements of small cells of different sizes. In this embodiment, the number of the second tangent planes b2 is three, and the second tangent plane b2 located in the middle passes through the center line of the silicon rod a1, so that the cross-sectional areas of the two small silicon rods s4 are equal.

In the above solution, the distance between the two second cut surfaces b2 located on the outside is smaller than the width of the surface formed by cutting the silicon rod a1 by the first cut surface b1. So that the second cut surface b2 is not in contact with the intersection of the plane and the arc surface of the intermediate rod a2, so that the cutting process is relatively stable and accurate, and the dimensional accuracy of the small silicon rod a4 is guaranteed.

An implementation method: the number of the second cut planes b2 is three, and the distance between the two second cut planes b2 located on the outside is equal to the distance between the two first cut planes b1. The aspect ratio is 2:1.

Further, it is also possible to cut the left and right side skins obtained by the above cutting to obtain silicon rods with smaller cross-sectional areas, which can be used to reduce the waste of raw materials.

3 is a schematic structural diagram of cutting edge leather in the silicon rod cutting method provided by the embodiment of the present application. As shown in Figure 3, cut the edge leather a6 with the third cut surface b3 parallel to the length direction of the edge skin, and the third cut surface b3 is parallel to the bottom surface of the edge skin a6, so as to cut off the arc top a61 of the edge skin .

Cut the edge leather a6 with the fourth cut surface b4 parallel to the length direction of the edge skin, the fourth cut surface b4 is perpendicular to the bottom surface of the edge skin a6; the number of the fourth cut surface b4 is two, symmetrically arranged on the edge skin The edges and corners a62 on both sides of the edge skin material a6 are cut off on both sides of a6 to obtain edge skin silicon rods a63 with a rectangular cross-section.

The order of the above-mentioned cutting edge leather arc top a61 and corner a62 can be interchanged, that is, the arc top a61 can be cut first, and then the corner a62 can be cut; the corner a62 can also be cut first, and then the arc can be cut off. Top a61.

On the basis of the above technical solution, the present embodiment also provides a silicon rod cutting device, which uses the above cutting method to cut the silicon rod.

FIG. 4 is a schematic structural diagram of a silicon rod cutting device provided by an embodiment of the present application. As shown in Figure 4, the cutting equipment includes: a base 1, a carrying table 2 and a wire cutting device. Wherein, the carrying table 2 and the wire cutting device are both arranged on the base 1.

The carrier table 2 is used to carry the silicon rod a1, and the silicon rod a1 is placed on the carrier table 2. The carrier table 2 can also be provided with components for fixing and limiting the silicon rod a1 to limit the silicon rod a1 during the cutting process. Movement occurs. The silicon rod a1 can be placed flat on the bearing platform 2, or it can be placed vertically on the bearing platform 2. Specifically, the silicon rod a1 is laid flat on the bearing platform 2, and the length direction of the silicon rod a1 extends in the horizontal direction; a1 is vertically placed on the supporting platform 2, and the length direction of the silicon rod a1 extends along the vertical direction. When the placement method of the silicon rod a1 is different, the structure and cutting method of the wire cutting device are also different.

The wire cutting device and the carrying table 2 can move relatively along the length direction of the silicon rod a1. One way is: the carrying table 2 is fixed on the base 1, and the wire cutting device moves relative to the carrying table 2. For example, the wire cutting device includes: The main support, the wire wheel support and the support driving mechanism, the main support is fixedly arranged on the base, and the wire wheel support moves relative to the main support under the driving action of the support driving mechanism. Another way is: the wire cutting device is fixed on the base 1, and the carrying table 2 moves relative to the wire cutting device under the driving action of the driving mechanism.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wound on the cutting wire wheel set is used to cut the silicon rod.

Fig. 5 is the structural representation of the wire cutting device in the cutting equipment shown in Fig. 4, and Fig. 6 is the structural representation of the silicon rod being cut by the wire cutting device in the cutting equipment shown in Fig. 4. As shown in Fig. 4 to Fig. 6 , the bearing platform 2 is arranged on the base 1, and the silicon rod a1 is vertically placed on the bearing platform 2.

An annular cutting wire is wound around the cutting wire wheel in the wire cutting device, and the cutting wire wheel moves up and down to cut the silicon rod. Specifically, the wire cutting equipment includes: a main support 301, a wire wheel support 302 and a support driving mechanism. The main support 301 is fixedly arranged on the base 1, the main support 301 is provided with a sliding rail, and the wire wheel support 302 is in the support driving mechanism. It moves along the slide rail under the driving action, and moves up and down relative to the main bracket 301 .

The bearing platform 2 includes two parts: a bearing part and a top tightening part, the bearing part is arranged on the base 1, and the top tightening part is arranged on the main bracket 301. The silicon rod is vertically arranged between the bearing part and the pressing part, and the top part presses the silicon rod downward. The silicon rod is cut by moving the wire wheel support 302 up and down.

The wire wheel bracket 302 is provided with a first cutting wire wheel set and a second cutting wire wheel set, wherein the first cutting wire wheel set includes: cutting wire wheels 31-1, 31-2, 31-3 and 31-4; The second cutting wire set includes: 31-5, 31-6, 31-7, 31-8, 31-9 and 31-10.

5 and 6 only, the cutting wire wheels 31-1, 31-2 are at the same height, the cutting wire wheels 31-3, 31-4 are at the same height and located at the cutting wire wheels 31-1, 31 -2 below. The cutting wire wheels 31-1 and 31-2 are wound with annular cutting lines, which are used as the first section to cut the silicon rod; the cutting wire wheels 31-3 and 31-4 are wound with annular cutting lines as The other first section faces the silicon rod for cutting. The cutting wire wheels 31-1 and 31-3 are respectively arranged on the wire wheel support 302, or both can be arranged on the same rotating shaft. The cutting wire pulleys 31-2 and 31-4 are respectively arranged on the wire pulley support 302, or they can also be arranged on the same rotating shaft.

The cutting reels 31-5 and 31-6 are arranged up and down as a pair of reels, the cutting reels 31-7 and 31-8 are arranged up and down as a pair of reels, and the cutting reels 31-9 and 31-10 are arranged up and down as a pair. Alignment wheel. Three pairs of wire pulleys are arranged side by side, the annular cutting line wound on the cutting wire pulleys 31-5 and 31-6 is used as the second cutting surface, and the annular cutting wire wound on the cutting wire pulleys 31-57 and 31-8 is used as the second cutting surface. For the second cut surface in the middle, the annular cutting line wound around the cutting wire wheels 31-9 and 31-10 is used as another second cut surface to cut the silicon rod. The cutting wire wheels 31-5, 31-7, 31-9 can be arranged on the same rotating shaft. Alternatively, 31-5 and 31-9 are respectively arranged on the reel support 302, and 31-7 can be arranged on the same shaft as 31-5, or can be arranged on the same shaft as 31-9.

For each pair of wire pulleys, at least one tension pulley may also be used, and the annular cutting wire is also sleeved on the tension pulley for maintaining the tension of the cutting wire. The cutting wire can be driven by a wire wheel driver, for example, the wire wheel driver drives the driving wheel at the output end to rotate, and the driving wheel drives the cutting wire sleeved on it to move.

There is a space for the silicon rod to pass through in the middle of the area where each cutting wire wheel is arranged. During the relative movement of the wire wheel support and the silicon rod, the silicon rod is cut by the cutting wire.

Further, the cutting equipment also includes: a sleeve that can move vertically and a side leather gripper, the sleeve is used to be sleeved on the outer side of the silicon rod, and the side wallet gripper is inserted from the top on the side leather and the cut. Between the silicon rods, the edge leather gripper and the sleeve exert a clamping force on the edge leather. The edge leather gripper and the sleeve pick up the edge leather and move it to the edge leather recovery area.

FIG. 7 is a schematic structural diagram of another silicon rod cutting device according to an embodiment of the present application. The difference from the above scheme is that in the cutting device shown in FIG. 7 , the wire wheel bracket 302 is fixedly arranged on the main bracket 301 , and the carrying table 2 cooperates with the slide rail on the main bracket 301 to realize the movement of the carrying table 2 relative to the wire wheel bracket 302 . . The silicon rod is moved up and down by the bearing platform 2, and the silicon rod is cut by the cutting wire wheel.

FIG. 8 is a schematic structural diagram of yet another silicon rod cutting device provided by an embodiment of the present application. The difference from the above solution is that: in the cutting equipment shown in FIG. 8, the method of long wire cutting is adopted, and the wire cutting device also includes: a wire pay-off mechanism 34, a wire take-up mechanism 36 and a wire-arrangement mechanism 35, a wire pay-off mechanism 34 and a wire take-up mechanism 36 are respectively arranged on both sides of the cutting wire wheel set, and the cutting wire is a single long wire wound between the wire pay-off mechanism 35, the wire take-up mechanism 36, the wire arranging mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used to make the cutting wire evenly wound on the wire take-up mechanism 36 or the wire pay-off mechanism 34.

During the cutting process, the cutting wire 32 is wound out from the wire pay-off mechanism 34, guided by the wire arranging mechanism 35, and then passes through each cutting wire wheel 31, and then is retracted by the wire take-up mechanism 35. During a cutting process, the wire pay-off mechanism 34 also functions as the wire take-up mechanism 36, and the wire take-up mechanism 36 also functions as the wire pay-off mechanism 34 to reciprocate the cutting wire 31.

FIG. 9 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application. Different from FIG. 8 , in the cutting device shown in FIG. 9 , the wire wheel bracket 302 is fixedly arranged on the main bracket 301 , and the carrying table 2 cooperates with the slide rail on the main bracket 301 to realize the movement of the carrying table 2 relative to the wire wheel bracket 302 . . The silicon rod is driven to move up and down by the bearing platform 2, and the silicon rod is cut by the cutting wire wound around the cutting wire wheel.

FIG. 10 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application. Different from the previous solution, Figure 10 shows a horizontal cutting method. The main support 301 includes a top plate and legs vertically arranged at the bottom of the four top corners of the top plate, and the legs are fixed on the base 1. The base 1 is provided with a slide rail, and the bottom of the wire wheel support 302 is matched with the slide rail to realize the movement of the wire wheel support 302 relative to the base 1. The bearing platform 2 is fixed on the lower surface of the top plate of the main support 301, and the silicon rods are clamped from both ends. The silicon rods are cut by moving the wire wheel support 302 relative to the silicon rods.

FIG. 11 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application. The difference from FIG. 10 is that in the cutting equipment shown in FIG. 11 , the wire wheel support 302 is fixedly arranged on the base 1 , the lower surface of the top plate of the main support 301 is provided with a slide rail, and the bearing platform 2 cooperates with the sliding rail to realize the driving of the bearing platform 2 . The silicon rod moves relative to the main support 301, and during the movement of the silicon rod, the silicon rod is cut by a cutting wire wound around the cutting wire wheel.

For the horizontal cutting equipment shown in Figures 10 and 11, the method of long-line cutting can also be adopted with reference to the above-mentioned solution. The wire pay-off mechanism and the wire take-up mechanism drive the cutting wire to reciprocate for cutting.

The cutting wire mentioned in this embodiment is a diamond wire, which is used for cutting a single crystal silicon material.

The above solution can directly cut and process the monocrystalline silicon rod into small pieces of silicon wafers, and solves the drawbacks of processing small pieces of silicon wafers from large pieces of silicon wafers in the prior art.

The length L of the above-mentioned small silicon rod is greater than its width W and height H, and the length direction of the small silicon rod can be understood to be the same as the axial direction of the silicon rod a1.

In some embodiments of the present application, the cross-sectional length and width of the plurality of small silicon rods are equal or unequal. When the cross-sectional length and width of multiple small silicon rods are equal, the size of the small silicon wafer prepared by slicing multiple small silicon rods is the same; when the cross-sectional length and width of multiple small silicon rods are different, the The sizes of the small silicon wafers prepared from the silicon rods are different to meet the production of small cells of different sizes.

In some embodiments of the present application, in the step of "slicing small pieces", each small silicon rod is sliced independently in a direction in which the cut plane is parallel to the end face of the small silicon rod; or, a plurality of small silicon rods are sliced simultaneously. Simultaneous slicing is preferred for higher efficiency.

In some embodiments of the present application, the processing method further includes the step of cutting edge leather: cutting four pieces of edge leather with the cutting plane parallel to the axis of the silicon rod, and each piece of edge leather can be cut to obtain an outer edge Leather and at least one middle edge leather. The outer edge leather and the middle edge leather are used for subsequent processing to improve the utilization rate of silicon rods.

In some embodiments of the present application, the thicknesses of the outer side leather and the middle side leather are equal or unequal to meet the processing requirements of different subsequent products.

This embodiment also provides a device for cutting edge leather. As shown in FIG. 12, the cutting device includes: a base 1, a carrying table 2 and a wire cutting device, wherein the carrying table 2 and the wire cutting device move relative to each other, The carrying table 2 may be moved relative to the base, or the wire cutting device may be moved relative to the base. The edge leather can be placed on the carrying platform 2 horizontally or vertically. The wire cutting device can use an annular cutting wire or a single long wire. For details, please refer to the above content.

The wire cutting device includes a gate-shaped wire wheel support 302 on which a plurality of sets of cutting wire wheels 32 are arranged. Figure 12 sets up four stations, which can cut four side leather materials at the same time. For one of the stations, it includes a set of cutting wire wheels, at least two cutting wire wheels 32, arranged horizontally or up and down, and the cutting lines wound on the two cutting wire wheels 32 extend horizontally or vertically to form cutting planes , to cut off the curved top or corner of the hem leather. Figure 13 shows the horizontal arrangement. When a station includes two sets of cutting wire wheels, the cutting wire wound on the two sets of cutting wire wheels can cut off two corners of the edge leather at the same time. Figure 14 shows a view of two sets of cutting wire wheels.

In the structure shown in Fig. 12, the cutting wire wheel is connected to the same rotating shaft, and the rotating shaft is driven to rotate by a driver, thereby driving each cutting wire wheel to rotate synchronously. The connection between the drive and the shaft can be direct drive, belt drive, chain drive or gear drive.

For the above-mentioned carrying table 2, this embodiment also provides a specific implementation manner: FIG. 15 is a schematic structural diagram of the carrying table in the cutting device provided by the embodiment of the application. Figure 15 shows four stations, which can cut four edge hides at the same time. For one of the stations, the carrier table 2 has a first preset opening 261 to make way for the cutting line. The first preset opening 261 divides the front end of the carrying platform into a main carrying part 211-1 and an auxiliary carrying part 211-2, and the main carrying part 211-1 and the auxiliary carrying part 211-2 are used to jointly carry the flat side to be cut. Leather.

When it is necessary to cut the edge leather, first fix the edge leather on the bearing platform in a flat manner. At this time, the edge leather is located between the main bearing part, the auxiliary bearing part and the two first preset openings. superior. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the first preset opening, and starts to cut from one end face of the edge leather until it reaches the other end face.

It can be understood that after cutting off the edge and corner of the edge leather first, in the process of cutting off the arc top, the edge leather side of the cut edge can be placed on the bearing platform, and the bearing platform does not need to be provided with a preset. Set an opening.

FIG. 16 is a cross-sectional view of a clamping mechanism in a cutting device provided by an embodiment of the present application. As shown in Fig. 15 and Fig. 16, further, the bearing platform is further provided with a limiting mechanism 221 and a clamping mechanism 23. The clamping mechanism includes a clamping driving mechanism 231, a telescopic rod 232 and a clamping head 233. One end of the telescopic rod is fixed on the side of the clamping driving mechanism, and the other end of the telescopic rod is fixed with the clamping head, and the clamping head 233 is connected to the limiter. Bit mechanism relative settings. The clamping drive mechanism is used to drive the telescopic rod to telescopically adjust the distance between the clamping head 233 and the limiting mechanism 221 to place the edge leather between the clamping head and the limiting mechanism. The limiting mechanism 221 and the clamping head 233 It is used to fix the edge leather at both ends of the edge leather.

Further, the carrying device further includes: a flat plate-type abutting plate 251 fixedly installed on the upper surfaces of the main carrying part 211-1 and the auxiliary carrying part 211-2, the upper surface of the main carrying part 211-1 and the The flat plate-type abutting plate of the bearing portion is in close contact with the plate surface, and the upper surface of the auxiliary bearing portion 211-2 is in close contact with the plate surface of the flat-plate abutting plate fixed on the auxiliary bearing portion.

The flat plate-type abutting plate 251 is a full-length flat-type abutting plate, and a flat plate-type abutting plate is fixed on each of the main bearing portion 211-1 and the auxiliary bearing portion 211-2. Or at least two flat plate-type abutting plates are respectively fixed on the main bearing part and the auxiliary bearing part at intervals.

In order to realize the bearing function of the opposite leather material and the multiple components mounted on the bearing platform, the bearing platform needs to be a bearing platform of rigid material. The edge leather of the brittle and hard material is itself brittle and hard. In order to avoid hard-to-hard contact between the edge skin of the brittle and hard material and the bearing platform of the rigid material, an elastic flat plate-type abutting plate is provided. When the bottom surface of the edge leather with the curved end face is placed on the elastic flat plate abutting plate, it provides a buffer for the edge leather and protects the edge leather.

FIG. 17 is a schematic structural diagram of another bearing platform in the cutting device provided by the embodiment of the present application. As shown in FIG. 17 , the L-shaped abutment plate 252 is fixed on at least the upper surface of one of the auxiliary bearing parts 211-2, the transverse arm of the L-shaped abutment plate 252 is fixed on the upper surface of the auxiliary bearing part 211-2, and The auxiliary bearing portion 211-2 is flush with the end of the transverse arm of the L-shaped abutment plate fixed on the auxiliary bearing portion. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be applied. The L-shaped abutment plate can smoothly carry the edge leather with two adjacent vertical planes.

FIG. 18 is a cross-sectional view of a cutting wire wheel in a cutting device provided by an embodiment of the present application. As shown in FIG. 18 , this embodiment provides a structure of a cutting wire wheel. The outer edge of the cutting wire wheel is provided with a plurality of wire grooves 311 arranged in parallel, and the cutting wire 32 is embedded in one of the wire grooves 311 to cut the cutting wire The wire 32 is limited to the wire groove 311 to prevent it from coming off the cutting wire wheel during rotation. In addition, due to the sliding friction between the cutting wire and the wire groove 311, a lot of diamonds are arranged on the cutting wire, so that the wear of the wire groove is serious. After one wire groove is worn out, other wire grooves can be directly used without frequent replacement of the cutting wire wheel, which is convenient for maintenance and saves materials and maintenance costs.

Fig. 19 is a schematic structural diagram 1 of the clamping device in the cutting device provided by the embodiment of the application, and Fig. 20 is a schematic structural diagram 2 of the clamping device in the cutting device provided by the embodiment of the application. As shown in Fig. 19 and Fig. 20, the cutting equipment provided in this embodiment further includes a clamping device for grabbing the edge leather and placing it on the carrying table or leaving the carrying table.

Specifically, the clamping device includes: a fixing member 51 and two oppositely arranged clamping jaws 52, at least one clamping jaw 52 is slidably installed on the lower bottom surface of the fixing member 51, so that the distance between the two clamping jaws 52 is adjustable, In order to adapt to the edge leather of different widths.

When it is necessary to clamp the edge leather, adjust the distance between the two jaws to be greater than the width of the edge leather, and move the position of the clamping device, so that the two clamping jaws are located on both sides of the width direction of the edge leather respectively; After that, adjust the distance between the two jaws to become smaller until the width direction of the edge leather is gripped. The cutting equipment provided by the embodiments of the present application can conveniently realize the clamping of the edge leather material through the clamping device, which provides favorable conditions for the movement of the edge leather material.

Specifically, the clamping jaw 52 includes: a vertical mounting plate 521 and a clamping jaw body 522 . At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51. The jaw body 522 is fixed on the inner surface of the mounting plate 521 . The jaw itself is not an integral structure, but the mounting plate and the jaw body are formed from two separate parts. The vertical mounting plate is the installation base of the gripper body and also the base for the gripper to move. The mounting plate and the clamping jaw body are two independent parts. During the process of clamping the raw material bar by the clamping jaw body, the clamping jaw body is seriously worn, and only the clamping jaw body needs to be replaced, and the installation plate does not need to be replaced.

By using the cutting equipment for edge leather of the present application, it is possible to realize the cutting of edge leather with an arc-shaped end surface. The cutting process is as follows: first, cut the corners of both ends of the edge leather to form the edge leather with the combined shape of the rectangle and the arc; then, cut the top of the edge leather with the combined shape of the rectangle and the arc. The arc is cut to form a rectangular bar with a rectangular end face.

Before cutting the edges and corners of the edge leather, after placing the edge leather on the carrying device, firstly, the laser marking is carried out through the laser positioning device to ensure that the edge leather is placed in the proper and correct position. A bottom sensing device is fixed on the bearing platform 2 to detect whether the edge leather is installed in place. Only after all the detection conditions are satisfied, the clamping mechanism will move to tighten the edge leather, and it will be pressed and fixed together with the limit mechanism. Edge leather.

Before the cutting equipment cuts the top of the arc, the edge leather is placed on the bearing device and the material sensing switch is triggered to detect that the edge leather is placed in place. At this time, the edge leather is marked and positioned by the laser locator and the side sensing device fixed on the auxiliary bearing part of the bearing device, so as to ensure that the edge leather is placed in the correct position and meet all the detection conditions to complete the edge leather positioning. . Start the clamping mechanism and start the extension movement to complete the positioning and clamping process of the edge leather.

As shown in FIG. 12 , a laser alignment device 38 and a spray lubricating device 39 are also included.

The laser alignment device is set above the edge leather cutting table to realize the precise installation and feeding function of the edge leather. The laser alignment device is provided with a plurality of laser generators. Before the edge leather is installed on the edge leather cutting table, the laser generators are turned on to form a linear laser, which is projected onto the carrying device. When the edge leather is installed on the carrier device, it is firstly aligned with the linear laser, so that the rectangular block of brittle and hard material formed after cutting is exactly the required size. Among them, the position and distance of each laser generator can be adjusted, which is determined according to the specifications of different edge leather materials.

The specific working process of the laser alignment device is: using tooling or measuring tools (vernier caliper, steel ruler) to find the center line of the two rounds. Adjust the position of the focused laser reticle so that the laser emitted by the laser reticle is aligned with the center line of the two wheels, and fix the laser reticle. Find the position of the center line on the edge leather and mark it. When feeding, adjust the position of the edge leather so that the center line of the edge leather is aligned with the laser emitted by the laser marking device.

The spray lubricating device continuously sprays the cutting fluid on the vertical diamond wire during the cutting process to improve the quality of the edge leather after cutting. The spray lubrication device also needs to be installed above the edge leather cutting table. During the cutting process, the cutting fluid is continuously sprayed on the vertical diamond wire, and the cutting fluid will flow vertically to the position of the edge skin to be cut to achieve the purpose of cooling and lubrication. .

Before cutting the silicon rod, after placing the silicon rod on the bearing table, the laser marking line is firstly positioned by the laser positioning device to ensure that the silicon rod is placed in the proper and correct position. The bottom or side of the bearing platform is provided with an induction device to detect whether the silicon rod is installed in place. Only after all the detection conditions are met, the jacking mechanism will move to tighten the silicon rod, and press and fix the silicon rod together with the limit mechanism. Great.

Further, the position of the silicon rod is detected by the induction device, and the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to a preset cutting position to cut the silicon rod.

Further, this embodiment also provides a grinding device for grinding the small silicon rods in the above steps. As shown in FIGS. 21 to 24 , the grinding equipment includes: a base assembly 41 , a feeding assembly 42 , and a grinding assembly 43 . The whole grinding equipment includes: a feeding area 401 and a grinding area 402 . Wherein, the feeding assembly 42 is arranged in the feeding area 401, and the small silicon rods to be ground are assembled from the feeding area 401 to the feeding assembly 42, and then sent to the grinding area 402. The grinding assembly 43 is arranged in the grinding area 402 to grind the surface and/or the edge of the small silicon rod.

Taking the grinding of the small silicon rod a4 as an example, Figures 22 and 23 show the implementation of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a feeding slide table 421, a headstock 422 and a tailstock 423. One implementation method is: the slide table is fixed, and the headstock 422 and the tailstock 423 move relative to the slide table; the other way is that the headstock 422 is fixed relative to the slide table, and the tailstock 423 moves relative to the slide table, The slide table is movable relative to the base. Take the second solution as an example: place the small silicon rod a4 between the headstock 422 and the tailstock 423, adjust the position of the tailstock 423 relative to the slide table, and clamp the small silicon rod a4. By moving the sliding table, the small silicon rod a4 is moved to the model area 402 for grinding by the grinding assembly 43 .

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 is arranged opposite to the tailstock chuck 425, and the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425. Between the tailstock chucks 425, the headstock chucks 424 and the tailstock chucks 425 clamp the small silicon rod a4 from both ends.

As shown in Fig. 21, in another implementation manner, the loading assembly includes: a grinding fixed seat 426 and a chuck 427, which are arranged up and down. The small silicon rod a3 is vertically disposed between the grinding fixed seat 426 and the chuck 427, and the chuck 427 clamps the small silicon rod downward. The grinding assembly includes a grinding head 431 and a grinding head driver, which are located on the left and right sides of the small silicon rod, respectively. The grinding head driver is used to drive the grinding head 431 to move horizontally to contact with the small silicon rod or move in the opposite direction away from the small silicon rod.

The grinding head 431 can move vertically to grind the surface of the small silicon rod during the lifting process. Alternatively, the grinding holder and the chuck drive the small silicon rod to move up and down, and the grinding head is fixed.

The grinding holder 426 and the chuck can drive the small silicon rod to rotate horizontally. After grinding the two sides of the small silicon rod, the grinding fixed base drives the small silicon rod to rotate 90°, and grinds the other two sides. . After all sides are ground, turn the small silicon rod 45° to grind the edges and corners of the small silicon rod; then turn 90° in turn to grind the remaining three edges and corners.

The above-mentioned grinding assembly 43 is provided with a grinding wheel, which is used for grinding the small silicon rod a4. The grinding wheel includes a rough grinding wheel and a fine grinding wheel, which respectively perform rough grinding and fine grinding on the small silicon rod a4.

In the above scheme, the small silicon rods are ground, usually on the side face, and also on the end face in special cases.

This embodiment also provides a silicon rod cutting system, including: the above-mentioned cutting device for cutting a silicon rod with a first section and a second section to obtain small silicon rods, and a grinding machine for grinding the small silicon rods The cutting device may further include a cutting device for cutting the edge leather. The silicon rods are cut through various cutting equipment according to the assembly line operation to obtain small silicon wafers.

Claims (12)

1. a silicon rod cutting method, is characterized in that, comprises: Limit the silicon rod to the cutting equipment; The silicon rod is cut synchronously with the first section and the second section parallel to the length direction of the silicon rod, the number of the first section is two, and the two first sections are parallel; the number of the second section is at least three , at least three second cut planes are parallel to each other; the second cut planes are perpendicular to the first cut planes, so as to obtain at least two small silicon rods and an edge leather with a flat surface and an arc surface. 2 . The method according to claim 1 , wherein the two second cut surfaces located on the outside are arranged on both sides of the center line of the silicon rod; the number of the second cut surfaces is three, and two small silicon rods are obtained. 3 . ; The ratio of the cross-sectional area of the two small silicon rods is 1:1-1:6. 3. The method according to claim 2, wherein the number of the second section is three, the second section located in the middle passes through the center of the silicon rod, and the obtained two small silicon rods have equal cross-sectional areas . 4 . The method according to claim 1 , wherein the distance between the two second cutting planes located on the outer side is equal to the distance between the two first cutting planes. 5 . 5. The method according to any one of claims 1-4, further comprising: The small silicon rods are sliced along the length direction of the small silicon rods with a section perpendicular to the length direction of the small silicon rods to obtain a plurality of small raw material sheets. 6. The method according to claim 5, characterized in that, before slicing the small silicon rods, further comprising: Grinding the four sides of the small silicon rod, the side of the small silicon rod is the surface parallel to its length direction; The corners between two adjacent sides of the small silicon rod are ground to form a chamfered surface between the two sides. 7. The method of claim 1, further comprising: Cut the edge leather with the third cutting plane parallel to the length direction of the edge leather, and the third cutting surface is parallel to the bottom surface of the edge leather to cut off the arc top of the edge leather; The edge leather is cut with the fourth cut surface parallel to the length direction of the edge skin, and the fourth cut surface is perpendicular to the bottom surface of the edge skin; the number of the fourth cut surface is two, which are symmetrically arranged on both sides of the edge skin. The edge and corners on both sides of the edge leather are cut off to obtain edge skin silicon rods with a rectangular cross section. 8. A cutting device applying the silicon rod cutting method of any one of claims 1-7, characterized in that, comprising: pedestal; a bearing platform, arranged on the base, for bearing the silicon rod; A wire cutting device is arranged on the base, and can move relative to the bearing platform along the length direction of the silicon rod; the wire cutting device is provided with a cutting wire wheel group; The cutting wire wound on the cutting wire wheel set is used to cut the silicon rod. 9 . The cutting device according to claim 8 , wherein the carrying platform is fixedly arranged on the base; the wire cutting device comprises: a wire wheel support and a support driving mechanism; the wire wheel support is driven by the support Under the driving action of the mechanism, it moves relative to the base; the cutting wire wheel set is arranged on the wire wheel bracket; Or, the wire cutting device is fixed on the base; the carrying table moves relative to the wire cutting device under the driving action of the driving mechanism. 10 . The cutting device according to claim 9 , wherein the silicon rod is vertically arranged on the bearing platform; the wire wheel support and the bearing platform move relatively vertically; 10 . Alternatively, the silicon rods are horizontally arranged on the bearing platform, and the wire wheel support and the bearing platform move horizontally relative to each other. 11. The cutting device according to claim 9, wherein the cutting wire is wound around each wire wheel in the cutting wire wheel group to form a loop; Or, the wire cutting device further comprises: a wire pay-off mechanism, a wire take-up mechanism and a wire-arranging mechanism; the wire pay-off mechanism and the wire take-up mechanism are respectively arranged on both sides of the cutting wire wheel set, and the cutting wire is a single long wire wound around the pay-off mechanism. Between the wire mechanism, the wire take-up mechanism, the wire arrangement mechanism and the cutting wire wheel set. 12. A silicon rod cutting system, comprising: The cutting apparatus of any one of claims 8-11, for cutting a silicon rod with a first section and a second section to obtain small silicon rods; and, Grinding equipment for grinding small silicon rods.

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