CN114158239A - Vehicle-mounted power amplifier with heat radiation structure - Google Patents
Vehicle-mounted power amplifier with heat radiation structure Download PDFInfo
- Publication number
- CN114158239A CN114158239A CN202111551592.2A CN202111551592A CN114158239A CN 114158239 A CN114158239 A CN 114158239A CN 202111551592 A CN202111551592 A CN 202111551592A CN 114158239 A CN114158239 A CN 114158239A
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- China
- Prior art keywords
- heat dissipation
- vehicle
- mounted power
- power amplifier
- shell
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- 230000005855 radiation Effects 0.000 title claims description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 78
- 238000009423 ventilation Methods 0.000 claims description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 16
- 238000009825 accumulation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a vehicle-mounted power amplifier with a heat dissipation structure, which relates to the technical field of vehicle-mounted power amplifiers and comprises the following components: the heat dissipation device comprises a heat dissipation shell, a heat dissipation plate and a heat dissipation cover, wherein a plurality of heat dissipation fins are arranged on the outer wall of the heat dissipation shell, a plurality of vent holes are formed in the side wall of the heat dissipation shell, and an opening is formed in one side of the heat dissipation shell; the bottom plate can be detachably connected to the opening, an accommodating cavity is formed between the bottom plate and the radiating shell, and the vent hole is communicated with the accommodating cavity; the base plate, the base plate is a plurality of, and the base plate is fixed in the holding intracavity. The side wall of the heat dissipation shell is provided with the vent hole, so that accumulated heat in the heat dissipation shell can be dissipated.
Description
Technical Field
The invention relates to the technical field of vehicle-mounted power amplifiers, in particular to a vehicle-mounted power amplifier with a heat dissipation structure.
Background
In recent years, due to the miniaturization trend of vehicle-mounted power amplifiers, the internal substrate of a product is designed into a double-layer (multilayer) structure in many cases, so that the heat accumulation of the intermediate layer substrate is serious, and the high temperature seriously affects the function of the product.
In order to reduce the temperature of the vehicle-mounted power amplifier, the existing heat dissipation is mostly as follows:
1. increasing the mass of the housing fins.
The purpose is as follows: the overall temperature rise speed of the product is slowed down.
The disadvantages are as follows: the cost is increased, the overall dimension of the product is increased, and the problem of heat accumulation of the intermediate substrate cannot be effectively improved due to the obstruction of the multilayer substrate.
2. The surface area of the radiating fins of the shell is increased.
The purpose is as follows: the heat conduction efficiency of the whole product and the ambient cold air is increased.
The disadvantages are as follows: the cost is increased, the height and the size of the product are increased, and the problem of heat accumulation of the intermediate substrate cannot be effectively improved due to the obstruction of the multilayer substrate.
3. A heat radiation fan is added outside the product.
The purpose is as follows: the heat convection efficiency of the whole product and the ambient cold air is increased.
The disadvantages are as follows: the cost is greatly increased, and the problem of heat accumulation of the intermediate substrate cannot be effectively improved due to the obstruction of the multilayer substrate.
4. And adding heat dissipation holes at the bottom of the product.
The purpose is as follows: the heat convection efficiency of the hot air at the bottom of the product and the cold air at the periphery is increased.
The disadvantages are as follows: due to the obstruction of the multilayer substrate, the problem of heat accumulation of the intermediate substrate cannot be effectively improved.
Therefore, the heat accumulation problem of the vehicle-mounted power amplifier cannot be substantially improved by the methods.
Therefore, a novel vehicle-mounted power amplifier is urgently needed in the market for solving the problems.
Disclosure of Invention
The invention aims to provide a vehicle-mounted power amplifier with a heat dissipation structure, which is used for solving the technical problems in the prior art.
In order to achieve the purpose, the invention provides the following scheme:
the invention discloses a vehicle-mounted power amplifier with a heat dissipation structure, which comprises:
the heat dissipation device comprises a heat dissipation shell, a heat dissipation shell and a heat dissipation device, wherein a plurality of heat dissipation fins are arranged on the outer wall of the heat dissipation shell, a plurality of vent holes are formed in the side wall of the heat dissipation shell, and an opening is formed in one side of the heat dissipation shell;
the bottom plate can be detachably connected to the opening, an accommodating cavity is formed between the bottom plate and the radiating shell, and the vent hole is communicated with the accommodating cavity;
the base plate, the base plate is a plurality of, the base plate is fixed in the holding intracavity.
Preferably, the base plate comprises a first floor base plate and a second floor base plate.
Preferably, the heat dissipation shell is made of aluminum alloy.
Preferably, one side of the heat dissipation housing is provided with one row of the vent holes, and the number of the vent holes is six.
Preferably, the vent hole is a straight hole or an inclined hole.
Preferably, the heat dissipation housing and the bottom plate are fixed by screws.
Preferably, one side of the heat dissipation shell is an interface side, the interface side is provided with a plurality of connection interfaces, the other side is a ventilation side, and the ventilation holes are fixed on the ventilation side.
Preferably, the heat radiating fins include straight type heat radiating fins and right-angled type heat radiating fins.
Compared with the prior art, the invention has the following technical effects:
the invention can be completely processed on the existing vehicle-mounted power amplifier without adding additional parts, thereby greatly reducing the production cost. The heat convection efficiency of the hot air in the intermediate layer substrate of the product and the external cold air is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a vehicle-mounted power amplifier with a heat dissipation structure according to an embodiment of the present invention;
fig. 2 is a side sectional view of a vehicle-mounted power amplifier with a heat dissipation structure according to an embodiment of the present invention;
fig. 3 is a bottom view of the vehicle-mounted power amplifier with the heat dissipation structure according to the embodiment of the present invention;
in the figure: 1-a heat dissipation housing; 2-a bottom plate; 3-radiating fins; 4-a vent hole; 5-first floor base plate; 6-second floor base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a vehicle-mounted power amplifier with a heat dissipation structure, which is used for solving the technical problems in the prior art.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-2, the present embodiment provides a vehicle-mounted power amplifier with a heat dissipation structure, including:
the heat dissipation device comprises a heat dissipation shell 1, wherein a plurality of heat dissipation fins 3 are arranged on the outer wall of the heat dissipation shell 1, a plurality of vent holes 4 are arranged on the side wall of the heat dissipation shell 1, the heat dissipation shell 1 is of a box-shaped structure, and an opening is formed in one side of the heat dissipation shell 1;
the heat dissipation device comprises a bottom plate 2, wherein the bottom plate 2 is a steel plate, the bottom plate 2 can be detachably connected to an opening, an accommodating cavity is formed between the bottom plate 2 and the heat dissipation shell 1, a vent hole 4 is communicated with the accommodating cavity, the inner end of the vent hole 4 is located in hot air in the accommodating cavity, and the outer end of the vent hole 4 is connected with external cold air;
the base plate, the base plate is a plurality of, and a plurality of base plate distributes from top to bottom, and the base plate is fixed in the holding intracavity, and it needs to be noted that is equipped with the necessary electrical components of control vehicle-mounted power amplifier function on the base plate, and this is prior art, therefore does not add the unnecessary redundant description.
When the heat dissipation structure is used, heat generated in the base plate is transmitted outwards through the heat dissipation fins 3 and the ventilation holes 4, and therefore the technical effect of heat dissipation is achieved. The arrangement of the vent holes 4 can enhance the heat convection efficiency between the hot air in the substrate and the external cold air, thereby reducing the heat accumulation in the heat dissipation housing 1 better.
In the present embodiment, the substrates include a first floor substrate 5 and a second floor substrate 6. The number of substrates can be adjusted by those skilled in the art as needed, and the volume and shape of the heat dissipation housing 1 can be adjusted according to the installation environment.
In this embodiment, the heat dissipation housing 1 is made of aluminum alloy, which has a good heat dissipation effect. Meanwhile, the heat dissipation fins 3 and the heat dissipation shell 1 are of an integrated structure, so that the heat dissipation effect can be further enhanced due to the fact that the heat dissipation fins are also made of aluminum alloy.
In this embodiment, a row of vent holes 4 is formed on one side of the heat dissipation housing 1, and the number of the vent holes 4 is six. The number of ventilation holes 4 can be adjusted by those skilled in the art according to the actual need of ventilation and the volume of the heat dissipation housing 1.
In the present embodiment, the vent hole 4 is a straight hole or an inclined hole. The straight hole is convenient to process. Regarding the shape of the inclined hole, as shown in fig. 2, the height of the inner end of the inclined hole is higher than that of the outer end, and the inclined hole can reduce the entrance of dust and water.
In the present embodiment, the heat dissipation housing 1 and the bottom plate 2 are fixed by screws. The advantage of this arrangement is that it is easy to disassemble and, if there is a fault inside, it is easy for the staff to repair it.
In this embodiment, one side of the heat dissipation housing 1 is an interface side, and the interface side is provided with a plurality of connection interfaces for connecting related electrical components. The other side is the ventilation side, and the ventilation hole 4 is fixed on the ventilation side. The interface side and the ventilation side are arranged oppositely and are of strip structures.
In the present embodiment, as shown in fig. 1, the heat dissipating fins 3 include straight heat dissipating fins 3 and right-angled heat dissipating fins 3 (in a top view). The top is a plurality of linear type radiating fins 3 parallel distribution, and right-angle shape radiating fin divide into two parts about, and the right-angle shape radiating fin 3 of two parts about sets up back of the body mutually.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. The utility model provides a vehicle-mounted power amplifier with heat radiation structure which characterized in that includes:
the heat dissipation device comprises a heat dissipation shell, a heat dissipation shell and a heat dissipation device, wherein a plurality of heat dissipation fins are arranged on the outer wall of the heat dissipation shell, a plurality of vent holes are formed in the side wall of the heat dissipation shell, and an opening is formed in one side of the heat dissipation shell;
the bottom plate can be detachably connected to the opening, an accommodating cavity is formed between the bottom plate and the radiating shell, and the vent hole is communicated with the accommodating cavity;
the base plate, the base plate is a plurality of, the base plate is fixed in the holding intracavity.
2. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: the base plate comprises a first floor base plate and a second floor base plate.
3. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: the heat dissipation shell is made of aluminum alloy.
4. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: one side of heat dissipation casing is equipped with one row the ventilation hole, the ventilation hole has six.
5. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: the vent hole is a straight hole or an inclined hole.
6. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: the heat dissipation shell and the bottom plate are fixed through screws.
7. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: one side of the heat dissipation shell is an interface side, the interface side is provided with a plurality of connecting interfaces, the other side of the heat dissipation shell is a ventilation side, and the ventilation holes are fixed on the ventilation side.
8. The vehicle-mounted power amplifier with the heat dissipation structure according to claim 1, wherein: the radiating fins comprise linear radiating fins and right-angle radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111551592.2A CN114158239A (en) | 2021-12-17 | 2021-12-17 | Vehicle-mounted power amplifier with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111551592.2A CN114158239A (en) | 2021-12-17 | 2021-12-17 | Vehicle-mounted power amplifier with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114158239A true CN114158239A (en) | 2022-03-08 |
Family
ID=80451379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111551592.2A Pending CN114158239A (en) | 2021-12-17 | 2021-12-17 | Vehicle-mounted power amplifier with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114158239A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068880A (en) * | 1999-08-31 | 2001-03-16 | Nec Saitama Ltd | Cooling structure of communication equipment |
| US20040165352A1 (en) * | 2003-02-26 | 2004-08-26 | Nec Corporation | Housing structure of electronic device and heat radiation method therefor |
| JP2016063055A (en) * | 2014-09-18 | 2016-04-25 | サクサ株式会社 | Heat dissipation structure of electronic apparatus |
| CN207854094U (en) * | 2018-01-18 | 2018-09-11 | 广州市荣鼎电子有限公司 | A kind of high efficiency and heat radiation vehicle-mounted digital power amplifier |
| CN210405997U (en) * | 2019-05-24 | 2020-04-24 | 科大讯飞股份有限公司 | Heat dissipation structure of electronic device |
| CN210537194U (en) * | 2019-07-09 | 2020-05-15 | 湖北亿咖通科技有限公司 | Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment |
| CN214206189U (en) * | 2020-10-10 | 2021-09-14 | 深圳市哲思特科技有限公司 | High heat dissipation backshell and vehicle-mounted display |
| CN216721894U (en) * | 2021-12-17 | 2022-06-10 | 先锋高科技(上海)有限公司 | Vehicle-mounted power amplifier with heat radiation structure |
-
2021
- 2021-12-17 CN CN202111551592.2A patent/CN114158239A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068880A (en) * | 1999-08-31 | 2001-03-16 | Nec Saitama Ltd | Cooling structure of communication equipment |
| US20040165352A1 (en) * | 2003-02-26 | 2004-08-26 | Nec Corporation | Housing structure of electronic device and heat radiation method therefor |
| JP2016063055A (en) * | 2014-09-18 | 2016-04-25 | サクサ株式会社 | Heat dissipation structure of electronic apparatus |
| CN207854094U (en) * | 2018-01-18 | 2018-09-11 | 广州市荣鼎电子有限公司 | A kind of high efficiency and heat radiation vehicle-mounted digital power amplifier |
| CN210405997U (en) * | 2019-05-24 | 2020-04-24 | 科大讯飞股份有限公司 | Heat dissipation structure of electronic device |
| CN210537194U (en) * | 2019-07-09 | 2020-05-15 | 湖北亿咖通科技有限公司 | Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment |
| CN214206189U (en) * | 2020-10-10 | 2021-09-14 | 深圳市哲思特科技有限公司 | High heat dissipation backshell and vehicle-mounted display |
| CN216721894U (en) * | 2021-12-17 | 2022-06-10 | 先锋高科技(上海)有限公司 | Vehicle-mounted power amplifier with heat radiation structure |
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