CN211879372U - Radiator and power module with same - Google Patents

Abstract

The application discloses a radiator and a power module with the radiator, wherein the radiator comprises a shell and a radiating assembly, a water tank is concavely arranged on the shell and comprises a first side wall and a second side wall which are opposite, a water inlet and a water outlet are respectively arranged on the first side wall and the second side wall, and the radiating assembly is accommodated in the water tank; still be equipped with at least one piece that flow equalizes in the basin, water inlet and at least one piece that flow equalizes set gradually along the first direction. The application provides a radiator and have its power module is through being equipped with water inlet and delivery port on basin first side wall and second lateral wall respectively, be equipped with radiator unit and at least one piece that flow equalizes in the basin, and water inlet and at least one piece that flow equalizes set gradually along the first direction, realize improving the purpose of the heat dissipation homogeneity of coolant liquid in order to increase the radiator in radiator unit's homogeneity, and then improve power module's whole ability to flow over and the stability and the reliability that power module used.

Description

Radiator and power module with same

Technical Field

The utility model relates to a semiconductor device technical field, concretely relates to power module technical field especially relates to radiator and have its power module.

Background

The recent trend of power modules is toward high power density in the direction of electrical performance, toward miniaturization in the direction of volume, and toward weight reduction in the direction of weight, based on the demand for the development of semiconductor device technology. In order to keep the power module small and light on the premise of high power density, a radiator in the power module has good heat dissipation balance performance.

The bottom plate of the existing power module is provided with a heat dissipation column array, a water channel is arranged in a radiator of the power module, and the heat dissipation column array is inserted into the water channel. The radiator injects cooling water flowing through the radiating column array along the linear direction into the water channel to reduce the temperature of the radiating column, and further achieves the purpose of radiating the power module. However, the flow velocity distribution of the cooling water in the heat dissipation column array is not uniform, so that the heat dissipation balance performance of the power module is low, and the overall overcurrent capacity of the power module and the stability and reliability of the module application are affected.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks and deficiencies in the prior art, it is desirable to provide a heat sink and a power module having the same.

In a first aspect, the present application provides a heat sink, including a housing and a heat dissipation assembly, wherein a water tank is concavely disposed on the housing, the water tank includes a first side wall and a second side wall which are opposite to each other, a water inlet and a water outlet are respectively disposed on the first side wall and the second side wall, and the heat dissipation assembly is accommodated in the water tank;

still be equipped with at least one piece that flow equalizes in the basin, water inlet and at least one piece that flow equalizes set gradually along the first direction.

Further, when the flow equalizing piece has a plurality ofly, a plurality of flow equalizing piece are along first direction interval setting, and a plurality of flow equalizing piece reduce in the first direction volume gradually.

Furthermore, the water inlet and the water outlet are arranged diagonally.

Furthermore, the flow equalizing piece is of a square column structure.

Further, the flow equalizing piece is arranged on the bottom surface of the water tank.

Furthermore, the water tank comprises a third side wall and a fourth side wall which are opposite, the first side wall, the second side wall and the fourth side wall jointly enclose an accommodating space of the water tank, and the heat dissipation assembly is positioned in the accommodating space;

a first gap is arranged between the flow equalizing piece and the third side wall.

Further, the heat dissipation assembly comprises a back plate and a plurality of heat dissipation fins fixed on the back plate, wherein second gaps exist among the heat dissipation fins to form the flow guide channels.

Furthermore, a plurality of partition plates are arranged on the back plate at intervals so as to divide the plurality of radiating fins into a plurality of radiating fin modules.

Furthermore, the shell, the flow equalizing piece and the heat dissipation assembly are of an integrally formed structure.

In a second aspect, the present application further provides a power module, which includes a substrate and the heat sink, wherein the housing is fixedly connected to the substrate, the substrate covers the opening of the water tank, and one end of the heat sink close to the substrate contacts the substrate.

Further, the shell and the substrate are hermetically welded.

The application provides a radiator and have its power module, through be equipped with water inlet and delivery port on basin first side wall and second lateral wall respectively, be equipped with radiator unit and at least one piece that flow equalizes in the basin, and water inlet and at least one piece that flow equalizes set gradually along the first direction, make the coolant liquid through the piece that flow equalizes reduce along the flow difference of first direction, the realization improves the purpose of the heat dissipation homogeneity of coolant liquid homogeneous flow nature in order to increase the radiator in radiator unit, and then improve power module's whole ability to flow over and the stability and the reliability that power module used.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic top view of a heat sink according to an embodiment of the present disclosure.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

The power module comprises a substrate, a chip, a radiator and the like. The chip and the radiator are connected to the substrate, and the chip and the radiator are located on two sides of the substrate. The substrate can conduct heat generated by the chip and other structures to the heat radiator and is cooled by the heat radiator. The radiator generally performs a cooling operation by a coolant. Among these, in general, a radiator is often injected with a coolant by an injection device such as an injection pump. The cooling fluid is, for example, but not limited to, cooling water, cooling oil, and the like. It should be understood that the applicable objects of the heat sink are not limited to the power module, and may be applied to other electronic or mechanical devices requiring heat dissipation.

Referring to fig. 1, the present application provides a heat sink, including a housing 100 and a heat dissipation assembly 200, wherein a water tank 110 is recessed in the housing 100, the water tank 110 includes a first side wall 111 and a second side wall 112 opposite to each other, the first side wall 111 and the second side wall 112 are respectively provided with a water inlet 113 and a water outlet 114, and the heat dissipation assembly 200 is accommodated in the water tank 110;

the water tank 110 is further provided with at least one flow equalizing member 300, and the water inlet 113 and the at least one flow equalizing member 300 are sequentially arranged along a first direction.

In this embodiment, the water inlet 113 and the water outlet 114 are located at two sides of the heat dissipation assembly 200, so that the cooling liquid injected into the water tank 110 from the water inlet 113 is discharged from the water outlet 114 after passing through the heat dissipation assembly 200, thereby increasing the contact area between the cooling liquid and the heat dissipation assembly 200 and further increasing the heat dissipation performance of the heat sink.

The water tank 110 is further provided with at least one flow equalizing member 300, and the water inlet 113 and the at least one flow equalizing member 300 are sequentially arranged along a first direction, so that the cooling liquid injected into the water tank 110 from the water inlet 113 can pass through the flow equalizing member 300 when flowing along the first direction. A third gap 115 is formed between the flow equalizing member 300 and the heat dissipating assembly 200 for the cooling fluid to flow therebetween. Since the flow equalizers 300 have a certain water resistance, the flow rate of the cooling fluid is increased when passing through the flow equalizers 300 to compensate for the loss of the flow rate when the cooling fluid flows in the water tank 110, so that the flow rate difference of the cooling fluid passing through the flow equalizers 300 in the first direction is reduced. When the flow speed difference of the cooling liquid along the first direction is reduced, the cooling liquid can flow into the heat dissipation assembly 200 at a relatively similar flow speed when flowing along the first direction, so that the flow uniformity of the cooling liquid in the heat dissipation assembly 200 is improved, and further the heat dissipation uniformity of the heat sink is improved.

The first direction may be a length direction or a width direction of the water tank 110. Based on the radiator structure shown in fig. 1, the first direction is the length direction of the water tank 110, and is indicated by an arrow a.

It should be understood that a plurality of flow guide channels are formed in the heat dissipation assembly 200, and the flow guide channels have a small channel width and a certain water resistance. Since the guide channel has a certain water resistance, the cooling fluid injected from the inlet 113 flows in a first direction and then flows into the guide channel.

In some embodiments, when there are a plurality of flow equalizers 300, the plurality of flow equalizers 300 are spaced along the first direction, and the volume of the plurality of flow equalizers 300 is gradually reduced along the first direction.

In this embodiment, a plurality of flow equalizers 300 are disposed in the water tank 110, the flow equalizers 300 are spaced along the first direction, and the flow equalizers 300 and the water inlet 113 are located on the same side of the heat dissipation assembly 200, so that the cooling liquid injected from the water inlet 113 sequentially passes through each flow equalize 300 when flowing along the first direction. The volume of the plurality of flow equalizing members 300 in the first direction is gradually reduced, that is, the water resistance of the plurality of flow equalizing members 300 to the coolant in the first direction is gradually reduced, so that the flow speed difference of the coolant flowing through the plurality of flow equalizing members 300 in the first direction is further reduced, the flow equalizing performance of the coolant in the heat dissipation assembly 200 is further improved, and the heat dissipation uniformity of the heat sink is further improved.

The embodiments in which the volume of the plurality of flow equalizers 300 gradually decreases in the first direction include, but are not limited to: the maximum cross-sectional area of the plurality of flow equalizers 300 in the direction perpendicular to the first direction is gradually reduced along the first direction.

In some embodiments, the water inlet 113 and the water outlet 114 are diagonally disposed. So set up, not only can be convenient for the structural design in the aspect of the business turn over water route of radiator, can also make the coolant liquid can dispel the heat to radiator unit 200 to the at utmost, further improve the radiator radiating effect. Of course, in other embodiments, the water outlet 114 may be disposed at other positions of the second sidewall 112 as long as the cooling liquid flowing out of the heat sink assembly 200 can be discharged out of the water tank 110. For example, the water outlet 114 may also be provided on the middle of the second sidewall 112 or the end near the water inlet 113.

In some embodiments, the flow equalizers 300 are square pillar structures.

In the present embodiment, the flow equalizing member 300 is a square column, i.e. a flow equalizing column. The circumferential side surfaces of the flow equalizing columns are planar, and the included angle between the two adjacent side surfaces is a right angle, so that the volume of the flow equalizing piece 300 is relatively small under the condition of required water resistance, and the material and the weight of the flow equalizing piece 300 are reduced. Simultaneously, the column design that flow equalizes is simple, the processing production of being convenient for. Of course, in other embodiments, the flow equalization member 300 may have a cylindrical structure, such as a cylindrical column, a prismatic column, or an irregular three-dimensional structure.

In some embodiments, the flow straightener 300 is disposed on the bottom surface of the basin 110. With such an arrangement, the operation difficulty of forming the flow equalizing member 300 in the water tank 110 can be reduced, and the processing difficulty of the radiator can be further reduced. Of course, in other embodiments, the flow straightener 300 may also be located on the circumferential side wall of the trough 110.

In some embodiments, the water tank 110 includes a third side wall 116 and a fourth side wall 117 opposite to each other, the first to fourth side walls 117 together enclose a receiving space of the water tank 110, and the heat dissipation assembly 200 is located in the receiving space;

a first gap 118 is provided between the flow straightener 300 and the third sidewall 116.

In the present embodiment, the circumferential side wall of the water tank 110 includes first to fourth side walls 117, wherein the first to fourth side walls 117 together enclose an accommodating space of the water tank 110, and the heat sink assembly 200 is located in the accommodating space. The first gap 118 is formed between the flow equalizing member 300 and the third sidewall 116, so that the flow equalizing member 300 has a flow dividing effect on the coolant injected from the water inlet 113, the flow speed difference of the coolant in the first direction is further reduced, and the flow equalization of the coolant in the heat dissipating assembly 200 is further improved.

In some embodiments, a fourth gap 119 is provided between the heat sink and the second sidewall 112, and the fourth gap 119 is disposed in communication with the flow guide in the heat sink assembly 200. The fourth gap 119 may be used to collect and uniformly flow the cooling fluid flowing from the heat sink assembly 200 to the water outlet 114. By arranging the fourth gap 119, the structural design of the radiator can be optimized to reduce the number of coolant outlets, and the coolant in the fourth gap 119 can still contact with the heat dissipation assembly 200 to continue heat dissipation in the process of flowing to the water outlet 114, thereby further improving the heat dissipation effect of the radiator.

In some embodiments, the heat dissipation assembly 200 includes a backplate and a plurality of fins 210 secured to the backplate, with a second gap between the fins 210 to form a flow leader.

In the present embodiment, a second gap is formed between two adjacent heat dissipation fins 210, and the second gap is a flow guide in the heat dissipation assembly 200. The heat dissipation assembly 200 has a plurality of flow guiding channels along a first direction, and each flow guiding channel is respectively communicated with the water inlet 113 and the water outlet 114 for allowing the cooling fluid to flow through the heat dissipation assembly 200.

The back plate is located on a side of the heat sink 210 away from the bottom wall of the water tank 110, and is not only used for supporting and fixing a plurality of heat sinks 210, but also used for conducting heat required by the heat sink to the heat sink 210.

The back plate and the heat sink 210 may be made of metal, and have better heat dissipation performance. The metal material may be, for example, but not limited to, copper or aluminum.

Of course, in other embodiments, the heat dissipation assembly 200 is not limited to the fin heat dissipation assembly, and may also be a pin fin heat dissipation assembly, for example.

In some embodiments, a plurality of partition plates 220 are spaced apart on the back plate to separate the plurality of fins 210 into a plurality of fin 210 modules. Due to the arrangement, the cooling liquid cannot circulate between the two adjacent radiating fin 210 modules, the flow path of the cooling liquid in the radiating assembly 200 is shortened, and the radiating uniformity of the radiating assembly 200 is further improved.

In some embodiments, the housing 100, the flow equalizers 300, and the heat dissipation assembly 200 are an integral structure. By the arrangement, the heat resistance of the radiator can be reduced, so that the radiating effect is better, and the radiator can have higher structural strength.

The present application further provides a power module, which includes a substrate and the heat sink, the housing 100 is fixedly connected to the substrate, the substrate covers the opening of the water tank 110, and one end of the heat sink assembly 200 close to the substrate contacts the substrate.

In the present embodiment, the housing 100 is fixedly connected to a side of the substrate away from the chip. The opening of the water tank 110 is disposed toward the substrate and the substrate covers the opening of the water tank 110, so as to prevent the cooling liquid from leaking between the substrate and the housing 100 and affecting the heat dissipation performance of the heat sink. One end of the heat sink assembly 200 near the substrate is in contact with the substrate to conduct heat from the substrate to itself and is cooled by the cooling fluid.

The power module provided by the embodiment is provided with the radiator, so that the overall heat radiation performance of the power module is improved, and the overall overcurrent capacity of the power module and the stability and reliability of the application of the power module are further improved.

In some embodiments, the housing 100 and the substrate are hermetically welded, so that the weld joint formed between the housing 100 and the substrate has better sealability, thereby improving the sealing performance between the heat sink and the substrate. In addition, after the housing 100 and the substrate are welded together by sealing, the overall structural strength of the substrate is increased, and the thickness of the substrate can be reduced to reduce thermal resistance in heat conduction, thereby further improving heat dissipation efficiency. The seal welding method is not limited to a laser welding method.

It will be understood that any reference herein to the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as indicating or relating to the orientation or positional relationship illustrated in the drawings, is intended merely to facilitate the description of the invention and to simplify the description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered as limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means three or more unless otherwise specified.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (11)

1. A radiator is characterized by comprising a shell and a radiating assembly, wherein a water tank is concavely arranged on the shell and comprises a first side wall and a second side wall which are opposite, a water inlet and a water outlet are respectively arranged on the first side wall and the second side wall, and the radiating assembly is accommodated in the water tank;

the water tank is also internally provided with at least one flow equalizing piece, and the water inlet and the at least one flow equalizing piece are sequentially arranged along a first direction.

2. The heat sink according to claim 1, wherein when there are a plurality of the flow equalizers, the flow equalizers are spaced along a first direction, and the volume of the flow equalizers decreases gradually in the first direction.

3. The heat sink of claim 1, wherein the water inlet and the water outlet are diagonally disposed.

4. The heat sink as claimed in claim 1, wherein the flow equalizing member is a square column structure.

5. The heat sink as claimed in claim 1, wherein the flow equalizing member is disposed on a bottom surface of the water tank.

6. The heat sink as recited in claim 1, wherein the water tank includes third and fourth opposing side walls, the first through fourth side walls collectively enclosing a receiving space of the water tank in which the heat dissipation assembly is located;

a first gap is arranged between the flow equalizing piece and the third side wall.

7. The heat sink as claimed in claim 1, wherein the heat dissipating assembly comprises a back plate and a plurality of fins fixed to the back plate, the fins having a second gap therebetween to form a flow guide.

8. The heat sink of claim 7, wherein the back plate has a plurality of partitions spaced thereon to separate the plurality of fins into a plurality of fin modules.

9. The heat sink of claim 1, wherein the housing, the flow equalizers, and the heat sink assembly are an integrally formed structure.

10. A power module comprising a base plate and the heat sink of any of claims 1-9, wherein the housing is fixedly attached to the base plate and the base plate covers the opening of the water channel, and wherein the end of the heat sink member adjacent to the base plate contacts the base plate.

11. The power module of claim 10, wherein the housing and the substrate are hermetically welded.

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