CN114189987A - PCB and manufacturing method thereof - Google Patents
PCB and manufacturing method thereof Download PDFInfo
- Publication number
- CN114189987A CN114189987A CN202111528994.0A CN202111528994A CN114189987A CN 114189987 A CN114189987 A CN 114189987A CN 202111528994 A CN202111528994 A CN 202111528994A CN 114189987 A CN114189987 A CN 114189987A
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- Prior art keywords
- metal pattern
- layer metal
- manufacturing
- pattern
- assembly
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 95
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 238000013461 design Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a PCB and a manufacturing method thereof, wherein the PCB comprises: manufacturing a mother board with at least one inner layer metal pattern and manufacturing a pattern assembly with an outer layer metal pattern; the motherboard comprises a top wall, a bottom wall and a side wall arranged between the top wall and the bottom wall in a surrounding mode, and the inner-layer metal graph part is exposed out of the side wall; the graphic assembly is soldered to the exposed area of the inner metal pattern on the sidewall such that the outer metal pattern of the graphic assembly is electrically connected to the inner metal pattern of the motherboard. The PCB provided by the invention utilizes the space of the side wall of the motherboard, arranges the graphic assembly with the outer layer metal graph on the side wall, and electrically connects the graphic assembly with the inner layer metal graph of the motherboard so as to realize the signal transmission function of the graphic assembly. The PCB effectively expands the limited space, enlarges the available space, and improves the wiring density or the element patch density, so that the PCB meets the development trend of miniaturization and high-density.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a PCB and a manufacturing method thereof.
Background
In the printed circuit board, the pads are mainly divided into pin pads and surface mount pads, the pin pads are provided with welding holes and mainly used for welding pin elements, and the surface mount pads are not provided with welding holes and are mainly used for surface mount elements. With the miniaturization of semiconductor design, the density of components on the corresponding PCB substrate is higher and higher, and the pad layout area on the surface of the conventional PCB is more and more tense, so how to increase the area of the PCB to meet the design requirements of miniaturization and high density of the terminal electronic product is a problem to be solved.
Disclosure of Invention
The invention aims to provide a PCB and a manufacturing method thereof, which aim to solve the problem that the wiring area on the surface of the existing PCB substrate is more and more tense.
In order to achieve the purpose, the invention adopts the following technical scheme:
a PCB, comprising: manufacturing a mother board with at least one inner layer metal pattern and manufacturing a pattern assembly with an outer layer metal pattern;
the motherboard comprises a top wall, a bottom wall and a side wall arranged between the top wall and the bottom wall in a surrounding mode, and the inner-layer metal graph part is exposed out of the side wall;
the graphic assembly is welded on the exposed area of the inner layer metal pattern on the side wall, so that the outer layer metal pattern of the graphic assembly is electrically connected with the inner layer metal pattern of the motherboard.
Optionally, the pattern assembly comprises a double-sided copper-clad plate provided with a signal via hole, the outer metal pattern is manufactured on one side surface of the double-sided copper-clad plate, a pad for welding with the side wall is manufactured on the other side surface of the double-sided copper-clad plate, and the outer metal pattern and the pad are electrically connected through the signal via hole.
Optionally, the outer metal pattern formed on the pattern assembly includes pads and/or lines.
Optionally, the number of the inner layer metal patterns is at least two, and the inner layer metal patterns are arranged on different inner layers of the motherboard; the number of the graphic assemblies is at least two, and each graphic assembly is electrically connected with one corresponding inner-layer metal pattern.
A method for manufacturing a PCB comprises the following steps:
providing a mother board with an inner layer metal pattern and a pattern assembly with an outer layer metal pattern; the motherboard comprises a top wall, a bottom wall and a side wall enclosed between the top wall and the bottom wall, and the inner metal pattern part is exposed out of the side wall;
and welding the graphic assembly on the exposed area of the inner metal pattern on the side wall, so that the outer metal pattern of the graphic assembly is electrically connected with the inner metal pattern of the motherboard.
Optionally, the providing of the graphic assembly manufactured with the outer metal graphic includes:
providing a double-sided copper-clad plate;
manufacturing the outer layer metal pattern on one side surface of the double-sided copper-clad plate, and manufacturing a bonding pad for welding with the motherboard on the other side surface;
and manufacturing a signal via hole on the double-sided copper-clad plate, so that the outer layer metal pattern is electrically connected with the bonding pad through the signal via hole to obtain the pattern assembly.
Optionally, the number of the inner layer metal patterns is at least two, and the inner layer metal patterns are arranged on different inner layers of the motherboard; the number of the graphic assemblies is at least two, and each graphic assembly is welded on the exposed area of the side wall corresponding to the inner layer metal pattern.
Optionally, the providing of the graphic assembly manufactured with the outer metal graphic includes:
providing a double-sided copper-clad plate;
manufacturing the outer layer metal patterns corresponding to the pattern components on the surface of one side of the double-sided copper-clad plate in a subarea mode, and manufacturing the bonding pads corresponding to the outer layer metal patterns on the surface of the other side of the double-sided copper-clad plate in a subarea mode, wherein the bonding pads are used for being welded with the motherboard;
manufacturing signal via holes in different areas on the double-sided copper-clad plate, so that each outer layer metal pattern is electrically connected with the corresponding bonding pad through the signal via hole;
and cutting the double-sided copper-clad plate according to regions to obtain at least two graphic assemblies.
Optionally, the outer metal pattern includes a pad and/or a line.
Compared with the prior art, the invention has the beneficial effects that:
the PCB provided by the embodiment of the invention utilizes the space of the side wall of the motherboard, arranges the graphic assembly with the outer layer metal graph on the side wall, and electrically connects the graphic assembly with the inner layer metal graph of the motherboard to realize the signal transmission function of the graphic assembly. The PCB effectively expands the limited space, enlarges the available space of the PCB, and improves the wiring density or the element patch density, so that the PCB meets the development trend that electronic products are increasingly miniaturized and highly-densified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a PCB according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention.
Illustration of the drawings: the circuit board comprises a mother board 1, a top wall 11, a bottom wall 12, side walls 13, a graphic assembly 2, a double-sided copper-clad plate 21, an outer layer metal graphic 22 and a signal via hole 23.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a PCB, including: making a mother board 1 with at least one inner layer metal pattern and making a pattern assembly 2 with an outer layer metal pattern 22;
the motherboard 1 comprises a top wall 11, a bottom wall 12 and a side wall 13 enclosed between the top wall 11 and the bottom wall 12, and the inner layer metal pattern part is exposed on the side wall 13;
the graphic assembly 2 is soldered to the exposed area of the inner metal pattern on the sidewall 13 so that the outer metal pattern 22 of the graphic assembly 2 is electrically connected to the inner metal pattern of the mother board 1.
Unlike the conventional PCB in which metal patterns are disposed only on the surface (including the top wall 11 and the bottom wall 12), the PCB according to the embodiment of the present invention utilizes the space of the side wall 13 of the motherboard 1, disposes the graphic assembly 2 fabricated with the outer metal pattern 22 on the side wall 13, and electrically connects the graphic assembly 2 with the inner metal pattern of the motherboard 1 to realize the signal transmission function of the graphic assembly 2. The PCB effectively expands the limited space, enlarges the available space of the PCB, and improves the wiring density or the element patch density, so that the PCB meets the development trend that electronic products are increasingly miniaturized and highly-densified.
In an optional embodiment, the graphic assembly 2 includes a double-sided copper-clad plate 21 provided with a signal via 23, an outer metal graphic 22 is formed on one side surface of the double-sided copper-clad plate 21, a pad for welding with the side wall 13 is formed on the other side surface of the double-sided copper-clad plate 21, and the outer metal graphic 22 and the pad are electrically connected through the signal via 23. In the embodiment, the graphic assembly 2 is formed by completing graphic manufacturing by using a commonly used double-sided copper-clad plate 21 in the field, and is simple and efficient.
The outer metal pattern 22 formed on the pattern assembly 2 may include pads and/or traces, which is not limited in this respect and may be designed according to actual requirements.
In this embodiment, the number of the inner metal patterns to be electrically connected to the pattern assembly 2 may be one or at least two. When the number is more than one, the inner layer metal patterns can be arranged on different inner layers of the motherboard 1 and exposed at different layer positions on the side wall 13; or may be disposed in the same interior layer and exposed at different locations of the same layer on the sidewall 13.
Accordingly, the number of the graphic assemblies 2 may be at least two, and each graphic assembly 2 is electrically connected to a corresponding one of the inner metal patterns.
Referring to fig. 2, an embodiment of the present invention further provides a method for manufacturing the PCB, including the steps of:
The motherboard 1 includes a top wall 11, a bottom wall 12 and a side wall 13 enclosed between the top wall 11 and the bottom wall 12, and the inner metal pattern is partially exposed on the side wall 13.
It should be noted that the mother board 1 may be formed by laminating a plurality of core boards according to a conventional process.
According to the method, the motherboard 1 and the graphic assembly 2 are manufactured separately, and then the graphic assembly 2 is welded on the side wall 13 of the motherboard 1, so that the surface space of the motherboard 1 is effectively expanded, the wiring density or the element patch density can be greatly improved, and the manufacturing method is simple and efficient.
When the number of graphic assemblies 2 is only one, the following individual manufacturing method may be employed: providing a double-sided copper-clad plate 21; manufacturing an outer layer metal pattern 22 on one side surface of a double-sided copper-clad plate 21, and manufacturing a bonding pad for welding with a mother plate 1 on the other side surface; and manufacturing a signal via hole 23 on the double-sided copper-clad plate 21, so that the outer layer metal pattern 22 and the bonding pad are electrically connected through the signal via hole 23, and obtaining the pattern component 2.
When the number of the graphic assemblies 2 is at least two, the above-described individual production method may be adopted, or the following collective production method may be adopted: providing a double-sided copper-clad plate 21; manufacturing outer layer metal patterns 22 corresponding to the pattern components 2 on the surface of one side of the double-sided copper-clad plate 21 in a subarea mode, manufacturing bonding pads corresponding to the outer layer metal patterns 22 on the surface of the other side in a subarea mode, and welding the bonding pads with the motherboard 1; manufacturing signal via holes 23 on the double-sided copper-clad plate 21 in different areas, so that each outer layer metal pattern 22 is electrically connected with the corresponding bonding pad through the signal via hole 23; and cutting the double-sided copper-clad plate 21 according to the area to obtain at least two graphic assemblies 2.
The method adopts the mode of uniformly manufacturing a plurality of graphic assemblies 2 on the same double-sided copper-clad plate 21 and then dividing each graphic assembly 2 into independent assemblies, thereby effectively improving the processing efficiency.
In another possible embodiment, if the graphic assemblies 2 are integrally formed completely according to the welding positions on the side wall 13, the graphic assemblies 2 may be integrally welded to the side wall 13 without being divided.
In addition, the outer layer metal pattern 22 on each pattern assembly 2 may include pads and/or traces, wherein the pads may be used for soldering components to increase the density of the arrangement of the components.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A PCB, comprising: manufacturing a mother board with at least one inner layer metal pattern and manufacturing a pattern assembly with an outer layer metal pattern;
the motherboard comprises a top wall, a bottom wall and a side wall arranged between the top wall and the bottom wall in a surrounding mode, and the inner-layer metal graph part is exposed out of the side wall;
the graphic assembly is welded on the exposed area of the inner layer metal pattern on the side wall, so that the outer layer metal pattern of the graphic assembly is electrically connected with the inner layer metal pattern of the motherboard.
2. The PCB of claim 1, wherein the pattern assembly comprises a double-sided copper-clad plate provided with signal via holes, the outer metal pattern is manufactured on one side surface of the double-sided copper-clad plate, a bonding pad for welding with the side wall is manufactured on the other side surface of the double-sided copper-clad plate, and the outer metal pattern and the bonding pad are electrically connected through the signal via holes.
3. The PCB of claim 1, wherein the outer metal pattern fabricated on the pattern assembly comprises pads and/or traces.
4. The PCB of claim 1, wherein the number of the inner layer metal patterns is at least two, arranged at different inner layers of the motherboard; the number of the graphic assemblies is at least two, and each graphic assembly is electrically connected with one corresponding inner-layer metal pattern.
5. A method for manufacturing a PCB is characterized by comprising the following steps:
providing a mother board with an inner layer metal pattern and a pattern assembly with an outer layer metal pattern; the motherboard comprises a top wall, a bottom wall and a side wall enclosed between the top wall and the bottom wall, and the inner metal pattern part is exposed out of the side wall;
and welding the graphic assembly on the exposed area of the inner metal pattern on the side wall, so that the outer metal pattern of the graphic assembly is electrically connected with the inner metal pattern of the motherboard.
6. The method of claim 5, wherein the providing of the graphic assembly with the outer metal pattern comprises:
providing a double-sided copper-clad plate;
manufacturing the outer layer metal pattern on one side surface of the double-sided copper-clad plate, and manufacturing a bonding pad for welding with the motherboard on the other side surface;
and manufacturing a signal via hole on the double-sided copper-clad plate, so that the outer layer metal pattern is electrically connected with the bonding pad through the signal via hole to obtain the pattern assembly.
7. The method of manufacturing a PCB of claim 5, wherein the number of the inner layer metal patterns is at least two, and the inner layer metal patterns are arranged on different inner layers of the motherboard; the number of the graphic assemblies is at least two, and each graphic assembly is welded on the exposed area of the side wall corresponding to the inner layer metal pattern.
8. The method of claim 7, wherein the providing of the graphic assembly with the outer metal pattern comprises:
providing a double-sided copper-clad plate;
manufacturing the outer layer metal patterns corresponding to the pattern components on the surface of one side of the double-sided copper-clad plate in a subarea mode, and manufacturing the bonding pads corresponding to the outer layer metal patterns on the surface of the other side of the double-sided copper-clad plate in a subarea mode, wherein the bonding pads are used for being welded with the motherboard;
manufacturing signal via holes in different areas on the double-sided copper-clad plate, so that each outer layer metal pattern is electrically connected with the corresponding bonding pad through the signal via hole;
and cutting the double-sided copper-clad plate according to regions to obtain at least two graphic assemblies.
9. The method of claim 5, wherein the outer metal pattern comprises pads and/or traces.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111528994.0A CN114189987A (en) | 2021-12-14 | 2021-12-14 | PCB and manufacturing method thereof |
| PCT/CN2022/099072 WO2023109048A1 (en) | 2021-12-14 | 2022-06-16 | Pcb and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111528994.0A CN114189987A (en) | 2021-12-14 | 2021-12-14 | PCB and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114189987A true CN114189987A (en) | 2022-03-15 |
Family
ID=80543812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111528994.0A Pending CN114189987A (en) | 2021-12-14 | 2021-12-14 | PCB and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114189987A (en) |
| WO (1) | WO2023109048A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109048A1 (en) * | 2021-12-14 | 2023-06-22 | 生益电子股份有限公司 | Pcb and manufacturing method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090236139A1 (en) * | 2008-03-19 | 2009-09-24 | Harris Corporation | Printed wiring board assembly and related methods |
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| CN208285640U (en) * | 2018-04-25 | 2018-12-25 | 维沃移动通信有限公司 | A kind of signal transmssion line line structure and mobile terminal |
| US20190141830A1 (en) * | 2017-11-09 | 2019-05-09 | International Business Machines Corporation | Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5657537A (en) * | 1995-05-30 | 1997-08-19 | General Electric Company | Method for fabricating a stack of two dimensional circuit modules |
| CN107994011B (en) * | 2016-10-26 | 2020-06-02 | 晟碟信息科技（上海）有限公司 | Semiconductor package and method of manufacturing the same |
| JP2018198249A (en) * | 2017-05-23 | 2018-12-13 | 日本特殊陶業株式会社 | Wiring board |
| CN113543485A (en) * | 2021-06-29 | 2021-10-22 | 生益电子股份有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN114189987A (en) * | 2021-12-14 | 2022-03-15 | 生益电子股份有限公司 | PCB and manufacturing method thereof |
-
2021
- 2021-12-14 CN CN202111528994.0A patent/CN114189987A/en active Pending
-
2022
- 2022-06-16 WO PCT/CN2022/099072 patent/WO2023109048A1/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090236139A1 (en) * | 2008-03-19 | 2009-09-24 | Harris Corporation | Printed wiring board assembly and related methods |
| CN106132082A (en) * | 2016-07-26 | 2016-11-16 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board of side paster and preparation method thereof |
| US20190141830A1 (en) * | 2017-11-09 | 2019-05-09 | International Business Machines Corporation | Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly |
| CN208285640U (en) * | 2018-04-25 | 2018-12-25 | 维沃移动通信有限公司 | A kind of signal transmssion line line structure and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109048A1 (en) * | 2021-12-14 | 2023-06-22 | 生益电子股份有限公司 | Pcb and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023109048A1 (en) | 2023-06-22 |
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Application publication date: 20220315 |
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| RJ01 | Rejection of invention patent application after publication |