CN114340317A - Three-dimensional liquid cooling heat abstractor - Google Patents
Three-dimensional liquid cooling heat abstractor Download PDFInfo
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- CN114340317A CN114340317A CN202111477610.7A CN202111477610A CN114340317A CN 114340317 A CN114340317 A CN 114340317A CN 202111477610 A CN202111477610 A CN 202111477610A CN 114340317 A CN114340317 A CN 114340317A
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Abstract
The invention discloses a three-dimensional liquid cooling heat dissipation device which comprises a plurality of side plates, wherein the side plates are connected in a surrounding manner and define an accommodating cavity which is positioned between the side plates and is used for accommodating a heating device; the inner part of each side plate is hollow to form a flow channel in which cooling liquid flows, and the flow channels in the side plates are communicated. According to the three-dimensional liquid-cooling heat dissipation device, the side plates with the flow channels are arranged in a surrounding manner, so that cooling liquid can flow among the side plates, multi-surface heat dissipation of a heating device is realized, and further three-dimensional heat dissipation is realized.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a three-dimensional liquid cooling heat dissipation device.
Background
With the development of electronic technology, the integration level of electronic devices is higher and higher, the performance requirements are gradually improved, and the heat flux density of the electronic devices is increased sharply. Temperature is a key factor influencing the service performance and service life of electronic devices, so how to solve the problem of heat dissipation of high heat flow density electronic devices is a research hotspot in various industries. Liquid cooling heat dissipation is an efficient heat exchange mode, and the principle of the liquid cooling heat dissipation is that a liquid cooling plate is arranged on a heating device, and cooling liquid passes through the liquid cooling plate to quickly take away heat.
At present, the liquid cooling plate is generally in a flat plate type, only one surface of a heating device can be subjected to heat dissipation, and along with the increasing power of the heating device, the single-surface liquid cooling heat dissipation is difficult to achieve a good heat dissipation effect.
Disclosure of Invention
The invention aims to provide a three-dimensional liquid cooling heat dissipation device.
The technical scheme adopted by the invention for solving the technical problems is as follows: the three-dimensional liquid cooling heat dissipation device comprises a plurality of side plates, wherein the side plates are connected in a surrounding manner to define an accommodating cavity which is positioned between the side plates and is used for accommodating a heating device;
the inner part of each side plate is hollow to form a flow channel in which cooling liquid flows, and the flow channels in the side plates are communicated.
Preferably, the three-dimensional liquid-cooling heat dissipation device further comprises a first joint for connecting cooling liquid and a second joint for discharging the cooling liquid;
the first joint and the second joint are connected to at least one side plate, and the first joint and the second joint are communicated with a flow passage of the side plate.
Preferably, in two adjacent connected side plates, the butt joint surface of one side plate is provided with at least one boss, the boss is tightly matched in the butt joint surface of the other side plate, and the boss is hollow and communicated with the flow channels of the two side plates.
Preferably, in two adjacent side plates, the two side plates are matched and welded and fixed by a butting surface with an inclined surface.
Preferably, the three-dimensional liquid-cooling heat dissipation device further comprises a bottom plate; the side plates are encircled on the side edge of the bottom plate.
Preferably, the plurality of side plates comprises two oppositely arranged side plates and two oppositely arranged end plates;
one end plate is connected between one end face of each of the two side plates, and the other end plate is connected between the other end face of each of the two side plates.
Preferably, at least one partition board extending along the length direction of the side board is arranged in the side board; the flow channel in the side plate is divided into at least two sub-flow channels by the partition plate; each branch runner is communicated with the runner in the adjacent end plate.
Preferably, the side plate is a flat cylinder structure with two opposite open ends, and the two open ends of the side plate are respectively butted with the two end plates.
Preferably, the end plate is of a flat cylinder structure and is transversely arranged and connected between the open ends of the two side plates;
the surface of the end plate facing the side plate is provided with a through hole or a boss matched with the open end of the side plate, and the through hole or the boss is communicated with the flow channel of the side plate and the flow channel of the end plate.
Preferably, the three-dimensional liquid-cooling heat dissipation device further comprises a bottom plate; the side edge plates and the end plates are connected on the side edges of the bottom plate in a surrounding mode.
According to the three-dimensional liquid-cooling heat dissipation device, the side plates with the flow channels are arranged in a surrounding manner, so that cooling liquid can flow among the side plates, multi-surface heat dissipation of a heating device is realized, and further three-dimensional heat dissipation is realized.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic structural diagram of a three-dimensional liquid-cooled heat dissipation apparatus according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a three-dimensional liquid-cooled heat dissipation device according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a side plate in the three-dimensional liquid-cooled heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an end plate of the three-dimensional liquid-cooled heat dissipation device according to an embodiment of the invention.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, the three-dimensional liquid-cooled heat dissipation apparatus of the present invention may include a plurality of side plates 10, wherein the plurality of side plates 10 are connected in a surrounding manner to define an accommodating chamber 200 located between the side plates 10, and the accommodating chamber 200 is used for accommodating a heat generating device.
The interior of each side plate 10 is hollow to form a flow channel 100, and the flow channels 100 in the side plates 10 are communicated with each other. The flow channel 100 is used for the cooling liquid to flow in it to when the device that generates heat sets up in the holding chamber 200 and with curb plate 10 laminating contact, flow in proper order in the flow channel 100 in each curb plate 10 through the cooling liquid, take away the heat that the device that generates heat produced in a plurality of directions, reach three-dimensional radiating effect.
Specifically, each side plate 10 may be a flat cylindrical structure, and an inner chamber of the flat cylindrical structure forms the flow passage 100. The flat tubular structure may be machined from an aluminum profile.
The side plates 10 can be connected by at least one of a plug-fit manner, a welding manner, and the like. For example, in a connection mode of two side plates 10 connected adjacently, the abutting surface of one side plate 10 is provided with at least one boss 101, the boss 101 is tightly fitted in the abutting surface of the other side plate 10 in an insertion manner, and the boss 101 is hollow and communicates with the flow passage 100 of the two side plates 10, as shown in fig. 2.
In addition, in the above connection manner, if necessary, a protruding step 102 may be further provided on the surface of the side plate 10 where the boss 101 is located, and the step 102 may be matched with the abutting surface of the other side plate 10. When the boss 101 is fitted in the abutting surface, the step 102 can be engaged and abutted on the abutting surface, and the connection sealing performance between the two side plates 10 is improved.
In another connection mode of two side plates 10 which are adjacently connected, the two side plates 10 are matched and welded and fixed by the inclined butting surfaces, so that the two butting surfaces are connected by an included angle; each abutting surface is an open end of the flow channel, so that the two abutting surfaces are connected to communicate the flow channels 100 of the two side plates 10.
In some embodiments, as shown in fig. 1 and 2, the number of the side plates 10 is four, including two side plates 11 and two end plates 12. Two side boards 11 are oppositely arranged, two end boards 12 are oppositely arranged, one end board 12 is connected between one end face of the two side boards 11, the other end board 12 is connected between the other end face of the two side boards 11, and therefore the four side boards 10 are encircled to form a square structure. For a rectangular structure, the two side plates 11 are long sides, and the two end plates 12 are short sides; for a square structure, the two side panels 11 and the two end panels 12 are of comparable length. The square chamber in the square structure is the accommodating cavity 200.
In other embodiments, the side plate 10 may also be an arc-shaped plate, so as to form a circular or oval structure, and the accommodating cavity 200 is a circular or oval chamber.
The number of flow channels 100 in the side plate 11 may be one or more, as desired. Alternatively, at least one partition 111 may be disposed in the side plate 11, and the partition 111 extends along the length direction of the side plate 11 to divide the flow channel 100 in the side plate 11 into at least two branch flow channels 110; each of the sub-channels 110 communicates with the channels 100 in the adjacent end plate 12.
The side edge 11 and the end plate 12 are both flat tubular structures, and in the embodiment shown in fig. 1 and 2, the side edge 11 is a flat tubular structure with two opposite ends open, and the two open ends respectively form the open ends of the flow channel 100 for connecting with the end plate 12 and communicating the flow channel 100 inside the side edge 11 and the end plate 12. The end plate 12 may be a closed flat tubular structure that is disposed transversely and connected between the open ends of the two side plates 12; the surface of the end plate 12 facing the side plate 11 is provided with a through hole or a boss which is matched with the open end of the side plate 11, and the through hole or the boss is communicated with the flow channels of the side plate 11 and the end plate 12.
The boss 101 is provided on the end plate 12, that is, the fitting manner of the boss 101 is provided on the abutting surface of the side plate 10. Specifically, referring to fig. 2 to 4, bosses 101 are respectively provided on the surface of the end plate 12 corresponding to the edge portions of the open ends of the two side plates 11, and the bosses 101 are provided with inner holes extending through the entire bosses 101 along the height of the bosses 101, so that the bosses 101 form a hollow structure. The end plates 12 are inserted into the open ends of the corresponding side plates 11 by means of the bosses 101, respectively, to connect the end plates 12 and the side plates 11 together. In order to make the two connected hermetically, the joint of the end plate 12 and the side plate 11 is tightly fitted, or further sealed by welding.
As shown in fig. 3 and 4, when two or more branch passages 110 are provided in the side plate 11, the number of the bosses 101 at each edge portion of the end plate 12 is set to correspond to the number of the branch passages 110, so that each boss 101 is fitted into one branch passage 110.
In other embodiments, the end plate 12 may be a flat cylindrical structure with opposite ends open, with the end plate 12 being vertically disposed with the open ends compared to the side plate 11 being placed with the open ends horizontally oriented. The open end of the end plate 12 may further be closed by a structural fit such as a cap.
Further, as shown in fig. 1 and 2, the three-dimensional liquid-cooled heat sink of the present invention further includes a first connector 20 for receiving the cooling liquid, and a second connector 30 for discharging the cooling liquid.
The first joint 20 and the second joint 30 may be connected to one side plate 10, and the first joint 20 and the second joint 30 communicate with the flow passage 100 of the side plate 10; as shown in fig. 2, the first and second connectors 20 and 30 are attached to one end plate 12. In the embodiment shown in fig. 2, for the arrangement on one end plate 12, a flow channel partition plate 13 is further preferably arranged in the end plate 12 to divide the flow channel 100 in the end plate 12 into a liquid inlet flow channel 121 and a liquid outlet flow channel 122, wherein the liquid inlet flow channel 121 is communicated with the first joint 20, and the liquid outlet flow channel 122 is communicated with the second joint 30. The coolant enters the inlet flow channel 121 from the first joint 20, flows through the flow channel 100 of the side plate 11, the flow channel 100 of the other end plate 12 and the flow channel 100 of the other side plate 11 which are adjacently connected in sequence, finally enters the outlet flow channel 122, and is discharged from the second joint 30, and the flow direction of the coolant is shown by arrows in fig. 2.
In other embodiments, the first joint 20 and the second joint 30 may be respectively connected to the two side plates 10; the two side plates 10 may be a side plate 11 and an end plate 12 which are adjacently connected, or may be two opposite side plates 11 or two opposite end plates 12.
Referring to fig. 1, the three-dimensional liquid-cooled heat dissipating apparatus of the present invention may further include a base plate 40, as needed. The bottom plate 40 can be used as a supporting structure, and the plurality of side plates 10 are enclosed on the side edge of the bottom plate 40 to form a box type heat dissipation device with the bottom plate 40; the receiving cavity 200 is formed between the bottom plate 40 and the plurality of side plates 10.
In addition, the bottom plate 40 may also be used to position the heat generating device, and the heat generating device may be positioned in the accommodating cavity 200 by being fixed on the bottom plate 40 when being placed in the accommodating cavity 200. The accommodating cavity 200 can be divided into two or more chambers by a partition plate, so that the heating devices can be conveniently separated and placed.
The bottom plate 40 may be disposed corresponding to a structure formed by the plurality of side plates 10. For example, when the plurality of side plates 10 are formed by two side plates 11 and two end plates 12 and are connected to form a square structure, the bottom plate 40 is a rectangular plate, and the side plates 11 and the end plates 12 are connected to the sides of the bottom plate 40.
When the three-dimensional liquid cooling heat dissipation device is manufactured, the side plates 10 and the bottom plate 40 can be formed by processing aluminum profiles. The connection between the side plates 10 and the bottom plate 40 may be achieved by brazing.
When the three-dimensional liquid-cooling heat dissipation device is used, the heating device is arranged in the accommodating cavity 200 between the side plates 10. Let in the coolant liquid in toward curb plate 10 through first joint 20, the coolant liquid flows through a plurality of curb plates 10 in proper order, realizes that the multiaspect dispels the heat to the device that generates heat simultaneously to realize three-dimensional heat dissipation.
The coolant liquid that rises after absorbing heat can be discharged from second joint 30, combines the feed liquor of first joint 20, and the coolant liquid can be constantly circulate in curb plate 10, and the heat dissipation lasts.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A three-dimensional liquid cooling heat dissipation device is characterized by comprising a plurality of side plates, wherein the side plates are connected in a surrounding manner to define an accommodating cavity which is positioned between the side plates and is used for accommodating a heating device;
the inner part of each side plate is hollow to form a flow channel in which cooling liquid flows, and the flow channels in the side plates are communicated.
2. The three-dimensional liquid-cooled heat sink of claim 1, further comprising a first connector for receiving a cooling fluid, a second connector for discharging the cooling fluid;
the first joint and the second joint are connected to at least one side plate, and the first joint and the second joint are communicated with a flow passage of the side plate.
3. The three-dimensional liquid-cooled heat sink according to claim 1, wherein at least one boss is formed on the abutting surface of one of the two adjacent side plates, the boss is tightly fitted in the abutting surface of the other side plate, and the boss is hollow and communicates with the flow channels of the two side plates.
4. The three-dimensional liquid-cooled heat sink of claim 1, wherein the two side plates are joined together by welding with the two side plates being engaged with each other by a slanted engagement surface.
5. The three-dimensional liquid-cooled heat sink of any one of claims 1-4, further comprising a base plate; the side plates are encircled on the side edge of the bottom plate.
6. The three-dimensional liquid-cooled heat sink of any one of claims 1-4, wherein the plurality of side plates comprises two oppositely disposed side plates, two oppositely disposed end plates;
one end plate is connected between one end face of each of the two side plates, and the other end plate is connected between the other end face of each of the two side plates.
7. The three-dimensional liquid-cooled heat sink of claim 6, wherein the side plates have at least one partition extending along the length thereof; the flow channel in the side plate is divided into at least two sub-flow channels by the partition plate; each branch runner is communicated with the runner in the adjacent end plate.
8. The three-dimensional liquid-cooled heat sink of claim 6, wherein the side plates are flat tubular structures with opposite open ends, and the open ends of the side plates are respectively abutted to the two end plates.
9. The three-dimensional liquid-cooled heat sink of claim 8, wherein the end plates are flat tubular structures and are disposed across and connected between the open ends of the two side plates;
the surface of the end plate facing the side plate is provided with a through hole or a boss matched with the open end of the side plate, and the through hole or the boss is communicated with the flow channel of the side plate and the flow channel of the end plate.
10. The three-dimensional liquid-cooled heat sink of claim 6, further comprising a base plate; the side edge plates and the end plates are connected on the side edges of the bottom plate in a surrounding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111477610.7A CN114340317A (en) | 2021-12-06 | 2021-12-06 | Three-dimensional liquid cooling heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111477610.7A CN114340317A (en) | 2021-12-06 | 2021-12-06 | Three-dimensional liquid cooling heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114340317A true CN114340317A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111477610.7A Pending CN114340317A (en) | 2021-12-06 | 2021-12-06 | Three-dimensional liquid cooling heat abstractor |
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| Country | Link |
|---|---|
| CN (1) | CN114340317A (en) |
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2021
- 2021-12-06 CN CN202111477610.7A patent/CN114340317A/en active Pending
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